A water-cooled heat sink incorporating a magnetic fluid application

Abstract

The utility model discloses a water -cooled radiator containing magnetic fluid application, including support subassembly, magnetic flow subassembly and water cooling subassembly, magnetic flow subassembly is located in the inner side wall of support subassembly, and water cooling subassembly is located between support subassembly and magnetic flow subassembly, and it is convenient for the heat dissipation of case, and magnetic flow subassembly includes first accommodating cavity, magnet and microphone transmission block, first accommodating cavity is set up in the inner side wall of support subassembly, and magnet is located the upper surface of first accommodating cavity, and microphone transmission block is located the inner side wall of first accommodating cavity, and magnetic fluid is composed of two kinds of fluid, can produce regular or random jumping effect under the drive of electromagnetic fluctuation and the sound signal received by microphone transmission block, and its flow path and speed can be dynamically adjusted. This active control ability makes magnetic fluid can more accurately match the instantaneous heat demand of heat source, and quickly transfers heat from the heat conduction plate to the radiating fin.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, specifically a water-cooled radiator with magnetic fluid application. Background Technology

[0002] As the performance of electronic devices continues to improve, their heat generation is also increasing exponentially, making it difficult for traditional cooling technologies to meet the heat dissipation needs of high-power devices. At the same time, consumers' aesthetic demands for electronic devices (especially PC cases) are becoming increasingly diversified, requiring not only efficient heat dissipation but also unique visual appeal and interactive experiences. However, current technologies still have significant limitations in combining these two aspects. Current mainstream water-cooling radiators transfer heat from heat sources (such as CPUs and GPUs) to radiators through circulating coolant. Their core advantage lies in their superior heat dissipation efficiency compared to air cooling, but their function is highly singular. The flow of coolant only serves the function of heat exchange and lacks dynamic visual expression; the appearance design of water blocks usually relies on static lighting (such as RGB LEDs), resulting in a fixed visual effect that cannot interact with the user or environment in real time. In addition, the coolant in traditional water-cooling systems is mostly in a single phase (such as water or ethylene glycol), which cannot transmit additional information or enhance heat dissipation efficiency through changes in physical state. To address this issue, the inventors propose a water-cooling radiator incorporating magnetic fluid applications. Summary of the Invention

[0003] To address the shortcomings of the aforementioned technologies, this invention provides a water-cooled radiator with magnetic fluid application.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a water-cooled radiator with magnetic fluid application, comprising a support assembly, a magnetic fluid assembly, and a water-cooling assembly. The magnetic fluid assembly is disposed on the inner sidewall of the support assembly, and the water-cooling assembly is located between the support assembly and the magnetic fluid assembly to facilitate heat dissipation from the chassis. The magnetic fluid assembly includes a first receiving cavity, a magnet, and a microphone transmission block. The first receiving cavity is opened on the inner sidewall of the support assembly, the magnet is disposed on the upper surface of the first receiving cavity, and the microphone transmission block is disposed on the inner sidewall of the first receiving cavity.

[0005] As a further explanation, the system also includes a magnetic flux placement plate and a magnetic fluid, wherein the magnetic flux placement plate is disposed on the upper surface of the support assembly, the magnetic fluid is disposed inside the magnetic flux placement plate, and the upper surface of the magnetic flux placement plate is provided with a cover for sealing.

[0006] As further explained, the water-cooling assembly includes a heat-conducting plate and heat dissipation fins. The heat-conducting plate is disposed on the upper surface of the support assembly, and the heat dissipation fins are disposed on the inner sidewall of the heat-conducting plate.

[0007] As a further explanation, the upper surface of the heat-conducting plate is provided with a water pump mechanism, and the inner sidewall of the water pump mechanism is provided with a second receiving cavity.

[0008] As further explained, a motor is provided on the inner sidewall of the second accommodating cavity, and a connecting housing is provided on the upper surface of the water pump mechanism.

[0009] As a further explanation, one end of the water pump mechanism is provided with a water inlet connector, and the other end of the water pump mechanism is provided with a drain connector corresponding to the water inlet connector.

[0010] As further explained, one end of the water inlet connector is provided with a water inlet pipe, and one end of the drain connector is provided with a water outlet pipe.

[0011] As further explained, the support assembly includes a top cover, an outer appearance component, and a support plate. The outer appearance component is disposed on the upper surface of the support plate, the top cover is disposed on the upper surface of the outer appearance component, the first receiving cavity is located on the inner sidewall of the outer appearance component, the magnetofluid placement plate is located on the upper surface of the outer appearance component, and the heat-conducting plate is located on the upper surface of the support plate.

[0012] In summary, this utility model has the following beneficial effects: This utility model provides a water-cooled radiator incorporating magnetic fluid. The magnetic fluid consists of two fluids that, driven by electromagnetic fluctuations and sound signals received by a microphone transmission block, can produce a regular or random pulsating effect. Its flow path and speed can be dynamically adjusted. This active control capability allows the magnetic fluid to more accurately match the instantaneous heating requirements of heat sources (such as CPUs / GPUs), quickly transferring heat from the heat-conducting plate to the heat dissipation fins. Simultaneously, the microparticle structure of the magnetic fluid itself makes its thermal conductivity superior to traditional coolants. Combined with the forced circulation driven by the motor in the water pump mechanism (forming a complete circulation through the inlet pipe and drain connector), it further enhances heat exchange efficiency, effectively addressing the exponential heating problem of high-power devices. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of a water-cooled radiator with magnetic fluid application according to this utility model; Figure 2 This is an exploded view of a water-cooled radiator with magnetic fluid application according to this utility model; Figure 3 This is a schematic diagram of the inner wall structure of a water-cooled radiator with magnetic fluid application according to this utility model; Figure 4 This is a schematic diagram of the internal structure of a water-cooling component in a water-cooled radiator with magnetic fluid application according to this utility model. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] like Figure 1-4 As shown, this utility model discloses a water-cooled radiator incorporating magnetic fluid application, comprising a support assembly, a magnetic fluid assembly, and a water-cooling assembly. The magnetic fluid assembly is disposed on the inner wall of the support assembly, and the water-cooling assembly is located between the support assembly and the magnetic fluid assembly to facilitate heat dissipation from the chassis. The magnetic fluid assembly includes a first receiving cavity 201, a magnet 22, and a microphone transmission block 23. The first receiving cavity 201 is formed on the inner wall of the support assembly, the magnet 22 is disposed on the upper surface of the first receiving cavity 201, and the microphone transmission block 23 is disposed on the inner wall of the first receiving cavity 201. It also includes a magnetic fluid placement plate 21 and a magnetic fluid 24. The magnetic fluid placement plate 21 is disposed on the upper surface of the support assembly, and the magnetic fluid 24 is disposed inside the magnetic fluid placement plate 21. The upper surface of the magnetic fluid placement plate 21 is provided with a sealing cover 25. The magnetic fluid placement plate 21 and the cover 25 form a closed space, ensuring the stable suspension of the magnetic fluid 24 and preventing leakage, while the dynamic effect of the magnetic fluid 24 is displayed through the transparent cover.

[0016] Specifically, the magnet 22 disposed on the upper surface of the first receiving cavity 201 can generate a stable magnetic field. When the device is powered on, the magnetic field strength or direction of the magnet 22 can be dynamically adjusted through an external circuit. The change in the magnetic field will act on the fluid, causing it to produce regular "jumping" or flow under the action of the magnetic field, forming microscopic fluid motion. This motion can enhance the heat exchange efficiency between the fluid and the surrounding environment (such as the inner wall of the first receiving cavity 201 and the magnetofluid placement plate 21), and at the same time, the fluid motion disturbs the surrounding air, promoting air convection.

[0017] The microphone transmission block 23, located on the inner wall of the first receiving cavity 201, can receive external sound signals and convert the mechanical vibrations (sound waves) of the sound into micro-vibrations of the transmission block. This vibration directly acts on the fluid, causing it to produce a "jumping" or localized flow that matches the frequency of the sound waves. The sound-driven fluid motion can further refine the heat exchange area of ​​the fluid, especially for local high-temperature points, accelerating heat dissipation through the micro-motion of the fluid.

[0018] The water-cooling assembly includes a heat-conducting plate 310 and heat dissipation fins 311. The heat-conducting plate 310 is disposed on the upper surface of the support assembly, and the heat dissipation fins 311 are disposed on the inner sidewall of the heat-conducting plate 310. A water pump mechanism 31 is disposed on the upper surface of the heat-conducting plate 310, and a second receiving cavity 32 is formed on the inner sidewall of the water pump mechanism. A motor 33 is disposed on the inner sidewall of the second receiving cavity 32, and a connecting housing 34 is disposed on the upper surface of the water pump mechanism 31. One end of the water pump mechanism 31 is provided with a water inlet connector 303, and the other end of the water pump mechanism 31 is provided with a drain connector 304 corresponding to the water inlet connector 303. One end of the water inlet connector 303 is provided with a water inlet pipe 302, and one end of the drain connector 304 is provided with a water outlet pipe 301.

[0019] Specifically, the heatsink 310 is tightly attached to the upper surface of the support assembly (support plate 12) and comes into direct contact with heat-generating components (such as the CPU) inside the chassis. The heatsink 310 is made of a highly thermally conductive material (such as copper or aluminum), which can quickly absorb the heat generated by the heat-generating components and transfer the heat to the internal coolant.

[0020] The water pump mechanism 31 on the upper surface of the heat-conducting plate 310 is the power source for the circulation of coolant. A motor 33 is installed in the second receiving cavity 32 inside the water pump mechanism 31. The motor 33 drives the internal impeller to rotate (not shown), generating negative pressure to draw low-temperature coolant from the water inlet connector 303 (the water inlet connector 303 is connected to the external cold end, such as the heat dissipation fins 311, through the water inlet pipe 302), and at the same time discharges the high-temperature coolant after absorbing heat from the drain connector 304 (the drain connector 304 is connected to the heat dissipation fins 311 through the water outlet pipe 301).

[0021] The heat-conducting plate 310 has heat dissipation fins 311 inside, which increase the contact area with the air and dissipate some of the heat into the environment through natural convection or forced convection (such as with the assistance of the chassis fan).

[0022] Coolant is drawn in through inlet connector 303, pressurized by water pump, discharged through drain connector 304, and flows into external heat dissipation system (such as radiator or water tank) through outlet pipe 301. After cooling, it returns to water pump through inlet pipe 302, forming a closed loop circulation that continuously removes the heat accumulated on heat conduction plate 310.

[0023] The support assembly includes an outer surface component 11 and a support plate 12. The outer surface component 11 is disposed on the upper surface of the support plate 12. The first receiving cavity 201 is located on the inner sidewall of the outer surface component 11. The magnetofluid placement plate 21 is located on the upper surface of the outer surface component 11. The heat-conducting plate 310 is located on the upper surface of the support plate 12.

[0024] Specifically, the outer component 11 is fixed to the upper surface of the support plate 12, and its inner sidewall has a first receiving cavity 201 (for installing the magnetohydrodynamic assembly), and the upper surface is provided with a magnetohydrodynamic placement plate 21 (to carry the magnetohydrodynamic fluid); the support plate 12 serves as the bottom base, and a heat-conducting plate 310 (closely attached to the heating element) is installed on its upper surface to provide structural support for the entire heat sink. The core function of the support component is to integrate the magnetohydrodynamic assembly and the water-cooling assembly to ensure their stable operation.

[0025] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0026] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A water-cooled radiator for magnetic fluid applications, characterized in that: Including support components; A magnetic flux assembly, wherein the magnetic flux assembly is disposed on the inner sidewall of the support assembly; Water-cooled components; The water-cooling component is located between the support component and the magnetohydrodynamic component, which facilitates heat dissipation from the chassis; The magnetohydrodynamic assembly includes a first receiving cavity, a magnet, and a microphone transmission block. The first receiving cavity is formed in the inner wall of the support assembly, the magnet is disposed on the upper surface of the first receiving cavity, and the microphone transmission block is disposed in the inner wall of the first receiving cavity.

2. A water-cooled radiator for magnetic fluid applications according to claim 1, characterized in that: It also includes a magnetic flux placement plate and a magnetic fluid, the magnetic flux placement plate being disposed on the upper surface of the support assembly, the magnetic fluid being disposed inside the magnetic flux placement plate, and the upper surface of the magnetic flux placement plate being provided with a cover for sealing.

3. A water-cooled radiator for magnetic fluid applications according to claim 2, characterized in that: The water-cooling assembly includes a heat-conducting plate and heat dissipation fins. The heat-conducting plate is disposed on the upper surface of the support assembly, and the heat dissipation fins are disposed on the inner sidewall of the heat-conducting plate.

4. A water-cooled radiator for magnetic fluid applications according to claim 3, characterized in that: The upper surface of the heat-conducting plate is provided with a water pump mechanism, and the inner side wall of the water pump mechanism is provided with a second receiving cavity.

5. A water-cooled radiator for magnetic fluid applications according to claim 4, characterized in that: The inner wall of the second accommodating cavity is equipped with a motor, and the upper surface of the water pump mechanism is equipped with a connecting housing.

6. A water-cooled radiator for magnetic fluid applications according to claim 5, characterized in that: One end of the water pump mechanism is provided with a water inlet connector, and the other end of the water pump mechanism is provided with a drain connector corresponding to the water inlet connector.

7. A water-cooled radiator for magnetic fluid applications according to claim 6, characterized in that: One end of the water inlet connector is provided with a water inlet pipe, and one end of the drain connector is provided with a water outlet pipe.

8. A water-cooled radiator for magnetic fluid applications according to claim 3, characterized in that: The support assembly includes an outer surface component and a support plate. The outer surface component is disposed on the upper surface of the support plate. The first receiving cavity is located on the inner sidewall of the outer surface component. The magnetofluid placement plate is located on the upper surface of the outer surface component. The heat-conducting plate is located on the upper surface of the support plate.

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