cover member

Abstract

Embodiments of the present application provide a cover member (100) adapted for a component carrier structure (200) comprising a protrusion (230) protruding from a first main surface (210) of the component carrier structure (200), wherein the cover member (100) comprises a first cover (110) configured for temporarily covering the first main surface (210) of the component carrier structure (200) provided with the protrusion (230), and the first cover (110) comprises a perforated portion (112) configured to at least partially expose the protrusion (230) and the first main surface (210) where the protrusion (230) is located.

Description

Technical Field

[0001] This application relates to the field of semiconductor device packaging, and more specifically to a cover member suitable for temporarily protecting the structure of a component carrier during a specific process. Background Technology

[0002] This section provides background information relating to this application, but such information does not necessarily constitute prior art.

[0003] With the increasing functionality of products equipped with component carrier structures containing one or more electronic components, the miniaturization of these electronic components, and the rising number of electronic components to be mounted on component carrier structures, increasingly robust array-shaped components or packages with several electronic components are being adopted. These array-shaped components or packages have multiple contacts or connections, and the spacing between these contacts or connections is becoming increasingly smaller. Such component carrier structures must possess mechanical robustness and electrical reliability to operate even under harsh conditions.

[0004] Typically, the component carrier structure for flip chip packaging requires a semiconductor wafer to be attached to one surface and other electronic devices, such as capacitors, to be attached to the other surface.

[0005] like Figure 1A As shown, before attaching the semiconductor wafer (not shown) to the surface of the component carrier structure 200 (referred to as the flip-chip surface 10), solder bumps 20, such as solder bumps, need to be fabricated on the flip-chip surface 10. When fabricating the solder bumps 20, solder material is first provided on the pads of the flip-chip surface 10, and then a reflow soldering or wave soldering process is performed to form the solder bumps. During the solder bump fabrication process, flux is typically added under the solder material to remove oxide films on the metal surface (such as pads), prevent secondary oxidation of the metal surface at high soldering temperatures, reduce the interfacial tension between the molten solder and the metal surface to facilitate solder spread, and simultaneously protect the solder material from oxidation in the air. However, after the reflow soldering or wave soldering process, flux residues, depending on their chemical composition, may be corrosive or insulating, easily causing circuit failures. Therefore, a cleaning process is usually required to remove flux residues. The cleaning process (hereinafter referred to as the first cleaning process) can be performed using ultrasonic cleaning technology (such as using the ultrasonic generating device 30 shown in the figure).

[0006] After the solder bump 20 is fabricated, the next step is to attach other electronic components (e.g., capacitor 50) to the other side of the component carrier structure 200 opposite to the flip-chip surface 10. Figure 1BAs shown. Taking a capacitor as an example, flux is also required in the process of attaching the capacitor to the solder pad on the other side to facilitate the soldering process. Afterwards, a cleaning process is also required to remove flux residue. Similarly, this cleaning process (hereinafter referred to as the second cleaning process) can be performed using ultrasonic cleaning technology (such as using the ultrasonic generating device 30 shown in the figure).

[0007] However, the inventors of this application discovered that after the second cleaning process, the detachment rate of solder bumps 20 formed on the flip-chip surface 10 increased significantly, which seriously affected the product yield. Alternatively, another manufacturing problem arises: when the cleaning intensity of the solder resist is reduced to prevent solder bumps 20 from detaching, the solder resist cannot be completely removed, leading to electrical performance problems or contamination problems in other processes, ultimately affecting product yield. Therefore, this invention aims to prevent solder bumps 20 from detaching while ensuring complete cleaning of the solder resist.

[0008] After a series of experiments, the inventors of this application surprisingly discovered that the significantly increased bump removal rate after the second cleaning process was related to the ultrasonic parameters used in the ultrasonic cleaning technology of the second cleaning process. Typically, the ultrasonic parameters in the second cleaning process are several times (even more than ten times) higher than those in the first cleaning process. In the second cleaning process, powerful ultrasonic energy (microjets and shock waves generated when bubbles 40 burst) directly impacts the solder bumps, such as... Figure 1C As shown, this causes the solder bumps to detach from the flip-chip surface. Utility Model Content

[0009] This section provides a general overview of the application, rather than a full disclosure of the entire scope or all features of the application.

[0010] The purpose of this invention is to provide a covering member that can temporarily protect the component carrier structure when needed, especially in specific processes of component carrier structure (such as cleaning processes that use ultrasonic cleaning technology to remove flux), in order to at least solve the defects described above in the prior art.

[0011] An exemplary embodiment of this application provides a covering member suitable for a component carrier structure. The component carrier structure includes a protrusion projecting from a first main surface of the component carrier structure. The covering member includes a first cover configured to temporarily cover the first main surface of the component carrier structure where the protrusion is located. The first cover includes a perforated portion configured to at least partially expose the protrusion and the first main surface where the protrusion is located.

[0012] In the context of this application, the term "component carrier structure" may specifically refer to a prefabricated component carrier currently being manufactured. Specifically, a component carrier structure may include multiple component carriers or prefabricated components that remain integrally connected, and these component carriers or prefabricated components may be manufactured in a batch process prior to individualization. In particular, a component carrier structure may be a panel (e.g., having a size of 18 inches × 24 inches or larger or smaller) or an array (e.g., an array of six component carriers currently being manufactured).

[0013] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a mechanical and / or electronic carrier of a component. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board combining different carriers of the above types of component carriers.

[0014] In the context of this application, the term "protrusion" may specifically refer to an exposed element positioned on the surface of a component carrier structure and intended to be securely held on the respective surface (particularly the main surface) of the component carrier structure. The term "positioned on the surface of the component carrier structure" may specifically mean formed on the surface of the component carrier structure, surface mounted on the surface of the component carrier structure, and / or attached to the surface of the component carrier structure. There is an adhesion force between the protrusion and the respective surface of the component carrier structure, but such adhesion force is insufficient to securely hold the protrusion on the surface even when subjected to large external forces (e.g., cavitation forces associated with ultrasonic cleaning) at the interface or joint between the protrusion and / or the surface. Specifically, the protrusion protrudes from the respective surface of the component carrier structure, thereby exposing it to the external environment. One or more protrusions may be provided on the surface of the component carrier structure. Adjacent protrusions may be spaced at an appropriate distance. As an example, a protrusion may be a solder bump, such as a solder pad.

[0015] In the context of this application, the term "temporarily covering" the first main surface of a component carrier structure can specifically refer to a first cover member of a covering member temporarily or temporarily covering the first main surface of a component carrier structure when needed (e.g., during a specific process of the component carrier structure, such as a cleaning process to remove flux) to provide temporary protection for exposed elements positioned on the respective main surface. It will be understood that in some embodiments, the first cover member may remain temporarily covering the first main surface during subsequent processes closely associated with the aforementioned specific process, such as rinsing and / or drying processes.

[0016] In the context of this application, the term "perforated portion" may specifically refer to a portion having one or more perforations included in the body of the first cover. Different perforations among the plurality of perforations are connected by the material of the body. In particular, the perforated portion may be configured as a grid or similar structure. It is understood that a completely hollow portion enclosed only by its peripheral portion is not considered a perforated portion as understood in the context of this application.

[0017] In the context of this application, the term "at least partially exposed" for the protrusion and the first main surface on which the protrusion is located can specifically mean that when the first cover temporarily covers the first main surface of the component carrier structure, the first main surface and the protrusion thereon are at least partially visible, or at least partially accessible to the fluid.

[0018] This exemplary embodiment provides a covering member suitable for temporarily covering a first main surface of a component carrier structure having a protrusion. The covering member includes a first cover having a perforated portion. The perforated portion of the first cover is configured such that when the first cover temporarily covers the first main surface of the component carrier structure, the protrusion and the first main surface where the protrusion is located are at least partially exposed. In a specific process of manufacturing the component carrier structure, when the first main surface with the protrusion is subjected to external forces (such as cavitation forces associated with ultrasonic cleaning, including microjet impact forces and shock wave forces), the first cover temporarily covering the first main surface can provide protection to the protrusion and, through the design of the cover, filter out part of the shock wave force, thereby weakening the forces acting on the protrusion and / or the interface or joint between the protrusion and the surface, thereby promoting the stable retention of the protrusion on the main surface and preventing undesirable detachment of the protrusion from the surface. In addition, the design reduces the force of the shock wave to a level that is insufficient to separate the protrusion from the component carrier structure through a filtering function, while ensuring that there is enough shock wave force to clean away unwanted chemical residues on the component carrier structure.

[0019] Furthermore, designing the first cover to include perforated portions that at least partially expose the protrusions and the first main surface on which the protrusions are located is particularly advantageous in subsequent processes associated with the aforementioned specific process, especially those requiring sufficient contact between the fluids (such as rinsing fluids and drying gases) and the protrusions thereon. The first cover including the perforated portions provides temporary protection for the first main surface and the protrusions thereon during the specific process, while allowing sufficient contact between the fluids (such as rinsing fluids and drying gases) and the protrusions thereon in associated subsequent processes to ensure cleaning quality, without requiring a pause between processes to remove the first cover.

[0020] The following will explain another exemplary embodiment of the covering member.

[0021] In some alternative embodiments, the perforated portions are configured as a mesh. The mesh-type perforated portions enable uniform stress dispersion and impact reduction when the first cover covers the first main surface and its multiple protrusions, improving the overall protective effect while ensuring that the flushing force is sufficient to wash away chemicals on the component carrier structure.

[0022] In some alternative embodiments, the mesh includes: an array of first strips arranged parallel to each other and spaced apart; and an array of second strips arranged parallel to each other and spaced apart, and inclined relative to the array of first strips. By forming a mesh structure from the intersecting array of strips, the first cover containing this mesh structure exhibits high rigidity and stability in multiple directions, achieving uniform force distribution and simultaneously filtering out excess impact force.

[0023] In some alternative embodiments, the array of multiple second strips is arranged perpendicular to the array of multiple first strips. In some alternative embodiments, a portion of the array of multiple second strips is arranged perpendicular to a portion of the array of multiple first strips.

[0024] In some alternative embodiments, the array of multiple first strips and / or multiple array of multiple second strips includes at least one reinforcing strip, which has a larger dimension, such as a larger width, compared to the other adjacent and parallel strips. The reinforcing strip effectively enhances the rigidity and stability of the mesh structure, improves its durability, and extends its service life.

[0025] In some alternative embodiments, the reinforcing strip is arranged in a central position among the arrayed first strips and / or the arrayed second strips. By centrally arranging the reinforcing strip, it can evenly distribute the load at the center of symmetry of the grid structure, thereby improving the overall bending and torsional resistance of the structure and reducing deformation and stress concentration.

[0026] In some alternative implementations, an array of multiple first strips and / or an array of multiple second strips are arranged at an angle relative to the peripheral region surrounding the perforated portion.

[0027] In some alternative implementations, some of the first strips in an array and / or some of the second strips in an array are arranged at an angle relative to the peripheral region surrounding the perforated portion.

[0028] In the context of this application, the term "arranged obliquely" relative to the periphery can specifically mean that the strip is arranged at an angle other than 90 degrees and other than 180 degrees relative to at least a portion of the periphery, and more specifically, that the strip is arranged at an angle other than 90 degrees and other than 180 degrees relative to at least one of the lateral and vertical portions of the periphery.

[0029] When a particular process of the component carrier structure and / or its associated subsequent processes involves spraying or jetting liquid (especially rinsing liquid) and / or purging gas (especially hot air for drying) in a vertical direction, the inclined arrangement of the first strip and / or the second strip relative to the peripheral area can effectively promote full contact between the liquid and / or gas and the main surface of the component carrier structure and the protrusions thereon.

[0030] In some alternative implementations, the array of multiple first strips and / or the array of multiple second strips are tilted at an angle between 30 and 60 degrees relative to the peripheral region surrounding the perforated portion.

[0031] In some alternative implementations, the array of multiple first strips and / or the array of multiple second strips are tilted at 45 degrees relative to the peripheral region surrounding the perforated portion.

[0032] In some alternative implementations, the peripheral region is configured to come into contact with the first primary surface of the component carrier structure.

[0033] In some alternative embodiments, the cover member further includes a second cover. The second cover is configured to temporarily cover a second main surface of the component carrier structure, which is opposite to a first main surface provided with protrusions. In the context of this application, the term "temporarily cover" the second main surface of the component carrier structure can specifically mean that the second cover of the cover member temporarily or temporarily covers at least a portion of the second main surface of the component carrier structure during a specific process of the component carrier structure (such as a cleaning process to remove flux). Specifically, the second cover of the cover member temporarily or temporarily covers only the edge portion of the second main surface of the component carrier structure during a specific process of the component carrier structure (such as the second cleaning process described above), such that the uncovered portion (i.e., the exposed portion) of the second main surface and / or the exposed elements on that portion are subjected to (particularly sufficiently) the specific process. It is understood that, if desired, the second cover can also be configured to provide temporary protection to the second main surface and / or components formed or mounted thereon. For example, if desired, the second cover can also be configured to include a mesh structure, like the first cover.

[0034] In some alternative embodiments, the second cover is configured to engage with the first cover to accommodate the component carrier structure between the second cover and the first cover. The first and second covers, which engage with each other, form a space suitable for accommodating the component carrier structure between them, which facilitates the stable holding and coverage of the main surface of the component carrier structure during the manufacturing process.

[0035] In some alternative embodiments, the first cover includes a plurality of engagement holes arranged in a peripheral region surrounding the perforated portion, and the second cover includes a plurality of engagement inserts configured to engage with the plurality of engagement holes of the first cover. The interlocking configuration of the engagement holes and engagement inserts allows for easy joining between the first and second covers. Furthermore, this interlocking configuration also facilitates a stable engagement between the first and second covers, preventing undesirable misalignment during manufacturing, thereby providing a stable accommodating space for the component carrier structure.

[0036] In some alternative embodiments, the second cover defines a central hollow region. The central hollow region of the second cover allows sufficient exposure of the second main surface of the component carrier structure.

[0037] In some alternative implementations, the first cover and / or the second cover includes a plurality of support elements configured to abut against a component carrier structure housed between the first cover and the second cover.

[0038] In some embodiments, multiple support elements may be configured to laterally abut against the side edges of the component carrier structure to further enclose the component carrier structure, housed between the first and second covers, within a circumferential area defined by the multiple support elements. Furthermore, the arrangement of the multiple support elements allows the first and second covers to be spaced apart by an appropriate distance, particularly equal to the height of the support elements, to prevent the first cover from directly pressing against the first main surface of the component carrier structure and any protrusions thereon, thereby damaging the protrusions and causing electrical connection failure between the component carrier structure and the chip.

[0039] In other embodiments, the multiple support elements may also be configured to abut against the main surface of the component carrier structure in a direction perpendicular to the main surface of the component carrier structure, such that the body of the first and / or second cover is spaced from the first and / or main surface by an appropriate distance equal to the height of the support element. In such embodiments, multiple mating engagement members (such as engagement holes and inserts) on the first and second covers can be arranged circumferentially around the periphery of the multiple support elements, thereby further enclosing the component carrier structure placed on the support members within the circumferential range defined by the multiple mating engagement members through the engagement between the mating engagement members, avoiding unwanted displacement of the component carrier structure during the manufacturing process that could cause collision damage and electrical connection problems.

[0040] In some alternative embodiments, the protrusions on the first main surface of the component carrier structure to be temporarily covered by the first cover are configured as metal protrusions for interconnecting electronic components. In alternative embodiments, the metal includes at least one of the following: gold, palladium, tin, silver, iron, nickel, cobalt, lead, iridium, zinc, and copper. The metal protrusions are particularly solder bumps, and more particularly solder pads.

[0041] In some alternative embodiments, the component carrier structure has at least one exposed element, particularly an electronic component, and more particularly a capacitor, on the second main surface to be temporarily covered by the second cover. The exposed element may be surface-mounted on the second main surface; for example, the capacitor may be connected to a pad on the second main surface.

[0042] In alternative embodiments, the manufactured component carrier may include a stack of at least one electrically insulating layer structure and / or at least one conductive layer structure. For example, the component carrier may be a laminate of electrically insulating and conductive layer structures, particularly formed by applying mechanical pressure and / or heat. A “stack” can provide a plate-like component carrier that offers a large mounting surface for other components while remaining very thin and compact. The term “layer structure” may specifically refer to a continuous layer, a patterned layer, or multiple discontinuous islands within a common plane.

[0043] In an alternative implementation, the component carrier is shaped like a plate. This contributes to a compact design, where the component carrier still provides a large base for mounting components. Furthermore, particularly as a bare mold for embedded electronic components, its small thickness allows for easy embedding into thin plates, such as printed circuit boards.

[0044] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a board-shaped component carrier formed by laminating several conductive layer structures with several electrically insulating layer structures, for example by applying pressure and / or by providing heat. As the preferred material for PCB technology, the conductive layer structures are made of copper, while the electrically insulating layer structures can consist of resin and / or glass fiber, i.e., so-called prepreg or FR4 material. Various conductive layer structures can be formed with through-holes in the laminate, for example by laser drilling or mechanical drilling, and connected to each other in the desired manner by filling them with conductive material (especially copper), thus forming through-hole connections. In addition to one or more components that can be embedded in the PCB, PCBs are generally constructed to accommodate one or more components on one or two opposing surfaces of the board-shaped PCB. They can be soldered to their respective main surfaces. The dielectric portion of the PCB can consist of resin and reinforcing fibers such as glass fiber.

[0045] In the context of this application, the term "substrate" can specifically refer to a small component carrier. In the case of a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted, and can act as a connection medium between one or more chips and another PCB. For example, a substrate can have substantially the same dimensions as the components (especially electronic components) to be mounted thereon (e.g., in the case of chip-scale packages (CSP)). More specifically, a substrate can be understood as a carrier of electrical connections or electrical networks, and a component carrier equivalent to a printed circuit board (PCB), but with a considerably high density of lateral and / or vertical interconnects. For example, lateral connections are conductive channels, while vertical connections may be drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between packaged or unpackaged components (such as bare molds), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can be composed of resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

[0046] The substrate or interlayer may include or consist of at least one layer of glass, silicon (Si), or photo-imaging or dry-etching organic material such as epoxy-based stacked material (e.g., epoxy-based stacked film) or polymer compound such as polyimide, polybenzoxazole, or benzocyclobutene functionalized polymer.

[0047] In alternative embodiments, at least one electrical insulating layer structure may include at least one of the following: resin (e.g., reinforced or unreinforced resin, such as epoxy or bis(methylenediamide)-trinitride resin), cyanate ester resin, polystyrene derivative, glass (particularly glass fiber, multilayer glass, glass-like materials), prepreg (e.g., FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based constructed film, polytetrafluoroethylene (PTFE, Teflon), ceramic, metal oxide. Reinforcing structures such as fiber webs, fibers, or spheres, made of glass (multilayer glass), may also be used. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based deposited films or photo-imaging dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as PTFE, liquid crystal polymers and / or cyanate ester resins, low-temperature co-fired ceramics (LTCC), or other low, very low, or ultra-low DK materials may be implemented as electrical insulating layer structures in component carriers.

[0048] In the context of this application, the term "reinforcing material" may specifically refer to a substance incorporated into a layered structure for strengthening that layered structure. Such reinforcing materials include, but are not limited to, reinforcing particles (e.g., reinforcing spheres, particularly glass spheres), fiber webs, etc.

[0049] In an alternative implementation, at least one conductive layer structure may include at least one material from the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten. While copper is generally the preferred material, other materials or coating versions thereof are also possible, particularly coatings with superconducting materials such as graphene.

[0050] At least one component that can be embedded and / or surface-mounted on a stack can be selected from the group consisting of: non-conductive inlays (e.g., ceramic inlays, preferably including aluminum nitride or aluminum oxide), conductive inlays (e.g., metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), light guiding elements (e.g., optical waveguides or optical conductor connections), optical elements (e.g., lenses), electronic components, or combinations thereof. For example, the component can be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, an optical connector, a voltage converter (e.g., a DC / DC converter or an AC / DC converter), a encryption component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components can be embedded within a component carrier. For example, magnetic elements can be used as components. This magnetic element can be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferromagnetic element, or a ferrite core) or a paramagnetic element. However, the component can also be a substrate, an interlayer, or another component carrier, such as in a board-in-board configuration. The component can be surface-mounted on a component carrier and / or embedded therein. Furthermore, other components can also be used as components.

[0051] In an alternative embodiment, the component carrier may be a laminated component carrier. In such an embodiment, the component carrier may be a multilayered compound that is stacked and connected together by applying pressure and / or heat.

[0052] After the inner layer structure of the component carrier is processed, one or two opposing main surfaces of the processed layer structure can be symmetrically or asymmetrically covered (particularly by lamination) with one or more additional electrically insulating and / or conductive layer structures. In other words, accumulation can continue until the desired number of layers is obtained.

[0053] After completing the stacked component that forms an electrically insulating layer structure and a conductive layer structure, the obtained layer structure or component carrier can be surface treated.

[0054] Specifically, in terms of surface treatment, an electrically insulating solder resist can be applied to one or two opposing main surfaces of a laminate or component carrier. For example, a solder resist can be formed over the entire main surface, and the solder resist layer can then be shaped to expose one or more conductive surface portions for electrically bonding the component carrier to an electronic periphery. This effectively protects the surface portions of the component carrier, particularly those containing copper, from oxidation or corrosion.

[0055] Regarding surface treatment, surface treatment can also be selectively applied to the exposed conductive surface portions of the component carrier. Such surface treatment can be a conductive overlay material on the exposed conductive layer structure (e.g., pads, conductive tracks, etc., particularly including or composed of copper) on the surface of the component carrier. If this exposed conductive layer structure is not protected, the exposed conductive material (especially copper) may oxidize, reducing the reliability of the component carrier. A surface finish can then be formed, for example, as an interface between the surface-mount component and the component carrier. Surface treatment serves to protect the exposed conductive layer structure (especially copper circuitry) and enable connection processes with one or more components, such as by soldering. Suitable materials for surface treatment include organic solderable corrosion inhibitors (OSP), electroless nickel immersion gold (ENIG), gold (especially hard gold), electroless tin, nickel-gold, nickel-palladium, electroless nickel immersion palladium gold (ENIPIG), etc.

[0056] The foregoing limitations and other aspects of the present invention will become apparent from the examples of embodiments to be described below, and will be explained with reference to these examples of embodiments. Attached Figure Description

[0057] The features and advantages of embodiments of this application will become more readily understood from the following description with reference to the accompanying drawings, which are not drawn to scale and some features are enlarged or reduced to show details of specific components. Figures 1A to 1C Background information relating to this application is shown, wherein, Figure 1A The diagram schematically illustrates the first cleaning process of removing flux using ultrasonic cleaning technology after solder bumps are formed on one side surface of the component carrier structure. Figure 1B The diagram schematically illustrates a second cleaning process where, after attaching electronic components, such as capacitors, to the other side surface of a component carrier structure, flux is removed using ultrasonic cleaning technology; and, Figure 1C This schematically illustrates the reason why the inventors of this application discovered, after a series of experiments, that the solder bump removal rate significantly increased during the second cleaning process.

[0058] Figure 2 A plan view of a first cover in a cover member according to an exemplary embodiment of this application is schematically shown.

[0059] Figure 3 A plan view of a first cover in a cover member according to another exemplary embodiment of this application is schematically shown.

[0060] Figure 4 The cover member according to an exemplary embodiment of this application is schematically shown in... Figure 1BThe application in the second cleaning process is shown.

[0061] Figure 5 A plan view of a second cover in a cover member according to another exemplary embodiment of this application is schematically shown.

[0062] Figure 6 This schematically illustrates the situation as follows: Figure 4 The rinsing and drying processes that follow the cleaning process shown are shown.

[0063] The reference numerals in the figure: Flip-chip surface 10; solder bump 20; ultrasonic generator 30; bubble 40; capacitor 50; rinsing device 60; drying device 70; cover member 100; first cover 110; perforated portion 112; first strip 114; second strip 116; joint hole 119; peripheral area 118; second cover 120; joint insert 122; central hollow area 124; reinforcing strip 115; component carrier structure 200; first main surface 210; second main surface 220; protrusion 230; support element 125; exposed element 228. Detailed Implementation

[0064] The present application will now be described in detail with reference to the accompanying drawings and exemplary embodiments thereof. It should be noted that the following detailed description is for illustrative purposes only and is not intended to limit the scope of the application. Furthermore, the same reference numerals are used to denote the same parts in the various drawings.

[0065] It should also be noted that, for clarity, not all features of the actual specific embodiments are described and shown in the specification and drawings. In addition, in order to avoid unnecessary details from obscuring the technical solutions of interest in this application, only the arrangement structure closely related to the technical content of this application is described and shown in the specification and drawings, while other details that are not closely related to the technical content of this application and are known to those skilled in the art are omitted.

[0066] Those skilled in the art will understand that many technical details have been presented in the various embodiments of this application to facilitate a better understanding of the application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the various embodiments below is for ease of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.

[0067] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0068] In this application, terms such as “up,” “down,” “outside,” and “inside” used to describe orientation are used for descriptive purposes only and should not be considered restrictive.

[0069] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can also refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0070] Reference Figures 2 to 6 A cover member 100 according to an exemplary embodiment of this application is described. The cover member 100 is particularly adapted to temporarily cover the component carrier structure 200 during a specific manufacturing process to provide temporary protection. Such a component carrier structure 200 includes a protrusion 230 projecting from its first main surface 210, such as... Figure 4 As shown.

[0071] The covering member 100 according to an exemplary embodiment of this application includes a first covering member 110, such as Figure 2 and Figure 3As shown. The first cover 110 is configured to temporarily cover the first main surface 210 of the component carrier structure 200, where the protrusion 230 is located, when needed (e.g., when the component carrier structure is undergoing a specific process). The so-called specific process is, for example, but not limited to, a cleaning process, particularly a cleaning process for removing flux, and more particularly, an ultrasonic cleaning process for removing flux. The first cover 110 includes a perforated portion 112 configured to at least partially expose the protrusion 230 and the first main surface 210 where the protrusion 230 is located.

[0072] In a specific process of the component carrier structure 200, when the first main surface 210 on which the protrusion 230 is provided is subjected to external forces (such as cavitation forces associated with ultrasonic cleaning, including microjet impact forces and shock wave forces), the first cover 110 temporarily covering the first main surface 210 can provide temporary protection to the protrusion 230 positioned on the first main surface 210 by at least weakening the forces acting on the protrusion 230 and / or at the interface or joint between the protrusion 230 and the first main surface 210, thereby promoting the protrusion 230 to be firmly held on the first main surface 210 and preventing the protrusion 230 from undesirably falling off the first main surface 210.

[0073] Furthermore, designing the first cover 110 to include a perforated portion 112 that at least partially exposes the protrusion 230 and the first main surface 210 on which the protrusion 230 is located is particularly advantageous in subsequent processes closely related to the aforementioned specific process, especially those requiring sufficient contact between the fluid (such as rinsing liquid and drying gas) and the first main surface 210 and the protrusion 230 thereon. The first cover 110 including the perforated portion 112 can provide necessary temporary protection for the first main surface 210 and the protrusion 230 thereon during the process, and can also allow sufficient contact between the fluid and the first main surface 210 and the protrusion 230 thereon in successive subsequent processes to achieve effective cleaning, without having to pause between processes to remove the first cover 110.

[0074] As an example, refer to Figure 4 ,by Figure 1A and Figure 1B The described background is an application scenario, describing the application of the covering member 100 including the first covering member 110. It is understood that the application of the covering member 100 according to the embodiments of this application is not limited to this. Figure 4As shown, after an electronic component, such as a capacitor, is attached to the second main surface 220 of the component carrier structure 200, a second cleaning process to remove flux is performed using an ultrasonic cleaning device 30. Before performing the second cleaning process, a first cover 110 of the cover member 100 according to an exemplary embodiment of this application is applied to the component carrier structure 200 to temporarily cover the first main surface 210 of the component carrier structure 200 together with the plurality of protrusions 230 thereon. In the second cleaning process, the first cover 110 effectively buffers and mitigates the direct effect of strong ultrasonic energy (microjets and shock waves) on the protrusions 230 and / or the interface or joint between the protrusions 230 and the first main surface 210, thereby significantly reducing or even eliminating the possibility of the protrusions 230 detaching from the first main surface 210 and simultaneously achieving the purpose of completely cleaning the flux.

[0075] According to an exemplary embodiment, the protrusion 230 on the first main surface 210 may be a metal protrusion for interconnecting electronic components, particularly a solder bump.

[0076] According to an exemplary embodiment, the first cover 110 may be configured to have a shape adapted to the component carrier structure 200. For example, the first cover 110 may in particular have a substantially rectangular shape. However, it will be understood that the first cover 110 may be configured into any other suitable shape as required.

[0077] Still refer to Figure 2 and Figure 3 The perforated portion 112 can be configured as a grid or similar structure. The grid can include an array of multiple first strips 114 and an array of multiple second strips 116. The array of multiple first strips 114 can be arranged to be spaced apart from each other substantially parallel to each other. The array of multiple second strips 116 can be arranged to be spaced apart from each other substantially parallel to each other and inclined relative to the array of multiple first strips 114.

[0078] The plurality of first strips 114 and / or the plurality of second strips 116 may be spaced substantially equally. However, it is understood that the plurality of first strips 114 and / or the plurality of second strips 116 may also be spaced at least partially unequally. For example, the strips may be arranged with a relatively small spacing in the dense areas of the protrusions 230, and with a relatively large spacing in the sparse areas of the protrusions 230.

[0079] In some embodiments, the array of multiple second strips 116 may be arranged substantially perpendicular to the array of multiple first strips 114, as shown. In other embodiments, the array of multiple second strips 116 may be arranged at an angle other than 90 degrees relative to the array of multiple first strips 114.

[0080] The array of multiple first strips 114 and / or multiple array of second strips 116 may include one or more reinforcing strips 115. The reinforcing strip 115 has a larger dimension than the other adjacent strips, such as a larger width and / or a larger thickness.

[0081] In some embodiments, the reinforcing strip 115 may be arranged in a substantially central position among an array of multiple first strips 114 and / or an array of multiple second strips 116. In some embodiments, the multiple reinforcing strips 115 may be arranged at intervals within the array of the first strips 114. In some embodiments, the multiple reinforcing strips 115 may be arranged at intervals within the array of the second strips 116.

[0082] like Figure 2 As shown, the array of multiple first strips 114 and / or the array of multiple second strips 116 can be arranged perpendicularly to the peripheral region 118 surrounding the perforated portion 112.

[0083] like Figure 3 As shown, the arrayed plurality of first strips 114 and / or the arrayed plurality of second strips 116 can be arranged obliquely relative to the peripheral region 118 surrounding the perforated portion 112. Specifically, the angle of inclination of the arrayed plurality of first strips 114 and / or the arrayed plurality of second strips 116 relative to the peripheral region 118 surrounding the perforated portion 112 can be between 30 degrees and 60 degrees. More specifically, the angle of inclination of the arrayed plurality of first strips 114 and / or the arrayed plurality of second strips 116 relative to the peripheral region 118 surrounding the perforated portion 112 can be 45 degrees.

[0084] It is understood that in some embodiments, each of the plurality of first strips 114 may be arranged at an angle relative to the peripheral region 118, and / or each of the plurality of second strips 116 may be arranged at an angle relative to the peripheral region 118. It is also understood that in some embodiments, the tilt angle of each strip relative to different portions of the peripheral region 118 may be different.

[0085] When a specific process of the component carrier structure 200 and / or its associated subsequent processes require the first main surface 210 and its protrusions 230 to be in full contact with a fluid (such as a liquid or gas), compared to Figure 2 The structure shown Figure 3 The inclined arrangement of the first strip 114 and / or the second strip 116 relative to the peripheral region 118 is generally more advantageous.

[0086] As an example, in such Figure 6 As shown in Figure 4 The rinsing and drying processes following the second cleaning process involve spraying or jetting liquid (rinsing liquid, such as deionized water) vertically using the rinsing device 60 to rinse away the dirty cleaning liquid containing dissolved contaminants carried on the surface of the component carrier structure 200, preventing secondary contamination; and involving blowing gas (especially hot air for drying) vertically using the drying device 70 to remove moisture. The inclined arrangement of the first strip 114 and / or the second strip 116 relative to the peripheral region 118 can more effectively promote full contact between the rinsing liquid and the drying gas and the main surface of the component carrier structure 200 and the components thereon.

[0087] In some embodiments, when the first cover 110 temporarily covers the first main surface 210 of the component carrier structure 200, the peripheral region 118 surrounding the perforated portion 112 is in direct contact with the non-graphical edge area of ​​the first main surface 210. In other embodiments, when the first cover 110 temporarily covers the first main surface 210 of the component carrier structure 200, the peripheral region 118 surrounding the perforated portion 112 is indirectly in contact with the first main surface 210 through an additional intermediate portion.

[0088] like Figure 5 As shown, the covering member 100 according to another exemplary embodiment of this application may further include a second covering member 120. The second covering member 120 may be configured to temporarily cover the second main surface 220 of the component carrier structure 200, which is opposite to the first main surface 210 provided with the protrusion 230.

[0089] Depending on the specific requirements or application scenario, the second cover 120 may be configured to cover only a portion of the entire extension of the second main surface 220 (e.g., the second cover 120 includes a central hollow region 124 such that it covers only the edge portion of the second main surface), so that the remaining portion of the second main surface 220 is fully exposed; or, the second cover 120 may be configured to have a similar structure to the first cover 110.

[0090] In some embodiments, the second cover 120 may be configured to engage with the first cover 110 to accommodate the component carrier structure 200 between the second cover 120 and the first cover 110.

[0091] The joining method between the second cover 120 and the first cover 110 can be varied. For example, such as... Figure 2 , Figure 3 and Figure 5As shown, the first cover 110 may include a plurality of engagement holes 119 arranged in a peripheral region 118 surrounding the perforated portion 112, and correspondingly, the second cover 120 may include a plurality of engagement inserts 122 configured to engage with the plurality of engagement holes 119.

[0092] In some embodiments, the first cover 110 and / or the second cover 120 may include a plurality of support elements 125. The plurality of support elements 125 may be configured to abut against a component carrier structure 200 to be accommodated between the first cover 110 and the second cover 120.

[0093] In some embodiments, when the component carrier structure 200 is received between the first cover 110 and the second cover 120, a plurality of support elements 125 may laterally abut against the side edges of the component carrier structure 200 to enclose the component carrier structure 200 within a circumferential area defined by the plurality of support elements 125, thereby preventing undesirable displacement of the component carrier structure 200. Furthermore, this arrangement of the plurality of support elements 125 also allows the first cover 110 and the second cover 120 to be spaced apart, particularly by a distance equal to the height of the support elements 125, to particularly prevent the first cover 110 from directly pressing against the first main surface 210 of the component carrier structure 200 and its protrusions 230.

[0094] In other embodiments, when the component carrier structure 200 is received between the first cover 110 and the second cover 120, a plurality of support elements 125 may abut against the edge non-graphical area of ​​the main surface of the component carrier structure 200 in a direction perpendicular to the main surface of the component carrier structure 200, so that the body of the first and / or second cover is spaced from the first and / or main surface by an appropriate distance equal to the height of the support element 125, thereby facilitating stable positioning of the component carrier structure without damaging the circuit structure of the component carrier structure. In such embodiments, for example, a plurality of mating engagement members (such as engagement holes 119 and engagement inserts 122) on the first cover 110 and the second cover 120 may be arranged circumferentially around the plurality of support elements 125, thereby further enclosing the component carrier structure 200 placed on the support element 125 within the circumferential range defined by the plurality of mating engagement members through the engagement between the mating engagement members, thereby avoiding undesirable displacement of the component carrier structure 200.

[0095] As an example, refer to Figure 4 ,by Figure 1A and Figure 1B The described background is an application scenario, describing the application of the covering member 100, including the first covering member 110 and the second covering member 120. For example... Figure 4As shown, after the exposed element 228 (such as an electronic component, particularly a capacitor) is placed on the second main surface 220 of the component carrier structure 200, a second cleaning process to remove flux is required using an ultrasonic cleaning device 30. Before performing the second cleaning process, the component carrier structure 200 is placed between the first cover 110 and the second cover 120 of the cover member 100 according to an exemplary embodiment of this application, such that the first cover 110 temporarily covers the first main surface 210 of the component carrier structure 200 together with the plurality of protrusions 230 thereon, and the second cover 120 temporarily covers only the edge portion of the second main surface 220. The first cover 110 and the second cover 120 can be engaged with each other through the configuration of the engagement hole and insert as described above. As shown, the second cover 120 can support the component carrier structure 200. The support element 125 on the first cover 110 and / or the second cover 120 can laterally abut against the component carrier structure 200 to prevent its displacement. In the second cleaning process, the first cover 110 effectively buffers and mitigates the direct effects of powerful ultrasonic energy (microjets and shock waves) on the protrusion 230 and / or the interface or joint between the protrusion 230 and the first main surface 210, thereby significantly reducing or even eliminating the possibility of the protrusion 230 detaching from the first main surface 210.

[0096] This application also provides a cleaning method for a component carrier structure 200. The method can be performed in a cleaning chamber equipped with at least one cleaning device.

[0097] This cleaning method may include the following steps: (1) An exposed element, such as a solder bump, is formed on the first main surface 210 of the component carrier structure 200; (2) Before forming additional exposed elements such as capacitors on the second main surface 220 of the component carrier structure 200, the component carrier structure 200 is sent into a cleaning chamber, which is provided with at least one cleaning device (in particular an ultrasonic emitting assembly), such that the first main surface 210 of the component carrier structure 200 with protruding exposed elements such as solder bumps faces the ultrasonic emitting assembly, and the first main surface 210 is covered by the first cover 110. (3) Apply a first ultrasonic intensity to the component carrier structure 200 to clean the first main surface 210; (4) At least one additional exposed element, such as a capacitor, is formed on the second main surface 220 of the component carrier structure 200; (5) The component carrier structure 200 is sent back into the cleaning chamber so that the second main surface 220 with additional exposed elements faces the ultrasonic transmitting assembly, wherein the second main surface 220 is covered by the second cover 120, while the first main surface 210 is covered by the first cover 110; the first cover 110 and the second cover 120 can be engaged with each other through mating engagement holes and inserts to fix the component carrier structure 200 between the first cover 110 and the second cover 120; (6) A second ultrasonic intensity is applied to the component carrier structure 200, causing the ultrasonic waves to pass through the central hollow region of the second cover 120 and act directly on the second main surface 220 to achieve cleaning, wherein the second ultrasonic intensity is higher than the first ultrasonic intensity. During this process, the first main surface 210 faces away from the ultrasonic transmitting assembly, and the first cover 110 covering the first main surface 210 can attenuate the ultrasonic waves acting on it. In addition, the bubbles generated by the ultrasonic transmitting assembly move upward from the bottom of the cleaning chamber and eventually reach the first cover 110, thereby effectively protecting the formed exposed elements, such as solder bumps, from undesirable detachment by reducing the impact from bubbles that appear above the formed exposed elements, such as solder bumps, and eventually burst at their surface.

[0098] Although this application has been described with reference to exemplary embodiments, it should be understood that this application is not limited to the specific embodiments described and shown herein. Various changes can be made to the exemplary embodiments by those skilled in the art without departing from the scope defined by the claims of this application.

[0099] The features mentioned and / or shown in the above description of exemplary embodiments of this application may be combined in the same or similar manner with one or more other embodiments, combined with features in other embodiments, or substituted for corresponding features in other embodiments. Such combinations or substitutions should also be considered as including within the scope of protection of this application.

Claims

1. A cover member (100) adapted to a component carrier structure (200), the component carrier structure (200) including a protrusion (230) projecting from a first main surface (210) of the component carrier structure (200), characterized in that, The covering member (100) includes a first cover (110) configured to temporarily cover a first main surface (210) of the component carrier structure (200) on which the protrusion (230) is provided, and the first cover (110) includes a perforated portion (112) configured to expose at least partially the protrusion (230) and the first main surface (210) on which the protrusion (230) is located.

2. The covering member (100) according to claim 1, characterized in that, The perforated portion (112) is constructed as a mesh.

3. The covering member (100) according to claim 2, characterized in that, The grid includes: A plurality of first strips (114) arranged in an array, the plurality of first strips (114) being arranged parallel to each other and spaced apart; and A plurality of second strips (116) arranged in an array, the plurality of second strips (116) being arranged parallel to each other and inclined relative to the plurality of first strips (114) arranged in an array.

4. The covering member (100) according to claim 3, characterized in that, The array of multiple second strips (116) is arranged perpendicular to the array of multiple first strips (114).

5. The covering member (100) according to claim 3 or 4, characterized in that, The array of multiple first strips (114) and / or the array of multiple second strips (116) includes at least one reinforcing strip (115) which has a larger size than the other adjacent and parallel strips.

6. The covering member (100) according to claim 5, characterized in that, The reinforcing strip (115) is arranged in a central position among the arrayed plurality of first strips (114) and / or the arrayed plurality of second strips (116).

7. The covering member (100) according to any one of claims 3 to 6, characterized in that, The array of multiple first strips (114) and / or the array of multiple second strips (116) are arranged at an angle relative to the peripheral region (118) surrounding the perforated portion (112).

8. The covering member (100) according to any one of claims 3 to 7, characterized in that, The array of multiple first strips (114) and / or the array of multiple second strips (116) are tilted at an angle between 30 and 60 degrees relative to the peripheral region (118) surrounding the perforated portion (112).

9. The covering member (100) according to claim 8, characterized in that, The array of multiple first strips (114) and / or the array of multiple second strips (116) are tilted at 45 degrees relative to the peripheral region (118) surrounding the perforated portion (112).

10. The covering member (100) according to any one of claims 7 to 9, characterized in that, The peripheral region (118) is configured to come into contact with the first main surface (210) of the component carrier structure (200).

11. The covering member (100) according to any one of claims 1 to 9, characterized in that, The covering member (100) further includes a second covering member (120) configured to temporarily cover the second main surface (220) of the component carrier structure (200), the second main surface (220) being opposite to the first main surface (210) on which the protrusion (230) is provided.

12. The covering member (100) according to claim 11, characterized in that, The second cover (120) is configured to engage with the first cover (110) to accommodate the component carrier structure (200) between the second cover (120) and the first cover (110).

13. The covering member (100) according to claim 11 or 12, characterized in that, The first cover (110) includes a plurality of engagement holes (119) arranged in a peripheral region (118) surrounding the perforated portion (112), and the second cover (120) includes a plurality of engagement inserts (122) configured to engage with the plurality of engagement holes (119) of the first cover (110).

14. The covering member (100) according to any one of claims 11 to 13, characterized in that, The second cover (120) defines a central hollow area (124).

15. The covering member (100) according to claim 11, characterized in that, The first cover (110) and / or the second cover (120) include a plurality of support elements (125) configured to abut against the component carrier structure (200) housed between the first cover (110) and the second cover (120).

16. The covering member (100) according to any one of claims 1 to 9, characterized in that, The protrusion (230) on the first main surface (210) of the component carrier structure (200) to be temporarily covered by the first cover (110) is configured as a metal protrusion for interconnecting electronic components.

17. The covering member (100) according to claim 16, characterized in that, The protrusion (230) is configured as a solder bump for interconnecting electronic components.

18. The covering member (100) according to any one of claims 11 to 15, characterized in that, The component carrier structure (200) has at least one exposed element (228) on the second main surface (220) to be temporarily covered by the second cover (120).

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