A heat dissipation device and electronic equipment

Abstract

The application discloses a heat dissipation device and electronic equipment, relates to the technical field of electronic equipment heat dissipation, and aims to solve the problem of how to improve the heat dissipation efficiency of the heat dissipation device. The heat dissipation device comprises a heat pipe structure, the heat pipe structure comprises an evaporation end, at least part of the inner wall surface of the evaporation end is provided with a protrusion, the width of the protrusion gradually decreases along the protrusion direction of the protrusion, and a first capillary structure in the evaporation end is arranged on the protrusion, so that the gas in the first capillary structure can escape, the contact area of the cooling liquid and the first capillary structure is increased, and the evaporation efficiency of the cooling liquid is further improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat dissipation device and an electronic device. Background Technology

[0002] Servers are the core devices used for data processing. As the amount of data computation increases, the power consumption of components such as processors within servers also increases. This leads to the servers generating more and more heat during operation, requiring heat dissipation measures to ensure smooth server operation.

[0003] In existing technologies, heat sinks are typically installed inside the server to dissipate heat.

[0004] However, with the increase in the power of central processing units, the heat dissipation efficiency of existing heat sinks is limited and can no longer meet the heat dissipation requirements of servers. Utility Model Content

[0005] The purpose of this application is to provide a heat dissipation device and electronic device, which aims to solve the problem of how to improve the heat dissipation efficiency of the heat dissipation device.

[0006] In a first aspect, a heat dissipation device is provided, including a heat pipe structure, the heat pipe structure including an evaporation end, at least a portion of the inner wall surface of the evaporation end is provided with a protrusion, the width of the protrusion gradually decreases along the protrusion direction, and a first capillary structure is provided in the evaporation end on the protrusion.

[0007] In the above scheme, the first capillary structure at the evaporation end typically contains gas, which hinders the evaporation of coolant. Since the width of the protrusion gradually decreases along its direction, when the first capillary structure is positioned on the protrusion, the gas within it forms bubbles. As these bubbles escape along the protrusion, the pressure exerted by the upper bubbles on the lower bubbles is reduced, facilitating their escape. After the bubbles escape from the first capillary structure, the coolant capacity within it increases, the contact area between the coolant and the capillary structure increases, and the evaporation efficiency of the coolant is improved, thereby enhancing the heat dissipation efficiency of the heat dissipation device.

[0008] Optionally, the number of protrusions is multiple, and the multiple protrusions are arranged at intervals.

[0009] Optionally, the side of the protrusion is provided with a bevel or an arc-shaped surface.

[0010] Optionally, the top of the protrusion is provided with a hydrophobic portion.

[0011] Optionally, the top of the protrusion is provided with an organic coating.

[0012] Optionally, the heat pipe structure includes an evaporator plate portion and a heat pipe body, the evaporator plate portion forming the evaporation end, one end of the heat pipe body being connected to the evaporator plate portion, and the other end forming the condensation end of the heat pipe structure.

[0013] Optionally, the evaporation plate includes an evaporation cavity and a sidewall surrounding the evaporation cavity, the sidewall of the evaporation cavity including a first sidewall and a second sidewall opposite to each other; one end of the heat pipe body is connected to the first sidewall, and the protrusion is provided on the inner wall surface of the second sidewall.

[0014] Optionally, the inner wall surface of the first sidewall is provided with a second capillary structure.

[0015] Optionally, the inner wall surface of the heat pipe body is provided with a third capillary structure, which is connected to the evaporation end.

[0016] Optionally, the heat dissipation device further includes a heat dissipation structure connected to the condensation end of the heat pipe body, and the heat dissipation structure is located on the periphery of the evaporation plate.

[0017] Optionally, there are multiple heat pipe bodies, and multiple heat pipe bodies form a heat pipe body group. The heat pipe body group includes a first part and a second part. The first part is connected to the evaporator plate, and the second part is connected between the first part and the heat dissipation structure. Along the direction perpendicular to the evaporator plate, the height of the first part is less than the height of the second part.

[0018] Optionally, the heat pipe body assembly includes a first heat pipe body and a second heat pipe body, and the number of heat dissipation structures is multiple, including a first heat dissipation structure and a second heat dissipation structure. The first heat pipe body is connected between the evaporator plate and the first heat dissipation structure, and the second heat pipe body is connected between the evaporator plate and the second heat dissipation structure.

[0019] In a second aspect, an electronic device is provided, including a heat dissipation device.

[0020] It should be noted that the technical effects brought about by the second aspect of this application can be referred to the technical effects brought about by the corresponding implementation of the first aspect, and will not be repeated here. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of a heat dissipation device provided in an embodiment of this application;

[0023] Figure 2 for Figure 1 A schematic diagram of the connection structure between the condenser tube and the heat dissipation end of the heat dissipation device shown.

[0024] Figure 3 for Figure 2 The diagram shows the internal structure of the heat dissipation end.

[0025] Figure label:

[0026] 1. Evaporation end; 11. First sidewall; 12. Second sidewall; 121. Protrusion; 122. First capillary structure; 123. Hydrophobic part;

[0027] 2. Heat pipe body; 21. First group of heat pipe bodies; 211. First bend; 212. First pipe segment; 213. Second pipe segment; 214. Second bend; 215. Third pipe segment; 216. Fourth bend; 217. Fifth pipe segment; 22. Second group of heat pipe bodies; 221. Third bend; 222. Fourth pipe segment;

[0028] 23. Part One; 24. Part Two;

[0029] 3. Heat dissipation structure; 31. First heat dissipation structure; 32. Second heat dissipation structure. Detailed Implementation

[0030] In the embodiments of this application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature.

[0031] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0032] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0033] In the embodiments of this application, "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, said acceptable deviation range being determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range for approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range for approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0034] This application provides an electronic device that includes a heat dissipation device, which can dissipate heat from the electronic device.

[0035] In some embodiments, the electronic device may be a server, which typically includes a processor for data processing. The processor generates heat during operation, and a heat dissipation device may be connected to the processor to cool it, thereby reducing its temperature and improving its operational smoothness.

[0036] It should be noted that electronic devices can include not only servers, but also electric motors, microwave ovens, etc.

[0037] In some implementations, see Figure 1 and Figure 3 The heat dissipation device includes a heat pipe structure, which includes an evaporation end 1. At least a portion of the inner wall surface of the evaporation end 1 is provided with a protrusion 121. Along the protrusion direction of the protrusion 121, the width of the protrusion 121 gradually decreases. A first capillary structure 122 is provided in the evaporation end 1 on the protrusion 121.

[0038] In the above scheme, the first capillary structure of the evaporator end 1 typically contains gas, which hinders the evaporation of the coolant. Since the width of the protrusion 121 gradually decreases along its convex direction, after the gas in the first capillary structure forms bubbles, the pressure exerted by the upper bubbles on the lower bubbles during their escape along the protrusion is reduced, facilitating their escape. After the bubbles escape from the first capillary structure, the capacity of the coolant within it increases, the contact area between the coolant and the first capillary structure increases, and the evaporation efficiency of the coolant is improved, thereby enhancing the heat dissipation efficiency of the heat dissipation device.

[0039] It should be noted that "the protrusion direction of protrusion 121" refers to the direction in which the end of protrusion 121 facing the inner wall of the evaporator points away from the inner wall of the evaporator, such as... Figure 3 The z-axis direction in the equation.

[0040] "The width of protrusion 121 gradually decreases" means that the size of protrusion 121 gradually decreases along its width direction. When protrusion 121 is a convex ridge structure, the width direction of protrusion 121 is perpendicular to its length direction and parallel to the inner wall surface of the evaporation end, such as... Figure 3 The x-axis direction in the diagram. Here, a convex ridge refers to a convex ridge whose length is greater than the dimensions of the convex 121 in other directions parallel to the inner wall of the evaporator end.

[0041] When the protrusion 121 is a convex-hull structure, the width direction of the protrusion 121 can be any direction parallel to the inner wall surface of the evaporation end. Here, "convex-hull" means that the size of the protrusion 121 is approximately equal in all directions parallel to the inner wall surface of the evaporation end.

[0042] In some examples, the first capillary structure 122 can be a sintered capillary structure. For example, a porous structure formed by sintering metal or ceramic powder.

[0043] In other examples, the first capillary structure 122 can be a composite capillary structure. For example, a capillary structure formed by sintering powder on the surface of the trench.

[0044] It should be noted that the evaporator end 1 is equipped with coolant, which can be a liquid such as water. The first capillary structure 122 can store coolant. When the heat of the electronic device is transferred to the evaporator end 1, the temperature of the evaporator end 1 rises, and the coolant in the first capillary structure 122 is heated and vaporized to absorb the heat of the electronic device.

[0045] In some examples, the evaporator end 1 includes a heat-conducting plate for connection to an electronic device to conduct heat generated by the device to the heat-conducting plate. The heat-conducting plate can be connected to the heat-generating component within the electronic device via screws, adhesive bonding, or other methods.

[0046] The heat-conducting plate can be a flat plate, an arc-shaped plate, a columnar plate, or a similar structure.

[0047] The protrusion 121 can be provided on the heat-conducting plate and located on the side of the heat-conducting plate opposite to the electronic device. When the heat of the electronic device is conducted to the heat-conducting plate, the coolant in the first capillary structure 122 of the protrusion 121 is heated and evaporated, and vaporized to form steam, thereby carrying away the heat of the heat-conducting plate and cooling the electronic device.

[0048] In some implementations, see Figure 3There are multiple protrusions 121, which are arranged at intervals. By setting multiple protrusions 121 arranged at intervals, the evaporation area of ​​the coolant is further increased, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0049] In some examples, a plurality of protrusions 121 are spaced apart on the side of the heat-conducting plate facing away from the electronic device, with a gap between two adjacent protrusions 121.

[0050] In some examples, the portion between two adjacent protrusions 121 is also provided with a first capillary structure 122.

[0051] In some embodiments, the side of the protrusion 121 is provided with a bevel or an arc-shaped surface.

[0052] In the above scheme, the side of the protrusion 121 is a slope or an arc surface, which is conducive to the gas in the first capillary structure escaping along the slope of the triangle or trapezoid, or along the arc surface of the semicircle, thereby increasing the contact area between the coolant and the first capillary structure and improving the evaporation efficiency of the coolant.

[0053] In some examples, the protrusion 121 is a long strip structure, and the cross-sectional shape of the protrusion 121 can be triangular, trapezoidal, semi-circular, etc.

[0054] In some examples, multiple protrusions 121 have the same cross-sectional shape.

[0055] In other examples, the cross-sectional shapes of the multiple protrusions 121 are different. For example, the multiple protrusions 121 may be a combination of triangles and trapezoids, or a combination of triangles and semicircles, or a combination of trapezoids and semicircles, etc.

[0056] It should be noted that, in addition to the shapes described above, the cross-sectional shape of the protrusion 121 in this application can also be an irregular cross-sectional shape, but the side of the cross-sectional shape includes a sloping surface or an arc surface.

[0057] In some implementations, see Figure 3 The top of the protrusion 121 is provided with a hydrophobic portion 123. Since there may be gas inside the first capillary structure 122, when the evaporator end 1 is heated, the gas inside the first capillary structure 122 expands due to heat and escapes to the outside of the first capillary structure 122. When the gas passes through the coolant, it will generate bubbles, and the bubbles will create a gas resistance effect inside the heat pipe structure, affecting the flow of steam; in addition, the bubbles may adhere to the inner wall of the heat pipe structure, forming a heat insulation layer and reducing the heat transfer area. All of these factors will reduce the heat dissipation efficiency of the heat dissipation device.

[0058] A hydrophobic portion 123 is provided at the top of the protrusion 121. Under the action of force, the bubbles will move towards the top of the protrusion 121. When the bubbles come into contact with the smooth surface of the hydrophobic portion 123, the change in the radius of curvature of the bubble surface causes uneven surface tension distribution, making the film structure unstable and causing the bubbles to rupture. The hydrophobic portion 123 can eliminate the bubbles generated during the heat dissipation process, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0059] It should be noted that when protrusion 121 is connected to the heat-conducting plate, the top of protrusion 121 refers to the end of protrusion 121 that faces away from the heat-conducting plate.

[0060] In some examples, when the cross-section of the protrusion 121 is triangular, one side of the protrusion 121 is connected to the heat-conducting plate, and the other two sides extend upward and intersect. The hydrophobic part 123 is provided at the intersection of the two sides and can extend a certain distance away from the two sides.

[0061] In some examples, when the cross-section of the protrusion 121 is semi-circular, a hydrophobic portion 123 can be provided within a certain width of the semi-circular surface facing away from the heat-conducting plate and extend along the length direction of the protrusion 121.

[0062] In some embodiments, the top of the protrusion 121 is provided with an organic coating. Applying an organic coating to the top of the protrusion 121 to form a hydrophobic portion 123 results in a simple structure, easy processing, and effective elimination of air bubbles, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0063] In some examples, the organic coating can be fluorocarbon materials, organosilicon materials, etc. These materials have low surface energy, which can effectively repel moisture and achieve a hydrophobic effect.

[0064] In some other embodiments, the hydrophobic portion 123 may be the protrusion 121 itself. For example, the top of the protrusion 121 may be a smooth surface, while other portions may have a first capillary structure 122.

[0065] In some implementations, participants Figure 2 The heat pipe structure includes an evaporator plate section and a heat pipe body 2. The evaporator plate section forms the evaporation end 1, and one end of the heat pipe body 2 is connected to the evaporator plate section, while the other end forms the condensation end of the heat pipe structure.

[0066] In the above scheme, one end of the heat pipe body 2 is connected to the evaporator plate, and the other end forms the condenser end. In this way, the vapor formed by the coolant after the evaporator plate is heated can enter the condenser end through the heat pipe body 2. The vapor liquefies at the condenser end and conducts heat to the condenser end. This allows heat from the evaporator plate to be transferred to the condenser end, improving heat dissipation efficiency.

[0067] In some examples, the heat pipe body 2 and the evaporator plate can be connected by welding, plugging, bonding or other methods.

[0068] For some specific examples, see Figure 2 The evaporator plate includes an evaporation chamber and sidewalls surrounding the evaporation chamber. The sidewalls of the evaporation chamber include a first sidewall 11 and a second sidewall 12. One end of the heat pipe body 2 is connected to the first sidewall 11, and a protrusion 121 is provided on the inner wall surface of the second sidewall 12.

[0069] In the above scheme, the protrusion 121 is provided on the inner wall surface of the second sidewall 12, and one end of the heat pipe body 2 is connected to the first sidewall 11. Since the first sidewall 11 and the second sidewall 12 are opposite each other, after the coolant in the first capillary structure 122 of the protrusion 121 of the second sidewall 12 is heated and evaporated, it can enter the heat pipe body 2 connected to the second sidewall 12, which facilitates the heat in the evaporation chamber to be conducted outward through steam, thereby improving the heat dissipation efficiency.

[0070] For example, the second sidewall 12 can be the heat-conducting plate described above, used to connect with the heat-generating component of the electronic device to dissipate heat from the heat-generating component.

[0071] For example, the evaporation chamber has a flat structure, and the first sidewall 11 and the second sidewall 12 are two sidewalls in the thickness direction of the evaporator.

[0072] In some examples, the cross-sectional shape of the heat pipe body 2 can be circular.

[0073] In other examples, the cross-sectional shape of the heat pipe body 2 can be rectangular or elliptical, etc.

[0074] In some examples, the protrusion 121 can be an integral structure with the second sidewall 12.

[0075] In other examples, the protrusion 121 can be connected to the second sidewall 12 by screws or by adhesive or other means.

[0076] In some embodiments, the inner wall surface of the first sidewall 11 is provided with a second capillary structure.

[0077] In the above scheme, if the first sidewall 11 is not provided with a capillary structure, the coolant returning from the heat pipe body 2 will drip onto the corresponding position of the heat pipe body 2 inlet, resulting in uneven distribution of coolant on the first sidewall 11 and affecting the heat dissipation effect. In this application, the second capillary structure provides a low-resistance path, ensuring that the liquid in the heat pipe body 2 flows back evenly into the evaporation chamber, maintaining the continuous operation of the evaporation chamber.

[0078] It should be noted that the structure of the second capillary structure can be set with reference to the structure of the first capillary structure 122 mentioned above, and will not be repeated here.

[0079] In some embodiments, the inner wall surface of the heat pipe body 2 is provided with a third capillary structure, which is connected to the evaporation end 1. The third capillary structure on the inner wall surface of the heat pipe body 2 allows the liquid coolant inside the heat pipe body 2 to flow back to the evaporation end 1 through the third capillary structure, thereby improving the circulation efficiency of the coolant and thus improving the heat dissipation efficiency.

[0080] In some examples, the third capillary structure can be a grooved capillary structure through which the liquid at the condenser end of the heat pipe body 2 flows back to the evaporator end 1.

[0081] In some implementations, see Figure 1 The heat dissipation device also includes a heat dissipation structure 3, which is connected to the condensing end of the heat pipe body 2 and is located on the periphery of the evaporation plate. In this way, the heat dissipation area of ​​the heat dissipation device is located on the periphery of the evaporation plate, that is, the heat dissipation structure 3 can be far away from the evaporation end 1, which can reduce the temperature at the evaporation end 1 and improve the heat dissipation efficiency.

[0082] It should be noted that the heat dissipation structure 3 being located on the periphery of the evaporator plate means that the heat dissipation structure 3 is located on the periphery in the thickness direction of the evaporator plate.

[0083] In some examples, the heat dissipation structure 3 may include fins. For example, multiple fins form a fin group, and the condenser end of the heat pipe body 2 passes through the fin group to conduct heat from the condenser end to the fins, thereby dissipating heat to the outside through the fins, which can improve the heat dissipation speed of the heat pipe body 2.

[0084] To improve heat dissipation, a fan can be installed on one side of the heat dissipation structure 3. The fan blows airflow through the heat dissipation structure 3, thereby improving its heat dissipation efficiency.

[0085] In other examples, the heat dissipation structure 3 may include a heat dissipation film. For example, the heat dissipation film is attached to the condensation end of the heat pipe body 2 to improve the heat dissipation rate of the heat pipe body 2. The heat dissipation film may be made of a material with high thermal conductivity, such as graphite or copper.

[0086] In some other examples, the heat pipe body 2 has a flat tube structure with fins welded to the surface of the heat pipe body 2.

[0087] In some specific examples, the heat pipe body 2 includes a first pipe segment 212, a second pipe segment 213, and a first bend 211. One end of the first pipe segment 212 is connected to the evaporator plate portion, and the other end is connected to one end of the first bend 211. One end of the second pipe segment 213 is connected to the other end of the first bend 211. The bending direction of the first bend 211 is such that the length direction of the second pipe segment 213 is oriented towards a first direction, which is perpendicular to the arrangement direction of the evaporator plate portion and the heat pipe body 2.

[0088] In the above scheme, the heat pipe body 2 extends the second pipe segment 213 along a first direction by setting a first bend 211, and the first direction is perpendicular to the arrangement direction of the evaporator plate and the heat pipe body 2. This makes the extension direction of the second pipe segment 213 face the circumference of the evaporator plate, thus avoiding the space between the evaporator plate and the heat pipe body 2 in the arrangement direction, so as to facilitate the placement of other components on both sides of the evaporator plate and improve the flexibility of electronic equipment layout.

[0089] In some examples, the first pipe section 212, the second pipe section 213, and the first bend 211 are integrally formed and are processed from the heat pipe body 2 by a bending process.

[0090] In other examples, the first pipe segment 212, the second pipe segment 213, and the first bend 211 are assembled from multiple parts. Adjacent components can be connected by methods such as bonding, plugging, or welding.

[0091] In some examples, the cooling system is used in servers, which include processors and graphics cards. The side of the evaporator plate facing away from the heat pipe body 2 is used to connect to the processor to dissipate heat. Components such as graphics cards can be mounted on the side of the evaporator plate facing the heat pipe body 2.

[0092] In some implementations, see Figure 1 and Figure 2 There are multiple heat pipe bodies 2, which together form a heat pipe body group. The heat pipe body group includes a first part 23 and a second part 24. The first part 23 is connected to the evaporator plate, and the second part 24 is connected between the first part 23 and the heat dissipation structure 3. Along the direction perpendicular to the evaporator plate, the height of the first part 23 is less than the height of the second part 24.

[0093] In the above scheme, on the one hand, by setting multiple heat pipe bodies 2 to be connected to the evaporator end 1 simultaneously, the heat dissipation speed of the evaporator end 1 can be increased, thereby improving the heat dissipation efficiency of the heat dissipation device. On the other hand, since the height of the first part 23 of the heat pipe body assembly is less than the height of the second part 24, the space occupied by the heat pipe body assembly above the evaporator plate is smaller, which facilitates the placement of other electronic components above the evaporator plate and improves the flexibility of the electronic equipment structure.

[0094] In some examples, the number of heat pipe bodies 2 can be 2, 3, 4, 5, 6, etc.

[0095] In some examples, the heat pipe body 2 of the first part of the heat pipe body assembly includes a first pipe segment 212, a second pipe segment 213, and a first bend 211. One end of the first pipe segment 212 is connected to the evaporator plate portion, and the other end is connected to one end of the first bend 211. One end of the second pipe segment 213 is connected to the other end of the first bend 211. The bending direction of the first bend 211 is such that the length direction of the second pipe segment 213 is oriented towards a first direction, which is perpendicular to the arrangement direction of the evaporator plate portion and the heat pipe body 2.

[0096] The second part of the heat pipe body assembly includes a fourth bend 216 and a fifth pipe segment 217. One end of the fourth bend 216 is connected to the second pipe segment, and the other end is connected to the fifth pipe segment 217. The bending direction of the fourth bend 216 is such that the length direction of the fifth pipe segment 217 is oriented away from the evaporator end 1, thereby making the height of the first part smaller than the height of the second part. This increases the distance between the condensing ends of the multiple heat pipe bodies 2, thereby improving the heat dissipation effect.

[0097] In some implementations, see Figure 1 and Figure 2 The heat pipe body assembly includes a first heat pipe body 21 and a second heat pipe body 22. There are multiple heat dissipation structures 3, including a first heat dissipation structure 31 and a second heat dissipation structure 32. The first heat pipe body 21 is connected between the evaporation plate and the first heat dissipation structure 31, and the second heat pipe body 22 is connected between the evaporation plate and the second heat dissipation structure 32.

[0098] In the above scheme, the heat pipe body assembly is configured as a first heat pipe body 21 and a second heat pipe body 22, and a first heat dissipation structure 31 and a second heat dissipation structure 32 are respectively connected to the first heat pipe body 21 and the second heat pipe body 22. In this way, the heat dissipation space of the heat dissipation device can be increased, and the heat dissipation efficiency can be improved.

[0099] In some examples, the first set of heat pipe bodies 21 also includes a second bend 214 and a third pipe segment 215. One end of the second bend 214 is directly or indirectly connected to the second pipe segment 213, and the other end is connected to the third pipe segment 215. The bending direction of the second bend 214 is such that the length direction of the third pipe segment 215 is oriented toward the second direction. The second direction is perpendicular to the first direction, the evaporator plate portion and the arrangement direction of the heat pipe body 2.

[0100] The second heat pipe body 22 also includes a third bend 221 and a fourth pipe segment 222. One end of the third bend 221 is directly or indirectly connected to the second pipe segment 213, and the other end is connected to the fourth pipe segment 222. The bending direction of the third bend 221 makes the length direction of the fourth pipe segment 222 face the third direction, which is opposite to the second direction.

[0101] In the above scheme, the second bend 214 aligns the length direction of the third segment 215 of the first heat pipe body 21 towards the second direction, and the third bend 221 aligns the length direction of the fourth segment 222 of the second heat pipe body 22 towards the third direction. Since the second direction is opposite to the third direction, and the second direction is perpendicular to the first direction, the evaporator plate, and the arrangement direction of the heat pipe body 2, the second direction and the third direction are respectively oriented towards both sides of the first direction. This positions the first heat dissipation structure 31 connected to the first heat pipe body 21 and the second heat dissipation structure 32 connected to the second heat pipe body 22 on both sides of the first direction, increasing the heat dissipation space and avoiding low heat dissipation efficiency due to concentrated heat dissipation, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0102] In some examples, the first heat dissipation structure 31 and the second heat dissipation structure 32 are located on the same side of the evaporation plate portion and are respectively oriented towards the second direction and the third direction.

[0103] In some other embodiments, the first heat dissipation structure 31 and the second heat dissipation structure 32 may be located on different sides of the evaporator plate portion. For example, the first heat dissipation structure 31 and the second heat dissipation structure 32 may be located on opposite sides of the evaporator plate portion, or the first heat dissipation structure 31 and the second heat dissipation structure 32 may be located on adjacent sides of the evaporator plate portion.

[0104] In some examples, the number of heat dissipation structures 3 can be 3, 4, etc., and multiple heat dissipation structures 3 can be located on the same side of the evaporator plate or on different sides.

[0105] In some examples, both the first heat dissipation structure 31 and the second heat dissipation structure 32 include fins.

[0106] In other examples, both the first heat dissipation structure 31 and the second heat dissipation structure 32 include a heat dissipation film.

[0107] In some other examples, one of the first heat dissipation structure 31 and the second heat dissipation structure 32 includes a fin, and the other includes a heat dissipation film.

[0108] In the description of the embodiments of this application, specific features, structures, materials or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0109] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device, characterized in that, The heat pipe structure includes an evaporation end (1), at least a portion of the inner wall surface of the evaporation end (1) is provided with a protrusion (121), the width of the protrusion (121) gradually decreases along the protrusion direction, and a first capillary structure (122) in the evaporation end (1) is provided on the protrusion (121).

2. The heat dissipation device according to claim 1, characterized in that, The number of protrusions (121) is multiple, and the multiple protrusions (121) are arranged at intervals; And / or, the side of the protrusion (121) is provided with a bevel or an arc-shaped surface.

3. The heat dissipation device according to claim 1, characterized in that, The top of the protrusion (121) is provided with a hydrophobic part (123); And / or the top of the protrusion (121) is provided with an organic coating.

4. The heat dissipation device according to any one of claims 1-3, characterized in that, The heat pipe structure includes an evaporator plate section and a heat pipe body (2). The evaporator plate section forms the evaporation end (1). One end of the heat pipe body (2) is connected to the evaporator plate section, and the other end forms the condensation end of the heat pipe structure.

5. The heat dissipation device according to claim 4, characterized in that, The evaporation plate includes an evaporation chamber and sidewalls surrounding the evaporation chamber. The sidewalls of the evaporation chamber include a first sidewall (11) and a second sidewall (12) that are opposite each other. One end of the heat pipe body (2) is connected to the first sidewall (11), and the protrusion (121) is provided on the inner wall surface of the second sidewall (12).

6. The heat dissipation device according to claim 5, characterized in that, The inner wall surface of the first sidewall (11) is provided with a second capillary structure.

7. The heat dissipation device according to claim 4, characterized in that, It also includes a heat dissipation structure (3), which is connected to the condensation end of the heat pipe body (2); The heat dissipation structure (3) is located on the periphery of the evaporation plate.

8. The heat dissipation device according to claim 7, characterized in that, The number of heat pipe bodies (2) is multiple, and the multiple heat pipe bodies form a heat pipe body group. The heat pipe body group includes a first part (23) and a second part (24). The first part (23) is connected to the evaporator plate, and the second part (24) is connected between the first part (23) and the heat dissipation structure (3). Along the direction perpendicular to the evaporator plate portion, the height of the first portion (23) is less than the height of the second portion (24).

9. The heat dissipation device according to claim 8, characterized in that, The heat pipe body assembly includes a first heat pipe body (21) and a second heat pipe body (22). The number of heat dissipation structures (3) is multiple. The multiple heat dissipation structures (3) include a first heat dissipation structure (31) and a second heat dissipation structure (32). The first heat pipe body (21) is connected between the evaporation plate and the first heat dissipation structure (31), and the second heat pipe body (22) is connected between the evaporation plate and the second heat dissipation structure (32).

10. An electronic device, characterized in that, The heat dissipation device includes any one of claims 1-9.

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