A connecting mechanism for connecting a ceramic capacitor of a sensor to an FPC circuit board

Abstract

The utility model relates to sensor circuit connection technical field, concretely is a kind of connecting mechanism for the connection of ceramic capacitor and FPC circuit board for sensor, including ceramic capacitor and PFC circuit board;The upper surface of the ceramic capacitor is provided with capacitor pin;The PFC circuit board includes upper and lower arrangement upper connecting part and lower connecting part, and the elastic flanging for connecting both sides of the upper connecting part and the lower connecting part is arranged;The upper surface of the lower connecting part is provided with electronic component installation site, and the lower connecting part jack that can penetrate the lower connecting part;The capacitor pin can penetrate the lower connecting part jack and realize the electric connection of the ceramic capacitor and the PFC circuit board connection interface.This mechanism has the characteristics such as flexible adaptation, connection firm, layout reasonable, shape adaptation, etc., guarantees pressure signal stable transmission and processing, satisfies sensor miniaturization and high-precision demand.

Description

Technical Field

[0001] This utility model relates to the field of sensor circuit connection technology, and in particular to a connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor. Background Technology

[0002] Ceramic capacitive temperature and pressure sensors are core components for achieving combined temperature and pressure detection in fields such as industrial automation, automotive electronics, and medical equipment. They rely on ceramic capacitors as pressure-sensing components to convert external pressure signals into processable capacitance change signals. The signals are then amplified, filtered, calibrated, and processed by chips on the circuit board to achieve accurate detection.

[0003] However, the connection structure between ceramic capacitors and circuit boards in existing technologies has many defects, making it difficult to meet the performance and structural requirements of sensors: First, the connection structure lacks flexibility and adaptability. As a precision component, ceramic capacitors are usually installed in a small space and require minor position adjustments during assembly. Traditional circuit boards are mostly made of rigid materials and cannot adapt to such spatial characteristics. During assembly, installation stress is easily generated, which can cause the capacitor pins to bend and be damaged or the circuit board holes to deform, directly affecting the reliability of the electrical connection. Secondly, the connection stability is insufficient. Existing connections mostly rely on the insertion and cooperation of capacitor pins and circuit board sockets. When the sensor faces operating conditions such as vibration and temperature cycling, the pins and sockets are prone to loosening, causing interruption or fluctuation in pressure signal transmission and affecting detection accuracy. Third, the layout of electronic components on the circuit board lacks specificity. The relative positions of the mounting positions of electronic components such as chips and capacitor pins are not designed reasonably, which causes the weak capacitance change signals output by the capacitor to have an excessively long path during transmission to the chip, making them susceptible to electromagnetic interference and further reducing the accuracy of signal processing. Fourth, the shape adaptability is poor. The size of the connection part under the traditional circuit board is often larger than that of the ceramic capacitor. This not only occupies a lot of space inside the sensor, but also goes against the current industry trend of sensors becoming smaller and more integrated, thus limiting the application of the sensor in confined installation scenarios.

[0004] Therefore, there is an urgent need for a connection mechanism that can reliably connect ceramic capacitors to circuit boards, has flexible adaptability, reasonable component layout, and a suitable shape, in order to solve the shortcomings of existing structures and ensure the detection performance and structural compatibility of ceramic capacitive temperature and pressure sensors. Utility Model Content

[0005] The purpose of this utility model is to overcome the problems of the prior art and provide a connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor. This mechanism solves the technical problems of poor flexibility, easy loosening, large layout interference, and large space occupation in the connection between traditional ceramic capacitors and circuit boards. It aims to achieve a reliable electrical connection between the ceramic capacitor (pressure sensing component) and the FPC circuit board in a ceramic capacitor-type temperature and pressure sensor, while having the characteristics of flexible adaptation, reasonable layout, and shape adaptation, ensuring stable transmission and subsequent processing of pressure signals.

[0006] The above objectives are achieved through the following technical solutions: A connection mechanism between a ceramic capacitor for a sensor and an FPC circuit board includes: A ceramic capacitor, wherein a capacitor pin is provided on the upper surface of the ceramic capacitor; The PFC circuit board includes an upper connecting part and a lower connecting part arranged vertically, and an elastic flange disposed on the same side of the upper connecting part and the lower connecting part for connecting the two; the upper surface of the lower connecting part is provided with an electronic component mounting position and a lower connecting part insertion hole that can pass through the lower connecting part; the capacitor pin can pass through the lower connecting part insertion hole to realize the electrical connection between the ceramic capacitor and the PFC circuit board.

[0007] Furthermore, the upper connecting portion, the lower connecting portion, and the elastic flange of the PFC circuit board are integrally formed.

[0008] Furthermore, the PFC circuit board uses a flexible substrate.

[0009] Furthermore, the flexible substrate is polyimide (PI) or polyester film (PET).

[0010] Furthermore, the electronic component mounting position is provided with a chip, which is a signal conditioning chip.

[0011] Furthermore, the electronic component mounting position is located in the central region of the lower connector, and the lower connector socket is located at the edge of the lower connector opposite to the elastic flange.

[0012] Furthermore, the shape of the lower connection portion is not larger than the shape of the ceramic capacitor.

[0013] Furthermore, the lower connecting part has an octagonal shape, which is adapted to the surface of the ceramic capacitor.

[0014] Furthermore, the ceramic capacitor is square or circular.

[0015] Furthermore, the capacitor pin is soldered after being sleeved with the lower connection part socket.

[0016] This utility model provides a connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor. The PFC circuit board uses a flexible substrate, and the upper and lower connecting parts are integrally formed with the elastic flange, which can flexibly adapt to the narrow internal space of the sensor and the needs of installation fine adjustment, avoiding damage to the capacitor pins or circuit board sockets by installation stress. The capacitor pins are soldered to the sockets of the lower connecting part after being sleeved, which greatly improves the connection stability and can resist loosening caused by vibration and temperature changes. The electronic components are installed in the center of the lower connecting part, and the sockets are located on the opposite edge of the elastic flange, which shortens the signal transmission path to reduce interference and improve signal processing accuracy. The lower connecting part is octagonal and its shape is no larger than that of the ceramic capacitor, saving internal space of the sensor, helping to miniaturize the design, fully ensuring stable transmission of pressure signals, and meeting the high precision and structural adaptation requirements of the sensor. Attached Figure Description

[0017] Figure 1 This is a first-view structural schematic diagram of the connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to the present invention. Figure 2 This is a second-view structural schematic diagram of the connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to the present invention. Figure 3 This is a first-view schematic diagram of the connection mechanism between a ceramic capacitor for a sensor and an FPC circuit board, as described in this utility model, in which the capacitor pins are inserted into the lower connection part socket. Figure 4 This is a second-view schematic diagram showing the connection between the capacitor pin and the lower connection part socket in the connection mechanism between the ceramic capacitor and the FPC circuit board for the sensor described in this utility model. Figure 5 This is a schematic diagram of the electronic component mounting position and the lower connection part insertion hole in the connection mechanism between the ceramic capacitor and the FPC circuit board for the sensor described in this utility model. Figure 6 This is a schematic diagram of the connection mechanism between the ceramic capacitor and the FPC circuit board of the present invention applied to a square ceramic capacitor.

[0018] Illustration markings: 1-Ceramic capacitor, 101-Capacitor pins; 2-PFC circuit board, 201-upper connection part, 202-lower connection part, 203-elastic flange, 204-electronic component mounting position, 205-lower connection part socket, 206-chip. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. The described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] like Figures 1-5 As shown, a connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor is applied to a ceramic capacitive temperature and pressure sensor. This mechanism ensures a reliable electrical connection between the pressure sensing component (ceramic capacitor 1) and the PFC circuit board 2, guaranteeing pressure signal transmission for processing by the chip 206. It includes the following components: Ceramic capacitor 1: As a pressure-sensing component, its upper surface is provided with capacitor pins 101 for transmitting the capacitance change signal generated by pressure. The shape of ceramic capacitor 1 can be designed as circular or square according to the sensor requirements. Figure 1 and Figure 6 As shown; PFC Circuit Board 2: Made of a flexible substrate (such as polyimide PI, polyester film PET), it possesses flexible deformation capabilities, adapting to the confined installation space inside the sensor that requires fine-tuning. PFC Circuit Board 2 includes: Upper connecting part 201 and lower connecting part 202: are arranged vertically and connected by an elastic flange 203 on the same side; the upper connecting part 201, lower connecting part 202 and elastic flange 203 are integrally formed structures to ensure the integrity of the connection and the consistency of flexible deformation.

[0021] Electronic component mounting position 204: Located in the central area of ​​the lower connection portion 202, it is used to mount chip 206. In this embodiment, chip 206 is a signal conditioning chip, which can receive the weak capacitance change signal output by the ceramic capacitor and perform amplification, filtering, linearization calibration, and other processing. This solution only protects the connection structure; the specific circuitry for signal processing uses existing conventional methods and will not be described in detail here.

[0022] The lower connection socket 205 can penetrate the lower connection 202 and is located at the edge of the lower connection 202 opposite to the elastic flange 203. The capacitor pin 101 of the ceramic capacitor 1 can pass through the lower connection socket 205 to realize the electrical connection between the ceramic capacitor 1 and the PFC circuit board 2. To enhance the connection strength, the capacitor pin 101 can be soldered (such as laser soldering or tin soldering) after being sleeved with the lower connection socket 205.

[0023] In addition, the shape of the lower connection part 202 is no larger than that of the ceramic capacitor 1, and the shape of the lower connection part 202 is designed to be octagonal, which is compatible with the surface of the ceramic capacitor 1, reducing the space occupied inside the sensor and facilitating the miniaturization of the sensor.

[0024] like Figure 3 and Figure 4 As shown, in this embodiment, the capacitor pin 101 on the upper surface of the ceramic capacitor 1 is aligned with the lower connection part socket 205 of the lower connection part 202 of the PFC circuit board 2, and the capacitor pin 101 is inserted through the lower connection part socket 205 to complete the initial insertion. In order to enhance the connection firmness, the connection between the capacitor pin 101 and the lower connection part socket 205 can be soldered (such as laser soldering or tin soldering) after insertion to avoid loosening of the connection due to vibration and temperature changes.

[0025] like Figure 3 and Figure 4 As shown, in this embodiment, the PFC circuit board 2 uses a flexible substrate such as polyimide (PI), and the upper connecting part 201 and the lower connecting part 202 are integrally connected by an elastic flange 203, giving the PFC circuit board 2 flexible deformation capability. When the sensor is installed inside, if there is a need for fine adjustment of the spatial position, the elastic flange 203 can elastically deform, causing the upper connecting part 201 and the lower connecting part 202 to adjust their relative positions, avoiding damage to the capacitor pin 101 or the lower connecting part socket 205 by rigid connection, and improving installation adaptability and connection reliability.

[0026] like Figure 5 As shown, in this embodiment, the electronic component mounting position 204 is located in the central region of the lower connection portion 202, and the lower connection portion socket 205 is located at the edge opposite to the elastic flange 203. This arrangement allows the signal output from the capacitor pin 101 to be transmitted to the central signal conditioning chip 206 with a shorter path, reducing signal transmission interference and improving processing accuracy. At the same time, the electronic component mounting position 204 in the central region facilitates the soldering and protection of the chip 206.

[0027] In this embodiment, the lower connecting part 202 is octagonal in shape and not larger than the shape of the ceramic capacitor 1 (adapting to the surface size of the circular or square ceramic capacitor 1), which effectively reduces the space occupied by the PFC circuit board 2 inside the sensor and conforms to the design trend of miniaturization of ceramic capacitor temperature and pressure sensors.

[0028] Working principle diagram: After sensing pressure, the ceramic capacitor 1 deforms its internal ceramic diaphragm, causing a change in capacitance. The capacitance change signal is transmitted through the capacitor pin 101 and the lower connection port 205 to the chip 206 (a signal conditioning chip in this embodiment) on the PFC circuit board 2. The chip 206 amplifies and filters the weak capacitance change signal, and after processing it with existing algorithms such as temperature compensation, the signal is further transmitted to the upper connection 201 (interacting with external devices through the external structure of the upper connection), ultimately realizing the accurate detection and output of the pressure signal.

[0029] The above description is only for illustrating the embodiments of this utility model and is not intended to limit this utility model. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A connection mechanism between a ceramic capacitor for a sensor and an FPC circuit board, characterized in that, include: A ceramic capacitor (1) is provided with capacitor pins (101) on its upper surface. PFC circuit board (2), the PFC circuit board (2) includes an upper connecting part (201) and a lower connecting part (202) arranged vertically, and an elastic flange (203) for connecting the two on the same side of the upper connecting part (201) and the lower connecting part (202); the upper surface of the lower connecting part (202) is provided with an electronic component mounting position (204), and a lower connecting part socket (205) that can pass through the lower connecting part (202); the capacitor pin (101) can pass through the lower connecting part socket (205) to realize the electrical connection between the ceramic capacitor (1) and the PFC circuit board (2).

2. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 1, characterized in that, The upper connecting part (201), the lower connecting part (202), and the elastic flange (203) of the PFC circuit board (2) are integrally formed.

3. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 2, characterized in that, The PFC circuit board (2) is made of a flexible substrate.

4. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 3, characterized in that, The flexible substrate is polyimide (PI) or polyester film (PET).

5. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 1, characterized in that, The electronic component mounting position (204) is provided with a chip (206).

6. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 1, characterized in that, The electronic component mounting position (204) is located in the central region of the lower connecting part (202), and the lower connecting part socket (205) is located at the edge of the lower connecting part (202) opposite to the elastic flange (203).

7. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 1, characterized in that, The shape of the lower connecting part (202) is not larger than the shape of the ceramic capacitor (1).

8. A connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 1 or 7, characterized in that, The lower connecting part (202) is octagonal in shape and is adapted to the surface of the ceramic capacitor (1).

9. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 8, characterized in that, The ceramic capacitor (1) is square or circular.

10. The connection mechanism between a ceramic capacitor and an FPC circuit board for a sensor according to claim 1, characterized in that, The capacitor pin (101) is soldered after being sleeved with the lower connection part socket (205).

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