Ejector pin structure and ejector pin breakage detection device

Abstract

The utility model provides a kind of ejector pin structure and ejector pin fracture detection device.The ejector pin structure includes: ejector pin body;The cavity and purge channel are inside the ejector pin body, the cavity forms main air passage, the main air passage is communicated with the purge channel;One detection gas enters the main air passage from the bottom of the main air passage, and is blown out from the purge channel, the flow change of the detection gas in the main air passage responds whether the ejector pin body exists fracture.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment manufacturing, and in particular to a pin structure. Background Technology

[0002] A wafer support pin is a structure that supports a wafer. Existing wafer supports typically employ two configurations: a fixed wafer support pin and a moving heating plate (referred to as a fixed wafer support pin structure), and a fixed heating plate and a moving wafer support pin (referred to as a movable wafer support pin structure). In a fixed wafer support pin structure, after the wafer is placed on the pin, the heating plate rises and the wafer falls onto the heating plate. After film deposition, the heating plate descends, the wafer separates from the heating plate, and a wafer transfer robot removes the wafer. To ensure the wafer support pin lands on the cavity surface after the heating plate rises and falls, a counterweight is installed beneath the wafer support pin.

[0003] To ensure the ejector pin remains vertical after falling, the bottom surface of a weight is used as the contact surface. However, this means that if the ejector pin breaks and the fracture occurs within the thickness of the heating plate, the broken pin will not tip over. Instead, the upper part of the broken pin will rise and fall with the heating plate, landing on the lower part. The length of the broken pin will be slightly shorter than the length of the intact pin, resulting in an off-center position of the wafer relative to the heating plate. This can cause abnormalities in the deposited film, which are difficult to detect.

[0004] In the existing technology, after the ejector pin breaks, it can only be detected by dicing or cracking the wafer. Furthermore, if the location of the ejector pin breakage is hidden within the thickness range of the heating plate, it is impossible to detect whether the ejector pin is broken, which can lead to wafer misalignment and abnormal film layer.

[0005] In addition, the outer wall of the ejector pin itself is prone to film deposition, which can easily cause the ejector pin to get stuck between itself and the heating plate. Over time, this can lead to the ejector pin breaking.

[0006] Therefore, there is an urgent need for a pin structure that can detect whether a pin is broken. Utility Model Content

[0007] In order to overcome the shortcomings of the prior art, this utility model provides a novel ejector pin structure and ejector pin breakage detection device.

[0008] The ejector pin structure of this utility model includes an ejector pin body. The ejector pin body has a cavity and a purge channel inside. The cavity forms a main air channel, and the main air channel is connected to the purge channel. A detection gas enters the main air channel from the bottom and exits from the purge channel. The airflow change of the detection gas in the main air channel reflects whether the ejector pin body is broken.

[0009] In one embodiment, the ejector pin structure further includes an insert located at the bottom of the ejector pin body and embedded in the bottom of the semiconductor processing chamber. The insert has an internal connecting pipe for connecting the detection gas generated by an external airflow control detector into the main airflow channel.

[0010] In one embodiment, the cavity wall communicates with the purge channel at a location where the ejector pin body contacts the wafer heating device.

[0011] In one embodiment, the purging channel has an air inlet and an air outlet. The air inlet is connected to the main air channel, and the air outlet is located on the outer side wall of the ejector body. The detection gas in the main air channel is blown out from the air outlet.

[0012] In one embodiment, the purge channel forms an angle with the horizontal direction, such that the gas blown out by the purge channel purges the position where the ejector pin body contacts the wafer heating device.

[0013] In one embodiment, the ejector pin structure further includes a counterweight located at the lower end of the ejector pin body.

[0014] In one embodiment, the bottom surface of the weight can contact the bottom upper surface of the semiconductor processing chamber.

[0015] In one embodiment, the connecting pipe of the embedding seat connects the main airway and the air tube, and the air tube is connected to the airflow control detector.

[0016] In one embodiment, the detection gas is a purge gas.

[0017] In one embodiment, the change in airflow of the detection gas in the main air duct is detected by the airflow control detector.

[0018] This utility model also provides a pin breakage detection device, including the pin assembly as described above, the air tube, and the airflow control detector.

[0019] The ejector pin structure and ejector pin breakage detection device of this utility model are simple in structure and have unexpected effects:

[0020] Firstly, by detecting changes in the airflow of the gas introduced into the ejector pin, it is possible to detect whether there are cracks or breaks at the contact point between the ejector pin and the wafer heating device.

[0021] Secondly, the detection gas can be used as a purge gas. During the process, the purge gas protects the outer side of the ejector pin from film formation. Attached Figure Description

[0022] The above-described utility model and the following detailed embodiments will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are merely examples of the claimed utility model. In the drawings, the same reference numerals represent the same or similar elements.

[0023] Figure 1 A schematic diagram of a prior art semiconductor processing chamber is shown;

[0024] Figure 2 This invention illustrates a pin structure and a pin breakage detection device according to an embodiment of the present invention. Detailed Implementation

[0025] The detailed features and advantages of this utility model are described below in specific embodiments. The content is sufficient for any person skilled in the art to understand the technical content of this utility model and implement it accordingly. Furthermore, based on the specification, claims, and drawings disclosed herein, those skilled in the art can easily understand the related objectives and advantages of this utility model. Although the description of this utility model is presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived from the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. In addition, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation; therefore, they should not be construed as limiting the scope of this invention.

[0028] It is understood that while terms such as "first," "second," and "third" may be used herein to describe various components, channels, assemblies, regions, layers, and / or parts, these components, channels, assemblies, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, assemblies, regions, layers, and / or parts. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0030] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0031] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0032] Figure 1 A schematic diagram of a prior art semiconductor processing chamber is shown. (e.g.) Figure 1 As shown, the semiconductor processing chamber includes a wafer heating device 102, a pin 101, and a counterweight 103.

[0033] The wafer heating device 102 includes a heating plate and a heating plate support. The heating plate has multiple through holes for multiple ejector pins 101 to pass through.

[0034] Pin 101 is used to support the wafer.

[0035] For the fixed ejector pin structure, ejector pin 101 and counterweight 103 are fixed to the bottom of the chamber or to the ejector pin support plate and remain stationary, while the wafer heating device 102 can move up and down. When the wafer is placed on ejector pin 101, the wafer heating device 102 rises and the wafer falls onto it. After the film deposition is completed, the wafer heating device 102 descends, the wafer separates from the device, and the wafer transfer robot removes the wafer.

[0036] A counterweight 103 is installed below the ejector pin 101 to ensure that the ejector pin 101 lands on the cavity surface after the wafer heating device 102 rises and falls. Simultaneously, to ensure that the ejector pin 101 remains vertical after landing, the bottom surface of the counterweight 103 is used as the contact surface. However, this can lead to a situation where, in the event of ejector pin breakage, if the breakage occurs within the thickness range of the heating plate (e.g., ...), ... Figure 1 If the broken ejector pin is positioned as shown in position 104, it will not tip over. The upper half of the broken ejector pin will rise and fall with the heating plate, with the upper part of the ejector pin landing on the lower part. The length of the broken ejector pin will be slightly shorter than the length of the intact ejector pin. Therefore, the wafer will be off-center relative to the heating plate, resulting in abnormal deposition film, which is difficult to detect.

[0037] Figure 2 This invention illustrates a ejector pin structure and an ejector pin breakage detection device according to an embodiment of the present invention. The ejector pin structure of the present invention is hollow internally, and a purge channel is added to the outer side of the portion of the ejector pin that contacts the wafer heating device. An air pipe is connected at the location where the ejector pin contacts the cavity, and this air pipe is connected to an airflow detection device. By detecting changes in the airflow entering the ejector pin, it is determined whether the ejector pin has broken, and during the process, the purge gas protects the outer side of the ejector pin from film formation.

[0038] Specifically, the ejector pin structure of this utility model includes an ejector pin body 201. The ejector pin structure may also include an insert seat 204 and a counterweight 208.

[0039] The hammer 208 is located at the lower end of the ejector pin body 201, and the bottom surface of the hammer 208 can contact the bottom upper surface of the semiconductor processing chamber.

[0040] The ejector body 201 has a cavity and a purge channel 202 inside. The cavity forms the main air passage 203, and the cavity wall is connected to the purge channel 202.

[0041] In one embodiment, the purge channel 202 is located at a position where the ejector pin body 201 can contact the wafer heating device.

[0042] The purge channel 202 has an air inlet and an air outlet. The air inlet is connected to the main air passage 203, and the air outlet is located on the outer wall of the ejector pin. The purge channel 202 is connected to the main air passage 203. Gas in the main air passage 203 is blown out through the purge channel 202.

[0043] In one embodiment, the purge channel 202 forms an angle with the horizontal direction, so that the gas blown out by the purge channel 202 can purge to the position where the ejector pin body 201 contacts the wafer heating device.

[0044] The insert 204 is located at the bottom of the ejector pin body 201 and is embedded in the bottom cavity 207.

[0045] The insert 204 serves as a connector between the ejector pin body 201 and the air tube 206, and has an internal connecting pipe.

[0046] One end of the trachea 206 is connected to the insert 204, and the other end is connected to the airflow control detector 205.

[0047] Trachea 206 is located outside the cavity.

[0048] The airflow control detector 205 is used to generate gas and detect the airflow changes after the gas is introduced into the main air passage 203 of the ejector body.

[0049] The gas is generated by the airflow control detector 205, flows into the main air passage 203, and then flows out from the purge passage 202.

[0050] In one embodiment, the gas is a purge gas.

[0051] When the airflow control detector 205 detects a change in airflow, it indicates that the ejector pin has cracked or broken.

[0052] This invention also provides a pin breakage detection device. The pin breakage detection device includes a pin structure, an air tube 206, and an airflow control detector 205.

[0053] The ejector pin structure includes an ejector pin body 201, an insert seat 204, and a counterweight 208.

[0054] The hammer 208 is located at the lower end of the ejector pin body 201, and the bottom surface of the hammer 208 can contact the semiconductor processing cavity.

[0055] The ejector body 201 has a cavity and a purge channel 202 inside. The cavity forms the main air passage 203, and the cavity wall is connected to the purge channel 202.

[0056] In one embodiment, the purge channel 202 is located at a position where the ejector pin body 201 can contact the wafer heating device.

[0057] The purge channel 202 has an air inlet and an air outlet. The air inlet is connected to the main air passage 203, and the air outlet is located on the outer wall of the ejector pin. The purge channel 202 is connected to the main air passage 203. Gas in the main air passage 203 is blown out through the purge channel 202.

[0058] In one embodiment, the purge channel 202 forms an angle with the horizontal direction, so that the gas blown out by the purge channel 202 can purge to the position where the ejector pin body 201 contacts the wafer heating device.

[0059] The insert 204 is located at the bottom of the ejector pin body 201 and is embedded in the bottom cavity 207.

[0060] The insert 204 serves as a connector between the ejector pin body 201 and the air tube 206, and has an internal connecting pipe.

[0061] One end of the trachea 206 is connected to the insert 204, and the other end is connected to the airflow control detector 205.

[0062] The trachea 206 is located outside the semiconductor processing chamber.

[0063] The airflow control detector 205 is used to generate detection gas and detect the airflow changes after the detection gas is introduced into the main air passage 203 of the needle body.

[0064] The detection gas is generated by the airflow control detector 205, flows into the main airway 203, and then flows out from the purge channel 202.

[0065] In one embodiment, the detection gas is a purge gas.

[0066] When the airflow control detector 205 detects a change in airflow, it indicates that the ejector pin has cracked or broken.

[0067] The ejector pin structure and ejector pin breakage detection device of this utility model are simple in structure and have unexpected effects:

[0068] Firstly, by detecting changes in the airflow of the gas introduced into the ejector pin, it is possible to detect whether there are cracks or breaks at the contact point between the ejector pin and the wafer heating device.

[0069] Secondly, the detection gas can be used as a purge gas. During the process, the purge gas protects the outer side of the ejector pin from film formation.

[0070] The terminology and expressions used above are for descriptive purposes only, and this utility model should not be limited to these terms and expressions. The use of these terms and expressions does not mean excluding any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various possible modifications should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

[0071] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the utility model, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims.

[0072] Similarly, it should be noted that although the present invention has been described with reference to the specific embodiments described above, those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, any changes or modifications to the above embodiments within the scope of the essential spirit of the present invention will fall within the scope of the claims of this application.

Claims

1. A pin structure, characterized in that, include: Ejector body; The ejector pin body has a cavity and a purge channel inside, the cavity forms a main air channel, and the main air channel is connected to the purge channel; A detection gas enters the main airway from the bottom and exits from the purge channel. The airflow change of the detection gas in the main airway reflects whether the ejector pin body is broken.

2. The ejector pin structure as described in claim 1, characterized in that, Also includes: An insert is located at the bottom of the ejector pin body and is embedded into the bottom of the semiconductor processing chamber; The embedded base has a connecting pipe inside, which connects the detection gas generated by the external airflow control detector into the main air channel.

3. The ejector pin structure as described in claim 1, characterized in that, The cavity wall connects to the purge channel at the location where the ejector pin body contacts the wafer heating device.

4. The ejector pin structure as described in claim 1, characterized in that, The purging channel has an air inlet and an air outlet. The air inlet is connected to the main air channel, and the air outlet is located on the outer side wall of the ejector pin body. The detection gas in the main air channel is blown out from the air outlet.

5. The ejector pin structure as described in claim 1, characterized in that, The purging channel forms an angle with the horizontal direction, so that the gas blown out by the purging channel purifies the position where the ejector pin body contacts the wafer heating device.

6. The ejector pin structure as described in claim 1, characterized in that, Also includes: The counterweight is located at the lower end of the ejector pin body.

7. The ejector pin structure as described in claim 6, characterized in that, The bottom surface of the hammer can contact the bottom upper surface of the semiconductor processing chamber.

8. The ejector pin structure as described in claim 2, characterized in that, The connecting pipe of the embedded seat connects the main air passage and the air pipe, and the air pipe is connected to the airflow control detector.

9. The ejector pin structure as described in claim 1, characterized in that, The airflow changes of the detection gas in the main air duct are detected by an airflow control detector.

10. A device for detecting pin breakage, characterized in that, include: The ejector pin structure as described in any one of claims 1 to 9; The trachea; as well as The airflow control detector.

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