A combined field effect transistor heat sink

Abstract

The utility model provides a kind of combined field effect tube radiator, including two detachable connection heat dissipation body, each heat dissipation body includes first longitudinal part, second longitudinal part and upper connecting part, and the upper end of first longitudinal part and the upper end of second longitudinal part are connected respectively by upper connecting part;The first side surface of first longitudinal part and the first side surface of second longitudinal part are equipped with device mounting area of mounting field effect tube;Upper connecting part is equipped with the anti-vibration mounting groove of upward opening, and anti-vibration mounting groove is fixed with anti-vibration pad, and the upper end surface of anti-vibration pad projects the notch of anti-vibration mounting groove.Radiator is installed with anti-vibration pad, effectively alleviate the vibration of field effect tube under vibration environment, expand the application range of radiator.Each heat dissipation body's two outer sides can install field effect hanging tube, to more field effect tube with smaller space is radiated, improve the space utilization of radiator.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a combined field-effect transistor heat sink. Background Technology

[0002] In existing technologies, field-effect transistors (FETs) are key components in electronic devices, and heat dissipation has always been a significant challenge in their design and application. Traditional aluminum heat sinks often suffer from low heat dissipation efficiency due to design limitations. Furthermore, to ensure sufficient heat dissipation, traditional heat sinks typically require a large space, which not only affects the compactness of the device but also limits its application scenarios. Aluminum heat sinks are widely used, primarily for cooling internal heat-generating components in electronic products such as automotive inverters and chargers. Aluminum heat sinks are lightweight and offer good heat dissipation. However, in some applications, such as vehicles, the vibrations generated during vehicle movement can cause the FETs on the heat sink to vibrate, which is highly detrimental to their application. Utility Model Content

[0003] Based on the above description, this utility model provides a combined field-effect transistor heat sink, aiming to solve technical problems such as vibration affecting field-effect transistors in special scenarios in the prior art.

[0004] A combined field-effect transistor heat sink includes two detachably connected heat sink bodies. Each heat sink body includes a first longitudinal part, a second longitudinal part, and an upper connecting part. The upper connecting part is connected to the upper end of the first longitudinal part and the upper end of the second longitudinal part, respectively.

[0005] Both the first side of the first longitudinal section and the first side of the second longitudinal section are provided with device mounting areas for mounting field-effect transistors.

[0006] The upper connecting part is provided with an upward-opening anti-vibration mounting groove, in which an anti-vibration pad is fixed, and the upper end face of the anti-vibration pad protrudes from the opening of the anti-vibration mounting groove.

[0007] Furthermore, the first side of the first longitudinal portion has a first heat dissipation area, which is above the device mounting area of ​​the first longitudinal portion.

[0008] Several secondary heat dissipation components are provided in the first heat dissipation area.

[0009] Furthermore, the first side of the second longitudinal portion has a second heat dissipation area, which is located above the device mounting area of ​​the second longitudinal portion.

[0010] The second heat dissipation area is equipped with several third heat dissipation components.

[0011] Furthermore, a plurality of fourth heat sinks are provided on the second side of the first longitudinal portion, and a fifth heat sink is provided on the second side of the second longitudinal portion opposite to the fourth heat sinks.

[0012] Furthermore, a plurality of sixth heat sinks are provided between the second side of the first longitudinal portion and the second side of the second longitudinal portion;

[0013] The sixth heat sink is connected to the second side of the first longitudinal section and the second side of the second longitudinal section, respectively.

[0014] Furthermore, the gap formed between the first longitudinal portion, the second longitudinal portion, the upper connecting portion, the fourth heat sink, the fifth heat sink, and the sixth heat sink forms a heat dissipation channel.

[0015] Furthermore, each heat dissipation body also includes a lower connecting part, which is connected to the lower end of the first longitudinal part and the lower end of the second longitudinal part respectively;

[0016] The lower connecting part is provided with a first mounting hole that runs through the top and bottom;

[0017] The first mounting hole is used to secure the heatsink to the circuit board.

[0018] Furthermore, a second mounting hole is provided on the upper connecting part near the upper end of the first longitudinal part; a third mounting hole is provided on the lower connecting part near the lower end of the first longitudinal part.

[0019] The second and third mounting holes on the two heat sink bodies are used to fix the heat sink to the fan.

[0020] Furthermore, the upper connecting portion has a first extension portion that extends laterally outward from the upper end of the second longitudinal portion;

[0021] The first extension is provided with a mortise, and the mortises on the two heat dissipation bodies form a connecting groove. The connection between the two heat dissipation bodies is achieved by inserting a tenon into the connecting groove.

[0022] Furthermore, the upper connecting portion has a second extension portion that extends laterally outward from the upper end of the first longitudinal portion;

[0023] The upper surface of the second extension is provided with multiple first heat dissipation components arranged in parallel.

[0024] The beneficial technical effects of this utility model are as follows: This utility model combines two heat dissipation bodies, and field effect tubes can be installed on both outer sides of each heat dissipation body, so as to dissipate heat from a large number of field effect tubes in a small space, thereby improving the space utilization of the heat dissipation unit. In addition, the heat dissipation unit is equipped with anti-vibration pads, which effectively alleviates the vibration of the field effect tubes in the vibrating environment and expands the application range of the heat dissipation unit. Attached Figure Description

[0025] Figures 1-2 This is a three-dimensional structural diagram of a combined field-effect transistor heat sink according to the present invention;

[0026] Figure 3 This is a front structural diagram of a combined field-effect transistor heat sink according to the present invention;

[0027] Figure 4 This is a front view of a single heat sink body of a combined field-effect transistor heat sink according to the present invention.

[0028] Figure 5 This is a three-dimensional structural diagram of a single heat dissipation body of a combined field-effect transistor heat sink according to the present invention.

[0029] in:

[0030] 1-Heat dissipation body; 11-First longitudinal section; 12-Second longitudinal section; 13-Upper connecting section; 14-Lower connecting section; 15-Mouth; 16-Anti-vibration mounting groove; 17-First heat dissipation component; 18-Second heat dissipation component; 19-Third heat dissipation component; 20-Fourth heat dissipation component; 21-Fifth heat dissipation component; 22-Sixth heat dissipation component; 23-Second mounting hole; 24-Third mounting hole; 25-Heat dissipation channel.

[0031] 2-Anti-vibration pads;

[0032] 3-Tenon;

[0033] 4-Field-Effect Transistor;

[0034] 5-Circuit board;

[0035] 6- Fan. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other.

[0038] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0039] See Figures 1-5This utility model provides a combined field-effect transistor heat sink, including two detachably connected heat sinks 1. Each heat sink 1 includes a first longitudinal part 11, a second longitudinal part 12 and an upper connecting part 13. The upper connecting part 13 is connected to the upper end of the first longitudinal part 11 and the upper end of the second longitudinal part 12 respectively.

[0040] The first side of the first longitudinal section 11 and the first side of the second longitudinal section 12 are both provided with device mounting areas for mounting the field-effect transistor 4.

[0041] The upper connecting part 13 is provided with an upward-opening anti-vibration mounting groove 16, in which an anti-vibration pad 2 is fixed, and the upper end surface of the anti-vibration pad 2 protrudes from the groove opening of the anti-vibration mounting groove 16.

[0042] Specifically, the two heat sinks are arranged symmetrically.

[0043] This utility model combines two heat dissipation bodies 1, and each heat dissipation body 1 can install field effect tubes 4 on both outer sides, so as to dissipate heat from a large number of field effect tubes 4 in a small space, thereby improving the space utilization of the heat dissipation unit. In addition, the heat dissipation unit is equipped with anti-vibration pads 2, which effectively alleviates the vibration of the field effect tubes in the vibrating environment and expands the application range of the heat dissipation unit.

[0044] Specifically, the upper connecting part 13 is set horizontally.

[0045] Specifically, the width of the groove opening of the anti-vibration mounting groove 16 is smaller than the width inside the anti-vibration mounting groove 16. The anti-vibration mounting groove 16 is continuous from front to back. The anti-vibration pad 2 is inverted T-shaped and is inserted into the anti-vibration mounting groove 16 from the side. The upper end of the anti-vibration pad 2 protrudes from the groove opening of the anti-vibration mounting groove 16. When impacted, the upper end of the anti-vibration pad 2 is contacted first, thus relieving the vibration of the radiator.

[0046] Each device mounting area can accommodate at least two field-effect transistors (FETs). The design of the device mounting areas allows for the placement of more FETs on a single heatsink, improving the space utilization of the heatsink.

[0047] The field-effect transistor 4 is fixed to the device mounting area on the first side of the first vertical portion 11 and the second vertical portion 12 by means of screws.

[0048] Furthermore, the upper connecting portion 13 has a first extension portion that extends laterally outward from the upper end of the second longitudinal portion 12.

[0049] The first extension is provided with a mortise 15, and the mortise 15 on the two heat dissipation bodies 1 form a connecting groove. The connection of the two heat dissipation bodies 1 is achieved by inserting the tenon 3 into the connecting groove.

[0050] The tenon 3 connects with the connecting groove, thus connecting the two heat sink bodies 1. The tenon 3 is pulled out of the connecting groove, thus disassembling the two heat sink bodies 1.

[0051] The two heat sinks 1 can also be detachably connected in other ways, such as threaded connection, snap-fit ​​connection, etc.

[0052] Furthermore, the upper connecting portion 13 has a second extension portion that extends laterally outward from the upper end of the first longitudinal portion;

[0053] The upper surface of the second extension is provided with a plurality of first heat sinks 17 arranged in parallel.

[0054] Specifically, the first heat sink 17 is a heat sink fin.

[0055] The length of the first heat sink 17 is along the front-back direction of the heat sink body 1, the width of the first heat sink 17 is along the longitudinal direction of the heat sink body 1, and the thickness of the first heat sink 17 is along the transverse direction of the heat sink body 1.

[0056] Furthermore, the first side of the first longitudinal portion 11 has a first heat dissipation area, which is above the device mounting area of ​​the first longitudinal portion 11.

[0057] The first heat dissipation area is provided with several second heat dissipation components 18.

[0058] Specifically, a plurality of second heat sinks 18 are evenly arranged in the longitudinal direction in the first heat dissipation area. The length direction of the second heat sink 18 is along the front-back direction of the heat dissipation body 1. The width direction of the second heat sink 18 is the transverse direction of the heat dissipation body 1.

[0059] Furthermore, the width of the second heat sink 18 is not greater than the length of the second extension of the upper connecting portion 13. The second heat sink 18 is a heat dissipation fin.

[0060] Furthermore, the first side of the second longitudinal portion 12 has a second heat dissipation area, which is above the device mounting area of ​​the second longitudinal portion 12.

[0061] The second heat dissipation area is provided with several third heat dissipation components 19.

[0062] Specifically, several third heat sinks 19 are evenly arranged in the longitudinal direction in the second heat dissipation area. The length direction of the third heat sink 19 is along the front-back direction of the heat dissipation body 1. The width direction of the third heat sink 19 is the transverse direction of the heat dissipation body 1.

[0063] Furthermore, the width of the third heat sink 19 is not greater than the length of the first extension of the upper connecting portion 13.

[0064] The purpose of designing the first extension of the upper connecting part 13 is to place the mortise 15 of the first extension at its end, so that after the two heat sinks 1 are connected, there is a certain distance between the opposing second longitudinal portions 12 of the two heat sinks 1, which facilitates the design of the third heat sink 19 and improves heat dissipation efficiency. At the same time, it also provides installation space for the field-effect transistors 4 installed on the second longitudinal portions 12 of the two heat sinks 1.

[0065] The second heat sink 18 and the third heat sink 19 are heat sink fins.

[0066] Furthermore, a plurality of fourth heat sinks 20 are provided on the second side of the first longitudinal portion 11, and a fifth heat sink 21 opposite to the fourth heat sinks 20 is provided on the second side of the second longitudinal portion 12.

[0067] Specifically, the length of the fourth heat sink 20 is along the front-to-back direction of the heat sink body 1. The width of the fourth heat sink 20 is along the lateral direction of the heat sink body 1.

[0068] Specifically, the length of the fifth heat sink 21 is along the front-to-back direction of the heat sink body 1. The width of the fifth heat sink 21 is along the lateral direction of the heat sink body 1.

[0069] Furthermore, a plurality of sixth heat sinks 22 are provided between the second side of the first longitudinal portion 11 and the second side of the second longitudinal portion 12.

[0070] The sixth heat sink 22 is connected to the second side of the first longitudinal portion 11 and the second side of the second longitudinal portion 12, respectively.

[0071] Specifically, the length of the sixth heat sink 22 is along the front-to-back direction of the heat sink body 1. The width of the sixth heat sink 22 is along the lateral direction of the heat sink body 1.

[0072] Specifically, for the first longitudinal section 11, the fourth heat sink 20 and the sixth heat sink 22 are alternately arranged, and for the second longitudinal section 12, the fifth heat sink 21 and the sixth heat sink 22 are alternately arranged.

[0073] For the same heat dissipation body 1, multiple heat dissipation components are arranged between the first longitudinal part 11 and the second longitudinal part 12 to further improve heat dissipation efficiency.

[0074] Furthermore, the gap formed between the first longitudinal portion 11, the second longitudinal portion 12, the upper connecting portion 13, the fourth heat sink 20, the fifth heat sink 21 and the sixth heat sink 22 forms a heat dissipation channel 25.

[0075] The heat dissipation channel 25 runs through the front and back, and the air blown out by the fan 6 carries away the heat through the heat dissipation channel 25.

[0076] Furthermore, each heat dissipation body 1 also includes a lower connecting part 14, which is connected to the lower end of the first longitudinal part 11 and the lower end of the second longitudinal part 12 respectively.

[0077] The lower connecting part 14 is provided with a first mounting hole that runs vertically through the lower part;

[0078] The first mounting hole is used to secure the heat sink to the circuit board 5.

[0079] The heat sink and circuit board 5 are fixed securely by a first mounting hole that runs vertically through the lower connecting plate 14 at the lower end of the first longitudinal part 11 and the second longitudinal part 12.

[0080] Specifically, the first mounting hole is a threaded hole.

[0081] Specifically, the first longitudinal part 11, the second longitudinal part 12, the upper connecting part 13 and the lower connecting part 14, the first heat sink 17, the second heat sink 18, the third heat sink 19, the fourth heat sink 20, the fifth heat sink 21 and the sixth heat sink 22 are integrally formed.

[0082] Specifically, the heat sink body 1 is made of extruded aluminum profile.

[0083] Specifically, circuit board 5 is a printed circuit board, i.e., a PCB board.

[0084] The first heat sink 17, the second heat sink 18, the third heat sink 19, the fourth heat sink 20, the fifth heat sink 21, and the sixth heat sink 22 increase the heat dissipation area of ​​the heat sink body and the design of the device mounting area. While ensuring heat dissipation efficiency, the heat sink improves the usable area and cross-sectional area utilization rate of the heat sink, and saves the effective usable area of ​​the circuit board 5.

[0085] Furthermore, a second mounting hole 23 is provided on the upper connecting part 13 near the upper end of the first longitudinal part 11; a third mounting hole 24 is provided on the lower connecting part 14 near the lower end of the first longitudinal part 11.

[0086] The second mounting holes 23 and the third mounting holes 24 on the two heat sink bodies 1 are used to fix the heat sink to the fan 6.

[0087] The second mounting hole 23 and the third mounting hole 24 are used for detachable connection of the fan 6.

[0088] Specifically, when the second mounting hole 23 and the third mounting hole 24 are threaded holes, the fan 6 and the radiator are connected by bolts.

[0089] Specifically, when the second mounting hole 23 and the third mounting hole 24 are through holes, the fan 6 and the radiator are connected by bolts and nuts.

[0090] The air outlet of the fan 6 corresponds to the heat dissipation channel formed on each heat dissipation body 1 and then passes through the heat dissipation radiator, as well as through the heat dissipation channel formed between the third heat dissipation component between the second longitudinal part 12 of the two heat dissipation bodies 1, to remove the heat from the heat dissipation radiator. The combination of the fan and the heat dissipation radiator reduces the space occupancy rate and improves the heat dissipation efficiency.

[0091] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A combined field-effect transistor heat sink, characterized in that, It includes two detachably connected heat dissipation bodies, each of which includes a first longitudinal part, a second longitudinal part, and an upper connecting part, wherein the upper connecting part is respectively connected to the upper end of the first longitudinal part and the upper end of the second longitudinal part; Both the first side of the first longitudinal portion and the first side of the second longitudinal portion are provided with device mounting areas for mounting field-effect transistors; The upper connecting part is provided with an upward-opening anti-vibration mounting groove, and an anti-vibration pad is fixed in the anti-vibration mounting groove. The upper end face of the anti-vibration pad protrudes from the groove opening of the anti-vibration mounting groove.

2. The combined field-effect transistor heat sink as described in claim 1, characterized in that, The first side of the first longitudinal portion has a first heat dissipation area, which is located above the device mounting area of ​​the first longitudinal portion. The first heat dissipation area is provided with several second heat dissipation components.

3. A combined field-effect transistor heat sink as described in claim 1, characterized in that, The first side of the second longitudinal portion has a second heat dissipation area, which is located above the device mounting area of ​​the second longitudinal portion. The second heat dissipation area is provided with several third heat dissipation components.

4. A combined field-effect transistor heat sink as described in claim 1, characterized in that, The second side of the first longitudinal portion is provided with a plurality of fourth heat dissipation components, and the second side of the second longitudinal portion is provided with a fifth heat dissipation component opposite to the fourth heat dissipation components.

5. A combined field-effect transistor heat sink as described in claim 4, characterized in that, A plurality of sixth heat dissipation components are also provided between the second side surface of the first longitudinal portion and the second side surface of the second longitudinal portion; The sixth heat sink is connected to the second side of the first longitudinal portion and the second side of the second longitudinal portion, respectively.

6. A combined field-effect transistor heat sink as described in claim 5, characterized in that, The gap formed between the first longitudinal portion, the second longitudinal portion, the upper connecting portion, the fourth heat sink, the fifth heat sink, and the sixth heat sink forms a heat dissipation channel.

7. A combined field-effect transistor heat sink as described in claim 1, characterized in that, Each of the heat dissipation bodies further includes a lower connecting portion, which is respectively connected to the lower end of the first longitudinal portion and the lower end of the second longitudinal portion; The lower connecting part is provided with a first mounting hole that extends through the upper and lower parts; The first mounting hole is used to fix the heat sink to the circuit board.

8. A combined field-effect transistor heat sink as described in claim 7, characterized in that, The upper connecting part is provided with a second mounting hole near the upper end of the first longitudinal part; the lower connecting part is provided with a third mounting hole near the lower end of the first longitudinal part. The second and third mounting holes on the two heat dissipation bodies are used to fix the heat dissipation unit to the fan.

9. A combined field-effect transistor heat sink as described in claim 1, characterized in that, The upper connecting portion has a first extension portion, which extends laterally outward from the upper end of the second longitudinal portion. The first extension is provided with a mortise, and the mortises on the two heat dissipation bodies form a connecting groove. The connection of the two heat dissipation bodies is achieved by inserting a tenon into the connecting groove.

10. A combined field-effect transistor heat sink as described in claim 1, characterized in that, The upper connecting portion has a second extension portion, which extends laterally outward from the upper end of the first longitudinal portion. The upper surface of the second extension is provided with a plurality of first heat dissipation components arranged in parallel.

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