Wafer carrier switching transfer system

Abstract

The utility model provides a kind of wafer carrier switching conveying system, including carrier switching device and carrier conveying device, by the structural improvement of carrier switching device, it can at least two groups of wafers are transferred synchronously, to simultaneously at least two groups of wafers are transferred between internal carrier and external carrier, improve the switching efficiency of carrier;For carrier conveying device, by the first carrier support unit of configuration carrier support conveying, replace the conveying mode of traditional mechanical hand clamping, greatly improve the stability in the process of carrier conveying, to avoid the risk of carrier drop, and the performance of the first carrier support unit configuration can at least two carriers are synchronously loaded or carried out in carrier switching device, to improve the conveying efficiency of carrier.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically to a wafer carrier switching and conveying system. Background Technology

[0002] Wafer tank cleaning processes involve placing batches of wafers, carried by carriers, into multiple cleaning tanks according to the cleaning sequence. Surface contaminants are removed through methods such as immersion, spraying, ultrasonic vibration, or chemical reagent circulation. Wafer baskets are typically used as carriers for batch storage, transportation, and processing of wafers. To prevent cross-contamination between external carriers (those holding wafers outside the wafer tank cleaning equipment) and internal carriers (those holding wafers inside the wafer tank cleaning equipment), wafers need to be transferred between external and internal carriers.

[0003] Existing wafer tank cleaning equipment has the capacity to simultaneously accommodate multiple carriers carrying wafers for cleaning within a single cleaning tank. It primarily uses robotic arms as carrier transport devices in the wafer loading and cleaning areas. However, conventional robotic arms can only grip and transport one carrier at a time, resulting in a low wafer transfer rate. If multiple end effectors are configured on the same robotic arm to simultaneously grip and transport multiple carriers, the design requirements for these end effectors are more stringent, and the risk of carriers falling during actual use is also higher. For example, after prolonged use, the fasteners of the end effectors may loosen, leading to uneven force on the gripping arms and causing the gripped carriers to fall, resulting in significant cost losses.

[0004] In view of this, it is necessary to improve the wafer carrier transport device used in existing wafer tank cleaning equipment to solve the above problems.

[0005] It should be noted that the above description of the background technology is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background technology section of this application. Utility Model Content

[0006] The purpose of this invention is to disclose a wafer carrier switching and conveying system with high transport efficiency and high transport stability.

[0007] To achieve the above objectives, this utility model provides a carrier switching device, comprising a carrier loading mechanism, a wafer lifting mechanism disposed below the carrier loading mechanism, and a wafer clamping mechanism disposed above the carrier loading mechanism. The carrier loading mechanism is configured with at least two first carrier loading units, each first carrier loading unit being configured with a first loading channel, and the first loading channel being constructed to form at least two interconnected first loading stations. The wafer lifting mechanism is configured with at least two sets of wafer support units corresponding to the first loading stations, and the wafer clamping mechanism is configured with at least two sets of wafer grippers corresponding to the first loading stations.

[0008] The vehicle conveying device is equipped with a first vehicle conveying mechanism having a first vehicle support unit, the first vehicle support unit being equipped with at least two brackets for supporting vehicles, and the first vehicle support unit simultaneously loading or unloading at least two vehicles along the first loading channel.

[0009] As a further improvement of this utility model, the wafer carrier switching and conveying system further includes a mechanism for configuring carrier loading units. Each carrier loading unit is provided with a loading channel. The first carrier support unit loads and unloads carriers through the loading channel, so as to simultaneously convey at least two carriers between the mechanism for configuring carrier loading units and the carrier switching device.

[0010] As a further improvement of this utility model, the wafer carrier switching and conveying system further includes a carrier temporary storage mechanism configured with a second carrier loading unit. The second carrier loading unit is configured with a second loading channel, and the second loading channel is constructed to form at least two interconnected second loading stations. The carrier is conveyed between the second loading station and the first loading station by the carrier conveying device.

[0011] As a further improvement of this utility model, the vehicle conveying device is further configured with a second vehicle conveying mechanism and a third vehicle conveying mechanism. The third vehicle conveying mechanism is configured with a third loading station. The first vehicle conveying mechanism conveys the vehicle between the first loading station and the third loading station, and the second vehicle conveying mechanism conveys the vehicle between the second loading station and the third loading station.

[0012] As a further improvement of this utility model, the third carrier conveying mechanism is configured with a third carrier loading unit, the third carrier loading unit is configured with a third loading channel, and the third loading channel is constructed to form at least two interconnected third loading stations. The extension direction of the second loading channel is the same as the extension direction of the first loading channel, and the extension direction of the third loading channel is opposite to the extension direction of the first loading channel.

[0013] As a further improvement of this utility model, the second vehicle conveying mechanism is configured with a second vehicle support unit, the second vehicle support unit is configured with at least one of the brackets, and the second vehicle support unit loads or loads at least one vehicle into or out along the second loading channel or the third loading channel.

[0014] As a further improvement of this utility model, the vehicle temporary storage mechanism is configured on one side of the vehicle switching device along the X-axis, the extension direction of the first loading channel is located on the Y-axis, the first vehicle conveying mechanism is configured with a first driving component for moving the first vehicle support unit, the first driving component being a three-axis moving module; the second vehicle conveying mechanism is configured with a second driving component, which drives the second vehicle support unit to move at least along the Y-axis; the third vehicle conveying mechanism is configured with a third driving component, which drives the third vehicle loading unit to move at least along the X-axis.

[0015] As a further improvement of this utility model, the wafer lifting mechanism is configured to switch and move below at least two of the first carrier loading units, the wafer clamping mechanism is configured to switch and move above at least two of the first carrier loading units, at least one of the first carrier loading units is configured to load an internal carrier, at least one of the first carrier loading units is configured to load an external carrier, and at least two sets of the wafer grippers are vertically connected to at least two sets of the wafer support units to synchronously transfer at least two sets of wafers between the internal carrier and the external carrier.

[0016] As a further improvement of this utility model, the vehicle conveying device also includes a fourth vehicle conveying mechanism, which is configured with a vehicle lifting assembly and a fourth vehicle loading unit driven by the vehicle lifting assembly, and the vehicle is conveyed between the first vehicle loading unit and the fourth vehicle loading unit through the first vehicle conveying mechanism.

[0017] As a further improvement of this utility model, the wafer carrier switching and conveying system is configured in a wafer tank cleaning device, and the carrier conveying device is further configured with a third carrier conveying mechanism. The third carrier conveying mechanism conveys at least two internal carriers carrying wafers to be cleaned to the cleaning tank of the wafer tank cleaning device to perform the cleaning process.

[0018] Compared with the prior art, the beneficial effects of this application are:

[0019] Through the structural improvement of the carrier switching device, it can transfer at least two groups of wafers synchronously, so as to transfer at least two groups of wafers between internal carriers and external carriers at the same time, which improves the switching efficiency of the carriers; for the carrier transfer device, the first carrier supporting unit is configured to support and transfer the carriers, which replaces the traditional transfer mode of mechanical arm clamping, greatly improving the stability during carrier transfer, thereby avoiding the risk of carrier falling, and the first carrier supporting unit is configured with the performance of synchronously loading or unloading at least two carriers into or out of the carrier switching device, so as to improve the transfer efficiency of carriers. Brief Description of Drawings

[0020] Figure 1 is an overall structural diagram of a wafer carrier switching and transferring system provided by the present application;

[0021] Figure 2 is Figure 1 a schematic diagram of a carrier temporary storage mechanism configured in the wafer carrier switching and transferring system provided by;

[0022] Figure 3 is Figure 1 a partial structural schematic diagram of a wafer carrier switching and transferring system provided by;

[0023] Figure 4 is a structural schematic diagram of a carrier loading mechanism and a wafer jacking mechanism in the carrier switching device provided by the present application;

[0024] Figure 5 is a structural schematic diagram of a wafer clamping mechanism in the carrier switching device provided by the present application. Detailed Description of Embodiments

[0025] The present utility model will be described in detail below with reference to the embodiments shown in the accompanying drawings, it should be noted that these embodiments do not limit the present utility model, and any equivalent changes or substitutions in functions, methods or structures made by those skilled in the art based on these embodiments shall fall within the protection scope of the present utility model.

[0026] Referring to Figures 1 to 5 shown, the present application provides a wafer carrier switching and transferring system, which is suitable for wafer trough-type cleaning equipment, and is equipped with a carrier switching device 100 and a carrier transferring device 200. The switching between at least two groups of wafers between internal carriers and external carriers is realized through the carrier switching device 100, and the stable and efficient transfer of carriers in the wafer trough-type cleaning equipment is realized through the carrier transferring device 200, including loading or unloading to and from the carrier switching device 100, transferring to the cleaning trough of the wafer trough-type cleaning equipment to perform cleaning procedures and other steps. The wafer carrier switching and transferring system can improve the transfer efficiency of carriers, thereby improving the operating efficiency of the trough-type wafer cleaning equipment when performing cleaning procedures.

[0027] The carrier switching device 100 includes a carrier loading mechanism 10, a wafer lifting mechanism 20 disposed below the carrier loading mechanism 10, and a wafer clamping mechanism 30 disposed above the carrier loading mechanism 10.

[0028] The vehicle loading mechanism 10 is configured with at least two first vehicle loading units, for example, (see example). Figure 3 As shown, taking the configuration of two first vehicle loading units as an example, there are an internal vehicle loading unit 101 and an external vehicle loading unit 102. Each first vehicle loading unit is configured with a first loading channel extending along a first horizontal direction, and the first loading channel is constructed to form at least two interconnected first loading stations. For example, the internal vehicle loading unit 101 and the external vehicle loading unit 102 are arranged adjacent to each other along the X-axis. The extension direction of the internal vehicle loading unit 101 is set to the positive Y-axis. The internal vehicle loading unit 101 is configured with an internal vehicle loading channel 110, and the loading / unloading outlet 112 of the internal vehicle loading channel 110 is set on the opposite side of the Y-axis. The internal vehicle loading channel 110 is constructed to form two interconnected internal vehicle loading stations 111. The external vehicle loading channel 120 has the same structural configuration as the internal vehicle loading unit 101, and the external vehicle loading channel 120 is constructed to form two interconnected external vehicle loading stations 121. Each loading station (including internal carrier loading station 111 and external carrier loading station 121) is equipped with a carrier positioning component (not shown) for loading and positioning of the internal carrier 11 or the external carrier 12. A carrier clamping component can also be configured to lock the carrier more securely and improve the stability during wafer 300 transfer.

[0029] The wafer lifting mechanism 20 is configured with at least two sets of wafer support units 21 arranged at intervals along the Y-axis. For example, the wafer support units 21 are configured to correspond to the extension direction and number of loading stations configured in the internal carrier loading unit 101 and the external carrier loading unit 102. Figure 4 The diagram illustrates a configuration with two sets of wafer support units 21, capable of simultaneously supporting two sets of wafers 300 loaded into two external carriers 12 on two external carrier loading stations 121, or simultaneously supporting two sets of wafers 300 loaded into two internal carriers 11 on two internal carrier loading stations 111. The wafer lifting mechanism 20 is equipped with a drive assembly 22 to drive the wafer support units 21 in linear movement along the X-axis and in vertical movement along the Z-axis. This allows the wafer support units 21 to switch positions directly below the external carrier loading station 121 and the internal carrier loading station 111, and to support the wafers 300 within either the internal carrier 11 or the external carrier 12 in vertical movement. Each set of wafer support units 21 can be equipped with multiple pairs of support sections (not shown) suitable for wafers of different sizes (e.g., 6-inch, 8-inch, and 12-inch wafers), adaptively switching support according to the size of the loaded wafer.

[0030] The wafer clamping mechanism 30 is provided with at least two sets of wafer clamping jaws 31 arranged at intervals along the Y-axis, for example, refer to Figure 5 as shown in the figure, two oppositely arranged clamping rods 301 extending along the Y-axis are provided, and two sets of wafer clamping jaws 31 arranged at intervals along the Y-axis are formed on the clamping rods 301. The connecting end of the clamping rod 301 is connected to a movement control assembly 302. The movement control assembly 302 controls the clamping rods 301 to switch and move along the X-axis between positions directly above the external carrier loading station 121 and the internal carrier loading station 111, and controls the relative spacing between the two clamping rods 301 to control the clamping and picking / placing of wafers by the wafer clamping jaws 31. Each set of wafer clamping jaws 31 can be provided with multiple pairs of clamping jaws (not shown) suitable for wafers of different sizes (e.g., 6-inch wafers, 8-inch wafers and 12-inch wafers). For example, taking the extending direction of the clamping rod 301 as an axis, two or three pairs of clamping jaws adapted to different sizes are arranged on the circumference of the clamping rod 301, and the clamping is switched adaptively according to the size of the loaded wafer.

[0031] Refer to Figure 2 as shown in the figure, the wafer carrier switching and conveying system is provided with a carrier temporary storage mechanism 40 for temporary placement when the external carrier 12 is loaded in or unloaded out, and the external carrier 12 accommodates wafers 300 before or after cleaning. The carrier temporary storage mechanism 40 is provided with a second carrier loading unit 401, the second carrier loading unit 401 is provided with a second loading channel 410 extending along the positive Y-axis direction, and the second loading channel 410 is formed with at least two mutually communicated second loading stations 411. In the figure, the carrier temporary storage mechanism 40 is arranged at an adjacent position along the X-axis of the carrier loading mechanism 10 of the wafer switching device 100 as an illustration, the extending direction of the second loading channel 410 is configured to be the same as that of the internal carrier loading channel 110 and the external carrier loading channel 120, that is, the second loading channel 410 extends along the positive Y-axis direction, and the loading / unloading port 412 of the second loading channel 410 faces the reverse side of the Y-axis.

[0032] In combination with Figures 1 to 3 as shown in the figure, the carrier conveying device 200 is provided with a first carrier conveying mechanism 210, a second carrier conveying mechanism 220, and a third carrier conveying mechanism 230.

[0033] In one embodiment, the third carrier conveying mechanism 230 is configured as a transfer mechanism for conveying the external carrier 12 from the carrier temporary storage mechanism 40 to the external carrier loading unit 102, and a conveying mechanism for conveying at least two internal carriers 11 carrying wafers 300 to be cleaned to the cleaning tank of the wafer tank cleaning equipment to perform the cleaning process.

[0034] The third vehicle transfer mechanism 230 is disposed on the opposite side of the Y-axis of the vehicle switching device 100 and the vehicle temporary storage mechanism 40. The third vehicle transfer mechanism 230 is configured with a third vehicle loading unit 231, and the third vehicle loading unit 231 is configured with a third loading channel 232 extending along the opposite side of the Y-axis. The third loading channel 232 is constructed to form at least two interconnected third loading stations 203. The loading / unloading outlet 201 of the third loading channel 203 is oriented parallel to the loading / unloading outlet 112 of the inner vehicle loading channel 110 along the Y-axis, so as to facilitate the loading and unloading of vehicles between the inner vehicle loading station 111, the outer vehicle loading station 121, the second loading station 411, and the third loading station 203 by the first vehicle transfer mechanism 210 and the second vehicle transfer mechanism 220.

[0035] The first vehicle conveying device 210 is equipped with a first vehicle support unit 211 and at least two brackets 212 for supporting vehicles. The first vehicle support unit 211 loads or unloads vehicles along the positive Y-axis with the internal vehicle loading channel 110 and the external vehicle loading channel 120. For example, the first vehicle support unit 211 is equipped with two brackets 212, so that two internal vehicles 11 can be simultaneously loaded into or unloaded from the internal vehicle loading channel 110, or two external vehicles 12 can be simultaneously loaded into or unloaded from the external vehicle loading channel 120. For example, the first vehicle conveying device 210 can simultaneously convey two external vehicles 12 loaded on the third vehicle conveying mechanism 230 to the external vehicle loading channel 120.

[0036] The second vehicle conveying device 220 is equipped with a second vehicle support unit 221 and at least one bracket 222 for supporting vehicles. The second vehicle support unit 221 loads and unloads vehicles along the second loading channel 410 and along the third loading channel 232, so as to transfer the external vehicle 12 loaded in the vehicle temporary storage mechanism 40 to the third vehicle conveying mechanism 230 for transfer via the second vehicle conveying mechanism 220.

[0037] Regarding the configuration of the driving assembly of the carrier transfer device 200, for example, the first carrier transfer mechanism 210 is configured with a first driving assembly 213, and the first driving assembly 213 drives the first carrier supporting unit 211 to move in three directions of X-axis, Y-axis and Z-axis. The second carrier transfer mechanism 220 is configured with a second driving assembly 223, and the second moving assembly 223 drives the second carrier supporting unit 222 to move along the Y-axis. The third carrier transfer mechanism 230 is configured with a third driving assembly 233, and the third driving assembly 233 drives the third carrier loading unit 231 to move along the X-axis. This enables high connecting transfer efficiency among the first carrier transfer mechanism 210, the second carrier transfer mechanism 220, the third carrier transfer mechanism 230 and the carrier switching device 100.

[0038] Refer to Figure 1 as shown, the carrier transfer device 200 is further provided with a fourth carrier transfer mechanism 240, the fourth carrier transfer mechanism 240 is configured with a carrier lifting assembly 241 and a fourth carrier loading unit 242 driven by the carrier lifting assembly. In one embodiment, the carrier switching device 100 and the carrier transfer device 200 are disposed at one of the wafer loading stations of a wafer tank-type cleaning apparatus, and the fourth carrier transfer mechanism 240 is configured to transfer the cleaned wafers 300 carried by the inner carriers 11 back to the wafer loading station where the carrier switching device 100 is located. The inner carrier loaded by the fourth carrier transfer mechanism 240 is transferred by the first carrier transfer mechanism 210 to the inner carrier loading unit 101 of the carrier switching device 100 for carrier switching.

[0039] The series of detailed descriptions listed above are merely specific descriptions for feasible embodiments of the present utility model, and they are not intended to limit the protection scope of the present utility model. All equivalent implementations or modifications made without departing from the technical spirit of the present utility model shall be included within the protection scope of the present utility model.

[0040] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, the scope of the present utility model is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be construed as limiting the involved claims.

[0041] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer carrier switching and conveying system, characterized in that, include: The carrier switching device includes a carrier loading mechanism, a wafer lifting mechanism disposed below the carrier loading mechanism, and a wafer clamping mechanism disposed above the carrier loading mechanism. The carrier loading mechanism is configured with at least two first carrier loading units, each first carrier loading unit is configured with a first loading channel, and the first loading channel is configured to form at least two interconnected first loading stations. The wafer lifting mechanism is configured with at least two sets of wafer support units corresponding to the first loading stations, and the wafer clamping mechanism is configured with at least two sets of wafer grippers corresponding to the first loading stations. The vehicle conveying device is equipped with a first vehicle conveying mechanism having a first vehicle support unit, the first vehicle support unit being equipped with at least two brackets for supporting vehicles, and the first vehicle support unit simultaneously loading or unloading at least two vehicles along the first loading channel.

2. The wafer carrier switching and conveying system according to claim 1, characterized in that, The wafer carrier switching and conveying system also includes a mechanism for configuring carrier loading units. Each carrier loading unit is provided with a loading channel. The first carrier support unit loads and unloads carriers through the loading channel, so as to simultaneously convey at least two carriers between the mechanism for configuring carrier loading units and the carrier switching device.

3. The wafer carrier switching and conveying system according to claim 1, characterized in that, The wafer carrier switching and conveying system further includes a carrier temporary storage mechanism configured with a second carrier loading unit. The second carrier loading unit is configured with a second loading channel. The second loading channel is constructed to form at least two interconnected second loading stations. The carrier is conveyed between the second loading station and the first loading station by the carrier conveying device.

4. The wafer carrier switching and conveying system according to claim 3, characterized in that, The vehicle conveying device is further configured with a second vehicle conveying mechanism and a third vehicle conveying mechanism. The third vehicle conveying mechanism is configured with a third loading station. The first vehicle conveying mechanism conveys the vehicle between the first loading station and the third loading station, and the second vehicle conveying mechanism conveys the vehicle between the second loading station and the third loading station.

5. The wafer carrier switching and conveying system according to claim 4, characterized in that, The third vehicle conveying mechanism is configured with a third vehicle loading unit, the third vehicle loading unit is configured with a third loading channel, and the third loading channel is constructed to form at least two interconnected third loading stations. The extension direction of the second loading channel is the same as the extension direction of the first loading channel, and the extension direction of the third loading channel is opposite to the extension direction of the first loading channel.

6. The wafer carrier switching and conveying system according to claim 5, characterized in that, The second vehicle conveying mechanism is equipped with a second vehicle support unit, the second vehicle support unit is equipped with at least one of the brackets, and the second vehicle support unit loads or loads at least one vehicle into or out along the second loading channel or the third loading channel.

7. The wafer carrier switching and conveying system according to claim 4, characterized in that, The vehicle temporary storage mechanism is disposed on one side of the vehicle switching device along the X-axis, the extension direction of the first loading channel is located on the Y-axis, the first vehicle conveying mechanism is configured with a first drive component for moving the first vehicle support unit, the first drive component being a three-axis moving module; the second vehicle conveying mechanism is configured with a second drive component, which drives the second vehicle support unit to move at least along the Y-axis; the third vehicle conveying mechanism is configured with a third drive component, which drives the third vehicle loading unit to move at least along the X-axis.

8. The wafer carrier switching and conveying system according to claim 1, characterized in that, The wafer lifting mechanism is configured to switch and move below at least two of the first carrier loading units, and the wafer clamping mechanism is configured to switch and move above at least two of the first carrier loading units. At least one of the first carrier loading units is configured to load an internal carrier, and at least one of the first carrier loading units is configured to load an external carrier. At least two sets of wafer grippers are vertically engaged with at least two sets of wafer support units to synchronously transfer at least two sets of wafers between the internal and external carriers.

9. The wafer carrier switching and conveying system according to claim 1, characterized in that, The vehicle transport device also includes a fourth vehicle transport mechanism, which is equipped with a vehicle lifting assembly and a fourth vehicle loading unit driven by the vehicle lifting assembly. The vehicle is transported between the first vehicle loading unit and the fourth vehicle loading unit through the first vehicle transport mechanism.

10. The wafer carrier switching and conveying system according to claim 1, characterized in that, The wafer carrier switching and conveying system is configured in the wafer tank cleaning equipment. The carrier conveying device is also configured with a third carrier conveying mechanism, which conveys at least two internal carriers carrying wafers to be cleaned to the cleaning tank of the wafer tank cleaning equipment to perform the cleaning process.

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