Electronic device support

Abstract

The utility model discloses an electronic equipment support, include: first shell, be provided with first accommodating cavity in, second shell, detachably set up in first shell, second shell is provided with second accommodating cavity, second shell is provided with conductor, first circuit board, built -in first accommodating cavity, temperature regulation subassembly, including second circuit board and semiconductor refrigeration block, second circuit board and semiconductor refrigeration block all built -in second accommodating cavity and with conductor and is pasted, first circuit board and second circuit board electric connection, second circuit board and semiconductor refrigeration block electric connection. The scheme can heat or cool according to each environmental demand to electronic equipment, to satisfy the use demand under different temperature scene, because second shell and first shell are detachable connection, therefore user can install or detach second shell according to need, thereby convenient to carry and use, and also convenient for user to replace second shell or first shell.

Description

Technical Field

[0001] This utility model relates to the technical field of auxiliary accessories for electronic devices, and in particular to an electronic device bracket. Background Technology

[0002] Traditional electronic device stands have a relatively limited function, usually only used to support mobile phones or tablets, and cannot meet the diverse needs of users in different scenarios.

[0003] For example, when using a mobile phone for extended periods under high load or in hot outdoor environments, the internal chips, battery, and other components generate a significant amount of heat. If this heat cannot be dissipated in time, the phone will overheat, leading to a decrease in performance. In cold environments (such as outdoors in winter), the phone's battery will be affected by the low temperature, thus reducing its lifespan. Furthermore, traditional electronic device stands are bulky and inconvenient to carry. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides an electronic device bracket.

[0005] The technical solution adopted by this utility model to solve its technical problem is: An electronic device bracket, the electronic device bracket comprising: A first outer casing, wherein a first receiving cavity is provided inside the first outer casing; A second housing is detachably disposed on the first housing; a second receiving cavity is provided inside the second housing; and a conductor for attaching to an electronic device is provided in the second housing. A first circuit board, which is built into the first accommodating cavity; A temperature regulating component, comprising a second circuit board and a semiconductor cooling block; the second circuit board and the semiconductor cooling block are both built into the second accommodating cavity and are attached to the conductor; the first circuit board is electrically connected to the second circuit board, and the second circuit board is electrically connected to the semiconductor cooling block.

[0006] As a preferred technical solution of this utility model, the first outer shell is provided with a plurality of first conductive structures on the end face facing the first outer shell, and each of the first conductive structures is electrically connected to the first circuit board; the second outer shell is provided with a plurality of second conductive structures, and each of the second conductive structures is electrically connected to the second circuit board. Each of the first conductive structures is detachably connected to each of the second conductive structures.

[0007] As a preferred technical solution of this utility model, the first conductive structure includes a first magnetic suction element and a first conductive element; the first magnetic suction element has a first locking hole through it, the first outer shell has a first fixing hole through it communicating with the first accommodating cavity, the first conductive element is inserted into both the first locking hole and the first fixing hole, and one end of the first conductive element is electrically connected to the first circuit board. The second conductive structure includes a second conductive element and a second magnetic element for magnetic attraction with the first magnetic element; the second magnetic element has a second locking hole, the second housing has a second fixing hole communicating with the second accommodating cavity, the second conductive element is inserted into both the second locking hole and the second fixing hole, one end of the second conductive element abuts against the first conductive element, and the other end of the second conductive element is electrically connected to the second circuit board.

[0008] As a preferred technical solution of this utility model, the electronic device bracket further includes a blower, which is built into the second accommodating cavity and electrically connected to the second circuit board; the blowing direction of the blower is towards the conductor.

[0009] As a preferred technical solution of this utility model, the cavity wall of the second accommodating cavity has a plurality of ventilation holes, and each ventilation hole is arranged opposite to the blower.

[0010] As a preferred technical solution of this utility model, the electronic device bracket further includes a charging plug, which is electrically connected to the second circuit board via a conductive wire.

[0011] As a preferred technical solution of this utility model, the second outer shell includes a base and a cover plate; the second accommodating cavity is located inside the base, and the cover plate is detachably disposed on the base to block the opening of the second accommodating cavity; The conductor is detachably mounted on the cover plate.

[0012] As a preferred technical solution of this utility model, a support column is provided in the second accommodating cavity, and the support column has a second fixing hole; the conductor has a second locking hole for corresponding communication with the second fixing hole. The electronic device bracket also includes a locking member, which is detachably inserted into both the second locking hole and the second fixing hole.

[0013] In a preferred embodiment of this invention, the cover plate has a through-hole, and the conductor is located in the through-hole.

[0014] As a preferred technical solution of this utility model, the electronic device bracket further includes a heat dissipation structure, which is built into the second accommodating cavity and is in contact with the semiconductor cooling block.

[0015] Compared with the prior art, the beneficial effects of this utility model are: When the back panel of an electronic device is in contact with a conductor, the thermoelectric cooler can cool or heat the device through its cooling or heating functions. For example, in high-temperature environments, the thermoelectric cooler can quickly absorb heat from the electronic device, preventing performance degradation due to overheating; in low-temperature environments, the thermoelectric cooler can heat the electronic device, preventing battery damage due to low temperatures. This meets the needs of users in different temperature scenarios, improves the practicality and functionality of electronic device brackets, and solves the technical problem that traditional brackets cannot meet diverse needs.

[0016] Since the second shell is detachably connected to the first shell, users can quickly install or remove the second shell as needed, making it convenient to carry and use, and also making it easy for users to replace the second shell or the first shell. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a structural diagram of an electronic device bracket according to an embodiment of the present invention.

[0019] Figure 2 This is a structural cross-sectional view of the electronic device bracket according to an embodiment of the present utility model.

[0020] Figure 3 yes Figure 2 Exploded view of the structure.

[0021] Figure 4 This is an exploded view of the structure of the first and second outer shells according to an embodiment of the present invention.

[0022] Figure 5 yes Figure 4 Another perspective on the structure diagram.

[0023] 1. First outer shell; 11. First accommodating cavity; 2. Second outer shell; 21. Base; 22. Cover plate; 221. Positioning hole; 23. Second receiving cavity; 24. Conductor; 241. Second locking hole; 25. Support column; 251. Second fixing hole; 3. First circuit board; 4. Temperature control assembly; 41. Second circuit board; 42. Semiconductor cooling block; 5. First conductive structure; 51. First magnetic suction element; 52. First conductive element; 53. First locking hole; 54. First fixing hole; 6. Second conductive structure; 61. Second conductive component; 62. Second magnetic component; 63. Second locking hole; 64. Second fixing hole; 7. Hair dryer; 71. Ventilation hole; 8. Charging plug; 9. Heat dissipation structure. Detailed Implementation

[0024] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit it. It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on or indirectly on that other element. When an element is referred to as being "connected to" another element, it can be directly connected to or indirectly connected to that other element. It should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0026] The following describes in detail the specific structure of an electronic device bracket provided by an embodiment of this utility model, according to the appendix. Figure 1-5 As shown, the specific structure of the electronic device bracket includes a first housing 1, a second housing 2, a first circuit board, and a temperature regulation component 4.

[0027] It is understood that the electronic device in this embodiment of the utility model is a mobile phone or a tablet computer, and the specific type is not limited here.

[0028] The first housing 1 has a first receiving cavity 11, and the first circuit board is built into the first receiving cavity 11.

[0029] Specifically, the first outer shell 1 is the main supporting structure of the entire electronic device bracket, providing physical support to ensure the stability and robustness of the entire electronic device bracket, that is, to support the weight of the second outer shell 2, the first circuit board, the temperature regulation component 4, and the electronic device itself. The first outer shell 1 also protects the internal electronic components (such as the first circuit board) from external physical impacts, dust, liquids, etc. For example, in daily use, it can prevent the first circuit board from being damaged by accidental collisions. In addition, the first accommodating cavity 11 is used to accommodate the first circuit board, providing a precise installation position for the first circuit board, ensuring that the circuit board is firmly fixed inside the first outer shell 1 and will not affect its normal operation due to shaking.

[0030] The second housing 2 is detachably disposed on the first housing 1; the second housing 2 is provided with a second accommodating cavity 23; the second housing 2 is provided with a conductor 24 for attaching to the electronic device.

[0031] Specifically, the second housing 2 is detachable, allowing users to easily replace or repair it according to different needs. For example, if a component is damaged, only the second housing 2 needs to be replaced, without replacing the entire electronic device bracket. The second accommodating cavity 23 is mainly used to house the temperature regulating component 4. Since the temperature regulating component 4 includes a second circuit board and a semiconductor cooling block 42, such components require a relatively stable space. Therefore, assembling the second circuit board and the semiconductor cooling block 42 within the second accommodating cavity 23 ensures that such components can operate normally and are less susceptible to external interference.

[0032] Conductor 24 is used to conduct the heat or cold of the semiconductor cooling block 42 to the back cover of the electronic device. Specifically, one end of conductor 24 is in contact with the semiconductor cooling block 42 of the temperature regulating component 4, and the other end of conductor 24 is in contact with the back cover of the electronic device, thereby heating or cooling the back cover of the electronic device.

[0033] It should be noted that the larger the contact area between the conductor 24 and the back panel of the electronic device, the higher the heat or cold conduction efficiency. Therefore, the heat or cold conduction efficiency can be improved by increasing the contact area between the conductor 24 and the back panel of the mobile phone.

[0034] It is understood that the conductor 24 in this embodiment of the present invention is made of a material with high thermal conductivity, for example, the conductor 24 is made of metals such as copper and aluminum.

[0035] The temperature regulating component 4 includes a second circuit board and a semiconductor cooling block 42; both the second circuit board and the semiconductor cooling block 42 are built into the second accommodating cavity 23 and are attached to the conductor 24. The first circuit board is electrically connected to the second circuit board, and the second circuit board is electrically connected to the semiconductor cooling block 42.

[0036] Specifically, the second circuit board is the core controller of the temperature regulation component 4. It is responsible for receiving instructions from the first circuit board and controlling the operating state (cooling or heating) and power of the thermoelectric cooler 42 according to these instructions. The second circuit board is used to receive control signals from the first circuit board and send control instructions to the thermoelectric cooler 42. The thermoelectric cooler 42 is a temperature regulation element that operates based on the Peltier effect. Specifically, when current passes through the thermoelectric cooler 42, one end of the thermoelectric cooler 42 absorbs heat (cooling) and the other end of the thermoelectric cooler 42 releases heat (heating). Thus, by simply changing the direction of the current, the cooling or heating function of the thermoelectric cooler 42 can be controlled.

[0037] For example, when the user selects the cooling mode, the second circuit board controls the direction of the current, causing one end of the thermoelectric cooler 42 to absorb heat (cool) and the other end to release heat. At this time, the end of the thermoelectric cooler 42 facing the conductor 24 (the heat-absorbing end) is in close contact with the conductor 24, and the cooling energy is conducted to the back panel of the electronic device through the conductor 24, thereby reducing the temperature of the electronic device. When the user selects the heating mode, the second circuit board changes the direction of the current, causing one end of the thermoelectric cooler 42 to release heat (heat) and the other end to absorb heat. At this time, the end of the thermoelectric cooler 42 facing the conductor 24 (the heat-releasing end) is in close contact with the conductor 24, and the heat is conducted to the back panel of the electronic device through the conductor 24, thereby increasing the temperature of the electronic device. Thus, the thermoelectric cooler 42 receives control signals from the second circuit board and performs cooling or heating according to the signals.

[0038] Furthermore, the second circuit board can dynamically adjust the power of the semiconductor cooling block 42 according to user needs or a preset temperature range. For example, when the temperature of the electronic device is too high, the cooling power can be increased; when the temperature is close to the normal range, the cooling power can be reduced to save energy and avoid overcooling.

[0039] It should be noted that the Peltier effect is defined as the phenomenon where heat is absorbed and released at the ends of a thermocouple composed of two different conductors 24 when an electric current passes through it. Specifically, when current flows through a thermocouple composed of P-type and N-type semiconductors 24, the direction of the current determines the direction of heat transfer. For example, in cooling mode, when current flows from the P-type semiconductor 24 to the N-type semiconductor 24, the P-type semiconductor 24 absorbs heat, and the N-type semiconductor 24 releases heat; in heating mode, when current flows from the N-type semiconductor 24 to the P-type semiconductor 24, the N-type semiconductor 24 absorbs heat, and the P-type semiconductor 24 releases heat. Thus, the essence of the Peltier effect is the transfer of heat carried by the current within the semiconductor 24 material. When electrons move within the semiconductor 24 material, they absorb or release energy, resulting in heat transfer.

[0040] The semiconductor cooling block 42 is composed of multiple pairs of P-type and N-type semiconductor materials 24. These semiconductor materials 24 are connected together by electrodes to form a thermocouple array. When cooling, when current flows from the P-type semiconductor 24 to the N-type semiconductor 24, the P-type semiconductor 24 end absorbs heat and the N-type semiconductor 24 end releases heat. At this time, the end of the semiconductor cooling block 42 that is in contact with the conductor 24 will absorb heat, thereby reducing the temperature of the electronic device.

[0041] according to Figure 1 As shown, in some specific embodiments, the end face of the first housing 1 facing the first housing 1 is provided with a plurality of first conductive structures 5, each of which is electrically connected to the first circuit board; the second housing 2 is provided with a plurality of second conductive structures 6, each of which is electrically connected to the second circuit board; each of the first conductive structures 5 is detachably connected to each of the second conductive structures 6.

[0042] Specifically, the first conductive structure 5 and the second conductive structure 6 are used to transmit electrical energy. For example, when the first circuit board receives externally supplied electrical energy, the electrical energy is transmitted through the first conductive structure 5 to the second conductive structure 6, and then from the second conductive structure 6 to the second circuit board, thus providing power to the semiconductor cooling block 42 and other electronic components.

[0043] according to Figures 1-3As shown, specifically, the first conductive structure 5 includes a first magnetic attractor 51 and a first conductive member 52; the first magnetic attractor 51 has a first locking hole 53, the first outer shell 1 has a first fixing hole 54 communicating with the first accommodating cavity 11, the first conductive member 52 is inserted into both the first locking hole 53 and the first fixing hole 54, and one end of the first conductive member 52 is electrically connected to the first circuit board; the second conductive structure 6 includes a second conductive member 61 and a second magnetic attractor 62 for magnetic attraction with the first magnetic attractor 51; the second magnetic attractor 62 has a second locking hole 63, the second outer shell 2 has a second fixing hole 64 communicating with the second accommodating cavity 23, the second conductive member 61 is inserted into both the second locking hole 63 and the second fixing hole 64, one end of the second conductive member 61 abuts against the first conductive member 52, and the other end of the second conductive member 61 is electrically connected to the second circuit board.

[0044] Specifically, the first magnetic chuck 51 is used to attract the second magnetic chuck 62 of the second housing 2 through its generated magnetic force, thereby achieving a stable connection between the second housing 2 and the first housing 1. The first magnetic chuck 51 is a component made of magnetic material, with a first locking hole 53 passing through it for fixing the first conductive component 52. The first magnetic chuck 51 is installed on the first housing 1 and is tightly integrated with the structure of the first housing 1 to ensure its fixed position. The first conductive component 52 is used to transmit electrical energy, that is, to transmit the electrical energy generated by the first circuit board to the second circuit board. One end of the first conductive component 52 is electrically connected to the first circuit board and is simultaneously inserted into the first locking hole 53 and the first fixing hole 54 of the first housing 1 for fixation, which ensures the stable installation of the first conductive component 52.

[0045] It should be noted that one end of the first conductive element 52 is connected to the first circuit board by welding, plugging or other electrical connection methods to ensure stable power transmission. The other end of the first conductive element 52 is exposed through the first locking hole 53 for contact with the second conductive element 61, thereby realizing power transmission.

[0046] The second magnetic chuck 62 is used to attract the first magnetic chuck 51, thereby achieving a stable connection between the second outer shell 2 and the first outer shell 1. The second conductive element 61 is used to receive electrical energy transmitted from the first conductive element 52 and transmit it to the second circuit board. One end of the second conductive element 61 is exposed through the second locking hole 63 and is used to abut against the first conductive element 52. Thus, when the second outer shell 2 is installed on the first outer shell 1, the second conductive element 61 and the first conductive element 52 are in close contact, thereby achieving the transmission of electrical energy. The other end of the second conductive element 61 is connected to the second circuit board by welding, plugging or other electrical connection methods to ensure stable transmission of electrical energy.

[0047] In use, the user brings the second outer casing 2 close to the first outer casing 1. Due to the magnetic effect of the first magnetic 51 and the second magnetic 62, the first magnetic 51 and the second magnetic 62 are magnetically attracted and fixed to each other. During the attraction process, the end of the second conductive element 61 will abut against the end of the first conductive element 52. This magnetic connection is not only convenient and quick, but also ensures good contact between the two conductive elements. When the second conductive element 61 abuts against the first conductive element 52, electrical energy is transmitted through the first conductive element 52 to the second conductive element 61, and then from the second conductive element 61 to the second circuit board. This connection method ensures stable power transmission, and the magnetic force of the two magnetic elements further enhances the reliability of the connection. At this time, the electrical energy generated by the first circuit board is transmitted through the first conductive element 52 to the second conductive element 61, and then from the second conductive element 61 to the second circuit board. After receiving the electrical energy, the second circuit board distributes it to the semiconductor cooling block 42 and other electronic components so that this component can work normally.

[0048] This design makes the installation and removal of the second outer shell 2 very convenient and quick through magnetic connection. Users can simply bring it close to complete the connection and gently pull it to complete the removal. Moreover, this magnetic connection not only enhances the connection strength between the first outer shell 1 and the second outer shell 2, but also ensures good contact between conductive parts and reduces the risk of poor contact.

[0049] It is understood that the first conductive element 52 and the second conductive element 61 in this embodiment of the present invention are both copper rivets. By simultaneously inserting the copper rivets into the first locking hole 53 and the first fixing hole 54 of the first housing 1, and with one end electrically connected to the first circuit board, it is ensured that electrical energy can be transmitted from the first circuit board to the copper rivets. When the same ends of the two copper rivets abut against each other, electrical energy can be transmitted from each copper rivet to the second circuit board.

[0050] according to Figure 4 As shown, in some specific embodiments, the electronic device bracket also includes a blower 7, which is built into the second accommodating cavity 23 and electrically connected to the second circuit board; the blowing direction of the blower 7 is toward the conductor 24.

[0051] Specifically, the blower 7, the semiconductor cooling block 42, and the second circuit board are all built into the second accommodating cavity 23 of the second housing 2. This arrangement allows the blower 7 to be tightly integrated with the temperature regulation component 4 for easy collaborative operation. The second circuit board sends control signals to the blower 7. These signals can be simple switching signals or PWM (pulse width modulation) signals to adjust the fan speed of the blower 7. At the same time, the blower 7 receives electrical energy, such as DC power, through the second circuit board. Therefore, the circuit board can adjust the power supply voltage or current as needed to control the fan speed and power of the blower 7.

[0052] In this embodiment of the invention, the airflow direction of the blower 7 is directed towards the conductor 24. This configuration ensures that the airflow directly acts on the back panel of the electronic device, enhancing the heat dissipation effect. For example, in cooling mode, the airflow generated by the blower 7 can accelerate the flow of cold air, quickly transferring the cooling energy generated by the semiconductor cooling block 42 to the surface of the back panel of the electronic device, thereby improving cooling efficiency. Conversely, in heating mode, the blower 7 can evenly distribute the heat generated by the semiconductor cooling block 42 to the surface of the back panel of the electronic device, thereby preventing localized overheating.

[0053] It is understood that the blower 7 in this embodiment of the present invention is a small DC fan.

[0054] according to Figure 5 As shown, in a further embodiment, the cavity wall of the second accommodating cavity 23 is provided with a plurality of ventilation holes 71, each ventilation hole 71 being disposed opposite to the blower 7.

[0055] Specifically, the main function of the ventilation holes 71 is to promote airflow within the second accommodating cavity 23. When the blower 7 is operating, the airflow generated by the blower 7 blows towards the conductor 24, and each ventilation hole 71 provides a passage for this airflow, allowing air to form convection within the cavity. Furthermore, through each ventilation hole 71, hot air can be quickly exhausted from the second accommodating cavity 23, while cold air can enter the cavity, thereby accelerating heat dissipation. This convection significantly improves heat dissipation efficiency, especially in cooling mode, enabling rapid reduction of the temperature of electronic equipment.

[0056] according to Figures 1-2 As shown, in some specific embodiments, the electronic device bracket also includes a charging plug 8, which is electrically connected to the second circuit board via a conductive wire.

[0057] Specifically, the charging plug 8 draws power from the second circuit board via conductive wires. Since the first circuit board is connected to an external power source (such as a power bank) and distributes power to the charging plug 8 and the temperature regulation component 4, the second circuit board can adjust the voltage and current output to the charging plug 8 according to the needs of the electronic device. Thus, when the charging plug 8 is connected to the charging port of the electronic device, it can provide power to the electronic device for fast charging.

[0058] During use, if the temperature of the electronic device is too high, the second circuit board activates the semiconductor cooling block 42 and the blower 7 to prevent the electronic device from overheating. When the temperature of the electronic device is too low, the second circuit board activates the heating function of the semiconductor cooling block 42 and simultaneously activates the blower 7 to evenly distribute heat to the surface of the electronic device.

[0059] according to Figure 4As shown, in some specific embodiments, the second housing 2 includes a base 21 and a cover plate 22; the second accommodating cavity 23 is located inside the base 21, and the cover plate 22 is detachably disposed on the base 21 to block the opening of the second accommodating cavity 23; the conductor 24 is detachably disposed on the cover plate 22.

[0060] Specifically, the separate design of the base 21 and the cover 22 makes the second housing 2 highly modular, facilitating assembly and maintenance. Therefore, different covers 22 or conductors 24 can be replaced as needed. This design facilitates mass production and quality control for manufacturers, thereby reducing production costs. Since the cover 22 is removable, users can easily replace or maintain the conductor 24, extending the overall product lifespan. It also facilitates cleaning of the cover 22 and conductor 24, maintaining good contact performance.

[0061] It should be noted that the sealing between the cover plate 22 and the base 21 can effectively prevent dust and moisture from entering the second accommodating cavity 23, protect the internal components from the influence of the external environment, and prevent the leakage of heat or cold generated by the internal components, thereby improving the temperature regulation efficiency.

[0062] Since conductor 24 is also removable, users can replace conductor 24 as needed, making it easier to clean and maintain conductor 24. Furthermore, users can replace conductor 24 regularly to ensure its good thermal conductivity.

[0063] With this configuration, users can easily replace the cover plate 22 or conductor 24 or maintain internal components as needed.

[0064] according to Figures 4-5 As shown, in a further embodiment, a support column 25 is provided in the second accommodating cavity 23, and the support column 25 has a second fixing hole 64; the conductor 24 has a second locking hole 63 for corresponding communication with the second fixing hole 64; the electronic device bracket also includes a locking member, which is detachably inserted into the second locking hole 63 and the second fixing hole 64.

[0065] Specifically, the support post 25 is located within the second accommodating cavity 23, providing stable support for the conductor 24 and ensuring that the conductor 24 will not loosen or shift during operation. The second fixing hole 64 on the support post 25 is used to position the conductor 24, ensuring that the conductor 24 can be accurately aligned during installation and avoiding poor contact due to positional deviation. The second fixing hole 64 is formed on the support post 25 and is used to communicate with the second locking hole 63 on the conductor 24. By inserting the locking element into the second fixing hole 64 and the second locking hole 63, the conductor 24 can be firmly fixed to the support post 25. Place conductor 24 on cover plate 22, ensuring that the second locking hole 63 of conductor 24 is aligned with the second fixing hole 64 of support post 25. At this time, the position between conductor 24 and support post 25 is accurate. Then, insert locking member into the second locking hole 63 of conductor 24 and the second fixing hole 64 of support post 25 at the same time. Since the size and shape of locking member need to match the second locking hole 63 and the second fixing hole 64, it can be ensured that locking member can be smoothly inserted and firmly fixed conductor 24. Then, by tightening locking member, conductor 24 is firmly fixed to support post 25, thereby ensuring tight contact between conductor 24 and support post 25 and avoiding poor contact or reduced heat conduction efficiency due to loosening.

[0066] It is understood that the second fixing hole 64 in this embodiment of the present invention is a screw hole and the locking element is a bolt.

[0067] according to Figure 4 As shown, in a further embodiment, the cover plate 22 has a through-hole 221, and the conductor 24 is located in the through-hole 221.

[0068] Specifically, the main function of the positioning hole 221 is to ensure that the conductor 24 is accurately positioned on the cover plate 22. By inserting the conductor 24 into the positioning hole 221, the position of the conductor 24 can be precisely fixed, making it in close contact with the back panel of the mobile phone. The size of the positioning hole 221 needs to be precisely matched with the size of the conductor 24 to ensure that the conductor 24 can be smoothly inserted and fixed in the hole. Thus, the positioning hole 221 is not only used to align the conductor 24, but also to fix the conductor 24. By assembling the conductor 24 into the positioning hole 221, it can be ensured that the conductor 24 will not loosen or shift during operation.

[0069] It is understood that the shape of the positioning hole 221 in this embodiment of the present invention can be circular, square or other shapes, and the specific shape depends on the conductor 24.

[0070] according to Figure 4 As shown, in some specific embodiments, the electronic device bracket further includes a heat dissipation structure 9, which is built into the second accommodating cavity 23 and is attached to the semiconductor cooling block 42.

[0071] Specifically, the heat dissipation structure 9 is built into the second accommodating cavity 23. Since the heat dissipation structure 9 is in close contact with the thermoelectric cooler 42, this arrangement ensures that the heat dissipation structure 9 can directly contact the heat-generating surface of the thermoelectric cooler 42, thereby efficiently conducting and dissipating heat. For example, when the thermoelectric cooler 42 is working, one end of the thermoelectric cooler 42 will absorb heat (cooling) and the other end will release heat (heating). At this time, the heat on the heat-generating surface needs to be dissipated in time to avoid the temperature from being too high, which would cause the performance of the thermoelectric cooler 42 to degrade or be damaged. Since the heat dissipation structure 9 is in close contact with the heat-generating surface of the thermoelectric cooler 42, the heat can be efficiently conducted to the heat dissipation structure 9.

[0072] It is understood that the heat dissipation structure 9 of this utility model embodiment is made of a material with high thermal conductivity (such as aluminum or copper), so it can quickly conduct heat from the semiconductor cooling block 42 to the entire heat dissipation structure 9.

[0073] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An electronic device bracket, characterized in that, The electronic device bracket includes: A first outer casing, wherein a first receiving cavity is provided inside the first outer casing; A second housing is detachably disposed on the first housing; a second receiving cavity is provided inside the second housing; and a conductor for attaching to an electronic device is provided in the second housing. A first circuit board, which is built into the first accommodating cavity; A temperature regulating component, comprising a second circuit board and a semiconductor cooling block; the second circuit board and the semiconductor cooling block are both built into the second accommodating cavity and are attached to the conductor; the first circuit board is electrically connected to the second circuit board, and the second circuit board is electrically connected to the semiconductor cooling block.

2. The electronic device bracket according to claim 1, characterized in that, The first housing has a plurality of first conductive structures on its end face facing the first housing, and each of the first conductive structures is electrically connected to the first circuit board; the second housing has a plurality of second conductive structures, and each of the second conductive structures is electrically connected to the second circuit board. Each of the first conductive structures is detachably connected to each of the second conductive structures.

3. The electronic device bracket according to claim 2, characterized in that, The first conductive structure includes a first magnetic suction element and a first conductive element; the first magnetic suction element has a first locking hole, the first outer shell has a first fixing hole communicating with the first accommodating cavity, the first conductive element is inserted into both the first locking hole and the first fixing hole, and one end of the first conductive element is electrically connected to the first circuit board. The second conductive structure includes a second conductive element and a second magnetic element for magnetic attraction with the first magnetic element; the second magnetic element has a second locking hole, the second housing has a second fixing hole communicating with the second accommodating cavity, the second conductive element is inserted into both the second locking hole and the second fixing hole, one end of the second conductive element abuts against the first conductive element, and the other end of the second conductive element is electrically connected to the second circuit board.

4. The electronic device bracket according to claim 1, characterized in that, The electronic device bracket also includes a blower, which is built into the second accommodating cavity and electrically connected to the second circuit board; the blower blows air in the direction of the conductor.

5. The electronic device bracket according to claim 4, characterized in that, The second accommodating cavity has multiple ventilation holes through its cavity wall, and each ventilation hole is arranged opposite to the blower.

6. The electronic device bracket according to claim 1, characterized in that, The electronic device bracket also includes a charging plug, which is electrically connected to the second circuit board via a conductive wire.

7. The electronic device bracket according to claim 1, characterized in that, The second housing includes a base and a cover plate; the second accommodating cavity is located inside the base, and the cover plate is detachably disposed on the base to block the opening of the second accommodating cavity; The conductor is detachably mounted on the cover plate.

8. The electronic device bracket according to claim 7, characterized in that, The second accommodating cavity is provided with a support column, and the support column has a second fixing hole; the conductor has a second locking hole that communicates with the second fixing hole. The electronic device bracket also includes a locking member, which is detachably inserted into both the second locking hole and the second fixing hole.

9. The electronic device bracket according to claim 7, characterized in that, The cover plate has a through-hole, and the conductor is located in the through-hole.

10. The electronic device bracket according to claim 1, characterized in that, The electronic device bracket also includes a heat dissipation structure, which is built into the second accommodating cavity and is attached to the semiconductor cooling block.

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