Opto-coupler

Abstract

The utility model relates to technical field of semiconductor device discloses a photoelectric coupler, include: tube shell, the tube shell is pasted with photovoltaic chip through conductive glue, and the photovoltaic chip surface adopts gold wire bonding process and tube shell connection composition circuit core seat, circuit substrate, the circuit substrate is pasted with emitting diode chip through conductive glue, and emitting diode chip surface adopts gold wire bonding process and circuit substrate connection composition circuit core group, and the circuit core group adopts conductive glue and is connected with circuit core seat with the process of sticking. In the utility model, adopt double -deck structure, in the assembly process is more convenient, reduces the interference, guarantees the conversion efficiency under the premise, further reduces ceramic package appearance size, can be free assembly according to different needs simultaneously, and the light coupling output current can reach 25 mu A, and the voltage can reach 8V, satisfies the stable work demand under the wide temperature environment of -55 DEG C to 125 DEG C.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device technology, and in particular to an optocoupler. Background Technology

[0002] Optocouplers are indispensable semiconductor devices in integrated circuits. An optocoupler, or simply optocoupler, is a device that converts an input electrical signal into an optical signal, and then back into an electrical signal. Its input is a light-emitting diode (LED), which converts the input electrical signal into an optical signal. After passing through a transparent photoconductor, the optical signal is received by a photovoltaic chip, converted back into an electrical signal, and amplified, completing the electro-optical-electrical conversion. Through this conversion process, the input and output signals achieve unidirectional transmission and isolation, meaning the output signal does not interfere with the input signal. Optocouplers have advantages such as stable operation, high transmission efficiency, and long lifespan. However, current ceramic packaging designs for optocouplers have failed to effectively reduce the size while maintaining chip conversion efficiency, limiting their application. Utility Model Content

[0003] The purpose of this invention is to provide an optocoupler that, while ensuring the conversion efficiency of LED chips (light-emitting diode chips) and photovoltaic cells, further reduces the size of the ceramic package and allows for free assembly according to different needs, thereby increasing the application range of the optocoupler.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an optocoupler, comprising:

[0005] A housing, wherein a photovoltaic chip is bonded to the housing with conductive adhesive, and the surface of the photovoltaic chip is connected to the housing using a gold wire bonding process to form a circuit core base;

[0006] A circuit substrate on which light-emitting diode (LED) chips are bonded together with conductive adhesive. The LED chips are connected to the circuit substrate using a gold wire bonding process to form a circuit core assembly. The circuit core assembly and the circuit core holder are connected using a conductive adhesive bonding process.

[0007] By adopting the above technical solution: the circuit core group converts electrical signals into optical signals, and the circuit core socket receives optical signals and converts them into electrical signals, thus completing signal transmission and isolation. The connection method of conductive adhesive bonding and gold wire bonding ensures chip stability and reliable electrical connection. The double-layer structure realizes physical isolation of input and output circuits, reduces interference, and makes the assembly process more convenient.

[0008] As a further description of the above technical solution:

[0009] The tube shell is made of black alumina ceramic.

[0010] By adopting the above technical solution, the size of the optocoupler can be reduced, and it can maintain stable operation at -55℃ to 125℃.

[0011] As a further description of the above technical solution:

[0012] The casing contains multiple metallized regions for bonding and attaching the chip, and these metallized regions are interconnected.

[0013] By adopting the above technical solutions, stable mounting and bonding sites are provided for the chip, ensuring electrical connectivity of the internal circuitry and simplifying the complexity of wiring connections during assembly.

[0014] As a further description of the above technical solution:

[0015] The tube shell is made of multi-layer ceramic high-temperature co-firing, and the internal interconnections are all connected by electroplating lines.

[0016] By adopting the above technical solutions, the tube shell can be miniaturized and the structure can be compacted. The electroplating line connection improves the internal conductivity reliability, making it suitable for mass production and efficient assembly.

[0017] As a further description of the above technical solution:

[0018] The internal metallized area of ​​the casing is connected to the casing pins using electroplated lines.

[0019] By adopting the above technical solution, the low resistance of the pins and internal circuits is ensured, thereby enhancing the stability and reliability of external signal input / output.

[0020] As a further description of the above technical solution:

[0021] The metallization region has seven areas, A, G, and F. Among them, A and G are chip mounting metallization areas used to fix the chip; B, C, D, E, and F are bonding metallization areas used for the bonding process of electrical connection.

[0022] By adopting the above technical solution, the metallized area design supports multiple assembly methods, and the pins can be adjusted according to user needs, making it highly versatile.

[0023] As a further description of the above technical solution:

[0024] The light-emitting diode chip and the photovoltaic chip have a height difference on their light-receiving surfaces.

[0025] By adopting the above technical solution, the physical isolation of input and output circuits is achieved by utilizing the height difference, reducing electromagnetic interference and enhancing the electrical isolation performance of signal transmission.

[0026] Preferably, the light-emitting diode chip and the light-receiving surface of the photovoltaic chip have a height difference of 0.5-1.2 mm.

[0027] This utility model has the following beneficial effects:

[0028] 1. In this utility model, a double-layer structure is adopted, which makes the assembly process more convenient, realizes physical isolation of input and output circuits, reduces interference, and utilizes black alumina ceramic material for the tube shell to further reduce the size of the ceramic package while ensuring conversion efficiency. At the same time, it can be freely assembled according to different needs.

[0029] 2. The optocoupler proposed in this utility model has an output current of up to 25μA and a voltage of up to 8V, which meets the stable working requirements in a wide temperature range of -55℃ to 125℃. Attached Figure Description

[0030] Figure 1 This is a circuit diagram of an optocoupler proposed in this utility model;

[0031] Figure 2 This is a schematic diagram of the pinout of the tube housing of an optocoupler proposed in this utility model;

[0032] Figure 3 This is a schematic diagram of the metallized region of the tube shell of an optocoupler proposed in this utility model;

[0033] Figure 4 for Figure 3 A schematic diagram of the cross-section;

[0034] Figure 5 for Figure 3 A schematic diagram of the longitudinal section;

[0035] Figure 6 This is a schematic diagram of the circuit core assembly of an optocoupler proposed in this utility model;

[0036] Figure 7 This is a schematic diagram of the circuit core of an optocoupler proposed in this utility model;

[0037] Figure 8 This is a schematic diagram of the assembly of the circuit core assembly and circuit core base of an optocoupler proposed in this utility model;

[0038] Figure 9 This is a schematic diagram of assembly method a of an optocoupler proposed in this utility model;

[0039] Figure 10 This is a schematic diagram of assembly method b of an optocoupler proposed in this utility model;

[0040] Figure 11This is a schematic diagram of an assembly method c for an optocoupler proposed in this utility model;

[0041] Figure 12 This is a schematic diagram of an assembly method d for an optocoupler proposed in this utility model;

[0042] Figure 13 This is a wiring diagram of the internal casing of an optocoupler proposed in this utility model;

[0043] Figure 14 This is a dimensioning diagram of the tube shell in one embodiment of the optocoupler proposed in this utility model. Detailed Implementation

[0044] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0045] Example 1:

[0046] Reference Figures 1-8 The present invention provides an embodiment of an optocoupler, comprising a housing and a circuit substrate; a photovoltaic chip is bonded to the housing with conductive adhesive, and the surface of the photovoltaic chip is connected to the housing by gold wire bonding to form a circuit core base; a light-emitting diode chip is bonded to the circuit substrate with conductive adhesive, and the surface of the light-emitting diode chip is connected to the circuit substrate by gold wire bonding to form a circuit core assembly, and the circuit core assembly is connected to the circuit core base by conductive adhesive bonding.

[0047] Specifically, the circuit chip converts electrical signals into optical signals, and the circuit chip socket receives optical signals and converts them into electrical signals, thus completing signal transmission and isolation. The connection method of conductive adhesive bonding and gold wire bonding ensures the chip is stable and the electrical connection is reliable. The double-layer structure realizes physical isolation between input and output circuits, reduces interference, and makes the assembly process more convenient.

[0048] The tube shell is made of black alumina ceramic.

[0049] Specifically, by using a black alumina ceramic shell, the size of the ceramic package can be further reduced while ensuring the conversion efficiency of LED chips (light-emitting diode chips) and photovoltaic chips. It can also be freely assembled according to different needs, reducing the size and operating stably at temperatures from -55℃ to 125℃, making it suitable for harsh environments.

[0050] refer to Figures 2-5The casing contains multiple metallized regions for bonding and attaching the chip, and these metallized regions are interconnected.

[0051] Specifically, the metallized areas provide precise mounting and bonding sites for the chip (A and G areas fix the chip, and BF area enables electrical connection). Through electroplating lines or internal conductive structures, the conductive path between the chip and the pins is ensured to be stable, simplifying the complexity of the circuit layout during assembly and improving the integration of internal circuits.

[0052] The tube shell is made of multi-layer ceramic co-fired at high temperature, and the internal interconnections are all connected by electroplating lines.

[0053] Specifically, a multi-layer ceramic substrate (such as L1-L6 green ceramic sheets) is used to form an integrated structure through high-temperature co-firing. The internal electroplating lines connect the metallized areas of each layer. While reducing the volume of the casing, the internal circuitry is standardized, improving conductivity reliability and production assembly efficiency, making it suitable for mass production.

[0054] The internal metallized area of ​​the casing is connected to the casing pins using electroplated lines.

[0055] Specifically, the electroplating line directly connects the tube shell pins (pins 1-4) with the internal bonding metallization areas (such as D, E, B, and C areas), forming a low-resistance conductive channel.

[0056] There are seven metallization areas, A, G, and F. Among them, A and G are chip mounting metallization areas used to fix the chip; B, C, D, E, and F are bonding metallization areas used for bonding processes for electrical connections.

[0057] Specifically, areas A and G use conductive adhesive to fix the LED chip and photovoltaic chip, ensuring the chip's mechanical stability; area BF uses gold wire bonding to achieve electrical connection between the chip electrodes and pins, and the layout of each bonding area supports four assembly methods (e.g., ...). Figures 9 to 12 The pin definitions can be flexibly adjusted to adapt to different circuit interfaces, improving product versatility.

[0058] refer to Figure 3 , Figure 4 and Figure 5 The casing is made of black alumina ceramic, with multiple metallized regions inside for chip bonding and adhesion. To reduce structural complexity, these metallized regions are interconnected using electroplated lines inside the casing. The metallized regions are defined as follows:

[0059] A and G are the chip mounting metallization areas, used to fix the chip.

[0060] B, C, D, E, and F are bonding metallization regions used in the bonding process for electrical connections.

[0061] Electrical connections: (Pin 1 - D), (Pin 2 - E), (Pin 3 - B), (Pin 4 - C), clearly define the electrical connections between the pins and the metallized area.

[0062] Electrical performance: Dielectric withstand voltage ≥1000V to ensure insulation performance; insulation resistance ≥500MΩ to prevent leakage.

[0063] refer to Figure 13 The diagram showcases the unit wiring of the housing, consisting of green ceramic front-side units from L1 to L6. The housing is sintered from multiple layers of ceramic substrates with different designs, and the internal metallized areas are connected to the housing leads by electroplated lines. This design facilitates assembly, enabling a rational layout and reliable electrical connections of the internal circuitry, balancing electrical performance with ease of assembly.

[0064] The light-emitting diode chip and the photovoltaic chip have a height difference on their light-receiving surfaces.

[0065] Specifically, by utilizing the spatial misalignment between the circuit substrate (upper layer) and the casing (lower layer) in the double-layer structure, a physical height difference is formed between the light-emitting diode chip and the light-receiving surface of the photovoltaic chip, thereby achieving spatial isolation between the input circuit and the output circuit.

[0066] A height difference of 0.5-1.2mm is formed between the light-receiving surfaces of the LED chip and the photovoltaic chip. Precise control of the optical signal transmission path ensures efficient optical coupling while optimizing the internal space layout to reduce package size.

[0067] Working Principle: The input electrical signal is converted into an optical signal by the LED chip in the circuit core assembly. This optical signal is then transmitted via a transparent light guide path (formed by a double-layer spatial layout) to the photovoltaic chip in the circuit core socket. The photovoltaic chip converts the optical signal back into an electrical signal and outputs it. During this process, the black alumina ceramic casing provides insulation and mechanical protection. Multi-layer metallized areas and electroplated lines ensure a reliable signal path. The height difference design achieves physical isolation between input and output, ultimately achieving unidirectional signal transmission and efficient electrical isolation between electrical and optical signals. This meets the stable operating requirements in a wide temperature range of -55℃ to 125℃. The circuit principle is as follows: Figure 1 As shown.

[0068] Example 2:

[0069] refer to Figures 9-14 This embodiment provides a manufacturing process for an optocoupler, including the following steps:

[0070] I. Circuit Core Assembly Fabrication

[0071] Chip bonding: Select an LED chip and apply conductive adhesive (such as silver paste) evenly to the metallized area of ​​the circuit substrate (corresponding to chip mounting metallized area A or G). Precisely attach the LED chip to the circuit substrate, ensuring that the light-emitting surface of the LED chip faces upward. Cure the conductive adhesive by constant temperature curing (such as holding at 150℃ for 30 minutes), thereby achieving mechanical fixation and conductive connection between the LED chip and the circuit substrate.

[0072] Gold wire bonding: Using a gold wire bonding machine, one end of a 25μm diameter gold wire is soldered to the electrode pad of the light-emitting diode chip, and the other end is soldered to the bonding metallization area (such as the D' and E' areas) of the circuit substrate to form a low-resistance conductive path and complete the electrical connection of the circuit core assembly.

[0073] II. Circuit Core Socket Fabrication

[0074] Photovoltaic chip installation: The photovoltaic chip is bonded to the metallized area of ​​the casing (corresponding to chip mounting metallized area A or G) using conductive adhesive, ensuring that the light-receiving surface of the photovoltaic chip faces the direction of the circuit core assembly, and the chip is fixed by the same curing process.

[0075] Pin bonding: Using gold wire bonding technology, the electrodes of the photovoltaic chip are connected to the bonding metallization areas (such as areas B, C, D, and E) of the package. Among them, the package pin 3 is connected to area B, pin 4 to area C, pin 1 to area D, and pin 2 to area E through gold wire to form an electrical connection for the output circuit.

[0076] III. Final Assembly Process

[0077] Layered docking: Align the circuit substrate (upper input circuit) of the circuit core assembly with the casing (lower isolation drive circuit) of the circuit core socket, so that the D' and E' regions of the circuit core assembly completely overlap with the D and E regions of the circuit core socket.

[0078] Conductive adhesive fixing: Conductive adhesive is applied to the overlapping area, fixed by a pressure fixture, and then cured to achieve mechanical connection and electrical conduction between the circuit core assembly and the core holder, forming a complete double-layer structure. At this time, a height difference of 0.5-1.2mm is formed between the light-receiving surfaces of the LED chip and the photovoltaic chip, and physical isolation of the input and output circuits is achieved through spatial misalignment.

[0079] IV. Implementation of the Outer and Internal Structures

[0080] Ceramic shell preparation:

[0081] Using black alumina ceramic (Al2O3 content ≥90%) green ceramic sheets, metallization regions (7 regions in total, A, G, where A and G are chip mounting regions and BF is the bonding region) are formed on the green ceramic sheets via screen printing. The metallization regions are interconnected via electroplating lines (e.g., ...). Figure 3 Unit wiring diagram).

[0082] Multilayer green ceramic sheets (L1-L6) are stacked and hot-pressed, then co-fired at 1600℃ to form an integrated tube shell. The internal metallized area is connected to the pins through an electroplating line to ensure that pins 1-4 are connected to areas D, E, B, and C respectively.

[0083] Assembly method switching:

[0084] refer to Figures 9-12 Based on user needs, four assembly methods (ad) can be achieved by adjusting the bonding area between the circuit core and the core socket (such as selecting different combinations of metallization areas). Each method corresponds to different pin definitions (such as pin arrangement, input and output polarity), which can adapt to different circuit interfaces without changing the core structure.

[0085] The optocoupler manufactured using the process provided in this embodiment has the following advantages:

[0086] By optimizing the alignment accuracy of the LED chip and the photovoltaic chip and the design of the photoconductor medium, a stable driving capability of 25μA output current and 8V voltage is achieved, meeting the signal isolation requirements of the new generation of weapons and equipment.

[0087] The black alumina ceramic housing has a wide operating temperature range of -55℃ to 125℃, a dielectric withstand voltage of ≥1000V, and an insulation resistance of ≥500MΩ, ensuring reliable operation in high and low temperature and high voltage scenarios.

[0088] The dual-layer structure and multi-layer ceramic co-firing process reduce the package size compared to traditional optocouplers, making it suitable for high-density circuit board integration.

[0089] Standardized conductive adhesive bonding and gold wire bonding processes shorten the assembly time of single components, making them suitable for automated mass production.

[0090] The four assembly methods can be achieved by changing the bonding area, without the need to redesign the mold, thus reducing the customer's customization costs.

[0091] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An optocoupler, characterized in that, include: A housing, wherein a photovoltaic chip is bonded to the housing with conductive adhesive, and the surface of the photovoltaic chip is connected to the housing using a gold wire bonding process to form a circuit core base; A circuit substrate on which light-emitting diode (LED) chips are bonded together with conductive adhesive. The LED chips are connected to the circuit substrate using a gold wire bonding process to form a circuit core assembly. The circuit core assembly and the circuit core holder are connected using a conductive adhesive bonding process.

2. The optocoupler according to claim 1, characterized in that: The tube shell is made of black alumina ceramic.

3. The optocoupler according to claim 1, characterized in that: The casing contains multiple metallized regions for bonding and attaching the chip, and these metallized regions are interconnected.

4. The optocoupler according to claim 1, characterized in that: The tube shell is made of multi-layer ceramic high-temperature co-firing, and the internal interconnections are all connected by electroplating lines.

5. The optocoupler according to claim 1, characterized in that: The internal metallized area of ​​the casing is connected to the casing pins using electroplated lines.

6. The optocoupler according to claim 3, characterized in that: The metallization region has seven areas, A, G, and F. Among them, A and G are chip mounting metallization areas used to fix the chip; B, C, D, E, and F are bonding metallization areas used for the bonding process of electrical connection.

7. The optocoupler according to claim 1, characterized in that: The light-emitting diode chip and the photovoltaic chip have a height difference on their light-receiving surfaces.

8. An optocoupler according to claim 7, characterized in that: The light-emitting diode chip and the light-receiving surface of the photovoltaic chip have a height difference of 0.5-1.2mm.

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