Flexible circuit board assembly structure

Abstract

The utility model belongs to the technical field of flexible circuit board, concretely is a kind of flexible circuit board splicing structure, comprising: substrate assembly, the circuit board group of assembling in the substrate assembly and the heat dissipation component of being set on the substrate assembly;The substrate assembly includes special-shaped substrate, fixed groove being opened in the middle part of special-shaped substrate, limit tooth one being set on the fixed groove and the positioning hole being opened in the side edge of special-shaped substrate.The utility model can process special-shaped substrate and circuit board unit separately by substrate assembly and circuit board group, then circuit board unit is assembled into fixed groove, the scheme is split type assembly to circuit board splicing structure, effectively shortens single processing time, so that when part of single is unqualified, it will not affect other parts, and circuit board unit can also be replaced and maintained individually after being damaged, greatly improve the practicality of circuit board splicing structure.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, specifically a flexible circuit board panel structure. Background Technology

[0002] The panel structure of flexible circuit boards (FPCs) refers to a structure in which multiple flexible circuit boards are joined together. In the production process of FPCs, to save costs, improve production efficiency, and shorten the production cycle, panelization is often used instead of single-piece production. Generally, there are three panelization methods for FPCs: conventional panelization, angled panelization, and inverted panelization. All panelization methods must adhere to the principle of minimizing material consumption, provided that production is feasible.

[0003] Traditional rectangular panels are generally manufactured as a single piece, which takes a long time to process. If some parts are defective, the entire panel needs to be scrapped, resulting in high costs and low efficiency. Furthermore, the heat dissipation of the circuit board mainly relies on the structure of the board itself, and the heat dissipation effect needs to be further improved. Therefore, we propose a flexible circuit board panel structure. Utility Model Content

[0004] This utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0005] Therefore, the technical solution adopted by this utility model is as follows:

[0006] A flexible circuit board panel structure includes: a substrate assembly, a circuit board assembly assembled within the substrate assembly, and a heat dissipation assembly disposed on the substrate assembly; the substrate assembly includes an irregularly shaped substrate, a fixing groove formed in the middle of the irregularly shaped substrate, a first limiting tooth disposed on the fixing groove, and a positioning hole formed on the side of the irregularly shaped substrate; the circuit board assembly includes a circuit board unit disposed within the fixing groove and a second limiting tooth fixed to the side of the circuit board unit.

[0007] In a preferred embodiment, the present invention can be further configured such that the heat dissipation component includes a heat dissipation plate disposed at the bottom of the irregularly shaped substrate and located inside the fixing groove, a heat dissipation fin disposed on the side of the positioning hole, and a heat dissipation bridge connected to the heat dissipation fin and extending into the fixing groove.

[0008] In a preferred embodiment, the present invention can be further configured such that the circuit board unit adopts a polygonal structure, and the side of the fixing groove is adapted to the circuit board unit.

[0009] In a preferred embodiment, the present invention can be further configured such that the second limiting tooth and the first limiting tooth engage in a sawtooth-like manner.

[0010] In a preferred embodiment, the present invention can be further configured such that a heat-conducting plate located on the upper layer of the heat sink is provided in the middle of the irregularly shaped substrate.

[0011] In a preferred embodiment, the present invention can be further configured such that: a fixing hole is provided in the middle of the irregularly shaped substrate, and a fixing bolt is fixed to the outer end of the fixing hole.

[0012] The above-mentioned technical solution of this utility model has the following beneficial technical effects:

[0013] 1. This utility model allows for the separate processing of irregularly shaped substrates and circuit board units through substrate assemblies and circuit board groups, and then the circuit board units are assembled into fixed slots. This solution adopts a split assembly for the circuit board panel structure, which effectively shortens the processing time of individual units. Thus, if some individual units are defective, it will not affect other parts. At the same time, circuit board units can be replaced and maintained individually after damage, which greatly improves the practicality of the circuit board panel structure.

[0014] 2. This utility model uses a heat dissipation component to improve the heat dissipation effect of the upper circuit board unit by utilizing a heat dissipation plate and a heat conduction plate. At the same time, the heat on the circuit board unit and the irregularly shaped substrate can also be transferred to the heat sink through the heat dissipation bridge, further improving the overall heat dissipation effect. Attached Figure Description

[0015] Figure 1 This is a front view of the flexible circuit board panel structure of this utility model;

[0016] Figure 2 This is a cross-sectional view of the flexible circuit board panel structure of this utility model;

[0017] Figure 3 This is a side sectional view of the flexible circuit board panel structure of this utility model.

[0018] Figure label:

[0019] 100. Substrate assembly; 110. Irregularly shaped substrate; 120. Fixing groove; 130. Limiting tooth 1; 140. Positioning hole;

[0020] 200. Circuit board assembly; 210. Circuit board unit; 220. Limiting tooth two;

[0021] 300. Heat dissipation component; 310. Heat dissipation plate; 320. Heat sink; 330. Heat dissipation bridge; 340. Heat conduction plate; 350. Mounting hole; 360. Mounting bolt. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features of the present utility model can be combined with each other.

[0023] It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this invention.

[0024] The following describes, with reference to the accompanying drawings, some embodiments of the present invention, providing a flexible circuit board panel structure.

[0025] Combination Figures 1-3 As shown, the present invention provides a flexible circuit board panel structure, including: a substrate assembly 100, a circuit board group 200 assembled in the substrate assembly 100, and a heat dissipation assembly 300 disposed on the substrate assembly 100.

[0026] Specifically, the substrate assembly 100 includes an irregularly shaped substrate 110, a fixing groove 120 formed in the middle of the irregularly shaped substrate 110, a limiting tooth 130 provided on the fixing groove 120, and a positioning hole 140 formed on the side of the irregularly shaped substrate 110. By partially hollowing out the fixing groove 120 on the irregularly shaped substrate 110, and by adopting a polygonal structure for the circuit board unit 210, and by adapting the side of the fixing groove 120 to the circuit board unit 210, multiple circuit board units 210 can be easily assembled and placed in the fixing groove 120. At the same time, the toothed connection of the limiting tooth 130 and the limiting tooth 220 helps to improve the stability of the circuit board unit 210 in the fixing groove 120 in the contact state, preventing it from loosening and falling off. Furthermore, the limiting tooth 220 is not provided in the middle of the contact edge between the circuit board unit 210 and the adjacent circuit board unit 210, thereby facilitating the connection between the circuit board units 210.

[0027] Furthermore, the circuit board unit 210 is preferably configured as a polygonal structure, such as a hexagon. It can also be adaptively adjusted according to the specifications of the actual circuit board, such as adapting to the shape of the circuit board being mounted as a rectangle. The irregularly shaped substrate 110 is like a "puzzle" for assembling "puzzle pieces", providing a suitable fixation for the inner side of the circuit board unit 210, while the edge of the fixing groove 120 is adapted to the side of the circuit board unit 210.

[0028] Specifically, the second limiting tooth 220 and the first limiting tooth 130 are serrated and interlocked. The first limiting tooth 130 and the second limiting tooth 220 can be made of hard rubber and can be positioned by compression using an interference fit. Of course, other structures or materials with limiting functions can also be used.

[0029] Furthermore, the circuit board assembly 200 includes a circuit board unit 210 disposed in the fixing groove 120 and a limiting tooth 220 fixed to the side of the circuit board unit 210. The circuit board unit 210 is a single circuit board that is machined and formed. When in use, it can be directly placed in the fixing groove 120 and then wired and connected.

[0030] It should be noted that the heat dissipation assembly 300 includes a heat dissipation plate 310 disposed at the bottom of the irregular substrate 110 and located inside the fixing groove 120, a heat dissipation fin 320 disposed on the side of the positioning hole 140, and a heat dissipation bridge 330 connected to the heat dissipation fin 320 and extending into the fixing groove 120. Through the heat dissipation assembly 300, the heat dissipation effect of the upper circuit board unit 210 can be improved by utilizing the heat dissipation plate 310 and the heat conduction plate 340. At the same time, the heat on the circuit board unit 210 and the irregular substrate 110 can also be transferred to the heat dissipation fin 320 through the heat dissipation bridge 330, further improving the overall heat dissipation effect.

[0031] Specifically, both heat sink 320 and heat bridge 330 adopt copper foil heat dissipation structure, which has good heat conduction effect.

[0032] Furthermore, the irregularly shaped substrate 110 has a heat-conducting plate 340 located on the upper layer of the heat sink 310 in the middle. The heat-conducting plate 340 can adopt a metal heat-conducting structure, such as copper foil, which can transfer heat to the heat sink 310. The heat sink 310 adopts a porous ceramic heat conductor, which has a better heat dissipation effect.

[0033] Furthermore, a fixing hole 350 is provided in the middle of the irregularly shaped substrate 110, and a fixing bolt 360 is fixed to the outer end of the fixing hole 350. The fixing hole 350 is located at the junction between the circuit board units 210. After the circuit board unit 210 is placed in the fixing groove 120, the fixing bolt 360 is screwed into the fixing hole 350 to press the circuit board unit 210. A single fixing bolt 360 can press at least two or more sets of circuit board units 210. In this technical solution, three sets of hexagonal circuit board units 210 can be pressed at the same time, which effectively saves the use of fixing bolts 360 and effectively fixes the circuit board unit 210, making it highly practical.

[0034] In practical applications, the fixing groove 120 on the irregularly shaped substrate 110 can be composed of two sets of thinner substrates. The upper substrate is slotted to form the shape of the fixing groove 120, and the lower substrate is directly assembled with the heat sink 310. Then, the two sets of substrates are bonded or pressed together.

[0035] The working principle and usage process of this utility model are as follows: First, place the circuit board unit 210 into the fixing slot 120, then screw the fixing bolt 360 into the fixing hole 350 to press the circuit board unit 210 into place, and then connect the circuit board unit 210 for use.

[0036] The terms "fixed," "installed," "connected," "set up," "open," "equipped with," "embedded," and "assembled" used in this manual to describe the position or relationship of components all refer to conventional physical connections or spatial configurations that can be understood and implemented by those skilled in the art based on the function of the relevant components, the context, and common knowledge. These relationships encompass, but are not limited to, specific forms such as welding, bonding, threaded fastening, snap-fit, interference fit, plug-in, sliding fit, hinge, integral molding, adjacent arrangement, and opening or slot accommodating. Their purpose is to clearly describe the relative positions, mating methods, and functional implementation paths between components, rather than limiting a single specific structural detail. To ensure a smooth and concise reading experience and ease of understanding, no separate explanation is provided after each term.

[0037] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A flexible circuit board panel structure, characterized in that, include: The substrate assembly (100), the circuit board assembly (200) assembled in the substrate assembly (100), and the heat dissipation assembly (300) disposed on the substrate assembly (100). The substrate assembly (100) includes a shaped substrate (110), a fixing groove (120) formed in the middle of the shaped substrate (110), a limiting tooth (130) provided on the fixing groove (120), and a positioning hole (140) formed on the side of the shaped substrate (110). The circuit board assembly (200) includes a circuit board unit (210) disposed in the fixing groove (120) and a limiting tooth (220) fixed to the side of the circuit board unit (210).

2. The flexible circuit board panel structure according to claim 1, characterized in that, The heat dissipation assembly (300) includes a heat dissipation plate (310) disposed at the bottom of the irregular substrate (110) and located inside the fixing groove (120), a heat dissipation fin (320) disposed on the side of the positioning hole (140), and a heat dissipation bridge (330) connected to the heat dissipation fin (320) and extending into the fixing groove (120).

3. The flexible circuit board panel structure according to claim 1, characterized in that, The circuit board unit (210) adopts a polygonal structure, and the side of the fixing groove (120) is adapted to the circuit board unit (210).

4. The flexible circuit board panel structure according to claim 1, characterized in that, The second limiting tooth (220) and the first limiting tooth (130) are engaged in a sawtooth pattern.

5. A flexible circuit board panel structure according to claim 2, characterized in that, The irregularly shaped substrate (110) has a heat-conducting plate (340) located on the upper layer of the heat sink (310) in the middle.

6. The flexible circuit board panel structure according to claim 1, characterized in that, The irregularly shaped substrate (110) is provided with a fixing hole (350) in the middle, and a fixing bolt (360) is fixed to the outer end of the fixing hole (350).

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