Bonding fixture

Abstract

The utility model relates to the technical field of semiconductor manufacturing provides a kind of bonding fixture, and the bonding fixture includes: fixture body, suction accessory and down pressure piece;The fixture body has fixed cavity, and the suction accessory has suction surface, and the suction surface is located in the fixed cavity;The down pressure piece is provided with multiple, each the down pressure piece is set in the fixture body with adjustable position, and the down pressure piece has a down pressure end, and the down pressure end has first set distance from the suction surface.By the improvement of bonding fixture, to guarantee the effective fixation to semiconductor device, so that lead wire bonding process orderly.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a bonding fixture. Background Technology

[0002] Wire bonding is a crucial step in semiconductor packaging. The wire bonding process involves connecting semiconductor devices to the pins or metal wiring pads on the substrate of the package frame using metal leads (such as gold wires, copper wires, aluminum wires, etc.).

[0003] During wire bonding, semiconductor devices need to be fixed, for example by pressing or adsorption. For some semiconductor devices (such as those with ceramic substrates), warping deformation occurs due to heat in the previous process, affecting the fixation of the semiconductor device in the wire bonding process.

[0004] For warped semiconductor devices, the existing method for securing them during wire bonding typically involves manually pressing the semiconductor device to flatten it before fixing it with a fixture. This method is inefficient, highly random, and cannot standardize the device fixing process. Furthermore, the pressing process can easily cause contamination on the semiconductor device surface. Especially for semiconductor devices requiring secondary bonding, pressing may damage the leads, causing wire collapse.

[0005] When semiconductor devices are fixed by adsorption, the randomness and uncertainty of manual pressing may lead to failure in the fixation process. In such cases, the semiconductor device is easily pulled up by the leads during wire bonding, resulting in its scrap. Moreover, for semiconductor devices on ceramic substrates, manual pressing can easily cause localized stress concentration and breakage.

[0006] Therefore, this utility model provides a bonding fixture to ensure effective fixation of semiconductor devices, so that the wire bonding process can be carried out in an orderly manner. Utility Model Content

[0007] The purpose of this invention is to provide a bonding fixture that, through improvements to the bonding fixture, ensures effective fixation of semiconductor devices and enables the wire bonding process to proceed in an orderly manner.

[0008] This utility model provides a bonding fixture, comprising: a fixture body, an adsorption element, and a pressing element;

[0009] The fixture body has a fixing cavity, and the adsorption element has an adsorption surface, which is located in the fixing cavity;

[0010] Multiple pressing members are provided, and each pressing member is positioned on the fixture body in an adjustable manner. Each pressing member has a pressing end, and the pressing end is at a first predetermined distance from the adsorption surface.

[0011] Optionally, the first set distance is 1mm-2mm.

[0012] Optionally, at least one pressing member is provided on each side of the fixing cavity along the first direction, and the first direction is parallel to the adsorption surface.

[0013] Optionally, the pressing member is rotatably mounted on the fixture body, and the rotation axis of the pressing member is perpendicular to the adsorption surface.

[0014] Optionally, the pressing member is positionally adjustable on the fixture body along a second direction, which is parallel to the adsorption surface.

[0015] Optionally, the fixture body has a plurality of mounting positions arranged along the second direction, and one of the pressing members can be selectively disposed in one of the mounting positions.

[0016] Optionally, the pressing member is mounted in the mounting position in a linear motion, and the rotation axis of the pressing member is perpendicular to the adsorption surface.

[0017] Optionally, the fixture body includes a base, a pressing base, and a connector. The base and the pressing base are arranged along a third direction, which is perpendicular to the adsorption surface. The connector is supported between the base and the pressing base, so that the base and the pressing base have a second predetermined distance along the third direction.

[0018] The base has the fixing cavity, and the pressing member is disposed on the pressing base.

[0019] Optionally, the base has a plurality of fixing cavities, the adsorption member has a plurality of adsorption surfaces, and each fixing cavity is provided with an adsorption surface;

[0020] The pressing base is provided with at least one hollow area, the hollow area and at least one of the fixing cavities are directly opposite each other along the third direction, and the pressing end passes through the hollow area and has the first set distance from the adsorption surface.

[0021] Optionally, the adsorption element includes an adsorption substrate and adsorption protrusions located on the adsorption substrate, with the adsorption surface located on the adsorption protrusions;

[0022] The adsorption substrate is disposed on one side of the fixture body along a third direction, the third direction being perpendicular to the adsorption surface, and the adsorption protrusion extends into the fixing cavity.

[0023] In summary, the bonding fixture includes: a fixture body, an adsorption element, and a pressing element; the fixture body has a fixed cavity, the adsorption element has an adsorption surface, and the adsorption surface is located in the fixed cavity; multiple pressing elements are provided, each pressing element is positioned on the fixture body in an adjustable manner, and each pressing element has a pressing end, the pressing end being a first predetermined distance from the adsorption surface.

[0024] In this configuration, the bonding fixture, as described above, holds the semiconductor device to be bonded within a fixed cavity. The shape of the fixed cavity positions the semiconductor device, while an adsorption surface located within the fixed cavity adsorbs and fixes the semiconductor device. For warped semiconductor devices, a pressure element can apply downward pressure to improve their warping deformation, thereby reducing the gap between the semiconductor device and the adsorption surface. This allows the adsorption force of the adsorption surface to flatten the semiconductor device and ensure it is fully adhered to the adsorption surface, achieving effective fixation of the semiconductor device. This bonding fixture offers high efficiency in positioning and fixing semiconductor devices, which is beneficial for improving bonding efficiency and increasing bonding yield.

[0025] The aforementioned bonding fixture applies downward pressure to semiconductor devices through the coordinated action of multiple pressing components to mitigate warpage. These pressing components are positioned adjustablely within the fixture body, allowing for flexible adjustment of the pressing end's position. This adjusts the applied force to the semiconductor device, adapting to the pressing requirements of different device sizes and avoiding interference with semiconductor leads or unsuitable pressing areas. The design of these pressing components allows for flexible selection of the pressing position to meet warpage mitigation needs. Furthermore, the coordinated action of multiple pressing components ensures a uniform force on the semiconductor device, reducing the risk of breakage due to localized stress concentration during pressing.

[0026] The aforementioned bonding fixture, through the adjustment and coordinated operation of multiple pressing components, helps to standardize the semiconductor device pressing process, thereby improving the success rate of adsorption and fixation during semiconductor device bonding. The pressing components improve the efficiency of semiconductor device positioning and fixation, and mitigate the randomness and uncertainty of pressing force and position caused by manual pressing. This reduces adsorption and fixation failures or wire collapse caused by pressing on leads due to randomness and uncertainty. Furthermore, it helps reduce the probability of semiconductor devices being pulled up by leads during bonding due to adsorption and fixation failures, thus improving bonding yield. The pressing components also prevent contamination of the semiconductor device by manual pressing, ensuring surface cleanliness. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of a bonding fixture according to an embodiment of the present invention;

[0028] Figure 2 This is a side view of a bonding fixture according to an embodiment of the present invention.

[0029] Figure 3 This is a three-dimensional structural diagram of the base according to an embodiment of the present utility model;

[0030] Figure 4 This is a three-dimensional structural diagram of the pressing base according to an embodiment of the present invention;

[0031] Figure 5 This is a cross-sectional structural diagram of the pressing base according to an embodiment of the present invention;

[0032] Figure 6 This is a three-dimensional structural diagram of the adsorption element according to an embodiment of the present invention.

[0033] In the attached diagram:

[0034] 10- Fixture body; 101- Base; 102- Pressing base; 103- Connector; 11- Fixing cavity; 111- Protrusion; 112- Recessed area; 113- Anti-reverse structure; 12- Hollowed-out area; 13- Mounting position;

[0035] 20-Adsorption element; 201-Adsorption substrate; 202-Adsorption boss; 203-Groove; 21-Adsorption surface;

[0036] 30 - Pressing part; 31 - Pressing end; 32 - Connecting hole;

[0037] 40 - Semiconductor devices;

[0038] 50-bolt;

[0039] 60-Open;

[0040] a - First direction; b - Second direction; c - Third direction. Detailed Implementation

[0041] The bonding fixture proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0042] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the terms “at least two” or “more than” are generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Furthermore, the terms "installed," "connected," and "attached," as used in this utility model, and the term "set" on one element from another, should be interpreted broadly. They generally only indicate a connection, coupling, cooperation, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, meaning one element can be located inside, outside, above, below, or to one side of the other element, unless otherwise explicitly stated. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances. Additionally, directional terms such as above, below, up, down, upward, downward, left, and right are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0043] This embodiment provides a bonding fixture, including: a fixture body 10, an adsorption member 20, and a pressing member 30;

[0044] In this embodiment, the first direction a, the second direction b, and the third direction c are all perpendicular to each other.

[0045] Please refer to Figure 1 As shown, the fixture body 10 has a fixing cavity 11, which is used to accommodate the semiconductor device 40 to be bonded. The shape of the fixing cavity 11 is adapted to the shape of the semiconductor device 40. In this embodiment, the semiconductor device 40 has a cuboid structure, so the fixing cavity 11 is set as a rectangular cavity structure. The four sides of the semiconductor device 40 conformally fit the inner wall of the fixing cavity 11 to position the semiconductor device 40.

[0046] In other alternative embodiments, the shape of the fixed cavity 11 can be adaptively adjusted based on the actual shape of the semiconductor device 40.

[0047] Please continue to refer to this. Figure 1As shown, the adsorption member 20 has an adsorption surface 21, which is located in the fixing cavity 11. The fixing cavity 11 extends through the fixture body 10 along a third direction c, and the adsorption surface 21 is perpendicular to the third direction c. The adsorption surface 21 is used to adsorb the semiconductor device 40 located in the fixing cavity 11 to fix the semiconductor device 40.

[0048] like Figure 1 As shown, in this embodiment, there are eight fixed cavities 11 arranged in two rows and four columns. Each fixed cavity 11 has an adsorption surface 21, so the bonding fixture can simultaneously perform bonding of eight semiconductor devices. To clearly show the structure of the adsorption surface 21, Figure 1 The adsorption surfaces 21 in the four fixed cavities 11 located on the left side are not adsorbed by the semiconductor device 40; the adsorption surfaces 21 in these fixed cavities 11 are exposed. Figure 1 As shown, the adsorption element 20 has multiple adsorption holes that connect to the adsorption surface 21. These holes are connected to an external vacuum device to create a negative pressure environment, thereby adsorbing the semiconductor device 40 placed on the adsorption surface 21. To clearly show the structure of the adsorption surface 21 adsorbing the semiconductor device 40, Figure 1 Semiconductor devices 40 are adsorbed on the adsorption surfaces 21 in the four fixed cavities 11 located on the right side. At this time, the four sides of the semiconductor device 40 conform to the inner wall of the fixed cavity 11, and the lower surface of the semiconductor device 40 is adsorbed by the adsorption surfaces 21.

[0049] Please continue to refer to this. Figure 1 and Figure 2 As shown, multiple pressing members 30 are provided, each of which is positioned adjustablely on the fixture body 10. Each pressing member 30 has a pressing end 31, and the pressing end 31 is at a first predetermined distance from the adsorption surface 21. In this embodiment, the first predetermined distance is 1mm-2mm, for example, 1.5mm. The first predetermined distance should include the thickness of the semiconductor device 40 and the warpage height (approximately 0.2mm to 0.5mm), so that when the semiconductor device 40 warps, the pressing end 31 presses against the semiconductor device 40 to improve the warpage phenomenon of the semiconductor device 40, making the lower surface of the semiconductor device 40 closer to the adsorption surface 21, so that the adsorption surface 21 adsorbs and fixes the semiconductor device 40.

[0050] In other alternative embodiments, the first set distance can be set based on the actual thickness and warpage of the semiconductor device 40. The first set distance should also be set to be greater than the thickness of the semiconductor device 40, meaning that the pressing end 31 will not forcefully press against the semiconductor device 40 to completely adhere to the adsorption surface 21. A first set distance greater than the thickness of the semiconductor device 40 allows the pressing end 31 to press against the semiconductor device 40 only to mitigate the warpage of the semiconductor device 40, reducing the distance between the semiconductor device 40 and the adsorption surface 21, and then using adsorption force to flatten the semiconductor device 40 and completely adhere it to the adsorption surface 21.

[0051] In this embodiment, the pressing member 30 is disposed on the fixture body 10 in an adjustable manner, and the position of the pressing end 31 of the pressing member 30 can be adjusted, thereby adjusting the position or magnitude of the force applied to the semiconductor device 40.

[0052] In this embodiment, the pressing component 30 is made of antistatic acetal resin (POM). POM is an engineering plastic with excellent comprehensive performance, possessing high mechanical properties such as strength, modulus, wear resistance, toughness, fatigue resistance, and creep resistance. This material ensures the downward pressure exerted by the pressing component 30 on the semiconductor device 40, while also preventing surface damage to the semiconductor device 40 due to rigid contact between the pressing component 30 and the semiconductor device 40. In other alternative embodiments, the pressing component 30 may be made of polytetrafluoroethylene (PTFE), rubber, or other elastic materials to ensure reliable downward pressure applied to the semiconductor device 40 while preventing damage to its surface.

[0053] The aforementioned bonding fixture houses the semiconductor device 40 to be bonded through a fixed cavity 11. The shape of the fixed cavity 11 positions the semiconductor device 40, while the adsorption surface 21 within the fixed cavity 11 adsorbs and fixes the semiconductor device 40. For warped semiconductor devices 40, the pressing member 30 can apply downward pressure to improve their warping deformation, thereby reducing the gap between the semiconductor device 40 and the adsorption surface 21. This allows the adsorption force of the adsorption surface 21 to flatten the semiconductor device 40 and completely adhere it to the adsorption surface 21, achieving effective fixation of the semiconductor device 40. This bonding fixture has high efficiency in positioning and fixing the semiconductor device 40, which is beneficial for improving bonding efficiency and increasing bonding yield.

[0054] The aforementioned bonding fixture applies downward pressure to the semiconductor device 40 through the coordinated action of multiple pressing members 30 to improve its warpage. The pressing members 30 are positioned adjustablely on the fixture body 10, allowing for flexible adjustment of the pressing end 31 of each member to regulate the applied force to the semiconductor device 40. This adapts to the pressing requirements of semiconductor devices 40 of different specifications, avoiding interference with leads or unsuitable pressing areas. The aforementioned pressing members 30 allow for flexible selection of the pressing position on the semiconductor device 40 to meet the warpage reduction requirements. Furthermore, the coordinated action of multiple pressing members 30 ensures a uniform force on the semiconductor device 40, mitigating the problem of localized stress concentration leading to breakage during pressing.

[0055] The aforementioned bonding fixture, through the positional adjustment and coordinated operation of multiple pressing components 30, helps to standardize the pressing process of the semiconductor device 40, thereby improving the success rate of adsorption and fixation during the bonding process. The pressing components 30, on the one hand, help improve the efficiency of semiconductor device 40 positioning and fixation; on the other hand, they can mitigate the randomness and uncertainty of pressing force and position caused by manual pressing, thus reducing adsorption and fixation failures or wire collapse caused by pressing on the leads due to randomness and uncertainty. Furthermore, it helps reduce the probability of the semiconductor device being pulled up by the leads during bonding due to adsorption and fixation failure, thus improving the bonding yield. The pressing components 30 also prevent contamination of the semiconductor device 40 by manual pressing, helping to ensure the cleanliness of the semiconductor device 40 surface.

[0056] Furthermore, the fixture body 10 includes a base 101, a pressing base 102, and a connector 103.

[0057] Please continue to refer to this. Figure 2 and Figure 3 As shown, the base 101 has a rectangular plate structure. The first direction a corresponds to the width direction of the base 101, the second direction b corresponds to the length direction of the fixture body 10, and the third direction c corresponds to the thickness direction of the fixture body 10.

[0058] Combination Figure 2 As shown, the base 101 and the pressing base 102 are arranged along a third direction c, which is perpendicular to the adsorption surface 21. The connector 103 is supported between the base 101 and the pressing base 102, so that the base 101 and the pressing base 102 have a second predetermined distance along the third direction c.

[0059] The second set distance is configured such that the pressing base 102 is suspended above the base 101, providing more operating space for the pressing process. The specific dimensions of the second set distance are not limited in this embodiment and can be set based on actual needs.

[0060] Combination Figure 2 and Figure 3 As shown, the base 101 has the fixing cavity 11, and the pressing member 30 is disposed on the pressing base 102. Connecting members 103 are integrally formed with the base 101, and four connecting members 103 are provided, distributed on the upper surface of the base 101 and arranged at the four corners. Each connecting member 103 includes a specific protrusion connected to the base 101 and an approximately stepped shaft structure connected to the upper surface of the protrusion. The large-diameter end of the stepped shaft is connected to the protrusion, and the small-diameter end has a pin-like structure. The small-diameter end of the stepped shaft conformally fits into a positioning hole on the lower surface of the pressing base 102, and the lower surface of the pressing base 102 is supported by the shoulder surface of the stepped shaft. The connecting members 103 serve two purposes: firstly, to support the base 101 and the pressing base 102 and control the distance between them; and secondly, to provide relative positioning between the base 101 and the pressing base 102.

[0061] During the process of fixing the semiconductor device 40, the semiconductor device 40 is first placed on the adsorption surface 21 inside the fixing cavity 11, and then the pressing substrate 102 is installed and positioned above the base 101. Under the weight of the pressing substrate 102 and the pressing member 30, the pressing member 30 on the pressing substrate 102 adaptively presses on the semiconductor device 40 to improve its warpage. Then, the vacuum of the adsorption member 20 is turned on so that the adsorption surface 21 adsorbs the semiconductor device 40.

[0062] In other alternative embodiments, the connector 103 can be used to connect the base 101 and the pressing base 102 by means of bolts, snap-fit, etc.

[0063] Please continue to refer to this. Figure 3 As shown, the base 101 has eight fixing cavities 11. The eight fixing cavities 11 are arranged in two rows along the width direction (first direction a) of the base 101, and four fixing cavities 11 are arranged along the length direction (second direction b) of the base 101 in each row. The fixing cavities 11 are rectangular, and the length direction of the fixing cavities 11 is consistent with the width direction of the base 101.

[0064] In other alternative embodiments, the number of fixing cavities 11 provided on the base 101 can be adjusted based on actual usage requirements. For example, an even number such as six or ten cavities can be provided, or an odd number can be provided.

[0065] Please continue to refer to this. Figure 3 As shown, each fixing cavity 11 has a protrusion 111 on its inner wall, which is used to cooperate with the adsorption member 20 (the specific cooperation relationship will be described in detail below in conjunction with the specific structure of the adsorption member 20). The upper surface of the base 101 has recessed areas 112 on both sides along the length direction (first direction a) of the fixing cavity 11. The bottom of the recessed area 112 is lower than the adsorption surface 21 to facilitate the placement and removal of the semiconductor device 40 located within the fixing cavity 11. A shared recessed area 112 is provided between two adjacent fixing cavities 11 along the width direction (first direction a) of the base 101.

[0066] Please continue to refer to this. Figure 3 As shown, the upper surface of the base 101 is also provided with an anti-reverse structure 113. The anti-reverse structure 113 is located in the groove or through hole on the upper surface of the base 101 for marking arrows, so as to indicate the assembly direction of the base 101.

[0067] Combination Figure 1 , Figure 2 and Figure 4 As shown, the pressing base 102 has a rectangular plate structure. After the pressing base 102 is fitted with the base 101, the four sides of the pressing base 102 are parallel to the four sides of the base 101.

[0068] Two hollow areas 12 are formed on the pressing base 102. Each hollow area 12 has a rectangular structure, and its length is parallel to both the length of the pressing base 102 and the length of the base 101. The two hollow areas 12 are arranged along the width of the pressing base 102. Figure 1 As shown, each hollow area 12 is directly opposite to the four fixed cavities 11 arranged in a row along the third direction c, and the pressing end 31 passes through the hollow area 12 and has the first set distance from the adsorption surface 21.

[0069] In other alternative embodiments, the number of hollow areas 12 on the pressing substrate 102 and the number of fixing cavities 11 corresponding to each hollow area 12 can be adjusted based on bonding requirements. For example, four hollow areas 12 can be provided, with each hollow area 12 corresponding to two fixing cavities 11, or one hollow area 12 can correspond to one fixing cavity 11.

[0070] Combination Figure 1 and Figure 4 As shown, a set of pressing members 30 are provided on both sides of the width (first direction a) of each hollow area 12, so that each fixing cavity 11 is provided with one pressing member 30 on each side along its length (first direction a). Accordingly, the two pressing members 30 press down on a semiconductor device 40 and press on both sides of the upper surface of the semiconductor device 40 along its length direction to improve the warping phenomenon of the semiconductor device 40.

[0071] In other alternative embodiments, the number of pressing members 30 provided on both sides of each fixing cavity 11 along its length (first direction a) can be set based on actual pressing requirements, for example, multiple pressing members 30 can be provided on each side. In addition, pressing members 30 can also be provided on both sides of each fixing cavity 11 along its width (second direction b), with multiple pressing members 30 working together to press around the semiconductor device 40 to improve its warpage.

[0072] Please continue to refer to this. Figure 1 and Figure 4 As shown, the pressing member 30 is positioned adjustablely on the fixture body 10 along the length direction (second direction b) of the pressing base 102.

[0073] Specifically, the pressing base 102 has three rows of mounting holes, each mounting hole serving as a mounting position 13. Each row of mounting holes extends along the length direction (second direction b) of the pressing base 102, and two hollow areas 12 are located between adjacent rows of mounting positions 13. A corresponding pressing member 30 can be selectively mounted on one of the mounting positions 13, for example, by screws, to ensure that each fixing cavity 11 has one pressing member 30 on each side along its length (first direction a).

[0074] The pressing member 30 can be selected at the corresponding mounting position 13 to adjust the position of the pressing member 30 along the second direction b, thereby adjusting the position of the pressing member 30 pressing against the semiconductor device 40.

[0075] In this embodiment, mounting position 13 is a mounting hole formed on the pressing base 102. A screw passing through the pressing member 30 can be threaded into the mounting hole to connect and fix the pressing member 30. When adjusting the position of the pressing member 30, the screw can be removed, and another mounting position 13 can be selected for installation. In other alternative embodiments, mounting position 13 can also be a snap-fit ​​structure, in which case the pressing base 102 is installed at mounting position 13 by snap-fit. The specific structure of mounting position 13 can be adjusted based on actual usage requirements.

[0076] Furthermore, the pressing member 30 is rotatably disposed on the fixture body 10, and the rotation axis of the pressing member 30 is perpendicular to the adsorption surface 21.

[0077] Please continue to refer to this. Figure 4 and Figure 5 As shown, the pressing member 30 has an approximately L-shaped structure. One side is connected to the upper surface of the pressing base 102 and fixed to the mounting position 13 by screws. The other end serves as the pressing end 31, which is bent downward through the hollow area 12, so that the pressing end 31 has a first set distance from the adsorption surface 21.

[0078] The pressing member 30 has a connecting hole 32, and the stud of the bolt 50 passes through the connecting hole 32 and is threaded to the mounting position 13. After loosening the bolt 50, the pressing member 30 can rotate around the bolt 50 to adjust the orientation of the pressing end 31, thereby fine-tuning the position of the pressing member 30 pressing against the semiconductor device 40.

[0079] Furthermore, the pressing member 30 is mounted in the mounting position 13 in a linear motion, the linear motion being parallel to the adsorption surface 21.

[0080] In this embodiment, both the base 101 and the pressing substrate 102 are plate structures, parallel to each other, with the upper surface of the pressing substrate 102 parallel to the adsorption surface 21. Please continue to refer to... Figure 4 and Figure 5 As shown, the connecting hole 32 is an oblong hole, and the length of the oblong hole is greater than the outer diameter of the stud of the bolt 50. Therefore, after the bolt 50 passes through the connecting hole 32, the pressing member 30, which is attached to the upper surface of the pressing base 102, can move linearly relative to the bolt 50 in the length direction of the oblong hole. This allows the pressing member 30 to move linearly at the connection position for fine adjustment. After fine adjustment, the bolt 50 is tightened to fix the pressing member 30, thereby adjusting the position of the pressing member 30 pressing against the semiconductor device 40.

[0081] The aforementioned structure allows the pressure member 30 to be adjusted over a wide range of positions along the second direction b, selecting the corresponding connection position 13. This adjustment method helps to select the pressure position based on the warpage of the semiconductor device 40. After selecting the corresponding connection position 13, the pressure member 30 can rotate and move linearly on that connection position to fine-tune the position of the pressure end 31, thereby adjusting the pressure position of the pressure member 30 on the semiconductor device 40. This adjustment method can be used to avoid the leads of the semiconductor device 40 or other unsuitable parts to be pressured. The aforementioned pressure member 30 configuration provides high compatibility, adapting to various warpages that occur in semiconductor devices 40 made of different materials during reflow at different temperatures.

[0082] The aforementioned pressing component 30 has higher pressing reliability, improves the success rate of adsorption and fixation of the adsorption component 20, reduces human confirmation steps, reduces personnel pressing the product, reduces labor costs, reduces human intervention and avoids the risk of the semiconductor device 40 being pulled up by the bonding wire.

[0083] The aforementioned pressing member 30, through the oblong connecting hole 32, allows for linear movement of the pressing member 30 to achieve fine-tuning of its position. In other alternative embodiments, the pressing member 30 can be fitted with the mounting position via a track and track groove to achieve fine-tuning of its position. For example, each mounting position has a rotatable knob with a "T"-shaped track on it, and a "T"-shaped protrusion on the pressing member 30, with the protrusion of the pressing member 30 slidingly conforming to the track. In this case, linear movement can be achieved by sliding the pressing member 30 relative to the track, while rotation of the knob can adjust the rotation of the pressing member 30. Other existing methods can also be used to adjust the rotation and linear movement of the pressing member 30, which will not be elaborated here.

[0084] In this embodiment, a hollow area 12 is formed on the pressing base 102, and the pressing member 30 is connected to the upper surface of the pressing base 102. The hollow area 12 allows the pressing end 31 of the pressing member 30 to pass through, and also serves as a viewing window to facilitate observation of the pressing member 30 and the semiconductor device 40. In other alternative embodiments, the pressing member 30 can be mounted on the lower surface of the pressing base 102, in which case the hollow area 12 is not required for the pressing member 30 to pass through. In addition, for ease of observation, the pressing base 102 can be made of a transparent material. The position of the pressing member 30 on the pressing base 102 and the specific structural form of the pressing base 102 can be adjusted according to actual needs.

[0085] Please continue to refer to this. Figure 5 As shown, the edge of the pressing end 31 of the pressing member 30 is rounded, making the surrounding area of ​​the pressing end 31 smooth, so as to ensure that the semiconductor device 40 is not damaged by pressure and to ensure the convenience of the bonding machine welding head during operation.

[0086] Furthermore, the adsorption member 20 has multiple adsorption surfaces 21, and each of the fixed cavities 11 is provided with an adsorption surface 21.

[0087] Combination Figure 1 , Figure 2 and Figure 6 As shown, the adsorption element 20 includes an adsorption substrate 201 and an adsorption boss 202 located on the adsorption substrate 201, and the adsorption surface 21 is located on the adsorption boss 202.

[0088] The adsorption substrate 201 is disposed on one side of the fixture body 10 along the third direction c. Figure 1 and Figure 2 The bottom of the fixture body 10), wherein the adsorption substrate 201 is a rectangular plate structure, and its upper surface has eight adsorption protrusions 202. Each adsorption protrusion 202 is adapted to each fixing cavity 11. The adsorption protrusion 202 extends into the fixing cavity 11, so the adsorption surface 21 is naturally located inside the fixing cavity 11.

[0089] Combination Figure 6 As shown, in this embodiment, the surface of the adsorption surface 21 is densely covered with adsorption pores. In addition, a vacuum channel is provided inside the adsorption substrate 201, which is connected to each adsorption pore. The vacuum channel is connected to a vacuum device to create a negative pressure environment inside the adsorption pores to adsorb the semiconductor device 40.

[0090] Combination Figure 6 As shown, the edge of the adsorption boss 202 has a groove 203. After the adsorption boss 202 extends into the fixing cavity 11, the groove 203 and the protrusion 111 of the inner wall of the fixing cavity 11 (see details) Figure 1 and Figure 3 As shown, the outer contour of the adsorption boss 202 conforms to the inner cavity of the fixing cavity 11 to ensure the assembly accuracy of the adsorption component 20 and the pressing base 102.

[0091] The above-mentioned adsorption element 20 adopts vacuum adsorption. The adsorption element 20 can be an existing vacuum adsorption disk. The adsorption structure of the adsorption element 20 is existing technology and will not be described in detail here.

[0092] In other alternative embodiments, the adsorption element 20 may also employ other adsorption methods, such as an electrostatic adsorption structure, and the specific adsorption structure of the adsorption element 20 may be adjusted based on actual needs.

[0093] In summary, the bonding fixture includes: a fixture body, an adsorption element, and a pressing element; the fixture body has a fixed cavity, the adsorption element has an adsorption surface, and the adsorption surface is located in the fixed cavity; multiple pressing elements are provided, each pressing element is positioned on the fixture body in an adjustable manner, and each pressing element has a pressing end, the pressing end being a first predetermined distance from the adsorption surface.

[0094] In this configuration, the bonding fixture, as described above, holds the semiconductor device to be bonded within a fixed cavity. The shape of the fixed cavity positions the semiconductor device, while an adsorption surface located within the fixed cavity adsorbs and fixes the semiconductor device. For warped semiconductor devices, a pressure element can apply downward pressure to improve their warping deformation, thereby reducing the gap between the semiconductor device and the adsorption surface. This allows the adsorption force of the adsorption surface to flatten the semiconductor device and ensure it is fully adhered to the adsorption surface, achieving effective fixation of the semiconductor device. This bonding fixture offers high efficiency in positioning and fixing semiconductor devices, which is beneficial for improving bonding efficiency and increasing bonding yield.

[0095] The aforementioned bonding fixture applies downward pressure to semiconductor devices through the coordinated action of multiple pressing components to mitigate warpage. These pressing components are positioned adjustablely within the fixture body, allowing for flexible adjustment of the pressing end's position. This adjusts the applied force to the semiconductor device, adapting to the pressing requirements of different device sizes and avoiding interference with semiconductor leads or unsuitable pressing areas. The design of these pressing components allows for flexible selection of the pressing position to meet warpage mitigation needs. Furthermore, the coordinated action of multiple pressing components ensures a uniform force on the semiconductor device, reducing the risk of breakage due to localized stress concentration during pressing.

[0096] The aforementioned bonding fixture, through the adjustment and coordinated operation of multiple pressing components, helps to standardize the semiconductor device pressing process, thereby improving the success rate of adsorption and fixation during semiconductor device bonding. The pressing components improve the efficiency of semiconductor device positioning and fixation, and mitigate the randomness and uncertainty of pressing force and position caused by manual pressing. This reduces adsorption and fixation failures or wire collapse caused by pressing on leads due to randomness and uncertainty. Furthermore, it helps reduce the probability of semiconductor devices being pulled up by leads during bonding due to adsorption and fixation failures, thus improving bonding yield. The pressing components also prevent contamination of the semiconductor device by manual pressing, ensuring surface cleanliness.

[0097] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0098] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A bonding fixture, characterized in that, include: The fixture body, the suction component, and the pressing component; The fixture body has a fixing cavity, and the adsorption element has an adsorption surface, which is located in the fixing cavity; Multiple pressing members are provided, and each pressing member is positioned on the fixture body in an adjustable manner. Each pressing member has a pressing end, and the pressing end is at a first predetermined distance from the adsorption surface.

2. The bonding fixture as described in claim 1, characterized in that, The first set distance is 1mm-2mm.

3. The bonding fixture as described in claim 1, characterized in that, At least one pressing member is provided on each side of the fixed cavity along the first direction, and the first direction is parallel to the adsorption surface.

4. The bonding fixture as described in claim 1, characterized in that, The pressing component is rotatably mounted on the fixture body, and the rotation axis of the pressing component is perpendicular to the adsorption surface.

5. The bonding fixture as described in any one of claims 1 to 4, characterized in that, The pressing member is adjustablely positioned on the fixture body along a second direction, which is parallel to the adsorption surface.

6. The bonding fixture as described in claim 5, characterized in that, The fixture body has multiple mounting positions arranged along the second direction, and one of the pressing members can be selectively mounted in one of the mounting positions.

7. The bonding fixture as described in claim 6, characterized in that, The pressing component is mounted at the mounting position in a linear motion, and the direction of the linear motion is parallel to the adsorption surface.

8. The bonding fixture as described in claim 1, characterized in that, The fixture body includes a base, a pressing base, and a connector. The base and the pressing base are arranged along a third direction, which is perpendicular to the adsorption surface. The connector is supported between the base and the pressing base, so that the base and the pressing base have a second predetermined distance along the third direction. The base has the fixing cavity, and the pressing member is disposed on the pressing base.

9. The bonding fixture as described in claim 8, characterized in that, The base has multiple fixing cavities, and the adsorption member has multiple adsorption surfaces. Each fixing cavity is equipped with an adsorption surface. The pressing base is provided with at least one hollow area, the hollow area and at least one of the fixing cavities are directly opposite each other along the third direction, and the pressing end passes through the hollow area and has the first set distance from the adsorption surface.

10. The bonding fixture as described in claim 1, characterized in that, The adsorption element includes an adsorption substrate and adsorption protrusions located on the adsorption substrate, and the adsorption surface is located on the adsorption protrusions; The adsorption substrate is disposed on one side of the fixture body along a third direction, the third direction being perpendicular to the adsorption surface, and the adsorption protrusion extends into the fixing cavity.

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