Wafer sheet combining machine

Abstract

The utility model discloses a wafer combine piece machine, including main frame, the left side installation of main frame has left conveying device, the right side installation right conveying device of main frame, the middle of main frame is equipped with a combine piece device, the combine piece device includes first rotary cylinder and second rotary cylinder, first rotary cylinder is connected with first connecting shaft, second rotary cylinder is connected with second connecting shaft, the inside of first connecting shaft is equipped with second connecting shaft sleeve, first connecting shaft is connected with first rotation cover, second connecting shaft is connected with second rotation cover, first rotation cover is connected with first combine piece, second rotation cover is connected with second combine piece, the right side of main frame is equipped with third rotary cylinder, third rotary cylinder is connected with third connecting shaft, third connecting shaft is connected with blocking piece. The utility model stable operation, automatic high -efficiently complete combine piece process, and the labor intensity is small, and the production cost is low, and it is favorable to batch production.

Description

Technical Field

[0001] This utility model relates to the field of chocolate making technology, specifically to a wafer sheet combining machine. Background Technology

[0002] In the production of granulated wafer chocolate, wafer sheets are first made using a molding die. Then, a batter is poured into multiple cavities within the wafer sheets. After the batter slightly solidifies, two identical wafer sheets are joined together, and then the wafers are punched to form granulated chocolate. Finally, a chocolate coating is applied to the surface of the granulated chocolate. However, traditional wafer sheet joining is generally done manually, which is labor-intensive, time-consuming, and costly, making it unsuitable for mass production. Therefore, to avoid the shortcomings of existing technology, it is necessary to improve it. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings and deficiencies in the existing technology and provide a wafer wafer assembling machine that is stable in operation and has high working efficiency.

[0004] This utility model is achieved through the following technical solution:

[0005] A wafer wafer assembling machine includes a main frame, a left conveying device installed on the left side of the main frame, a right conveying device installed on the right side of the main frame, and a wafer assembling device provided in the middle of the main frame. The wafer assembling device includes a first rotary cylinder and a second rotary cylinder. The first rotary cylinder is connected to a first connecting shaft, and the second rotary cylinder is connected to a second connecting shaft. The second connecting shaft is sleeved inside the first connecting shaft. The first connecting shaft is connected to a first rotating sleeve, and the second connecting shaft is connected to a second rotating sleeve. The first rotating sleeve is connected to a first wafer, and the second rotating sleeve is connected to a second wafer.

[0006] Furthermore, a first positioning detector is provided on the left side of the left conveying device.

[0007] Furthermore, a second positioning detector is provided on the right side of the right conveying device.

[0008] Furthermore, a third rotary cylinder is provided on the right side of the main frame, the third rotary cylinder is connected to a third connecting shaft, and the third connecting shaft is connected to a blocking block.

[0009] Furthermore, a first guide plate is installed on the left side of the top of the main frame, and a second guide plate is installed on the right side of the top of the main frame. Guide ramps are provided on the left side of both the first guide plate and the left side of the second guide plate.

[0010] Furthermore, both the left conveying device and the right conveying device include a geared motor. The power output end of the geared motor is connected to a drive shaft, and the drive shaft is equipped with several drive pulleys. The main frame is equipped with a driven shaft, and the driven shaft is rotatably connected to several driven pulleys. The drive pulleys are connected to the driven pulleys via a conveyor belt.

[0011] Furthermore, a flattening device is also provided on the right side of the main frame. The flattening device includes a right frame, a conveyor belt is installed on the top of the right frame, a fourth rotary cylinder is installed on the right side of the top of the right frame, the fourth rotary cylinder is connected to a fourth connecting shaft, the fourth connecting shaft is connected to a blocking plate, and a fifth rotary cylinder is installed on the left side of the top of the right frame, the fifth rotary cylinder is connected to a fifth connecting shaft, the fifth connecting shaft is connected to a flattening plate.

[0012] Furthermore, the first rotating sleeve is connected to a first connecting rod for connecting the first assembly piece, and the second rotating sleeve is connected to a second connecting rod for connecting the second assembly piece.

[0013] Furthermore, a receiving tray is provided at the lower part of the main frame.

[0014] Furthermore, the bottom of the main frame is provided with adjustable support feet.

[0015] Compared to existing technologies, this invention features a left conveying device mounted on the left side of the main frame and a right conveying device mounted on the right side. The wafer-assembly device includes a first rotary cylinder and a second rotary cylinder. The first rotary cylinder is connected to a first connecting shaft, and the second rotary cylinder is connected to a second connecting shaft. The second connecting shaft is sleeved inside the first connecting shaft. The first connecting shaft is connected to a first rotating sleeve, and the second connecting shaft is connected to a second rotating sleeve. The first rotating sleeve is connected to a first wafer assembly, and the second rotating sleeve is connected to a second wafer assembly. During operation, the wafer is fed from the left side of the main frame, and the left and right conveying devices first transfer one wafer to the right side of the main frame. The left conveyor transfers another wafer to the left side of the main frame. The first rotary cylinder drives the first wafer assembly to rotate the wafer on the right to the left, and the second rotary cylinder drives the second wafer assembly to rotate the wafer on the left to the right. After assembling the wafers in the middle, the first rotary cylinder drives the first wafer assembly to rotate to the right, and the second rotary cylinder drives the second wafer assembly to rotate to the right. After placing the wafers onto the right conveyor, the first rotary cylinder drives the first wafer assembly to rotate to the right to reset, and the second rotary cylinder drives the second wafer assembly to rotate to the left to reset, completing the wafer assembly process. This process does not require manual labor, resulting in low labor intensity, short production time, low production costs, and suitability for mass production. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the wafer wafer assembling machine of this utility model;

[0018] Figure 2 for Figure 1 Enlarged view of part A.

[0019] In the diagram: 1-Main frame; 2-First rotary cylinder; 3-Second rotary cylinder; 41-First rotating sleeve; 42-Second rotating sleeve; 5-First assembly plate; 6-Second assembly plate; 7-First positioning detector; 8-Second positioning detector; 9-Third rotary cylinder; 10-Third connecting shaft; 11-Blocking block; 12-First guide plate; 13-Second guide plate; 14-Guide inclined plate; 15-Gear motor; 16-Drive shaft; 17-Drive pulley; 18-Driven shaft; 19-Driven pulley; 20-Conveyor belt; 21-Right frame; 22-Conveyor belt; 23-Fourth rotary cylinder; 24-Fourth connecting shaft; 25-Blocking plate; 26-Fifth rotary cylinder; 27-Fifth connecting shaft; 28-Flattening plate; 29-First connecting rod; 30-Second connecting rod; 31-Receiving tray; 32-Adjustable support foot. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figure 1 and Figure 2The present invention discloses a wafer wafer assembling machine, comprising a main frame 1, a left conveying device installed on the left side of the main frame 1, a right conveying device installed on the right side of the main frame 1, and a wafer assembling device provided in the middle of the main frame 1. The wafer assembling device includes a first rotary cylinder 2 and a second rotary cylinder 3. The first rotary cylinder 2 is connected to a first connecting shaft, and the second rotary cylinder 3 is connected to a second connecting shaft. The second connecting shaft is sleeved inside the first connecting shaft. The first connecting shaft is connected to a first rotating sleeve 41, and the second connecting shaft is connected to a second rotating sleeve 42. The first rotating sleeve 41 is connected to a first wafer 5, and the second rotating sleeve 42 is connected to a second wafer 6. During operation, the wafer is fed from the left side of the main frame 1. The left and right conveying devices first transfer one wafer to the right side of the main frame, and the left conveying device transfers another wafer to the left side of the main frame 1. The first rotary cylinder 2 drives the first wafer assembly 5 to rotate the wafer on the right side to the left, and the second rotary cylinder 3 drives the second wafer assembly 6 to rotate the wafer on the left side to the right. After assembling the wafers in the middle, the first rotary cylinder 2 drives the first wafer assembly 5 to rotate to the right, and the second rotary cylinder 3 drives the second wafer assembly 6 to rotate to the right. After placing the wafers on the right conveying device, the first rotary cylinder 2 drives the first wafer assembly 5 to rotate to the right to reset, and the second rotary cylinder 3 drives the second wafer assembly 6 to rotate to the left to reset, completing the wafer assembly process. This process does not require manual labor, resulting in low labor intensity, short production time, low production costs, and is conducive to mass production.

[0022] The left side of the left conveyor is equipped with a first positioning detector 7. After detecting that the wafer sheet on the left side has arrived in place, the wafer merging action begins.

[0023] A second positioning detector 8 is installed on the right side of the right conveyor device. After detecting that the wafer sheet on the right side has reached the positioning position, the material discharge and conveying operation begins.

[0024] A third rotary cylinder 9 is provided on the right side of the main frame 1. The third rotary cylinder 9 is connected to a third connecting shaft 10, and the third connecting shaft 10 is connected to a blocking block 11, which blocks and positions the wafer sheet on the right side, making it easier to perform the wafer assembly action and improving the accuracy of wafer assembly.

[0025] A first guide plate 12 is installed on the left side of the top of the main frame 1, and a second guide plate 13 is installed on the right side of the top of the main frame 1. Guide slopes 14 are provided on the left side of the first guide plate 12 and the left side of the second guide plate 13 to guide the wafer sheets and improve the wafer assembly accuracy.

[0026] Both the left and right conveying devices include a geared motor 15. The power output end of the geared motor 15 is connected to a drive shaft 16. The drive shaft 16 is equipped with several drive pulleys 17. The main frame 1 is equipped with a driven shaft 18. The driven shaft 18 is rotatably connected to several driven pulleys 19. The drive pulleys 16 are connected to the driven pulleys 19 through the conveyor belt 20, which facilitates the stable conveying of wafer sheets and the wafer assembly operation of the wafer assembly device.

[0027] A flattening device is also provided on the right side of the main frame 1. The flattening device includes a right frame 21. A conveyor belt 22 is installed on the top of the right frame 21. A fourth rotary cylinder 23 is installed on the right side of the top of the right frame 21. The fourth rotary cylinder 23 is connected to a fourth connecting shaft 24. The fourth connecting shaft 24 is connected to a blocking plate 25. A fifth rotary cylinder 26 is installed on the left side of the top of the right frame 21. The fifth rotary cylinder 26 is connected to a fifth connecting shaft 27. The fifth connecting shaft 27 is connected to a flattening plate 28. The fourth rotary cylinder 23 drives the blocking plate 25 to block the wafer sheet. The fifth rotary cylinder 26 drives the flattening plate 28 to flatten the wafer sheet and align it.

[0028] The first rotating sleeve 41 is connected to a first connecting rod 29 for connecting the first composite piece 5, and the second rotating sleeve 42 is connected to a second connecting rod 30 for connecting the second composite piece 6, so that the connection of the multiple first composite pieces 5 is stable and the movement is synchronized, and the connection of the multiple second composite pieces 6 is stable and the movement is synchronized.

[0029] The lower part of the main frame 1 is equipped with a receiving tray 31 to collect the scraps during the assembly process and prevent them from soiling the surrounding working environment.

[0030] The bottom of the main frame 1 is equipped with adjustable support feet 32 ​​to improve the levelness and stability of the laminator.

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer sheet combining machine, characterized in that: The device includes a main frame, with a left conveying device installed on the left side and a right conveying device installed on the right side. A joining device is provided in the middle of the main frame. The joining device includes a first rotary cylinder and a second rotary cylinder. The first rotary cylinder is connected to a first connecting shaft, and the second rotary cylinder is connected to a second connecting shaft. The second connecting shaft is sleeved inside the first connecting shaft. The first connecting shaft is connected to a first rotating sleeve, and the second connecting shaft is connected to a second rotating sleeve. The first rotating sleeve is connected to a first joining piece, and the second rotating sleeve is connected to a second joining piece.

2. The wafer wafer combining machine according to claim 1, characterized in that: The left side of the left conveying device is equipped with a first positioning detector.

3. The wafer wafer combining machine according to claim 1, characterized in that: A second positioning detector is provided on the right side of the right conveyor.

4. The wafer wafer stacking machine according to claim 1, characterized in that: A third rotary cylinder is provided on the right side of the main frame. The third rotary cylinder is connected to a third connecting shaft, and the third connecting shaft is connected to a blocking block.

5. The wafer wafer combining machine according to claim 1, characterized in that: A first guide plate is installed on the left side of the top of the main frame, and a second guide plate is installed on the right side of the top of the main frame. Guide ramps are provided on the left side of both the first guide plate and the second guide plate.

6. The wafer wafer combining machine according to claim 1, characterized in that: Both the left and right conveying devices include a geared motor. The power output end of the geared motor is connected to a drive shaft, and the drive shaft is equipped with several drive pulleys. The main frame is equipped with a driven shaft, and the driven shaft is rotatably connected to several driven pulleys. The drive pulleys are connected to the driven pulleys via a conveyor belt.

7. The wafer wafer combining machine according to claim 1, characterized in that: The right side of the main frame is also provided with a flattening device. The flattening device includes a right frame, a conveyor belt is installed on the top of the right frame, a fourth rotary cylinder is installed on the right side of the top of the right frame, the fourth rotary cylinder is connected to a fourth connecting shaft, the fourth connecting shaft is connected to a blocking plate, and a fifth rotary cylinder is installed on the left side of the top of the right frame, the fifth rotary cylinder is connected to a fifth connecting shaft, the fifth connecting shaft is connected to a flattening plate.

8. The wafer wafer combining machine according to claim 1, characterized in that: The first rotating sleeve is connected to a first connecting rod for connecting the first assemblies, and the second rotating sleeve is connected to a second connecting rod for connecting the second assemblies.

9. The wafer wafer combining machine according to claim 1, characterized in that: The lower part of the main frame is equipped with a receiving tray.

10. The wafer wafer stacking machine according to claim 1, characterized in that: The bottom of the main frame is equipped with adjustable support feet.

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