A heat dissipation structure with embedded thermal resistor and an electric appliance

Abstract

This application discloses a heat dissipation structure and electrical appliance with an embedded thermistor, comprising: a heat sink with a mounting surface and a mounting position for mounting a heating element; a temperature sensing hole on the side of the heat sink facing the mounting position and extending to the bottom of the temperature sensing hole at the location of the mounting position; and a thermistor placed at the bottom of the temperature sensing hole, with thermally conductive adhesive filling the gap between the thermistor and the temperature sensing hole. The heat dissipation structure with an embedded thermistor provided in this application embeds the thermistor inside the heat sink, shortening the heat conduction path, resulting in higher temperature detection accuracy, faster response speed, improved temperature sampling lag, and enhanced over-temperature protection accuracy. Furthermore, the use of thermally conductive adhesive for bonding simplifies the assembly process, reduces the number and types of parts, improves assembly efficiency, and reduces the risk of leakage and short circuits.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and more specifically, to a heat dissipation structure and electrical appliance with an embedded thermistor. Background Technology

[0002] Power transistors are widely used in various power supplies and converters. For example, power transistors are used in MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). Excessive temperature can seriously affect the lifespan of MOSFETs and system safety. Traditional temperature detection often uses a thermistor (Negative Temperature Coefficient Thermistor, NTC) attached to the surface of a heat sink or in the vicinity. This method has problems such as inconvenient NTC fixing, high thermal resistance, and insufficient temperature detection accuracy. Utility Model Content

[0003] In view of the shortcomings of the prior art, this application innovatively provides a heat dissipation structure and electrical appliance with an embedded thermistor, which can solve the technical problems of inconvenient thermistor fixing and insufficient temperature detection accuracy in the prior art.

[0004] To achieve the aforementioned technical objectives, the first aspect of this application discloses a heat dissipation structure with an embedded thermistor, comprising: A heat sink has a mounting surface with mounting positions for mounting heat-generating devices. A temperature measuring hole is formed on the side of the heat sink, the temperature measuring hole extends toward the mounting position, and the bottom end of the temperature measuring hole is located at the mounting position. A thermistor is placed at the bottom of the temperature measuring hole. Thermally conductive adhesive is provided inside the temperature measuring hole, and the thermally conductive adhesive fills the gap between the thermistor and the temperature measuring hole.

[0005] Furthermore, multiple temperature measuring holes are provided, and the multiple temperature measuring holes are distributed on different sides of the heat sink.

[0006] Furthermore, the temperature measuring hole includes a first temperature measuring hole, which is formed on a side surface perpendicular to the mounting surface.

[0007] Furthermore, the temperature measuring hole includes a second temperature measuring hole, which is formed on a side surface parallel to the mounting surface.

[0008] Furthermore, the second temperature measuring hole penetrates the heat sink.

[0009] Furthermore, the depth of the temperature sensing hole is greater than the length of the thermistor. The inner diameter of the temperature measuring hole is larger than the outer diameter of the thermistor.

[0010] Furthermore, the inner diameter of the temperature measuring hole is 1.1 to 1.2 times the diameter of the thermistor.

[0011] Furthermore, the temperature measuring hole is a conical hole, and the diameter of the bottom end of the temperature measuring hole is smaller than the diameter of the opening end of the temperature measuring hole. The bottom diameter of the temperature measuring hole is larger than the outer diameter of the thermistor.

[0012] Furthermore, the opening end of the temperature measuring hole is formed with a lead-out groove, which is formed on the side where the temperature measuring hole is located and communicates with the temperature measuring hole. The lead-out groove is used to accommodate the pins of the thermistor.

[0013] The second aspect of this application discloses an electrical appliance, including a heating element and a heat dissipation structure with an embedded thermistor, wherein the heating element is disposed on the mounting position of the heat dissipation block of the heat dissipation structure.

[0014] The beneficial effects of this application are as follows: The heat dissipation structure with embedded thermistor provided in this application shortens the heat conduction path by embedding the thermistor inside the heat sink, resulting in higher temperature detection accuracy, faster response speed, improved temperature sampling lag, and enhanced over-temperature protection accuracy. Furthermore, the use of thermally conductive adhesive for bonding simplifies the assembly process, reduces the number and types of parts, improves assembly efficiency, and lowers the risks of leakage and short circuits. Attached Figure Description

[0015] Figure 1 A schematic diagram of the heat dissipation structure of the embedded thermistor in an embodiment of this application is shown. Figure 2 This invention provides a schematic diagram of the structure of the thermistor and its pins according to an embodiment of this application. Figure 3 This diagram shows a schematic representation of the heat sink according to an embodiment of this application. Figure 4a This is a front view schematic diagram showing the heat dissipation structure of the embedded thermistor in an embodiment of this application; Figure 4b Show Figure 4a Sectional view at point AA; Figure 4c Show Figure 4a Sectional view at point BB; Figure 5 This diagram shows a schematic of the structure of a heat sink according to an embodiment of this application (with lead-out slots provided). Figure 6This diagram illustrates a heat dissipation structure for mounting a heat-generating device using an embedded thermistor, as shown in an embodiment of this application.

[0016] In the picture, 1. Heat sink; 11. Mounting surface; 12. Temperature measuring hole; 121. First temperature measuring hole; 122. Second temperature measuring hole; 13. Threaded hole; 14. Heat sink fins; 123. Lead-out slot; 2. Thermistor; 21. Lead; 3. Thermal adhesive; 4. Heating element; 5. Gasket. Detailed Implementation

[0017] The heat dissipation structure and electrical components of the embedded thermistor provided in this application will be explained and described in detail below with reference to the accompanying drawings.

[0018] Thermistors typically require an OT terminal to be installed and connected to the surface of a heat sink near the heat source using screws. This installation method affects the accuracy and response speed of temperature detection, increases assembly complexity and cost, and can also interfere with the installation of the heat sink.

[0019] The heat dissipation structure with an embedded thermistor provided in this application embeds the thermistor inside the heat sink, which shortens the heat conduction path, resulting in higher temperature detection accuracy, faster response speed, improved temperature sampling lag, and enhanced over-temperature protection accuracy. Simultaneously, the fixing method using thermally conductive adhesive simplifies the assembly process, reduces the number and types of parts, improves assembly efficiency, and reduces the risk of leakage and short circuits. The following detailed description, in conjunction with specific embodiments, further illustrates this application: In some embodiments, this application provides a heat dissipation structure with an embedded thermistor for use in power supplies and converters, etc., which can dissipate heat from heat-generating devices while also monitoring the temperature of heat-generating components. Figures 1-6 As shown, the heat dissipation structure of the embedded thermistor includes a heat sink 1 and a thermistor 2. The heat sink 1 is a block structure, and is made of high thermal conductivity materials such as aluminum alloy or copper.

[0020] A mounting surface 11 is formed on the heat sink 1, and a mounting position for mounting the heating element 4 is formed on the mounting surface 11. A threaded hole 13 is formed on the mounting position, and the heating element 4 has a corresponding mounting hole. After aligning the mounting hole with the threaded hole 13, a screw is screwed in, and the heating element 4 can be fixed to the mounting surface 11 by the screw. The heat generated by the heating element 4 can be transferred to the heat sink 1, and dissipated by the heat sink 1. For example, the mounting surface 11 is set as a plane, which can increase the heat transfer area of ​​the heating element 4 and improve the heat conduction efficiency. Alternatively, the position of the mounting position on the mounting surface 11 can be set as a plane to ensure the normal installation of the heating element 4 and maximize the heat transfer area. The part outside the mounting position can be set as other structures. For example, a groove can be set on the part outside the mounting position on the mounting surface 11. The groove can increase the contact area with air, thereby accelerating the heat dissipation effect. It is easy to imagine that any structure that can increase the contact area with air can also be set on the part outside the mounting position on the mounting surface 11, such as a protrusion, or a combination of a groove and a protrusion.

[0021] like Figure 1 As shown, the heat sink 1 is also provided with a plurality of heat sink fins 14. For example, the heat sink fins 14 are formed on the edge of the mounting surface 11 and on the side parallel to the mounting surface 11. The plurality of heat sink fins 14 on the same surface are arranged at a certain distance apart. The heat can be carried away by the air flowing over the surface of the heat sink fins 14, so as to achieve the heat dissipation effect.

[0022] In some embodiments, heat dissipation fins 14 are provided with heat dissipation grooves. The heat dissipation grooves extend along the length of the heat dissipation fins 14 and penetrate through both ends of the heat dissipation fins 14. Multiple heat dissipation grooves can be provided, and the multiple heat dissipation grooves are arranged parallel to each other. The provision of heat dissipation grooves increases the contact area between the heat dissipation fins 14 and the air, thereby making the heat dissipation efficiency of the heat dissipation fins 14 higher. For example, heat dissipation grooves can be provided on multiple surfaces of the heat dissipation fins 14 simultaneously, which can increase the number of heat dissipation grooves, thereby further increasing the heat dissipation area of ​​the heat dissipation fins 14 and making the heat dissipation efficiency even higher.

[0023] In some embodiments, multiple mounting positions may be provided, and each mounting position may be used to install a heating device 4. In this embodiment, the heating device 4 includes one or more of the following devices: MOS transistor, IGBT (Insulated Gate Bipolar Transistor). The mounting positions may be set in appropriate locations according to the type of heating device 4.

[0024] In some embodiments, such as Figure 6As shown, a gasket 5 is provided between the heating element 4 and the mounting surface 11. The gasket 5 is used to ensure the reliability of the heating element 4's fixation and to prevent instability of the heating element 4's mounting part due to incomplete contact between the heating element 4 and the mounting surface 11. For example, the gasket 5 is made of a high thermal conductivity material, such as a conductive material or an insulating material, to reduce or avoid the impact on heat conduction. In some embodiments, when the heating element 4 is an IGBT, the gasket 5 is made of a thermally conductive and insulating material, which provides electrical insulation while reducing the impact on heat conduction efficiency. For example, the gasket 5 can be made of ceramic or epoxy resin with added high thermal conductivity.

[0025] like Figure 1 , Figure 3 As shown, a temperature sensing hole 12 is formed on the heat sink 1. The temperature sensing hole 12 is used to install the thermistor 2. The depth of the temperature sensing hole 12 is greater than the length of the thermistor 2, so that the thermistor 2 can be completely embedded in the temperature sensing hole 12. Figure 2 As shown, the thermistor 2 is connected to a pin 21, which extends from the temperature sensing hole 12 and connects to a control circuit or protection circuit. Exemplarily, the pin 21 is a wire wrapped with an insulating layer or a metal conductor. The temperature sensing hole 12 extends towards the mounting position, with its bottom end located at the mounting position. Exemplarily, the distance between the projection of the bottom end of the temperature sensing hole 12 on the mounting surface 11 and the position with the highest junction temperature of the heating element deviates within ±5mm. The specific position of the bottom end of the temperature sensing hole 12 can be determined through finite element thermal simulation, or by combining it with the power loss distribution of the heating element, to form a more accurate thermal coupling path.

[0026] In some embodiments, such as Figure 1 As shown, each mounting position can be equipped with at least one temperature measuring hole 12 to monitor the temperature of each heating element 4, thereby enabling the monitoring of the temperature of each heating element 4. Alternatively, based on the heat output of the heating element 4, only the mounting position corresponding to the heating element 4 with the highest heat output can be equipped with a temperature measuring hole 12. This allows monitoring of the heating element 4 with the highest heat output, which is usually also the highest temperature. Detecting the temperature of the heating element 4 with the highest heat output is the highest temperature. Controlling the temperature based on the highest temperature can ensure that the temperature of other components does not become excessively high. For example, the temperature measuring hole 12 may include a first temperature measuring hole 121 and a second temperature measuring hole 122 (described in detail below).

[0027] In some embodiments, such as Figure 4a , Figure 4b , Figure 4cAs shown, the depth of the temperature sensing hole 12 is greater than the length of the thermistor 2, allowing the thermistor 2 to be completely embedded within it. The inner diameter of the temperature sensing hole 12 is greater than the outer diameter of the thermistor 2, facilitating its installation. In one embodiment, the inner diameter of the temperature sensing hole 12 is 1.1 to 1.2 times the diameter of the thermistor 2; for example, the inner diameter of the temperature sensing hole 12 is typically 2 mm to 8 mm. After the thermistor 2 is installed, thermally conductive adhesive 3 is injected into the temperature sensing hole 12. The adhesive 3 fills the gap between the thermistor 2 and the temperature sensing hole 12, and wraps the thermistor 2 and its connected pins 21. For example, epoxy resin can be used for potting and sealing, which not only fixes the thermistor 2 but also provides good thermal conductivity, does not affect temperature measurement, and acts as insulation to prevent short circuits between the thermistor 2 and the heat sink 1.

[0028] In some embodiments, the temperature sensing hole 12 is a tapered hole, meaning the diameter of the bottom end of the temperature sensing hole 12 is smaller than the diameter of the opening end, and the diameter of the bottom end is larger than the outer diameter of the thermistor 2. A larger opening diameter facilitates the insertion of the thermistor 2 and also facilitates the application of thermally conductive adhesive 3. In other embodiments, the opening diameter can be further increased by forming a chamfer at the opening end of the temperature sensing hole 12, which also facilitates the insertion of the thermistor 2 and the application of thermally conductive adhesive 3. It is understood that the shape and size of the temperature sensing hole 12 are determined based on the shape of the thermistor 2, ensuring convenient insertion of the thermistor 2.

[0029] In some embodiments, such as Figure 5 As shown, a lead-out groove 123 is formed at the opening end of the temperature measuring hole 12. A lead-out groove 123 is also provided at the opening end of the second temperature measuring hole 122. The lead-out groove 123 is formed on the side surface where the second temperature measuring hole 122 is located and communicates with the temperature measuring hole 12. The lead-out groove 123 is used to accommodate the pin 21 of the thermistor 2. For example, the pin 21 can be bent and placed into the lead-out groove 123. Through the lead-out groove 123, the pin 21 of the thermistor can be led out to one side of the heat sink 1, thereby ensuring the flatness of the side surface where the temperature measuring hole 12 is located and avoiding affecting the installation of the heat sink 1. Exemplarily, when the pin 21 is wrapped with an insulating layer, the pin 21 can be fixed in the lead-out groove 123 by thermally conductive adhesive 3, or it can be left unfixed. When the pin 21 itself does not have an insulating layer, the pin 21 is wrapped and fixed in the lead-out groove 123 by thermally conductive adhesive 3.

[0030] In some embodiments, a mounting position can be provided with multiple temperature measuring holes 12, and each temperature measuring hole 12 is equipped with a thermistor 2, which can realize temperature sampling redundancy and improve the reliability of temperature monitoring. As in one embodiment, Figure 3As shown, the temperature measuring hole 12 includes a first temperature measuring hole 121, which is formed on a side perpendicular to the mounting surface 11. The first temperature measuring hole 121 extends toward the mounting position and extends to the location of the mounting position.

[0031] For example, the first temperature measuring hole 121 can extend parallel to the mounting surface 11, which facilitates the processing of the first temperature measuring hole 121. The hole can be drilled as close to the mounting surface 11 as possible to reduce the distance between the first temperature measuring hole 121 and the mounting surface 11, thereby improving the efficiency and accuracy of temperature measurement. Alternatively, it can be tilted so that the bottom end is shorter than the opening end in vertical distance from the mounting surface 11, resulting in a smaller gap between the bottom end and the mounting surface 11, thus enabling more sensitive and accurate temperature measurement.

[0032] As in one embodiment, such as Figure 3 As shown, the temperature measuring hole 12 also includes a second temperature measuring hole 122, which is formed on a side surface parallel to the mounting surface 11. The second temperature measuring hole 122 is formed in the area where the vertical projection from the mounting position to the side surface is located. For example, when the thickness of the heat sink 1 is greater than the length of the thermistor 2, the second temperature measuring hole 122 can be formed perpendicular to the mounting surface 11. For example, the second temperature measuring hole 122 penetrates through the heat sink 1, that is, the second temperature measuring hole 122 penetrates from the aforementioned side surface to the mounting surface 11, which can further improve the temperature detection efficiency and accuracy. When the second temperature measuring hole 122 is a through hole, the thermistor 2 is located inside the second temperature measuring hole 122 and cannot extend onto the mounting surface 11, so as not to affect the installation of the heating device 4. It is easily understood that the second temperature measuring hole 122 can also be set as a blind hole, which will not affect the integrity of the mounting surface 11.

[0033] In some embodiments, such as Figure 3 As shown, a first temperature measuring hole 121 and a second temperature measuring hole 122 are provided simultaneously. For example, two first temperature measuring holes 121 and one second temperature measuring hole 122 can be provided on different sides of the heat sink 1, that is, three thermistors 2 are provided simultaneously to form a redundant temperature sampling system, which improves the reliability and accuracy of temperature monitoring, can better adapt to the temperature distribution under complex working conditions, and improves the overall reliability of the machine.

[0034] The thermistor 2 of this application does not require an OT terminal to be connected to the heat sink 1, thus eliminating the need for screw connections and simplifying the assembly process. Furthermore, the elimination of OT terminals and connecting screws reduces the number and types of components used, thereby reducing material and labor costs and potentially lowering the overall cost by 40% to 60%.

[0035] In some embodiments, this application also provides an electrical appliance, which, exemplarily, includes a charger, energy storage device, power converter, etc. The appliance includes a power control system, which includes a heating element and a heat dissipation structure with an embedded thermistor. The heating element is disposed on a mounting position of the heat sink. Exemplarily, multiple heating elements can be provided, each corresponding to a mounting position. The pins of the thermistor are connected to a main control or protection circuit, allowing the thermistor to monitor the temperature of the heating element, thereby controlling the charging or discharging of the appliance and achieving over-temperature protection.

[0036] In some embodiments, this application provides an energy storage device, which includes a power conversion circuit composed of at least one of an IGBT or a MOSFET. The energy storage device also includes a heat dissipation structure with an embedded thermistor, where the IGBT or MOSFET is a heat-generating device disposed on a heat sink of the heat dissipation structure with the embedded thermistor. Examples of energy storage devices include power banks, portable power banks, and other portable outdoor energy storage products.

[0037] In some embodiments, such as Figures 1-6 As shown, the heat dissipation structure of the embedded thermistor in the energy storage device includes a heat sink 1 and a thermistor 2. The heat sink 1 is a block structure, and is made of high thermal conductivity materials such as aluminum alloy or copper.

[0038] A mounting surface 11 is formed on the heat sink 1. Mounting positions for mounting the heat-generating device 4 (IGBT or MOSFET) are formed on the mounting surface 11. Threaded holes 13 are formed on the mounting positions. The heat-generating device 4 has corresponding mounting holes. By aligning the mounting holes with the threaded holes 13 and screwing in screws, the heat-generating device 4 can be fixed to the mounting surface 11. The heat generated by the heat-generating device 4 can be transferred to the heat sink 1 for heat dissipation. For example, the mounting surface 11 can be set as a plane to increase the heat transfer area of ​​the heat-generating device 4 and improve heat conduction efficiency. Alternatively, the mounting position on the mounting surface 11 can be set as a plane to ensure proper installation of the heat-generating device 4 and maximize the heat transfer area. The portion outside the mounting position can be configured with other structures. For example, grooves can be provided on the portion outside the mounting position on the mounting surface 11 to increase the contact area with air, thereby accelerating heat dissipation. Alternatively, protrusions, or a combination of grooves and protrusions, can be provided on the portion outside the mounting position on the mounting surface 11 to increase the contact area with air.

[0039] like Figure 1As shown, the heat sink 1 is also provided with a plurality of heat sink fins 14. For example, the heat sink fins 14 are formed on the edge of the mounting surface 11 and on the side parallel to the mounting surface 11. The plurality of heat sink fins 14 on the same surface are arranged at a certain distance apart. The heat can be carried away by the air flowing over the surface of the heat sink fins 14, so as to achieve the heat dissipation effect.

[0040] In some embodiments, heat dissipation fins 14 are provided with heat dissipation grooves. The heat dissipation grooves extend along the length of the heat dissipation fins 14 and penetrate through both ends of the heat dissipation fins 14. Multiple heat dissipation grooves can be provided, and the multiple heat dissipation grooves are arranged parallel to each other. The provision of heat dissipation grooves increases the contact area between the heat dissipation fins 14 and the air, thereby making the heat dissipation efficiency of the heat dissipation fins 14 higher. For example, heat dissipation grooves can be provided on multiple surfaces of the heat dissipation fins 14 simultaneously, which can increase the number of heat dissipation grooves, thereby further increasing the heat dissipation area of ​​the heat dissipation fins 14 and making the heat dissipation efficiency even higher.

[0041] In some embodiments, multiple mounting positions may be provided, and each mounting position may be used to install a heating device 4. The mounting positions may be set in appropriate locations according to the different types of heating devices 4.

[0042] In some embodiments, such as Figure 6 As shown, a gasket 5 is provided between the heating element 4 and the mounting surface 11. The gasket 5 is used to ensure the reliability of the heating element 4's fixation and to prevent instability of the heating element 4's mounting part due to incomplete contact between the heating element 4 and the mounting surface 11. For example, the gasket 5 is made of a high thermal conductivity material, such as a conductive material or an insulating material, to reduce or avoid the impact on heat conduction. In some embodiments, when the heating element 4 is an IGBT, the gasket 5 is made of a thermally conductive and insulating material, which provides electrical insulation while reducing the impact on heat conduction efficiency. For example, the gasket 5 can be made of ceramic or epoxy resin with added high thermal conductivity.

[0043] like Figure 1 , Figure 3 As shown, a temperature sensing hole 12 is formed on the heat sink 1. The temperature sensing hole 12 is used to install the thermistor 2. The depth of the temperature sensing hole 12 is greater than the length of the thermistor 2, so that the thermistor 2 can be completely embedded in the temperature sensing hole 12. Figure 2As shown, the thermistor 2 is connected to a pin 21, which extends from the temperature sensing hole 12 and connects to a control circuit or protection circuit. Exemplarily, the pin 21 is a wire wrapped with an insulating layer or a metal conductor. The temperature sensing hole 12 extends towards the mounting position, with its bottom end located at the mounting position. Exemplarily, the distance between the projection of the bottom end of the temperature sensing hole 12 on the mounting surface 11 and the position with the highest junction temperature of the heating element deviates within ±5mm. The specific position of the bottom end of the temperature sensing hole 12 can be determined through finite element thermal simulation, or by combining it with the power loss distribution of the heating element, to form a more accurate thermal coupling path.

[0044] In some embodiments, such as Figure 1 As shown, each mounting position can be equipped with at least one temperature measuring hole 12 to monitor the temperature of each heating element 4, thereby enabling the monitoring of the temperature of each heating element 4. Alternatively, based on the heat output of the heating element 4, only the mounting position corresponding to the heating element 4 with the highest heat output can be equipped with a temperature measuring hole 12. This allows monitoring of the heating element 4 with the highest heat output, which is usually also the highest temperature. Detecting the temperature of the heating element 4 with the highest heat output is the highest temperature. Controlling the temperature based on the highest temperature can ensure that the temperature of other components does not become excessively high. For example, the temperature measuring hole 12 may include a first temperature measuring hole 121 and a second temperature measuring hole 122 (described in detail below).

[0045] In some embodiments, such as Figure 4a , Figure 4b , Figure 4c As shown, the depth of the temperature sensing hole 12 is greater than the length of the thermistor 2, allowing the thermistor 2 to be completely embedded within it. The inner diameter of the temperature sensing hole 12 is greater than the outer diameter of the thermistor 2, facilitating its installation. In one embodiment, the inner diameter of the temperature sensing hole 12 is 1.1 to 1.2 times the diameter of the thermistor 2; for example, the inner diameter of the temperature sensing hole 12 is typically 2 mm to 8 mm. After the thermistor 2 is installed, thermally conductive adhesive 3 is injected into the temperature sensing hole 12. The adhesive 3 fills the gap between the thermistor 2 and the temperature sensing hole 12, and wraps the thermistor 2 and its connected pins 21. For example, epoxy resin can be used for potting and sealing, which not only fixes the thermistor 2 but also provides good thermal conductivity, does not affect temperature measurement, and acts as insulation to prevent short circuits between the thermistor 2 and the heat sink 1.

[0046] In some embodiments, the temperature sensing hole 12 is a tapered hole, meaning the diameter of the bottom end of the temperature sensing hole 12 is smaller than the diameter of the opening end, and the diameter of the bottom end is larger than the outer diameter of the thermistor 2. A larger opening diameter facilitates the insertion of the thermistor 2 and also facilitates the application of thermally conductive adhesive 3. In other embodiments, the opening diameter can be further increased by forming a chamfer at the opening end of the temperature sensing hole 12, which also facilitates the insertion of the thermistor 2 and the application of thermally conductive adhesive 3. It is understood that the shape and size of the temperature sensing hole 12 are determined based on the shape of the thermistor 2, ensuring convenient insertion of the thermistor 2.

[0047] In some embodiments, such as Figure 5 As shown, a lead-out groove 123 is formed at the opening end of the temperature measuring hole 12. A lead-out groove 123 is also provided at the opening end of the second temperature measuring hole 122. The lead-out groove 123 is formed on the side surface where the second temperature measuring hole 122 is located and communicates with the temperature measuring hole 12. The lead-out groove 123 is used to accommodate the pin 21 of the thermistor 2. For example, the pin 21 can be bent and placed into the lead-out groove 123. Through the lead-out groove 123, the pin 21 of the thermistor can be led out to one side of the heat sink 1, thereby ensuring the flatness of the side surface where the temperature measuring hole 12 is located and avoiding affecting the installation of the heat sink 1. Exemplarily, when the pin 21 is wrapped with an insulating layer, the pin 21 can be fixed in the lead-out groove 123 by thermally conductive adhesive 3, or it can be left unfixed. When the pin 21 itself does not have an insulating layer, the pin 21 is wrapped and fixed in the lead-out groove 123 by thermally conductive adhesive 3.

[0048] In some embodiments, a mounting position can be provided with multiple temperature measuring holes 12, and each temperature measuring hole 12 is equipped with a thermistor 2, which can realize temperature sampling redundancy and improve the reliability of temperature monitoring. As in one embodiment, Figure 3 As shown, the temperature measuring hole 12 includes a first temperature measuring hole 121, which is formed on a side perpendicular to the mounting surface 11. The first temperature measuring hole 121 extends toward the mounting position and extends to the location of the mounting position.

[0049] For example, the first temperature measuring hole 121 can extend parallel to the mounting surface 11, which facilitates the processing of the first temperature measuring hole 121. The hole can be drilled as close to the mounting surface 11 as possible to reduce the distance between the first temperature measuring hole 121 and the mounting surface 11, thereby improving the efficiency and accuracy of temperature measurement. Alternatively, it can be tilted so that the bottom end is shorter than the opening end in vertical distance from the mounting surface 11, resulting in a smaller gap between the bottom end and the mounting surface 11, thus enabling more sensitive and accurate temperature measurement.

[0050] As in one embodiment, such as Figure 3As shown, the temperature measuring hole 12 also includes a second temperature measuring hole 122, which is formed on a side surface parallel to the mounting surface 11. The second temperature measuring hole 122 is formed in the area where the vertical projection from the mounting position to the side surface is located. For example, when the thickness of the heat sink 1 is greater than the length of the thermistor 2, the second temperature measuring hole 122 can be formed perpendicular to the mounting surface 11. For example, the second temperature measuring hole 122 penetrates through the heat sink 1, that is, the second temperature measuring hole 122 penetrates from the aforementioned side surface to the mounting surface 11, which can further improve the temperature detection efficiency and accuracy. When the second temperature measuring hole 122 is a through hole, the thermistor 2 is located inside the second temperature measuring hole 122 and cannot extend onto the mounting surface 11, so as not to affect the installation of the heating device 4. It is easily understood that the second temperature measuring hole 122 can also be set as a blind hole, which will not affect the integrity of the mounting surface 11.

[0051] In some embodiments, such as Figure 3 As shown, a first temperature measuring hole 121 and a second temperature measuring hole 122 are provided simultaneously. For example, two first temperature measuring holes 121 and one second temperature measuring hole 122 can be provided on different sides of the heat sink 1, that is, three thermistors 2 are provided simultaneously to form a redundant temperature sampling system, which improves the reliability and accuracy of temperature monitoring, can better adapt to the temperature distribution under complex working conditions, and improves the overall reliability of the machine.

[0052] The thermistor 2 of this application does not require an OT terminal to be connected to the heat sink 1, thus eliminating the need for screw connections and simplifying the assembly process. Furthermore, the elimination of OT terminals and connecting screws reduces the number and types of components used, thereby reducing material and labor costs and potentially lowering the overall cost by 40% to 60%.

[0053] In the description of this application, it should be understood that the terms "length", "thickness", etc., indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0054] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0056] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0057] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and simple improvements made to the substantive content of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation structure with an embedded thermistor, characterized in that, include: A heat sink has a mounting surface with mounting positions for mounting heat-generating devices. A temperature measuring hole is formed on the side of the heat sink, the temperature measuring hole extends toward the mounting position, and the bottom end of the temperature measuring hole is located at the mounting position. A thermistor is placed at the bottom of the temperature measuring hole. Thermally conductive adhesive is provided inside the temperature measuring hole, and the thermally conductive adhesive fills the gap between the thermistor and the temperature measuring hole.

2. The heat dissipation structure with an embedded thermistor according to claim 1, characterized in that, Multiple temperature measuring holes are provided, and the multiple temperature measuring holes are distributed on different sides of the heat sink.

3. The heat dissipation structure with an embedded thermistor according to claim 1, characterized in that, The temperature measuring hole includes a first temperature measuring hole, which is formed on a side surface perpendicular to the mounting surface.

4. The heat dissipation structure with an embedded thermistor according to claim 1, characterized in that, The temperature measuring hole includes a second temperature measuring hole, which is formed on a side surface parallel to the mounting surface.

5. The heat dissipation structure with an embedded thermistor according to claim 4, characterized in that, The second temperature measuring hole penetrates the heat sink.

6. The heat dissipation structure with an embedded thermistor according to claim 1, characterized in that, The depth of the temperature measuring hole is greater than the length of the thermistor. The inner diameter of the temperature measuring hole is larger than the outer diameter of the thermistor.

7. The heat dissipation structure with an embedded thermistor according to claim 6, characterized in that, The inner diameter of the temperature measuring hole is 1.1 to 1.2 times the diameter of the thermistor.

8. The heat dissipation structure with an embedded thermistor according to claim 1, characterized in that, The temperature measuring hole is a conical hole, and the diameter of the bottom end of the temperature measuring hole is smaller than the diameter of the opening end of the temperature measuring hole. The bottom diameter of the temperature measuring hole is larger than the outer diameter of the thermistor.

9. The heat dissipation structure with an embedded thermistor according to claim 1, characterized in that, The opening end of the temperature measuring hole is formed with a lead-out groove, which is formed on the side where the temperature measuring hole is located and communicates with the temperature measuring hole. The lead-out groove is used to accommodate the pins of the thermistor.

10. An electrical appliance, characterized in that, The device includes a heat-generating device and a heat dissipation structure with an embedded thermistor as described in any one of claims 1-9, wherein the heat-generating device is disposed on the mounting position of the heat dissipation block of the heat dissipation structure.

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