Power module housing, integrated housing, integrated controller, powertrain, and vehicle
Patent Information
- Application Number
- CN202522019377.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-18
- Publication Date
- 2026-09-04
- Estimated Expiration
- 2035-09-18
AI Technical Summary
然而，该种结构由于受限于平面排布，不仅导致控制器整体体积难以缩小，还在散热路径上存在效率不足的问题，易造成局部温升过高，进而影响器件的稳定运行与寿命
[0018]可选的，所述电控模块内具有第三换热流道，所述第三换热流道与所述集成壳体的第二换热流道连通。
Smart Images
Figure CN224722094U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of vehicle technology, and in particular to a power module housing, an integrated housing, an integrated controller, a powertrain, and a vehicle. Background Technology
[0002] Currently, controllers typically employ a flat, planar heat dissipation channel layout to cool the integrated modules within the controller. However, this structure, limited by planar arrangement, not only makes it difficult to reduce the overall size of the controller but also suffers from inefficiency in the heat dissipation path, easily leading to excessively high local temperatures, which in turn affects the stable operation and lifespan of the device. Utility Model Content
[0003] This application provides a power module housing, an integrated housing, an integrated controller, a powertrain, and a vehicle to at least partially solve the above-mentioned technical problems.
[0004] To achieve the above objectives, according to a first aspect of this application, a power module housing is provided, characterized in that it includes a main housing, a first heat exchange plate and a second heat exchange plate, both the first heat exchange plate and the second heat exchange plate are disposed on the main housing, a first heat exchange channel is formed between the first heat exchange plate and the second heat exchange plate, the surface of the first heat exchange plate facing away from the first heat exchange channel is configured to mount a first electronic device, and the surface of the second heat exchange plate facing away from the first heat exchange channel is configured to mount a second electronic device.
[0005] Optionally, at least one of the first heat exchange plate and the second heat exchange plate is provided with a partition rib, which divides the first heat exchange channel into a first region and a second region that are connected; wherein, one of the first region and the second region is configured to communicate with the cooling medium inlet end and the other is configured to communicate with the cooling medium outlet end, and the connection between the first region and the second region is configured to be away from the cooling medium inlet end and / or the cooling medium outlet end.
[0006] Optionally, at least one of the first region and the second region is provided with guide ribs, and multiple guide ribs are arranged along the width direction of the first heat exchange channel, and the length direction of the guide ribs is consistent with the length direction of the first heat exchange channel.
[0007] Optionally, multiple of the aforementioned guide ribs are disposed on the first heat exchange plate body;
[0008] Alternatively, multiple of the aforementioned guide ribs may be disposed on the second heat exchange plate.
[0009] Alternatively, among the multiple guide ribs, one adjacent guide rib is disposed on the first heat exchange plate, and the other adjacent guide rib is disposed on the second heat exchange plate.
[0010] According to a second aspect of this application, an integrated housing is provided, including the power module housing described in the first aspect.
[0011] Optionally, it also includes an electronic control module housing, which is connected to the power module housing.
[0012] Optionally, a second heat exchange channel is formed between the electronic control module housing and the power module housing. The first end of the second heat exchange channel is connected to the first heat exchange channel, and the second end of the second heat exchange channel is configured to be connected to the electronic control module installed inside the electronic control module housing.
[0013] Optionally, the power module housing is integrally formed with a first channel, and the electronic control module housing is integrally formed with a second channel, wherein the first channel and the second channel are connected to form the second heat exchange channel.
[0014] Optionally, the end wall of the electronic control module housing is provided with a docking part located on the outer periphery of the opening of the first channel, and the end wall of the power module housing is provided with a docking groove located on the outer periphery of the opening of the second channel, and the docking part is inserted into the docking groove.
[0015] Optionally, a sealing ring is embedded in the mating groove, and the sealing ring abuts against the outer peripheral wall of the mating part.
[0016] According to a third aspect of this application, an integrated controller is provided, including the integrated housing described in the second aspect.
[0017] Optionally, it may also include a power supply module, a DC heating electronic device, and an electronic control module, wherein the power supply module is the first electronic device, the DC heating electronic device is the second electronic device, and the electronic control module is installed inside the housing of the electronic control module.
[0018] Optionally, the electronic control module has a third heat exchange channel, which is connected to the second heat exchange channel of the integrated housing.
[0019] According to a fourth aspect of this application, a powertrain is provided, including the integrated controller described in the third aspect.
[0020] According to a fifth aspect of this application, a vehicle is provided, including the powertrain described in the fourth aspect.
[0021] In the power module housing of this application embodiment, by respectively setting a first heat exchange plate and a second heat exchange plate on the main housing, and forming a first heat exchange channel between them, the power module housing can simultaneously achieve structural compactness and heat dissipation performance within a limited space. The outer surfaces of the first and second heat exchange plates serve as mounting surfaces for the first and second electronic devices, respectively. The electronic devices are arranged vertically to avoid occupying lateral area, which can reduce the overall volume of the power module housing to a certain extent and is beneficial for modular integrated installation in a space-constrained environment. At the same time, the first heat exchange channel exchanges heat with the heat exchange plates on the upper and lower sides simultaneously when the cooling medium flows, which is equivalent to removing the working heat of two sets of electronic devices through a single channel. The heat dissipation path is efficient and compact, which can improve heat dissipation efficiency to a certain extent and keep the electronic devices operating stably in a relatively low temperature environment. In addition, the first heat exchange channel forms a relatively closed flow space through sealing processing with the main housing, which is structurally beneficial to prevent cooling medium leakage and ensure the stability and long-term reliability of the cooling circuit, thereby balancing structural compactness, heat dissipation performance, and operational reliability.
[0022] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.
[0025] Figure 1 This is an exploded view of the power module housing provided in the embodiments of this application;
[0026] Figure 2 This is a cross-sectional schematic diagram of the first heat exchange plate or the second heat exchange plate provided in the embodiments of this application;
[0027] Figure 3 This is a cross-sectional view of the integrated housing provided in the embodiments of this application;
[0028] Figure 4 This is a partial schematic diagram of the housing of the electronic control module provided in the embodiments of this application;
[0029] Figure 5This is a partial schematic diagram of the power module housing provided in the embodiments of this application;
[0030] Figure 6 This is a schematic diagram of the external structure of the integrated housing provided in the embodiments of this application;
[0031] Figure 7 This is an exploded view of the integrated housing provided in the embodiments of this application.
[0032] Explanation of reference numerals in the attached figures:
[0033] 1. Power module housing; 11. Main housing; 111. First heat exchange plate; 112. Second heat exchange plate; 113. First heat exchange channel; 1131. First region; 1132. Second region; 12. Docking groove; 121. Sealing ring; 13. Power module; 14. DC heating electronic device;
[0034] 2. Dividing reinforcement;
[0035] 3. Guide ribs;
[0036] 4. Electrical control module housing; 41. Connecting part; 42. Electrical control module; 421. Third heat exchange channel;
[0037] 5. Second heat exchange channel; 51. First channel; 52. Second channel. Detailed Implementation
[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.
[0039] Firstly, this application provides a power module housing, combined with Figure 1 , Figure 2 The power module housing 1 includes a main housing 11, a first heat exchange plate 111, and a second heat exchange plate 112. The first heat exchange plate 111 and the second heat exchange plate 112 are respectively fixedly installed at different positions on the main housing 11, and a first heat exchange channel 113 is formed between the first heat exchange plate 111 and the second heat exchange plate 112 through a structural gap.
[0040] For example, the first heat exchange channel 113 is formed by extending the gap between the first heat exchange plate 111 and the second heat exchange plate 112. It is structurally designed to allow the cooling medium to flow, so that the first heat exchange plate 111 and the second heat exchange plate 112 can be cooled simultaneously during the flow process.
[0041] Furthermore, the side of the first heat exchange plate 111 facing away from the first heat exchange channel 113 is designed as a mounting surface for a first electronic device, such as a power module 13. Similarly, the side of the second heat exchange plate 112 facing away from the first heat exchange channel 113 is also designed as a mounting surface for a second electronic device, such as a DC heating electronic device 14.
[0042] Understandably, through this design, the first and second electronic components are vertically distributed in space. Specifically, the first electronic component is mounted on the outer surface of the first heat exchange plate 111, facing away from the outer surface of the first heat exchange channel 113, while the second electronic component is mounted on the outer surface of the second heat exchange plate 112, also facing away from the outer surface of the first heat exchange channel 113. The first heat exchange channel 113 serves as a spacer between the two components. This vertical arrangement significantly reduces the lateral area occupied by the first and second electronic components within the power module housing 1, thereby reducing the overall volume of the power module housing 1 and facilitating its integration and installation in space-constrained environments.
[0043] Meanwhile, the first heat exchange channel 113 can exchange heat with the first heat exchange plate 111 and the second heat exchange plate 112 simultaneously when the cooling medium flows through it. The cooling path covers the mounting areas where the first and second electronic devices are located, which is equivalent to the first and second electronic devices exchanging heat through the same channel. Since the first heat exchange channel 113 acts on both the first and second heat exchange plates 111 and 112 on the upper and lower sides, the flow of the cooling medium in the first heat exchange channel 113 carries away the working heat of the first and second electronic devices, thereby improving the heat dissipation efficiency to a certain extent and ensuring that the first and second electronic devices operate stably under relatively low temperature conditions.
[0044] It should be noted that the first heat exchange channel 113 formed between the first heat exchange plate 111 and the second heat exchange plate 112 can be structurally understood as a relatively closed flow space. This space is sealed to the main housing 11 through processing technology to prevent leakage of the cooling medium. Here, "away from" refers to the outer surface of the first heat exchange plate 111 or the second heat exchange plate 112 opposite to the first heat exchange channel 113, not completely separated, but rather the opposite side relative to the direction of the first heat exchange channel 113, to avoid ambiguity. Through this design, the power module housing 1 achieves a compact structure while effectively considering heat dissipation performance, and provides a modular basis for subsequent applications in integrated housings or integrated controllers.
[0045] In some implementations, combined with Figure 1 , Figure 2At least one of the first heat exchange plate 111 and the second heat exchange plate 112 is provided with a partition rib 2. The partition rib 2 extends from the inner surface of at least one of the first heat exchange plate 111 and the second heat exchange plate 112 along the length direction of the first heat exchange channel 113, dividing the first heat exchange channel 113 into a connected first region 1131 and a second region 1132.
[0046] In some embodiments, the partition rib 2 is separately provided on the first heat exchange plate 111. The partition rib 2 provided on the first heat exchange plate 111 divides the first heat exchange channel 113 into a first region 1131 and a second region 1132.
[0047] In some embodiments, the partition rib 2 is separately provided on the second heat exchange plate 112, and the partition rib 2 provided on the second heat exchange plate 112 divides the first heat exchange channel 113 into a first region 1131 and a second region 1132.
[0048] In some embodiments, a partition rib 2 is provided on the first heat exchange plate 111 and the second heat exchange plate 112 respectively, and the two partition ribs 2 are combined to separate the first heat exchange channel 113 to form a first region 1131 and a second region 1132.
[0049] For example, one of the first region 1131 and the second region 1132 is configured to communicate with the cooling medium inlet end and the other is configured to communicate with the cooling medium outlet end.
[0050] In some embodiments, the first region 1131 is configured to communicate with the cooling medium inlet end, and the second region 1132 is configured to communicate with the cooling medium outlet end.
[0051] In some embodiments, the second region 1132 is configured to communicate with the cooling medium inlet end, and the first region 1131 is configured to communicate with the cooling medium outlet end.
[0052] It is understood that the connection between the first region 1131 and the second region 1132 is located away from the inlet and / or outlet of the cooling medium. This structural arrangement ensures that after entering the first heat exchange channel 113, the cooling medium must sequentially pass through the first region 1131 and flow into the second region 1132, or through the second region 1132 and flow into the first region 1131, rather than flowing directly from the inlet to the outlet. This path extension significantly increases the residence length of the cooling medium within the first heat exchange channel 113, and also expands the coverage area of the fluid in the channel space to a certain extent, allowing the cooling medium to contact more surfaces of the first heat exchange plate 111 and the second heat exchange plate 112, thereby improving the overall heat exchange effect. Here, "away from" does not refer to the maximum absolute distance, but rather to the area spatially offset from the inlet or outlet, ensuring effective flow circulation of the fluid within the first region 1131 and the second region 1132.
[0053] In some embodiments, at least one of the first region 1131 and the second region 1132 is further provided with guide ribs 3. The length direction of the guide ribs 3 is consistent with the length direction of the first heat exchange channel 113, and multiple guide ribs 3 are arranged along the width direction of the first heat exchange channel 113. Such an arrangement of guide ribs 3 can divide the incoming cooling medium into multiple streams in the width direction, making the lateral distribution of the cooling medium in the first heat exchange channel 113 more uniform. When the cooling medium flows along the length direction of the first heat exchange channel 113, the multiple guide ribs 3 guide it to move in the same direction in the multiple divided small channels, thereby reducing turbulence and ineffective vortices during the flow process.
[0054] Understandably, this structure allows the cooling medium to cover more of the surfaces of the first heat exchange plate 111 and the second heat exchange plate 112. It also ensures that the fluid flow direction remains highly consistent within adjacent flow channel units, reducing local resistance and improving the utilization rate of the heat exchange interface. Here, "multiple" refers to an arrangement of at least two channels; the specific number can be adjusted according to the width of the first heat exchange plate 111 and the second heat exchange plate 112 and the cooling requirements. "Consistent" here does not mean absolutely parallel, but rather that they maintain the same length-direction trend in the overall flow direction.
[0055] Therefore, by simultaneously providing partition ribs 2 and guide ribs 3 in the gap between the first heat exchange plate 111 and the second heat exchange plate 112, the flow path of the cooling medium in the first heat exchange channel 113 is extended to a certain extent, and the distribution of the flow direction is more balanced. The cooling medium can form a more sufficient coverage on the surfaces of the first heat exchange plate 111 and the second heat exchange plate 112. Compared with a design that only has a straight flow channel, the structure in this embodiment can perform heat exchange with higher efficiency in a limited space, thereby improving the heat dissipation effect of electronic devices and improving the working stability of the power module housing 1 under high power density.
[0056] In some embodiments, multiple guide ribs 3 are disposed on the first heat exchange plate 111. The guide ribs 3 are spaced apart along the width direction of the first heat exchange channel 113, and their length direction is consistent with the length direction of the first heat exchange channel 113. When the cooling medium flows in the first heat exchange channel 113, the multiple guide ribs 3 on the first heat exchange plate 111 can divide the fluid into multiple fine streams in the width direction, thereby making the flow more uniform. The cooling medium can form a larger coverage area on the plate surface, which is beneficial to improving the heat exchange effect.
[0057] In some embodiments, multiple guide ribs 3 are disposed on the second heat exchange plate 112, arranged in a manner similar to the embodiments described above. Due to the flow-dividing structure formed by the guide ribs 3 on the second heat exchange plate 112, the cooling medium is also dispersed into multiple fine streams in the width direction when passing through the first heat exchange channel 113, and maintains a relatively consistent flow trend in the length direction. This structural arrangement reduces the turbulence generated by the cooling medium in local areas to a certain extent, and can increase the heat exchange contact area with the plate surface while maintaining the overall flow rate stability.
[0058] In some embodiments, among the multiple guide ribs 3, an adjacent guide rib 3 is arranged on the first heat exchange plate 111, and the next adjacent guide rib 3 is arranged on the second heat exchange plate 112. This staggered arrangement allows the cooling medium to be dispersed not only in the width direction but also to form an alternating guiding effect in the height direction during flow. The flow of the cooling medium between the first heat exchange plate 111 and the second heat exchange plate 112 is more complete, the local dead zone area is reduced to a certain extent, and the overall heat exchange efficiency of the fluid is further improved. Here, "staggered" does not refer to an absolutely symmetrical arrangement, but rather to a spatial distribution that shows an alternating arrangement of the first heat exchange plate 111 and the second heat exchange plate 112.
[0059] Through the various arrangements of the guide ribs 3 described above, the flow path of the cooling medium in the first heat exchange channel 113 is more reasonable, and the flow direction is more stable, enabling the cooling medium to form a wider contact interface with the first heat exchange plate 111 and the second heat exchange plate 112. This design provides flexible options for different application scenarios and, to a certain extent, helps to improve the heat dissipation performance of the power module housing 1 in a compact structure.
[0060] Secondly, referring to Figures 1 to 7 This application also provides an integrated housing, including a power module housing 1 as described in the first aspect.
[0061] In some implementations, combined with Figure 6 The integrated housing also includes an electronic control module housing 4, which is connected to the power supply module housing 1.
[0062] For example, refer to Figure 1 , Figure 3 A second heat exchange channel 5 is formed between the power module housing 1 and the electronic control module housing 4. The first end of the second heat exchange channel 5 is connected to the first heat exchange channel 113, so that the cooling medium can continue to flow into the second heat exchange channel 5 after flowing through the first heat exchange channel 113. The second end of the second heat exchange channel 5 is configured to be connected to the electronic control module 42 inside the electronic control module housing 4, so that the cooling medium performs temperature control on the power module 13 and the electronic control module 42 in one loop.
[0063] For example, the second heat exchange channel 5 is formed by two parts. Specifically, the power module housing 1 has a first channel 51 reserved during the integral molding process. This first channel 51 is adjacent to or connected to the first heat exchange channel 113 to ensure that the cooling medium can enter smoothly. The electronic control module housing 4 also has a second channel 52 reserved during the integral molding process. The layout of the second channel 52 corresponds to the mounting area of the electronic control module 42, so that the cooling medium can cover the main heat dissipation surface of the electronic control module 42 when flowing through this area. The first channel 51 and the second channel 52 are interconnected at the connection point of the integrated housing to form a continuous second heat exchange channel 5.
[0064] It is worth noting that "one-piece molding" does not mean that there is no possibility of splicing or welding structures. Rather, it means that during the manufacturing process, the first channel 51 and the second channel 52 are integrated with the shell body in the overall processing technology, reducing the amount of additional parts used, thereby improving the structural compactness and fluid sealing performance.
[0065] Through the above structural design, after the cooling medium enters the first heat exchange channel 113, it first exchanges heat with the first heat exchange plate 111 and the second heat exchange plate 112, carrying away the heat generated by the power module 13 and related electronic components. Subsequently, the cooling medium continues to enter the electronic control module 42 through the second heat exchange channel 5, where it exchanges heat with the electronic control module 42 in the mounting area, completing further temperature regulation. This cooling loop path is beneficial to improving the utilization rate of the cooling medium to a certain extent, because the same volume of cooling medium can continuously contact two types of electronic components with different functions, thereby forming a composite heat dissipation solution in a compact space.
[0066] On the other hand, the connection between the electronic control module housing 4 and the power module housing 1 is not merely a simple mechanical fixation, but also serves to connect cooling channels. In this design, both the electronic control module 42 and the power module 13 are core components of the controller system, and both generate heat during operation. If the two parts use completely independent cooling structures, multiple independent flow channels or additional cooling pipes would be required, increasing system complexity and occupying installation space. However, by using an integrated housing, the two parts are connected in the cooling circuit through the second heat exchange flow channel 5, reducing the need for additional flow channel design, making the cooling structure more compact, and facilitating installation and maintenance.
[0067] It should be further explained that the specific location where the first end of the second heat exchange channel 5 connects to the first heat exchange channel 113 can be adjusted according to actual heat dissipation requirements. For example, the first end of the second heat exchange channel 5 can be located near the inlet of the first heat exchange channel 113, so that the cooling medium first enters the area of the electronic control module 42 and then flows into the area of the power module 13; or it can be located near the outlet of the first heat exchange channel 113, so that the cooling medium first flows through the area of the power module 13 and then enters the area of the electronic control module 42. Different flow path selections are beneficial for optimizing the matching according to the heat dissipation requirements of the power devices and the electronic control module 42. The flow direction of the cooling medium may vary in different embodiments, but the basic principle is the same: the two electronic components are continuously cooled in one loop through the second heat exchange channel 5.
[0068] In summary, the integrated housing, through the integrated design of the power module housing 1 and the electronic control module housing 4, forms a continuous cooling channel structure within a limited volume, allowing the cooling medium to sequentially cover the heat dissipation surfaces of the power module 13 and the electronic control module 42, carrying away heat. This is beneficial to improving heat dissipation efficiency and enhancing the working stability of the devices, while also providing a more compact and reasonable layout scheme for the vehicle control system.
[0069] In some implementations, combined with Figure 4 , Figure 5The end wall of the power control module housing 4 is provided with a docking part 41, which is located at the outer periphery of the opening of the first channel 51. The end wall of the power module housing 1 is provided with a docking groove 12, which is located at the outer periphery of the opening of the second channel 52. The docking part 41 and the docking groove 12 form a plug-in mating relationship. Through this structural arrangement, the first channel 51 and the second channel 52 can form a continuous cooling flow path when the modules are docked, which is beneficial to the stable flow of the cooling medium between the two modules. The docking part 41 and the docking groove 12 adopt a plug-in structure, which, compared with a simple planar docking method, can increase the assembly stability of the docking position to a certain extent, avoid the misalignment of the channel opening affecting the flow of the cooling medium, and has a beneficial docking guidance effect.
[0070] For example, a sealing ring 121 is embedded inside the docking groove 12, and the sealing ring 121 abuts against the outer peripheral wall of the docking portion 41. This design allows an annular sealing interface to be formed at the channel opening during the docking process between the docking portion 41 and the docking groove 12. Because the sealing ring 121 is in contact with the outer wall of the docking portion 41, it can, to a certain extent, prevent the cooling medium from leaking out from the docking point, thereby improving the sealing performance at the docking point of the first channel 51 and the second channel 52, and ensuring that the flow of the cooling medium remains within a predetermined path range.
[0071] Through the above structural arrangement, the first channel 51 and the second channel 52 achieve a sealing effect while being plugged in, thus balancing assembly stability and the airtightness of cooling medium flow. It should be further explained that the plugging direction of the mating part 41 and the mating groove 12 is perpendicular to the thickness direction of the integrated shell. The plugging fit means that the mating part 41 slides into the inner wall of the mating groove 12 and abuts against the sealing ring 121 under a certain insertion force, thereby simultaneously playing a role in mechanical positioning and sealing performance.
[0072] This structural approach is beneficial for the integrated design of modular electronic control and power supply. On the one hand, it ensures channel continuity at the structural level, and on the other hand, it improves the stability of cooling performance at the functional level. This implementation method can, to a certain extent, enhance the durability and reliability of the integrated housing during long-term use, making the overall structure more suitable for cooling requirements under complex operating conditions.
[0073] Thirdly, combining Figures 1 to 7 This application also provides an integrated controller, including an integrated housing in the second aspect.
[0074] In some implementations, such as Figure 3 , Figure 7As shown, the integrated controller also includes a power supply module 13, a DC heating electronic device 14, and an electronic control module 42. The power supply module 13 is the first electronic device, the DC heating electronic device 14 is the second electronic device, and the electronic control module 42 is installed inside the electronic control module housing 4.
[0075] For example, the electronic control module 42 has a third heat exchange channel 421, which is connected to the second heat exchange channel 5 of the integrated housing. By setting the third heat exchange channel 421 in the electronic control module 42, the components in the electronic control module 42 can also be cooled accordingly, thereby further improving the operating effect of the components in the integrated controller.
[0076] Fourthly, in combination Figures 1 to 7 This application also provides a powertrain including an integrated controller in a third aspect.
[0077] Fifthly, in combination Figures 1 to 7 This application also provides a vehicle including a powertrain in the fourth aspect.
[0078] The vehicle may be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this application does not make any specific restrictions.
[0079] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0080] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0081] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.
[0082] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.
Claims
1. A power module housing, characterized in that, The device includes a main housing, a first heat exchange plate, and a second heat exchange plate. Both the first and second heat exchange plates are disposed on the main housing. A first heat exchange channel is formed between the first and second heat exchange plates. The surface of the first heat exchange plate facing away from the first heat exchange channel is configured to mount a first electronic device, and the surface of the second heat exchange plate facing away from the first heat exchange channel is configured to mount a second electronic device.
2. The power module housing according to claim 1, characterized in that, At least one of the first heat exchange plate and the second heat exchange plate is provided with a partition rib, which divides the first heat exchange channel into a first region and a second region that are connected to each other; wherein, one of the first region and the second region is configured to be connected to the cooling medium inlet end and the other is configured to be connected to the cooling medium outlet end, and the connection between the first region and the second region is configured to be away from the cooling medium inlet end and / or the cooling medium outlet end.
3. The power module housing according to claim 2, characterized in that, At least one of the first region and the second region is provided with flow guide ribs. Multiple flow guide ribs are arranged along the width direction of the first heat exchange channel, and the length direction of the flow guide ribs is consistent with the length direction of the first heat exchange channel.
4. The power module housing according to claim 3, characterized in that, Multiple flow guide ribs are provided on the first heat exchange plate body; Alternatively, multiple of the aforementioned guide ribs may be disposed on the second heat exchange plate. Alternatively, among the multiple guide ribs, one adjacent guide rib is disposed on the first heat exchange plate, and the other adjacent guide rib is disposed on the second heat exchange plate.
5. An integrated housing, characterized in that, Includes the power module housing as described in any one of claims 1 to 4.
6. The integrated housing according to claim 5, characterized in that, It also includes an electronic control module housing, which is connected to the power supply module housing.
7. The integrated housing according to claim 6, characterized in that, A second heat exchange channel is formed between the electronic control module housing and the power module housing. The first end of the second heat exchange channel is connected to the first heat exchange channel, and the second end of the second heat exchange channel is configured to be connected to the electronic control module installed inside the electronic control module housing.
8. The integrated housing according to claim 7, characterized in that, The power module housing is integrally formed with a first channel, and the electronic control module housing is integrally formed with a second channel. The first channel and the second channel are connected to form the second heat exchange channel.
9. The integrated housing according to claim 8, characterized in that, The end wall of the electronic control module housing is provided with a docking part located on the outer periphery of the opening of the first channel, and the end wall of the power module housing is provided with a docking groove located on the outer periphery of the opening of the second channel. The docking part and the docking groove are inserted into each other.
10. The integrated housing according to claim 9, characterized in that, A sealing ring is embedded in the docking groove, and the sealing ring abuts against the outer peripheral wall of the docking part.
11. An integrated controller, characterized in that, Includes the integrated housing as described in any one of claims 5 to 10.
12. The integrated controller according to claim 11, characterized in that, It also includes a power supply module, a DC heating electronic device, and an electronic control module. The power supply module is the first electronic device, the DC heating electronic device is the second electronic device, and the electronic control module is installed inside the housing of the electronic control module.
13. The integrated controller according to claim 12, characterized in that, The electronic control module has a third heat exchange channel, which is connected to the second heat exchange channel of the integrated housing.
14. A powertrain, characterized in that, Includes the integrated controller as described in any one of claims 11 to 13.
15. A vehicle, characterized in that, Includes the powertrain as described in claim 14.