An apparatus for multi-face intelligent detection and sorting of optical chips

Abstract

The utility model provides a kind of optical chip multi-face intelligent detection and sorting equipment, it is related to optical chip detection sorting field.The optical chip multi-face intelligent detection and sorting equipment, including chip vision detection module, chip detection stage, chip transfer module, chip pickup stylus module, chip feeding motion platform, chip OK\NG classification module and chip unloading camera, the chip vision detection module is mainly by chip A face detection vision module, chip B face detection vision module, chip C face detection vision module, chip D face detection vision module.The optical chip multi-face intelligent detection and sorting equipment, through the setting of chip vision detection module, chip detection stage, chip transfer module, chip pickup stylus module, chip feeding motion platform, chip OK\NG classification module and chip unloading camera, reach the improvement current for optical chip multi-face detection and sorting equipment, to improve automation level, realize automatic detection function and improve product shipment qualification rate.

Description

Technical Field

[0001] This utility model relates to the field of optical chip detection and sorting technology, specifically to a device for multi-faceted intelligent detection and sorting of optical chips. Background Technology

[0002] The rapid development of intelligent manufacturing has severely impacted traditional labor-intensive manufacturing industries, particularly those involving high manpower, high intensity, and high repetition, which will eventually be replaced by automated machines. Traditional manual labor is characterized by high intensity, low automation levels, and slow speed of manual microscope inspection. After prolonged work, visual fatigue significantly reduces worker efficiency. This is especially true in the high-capacity, high-efficiency optical communication industry, where there is a greater need to improve the automation level of production lines. Utility Model Content

[0003] The purpose of this invention is to provide a device for intelligent detection and sorting of optical chips from multiple sides, which solves the problems mentioned in the background art.

[0004] Technical solution

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a device for multi-face intelligent detection and sorting of optical chips, comprising a chip vision inspection module, a chip inspection platform, a chip transfer module, a chip pick-up pin module, a chip loading motion platform, a chip OK / NG classification module, and a chip unloading camera. The chip vision inspection module mainly consists of a chip A-side detection vision module, a chip B-side detection vision module, a chip C-side detection vision module, a chip D-side detection vision module, a marble platform, and shock-absorbing air cushions. The chip A-side detection vision module, chip B-side detection vision module, chip C-side detection vision module, and chip D-side detection vision module are fixedly connected to the marble platform, and six shock-absorbing air cushions are installed under the marble platform.

[0006] Furthermore, the chip inspection stage mainly consists of an X-axis motion axis, a Y-axis motion axis, a C-axis rotation axis, a chip stage nozzle, a C-axis rotation axis position sensor, a Y-axis motion axis position sensor, a drag chain bracket, and a drag chain. The chip is picked up by the chip stage nozzle and, under the combined movement of the X-axis motion axis, Y-axis motion axis, and C-axis rotation axis, the chip visual inspection module completes the visual microscopic inspection of the B, C, and D sides of the product.

[0007] Furthermore, the chip transfer module mainly consists of a chip scanning camera module, a chip precision positioning camera module, a loading mover cable chain, a loading linear motor mover, a loading mover position sensor, a unloading linear motor mover, an unloading mover cable chain, an unloading mover position sensor, a chip unloading pickup, a marble gantry frame, a dual-motor linear motor, and a chip loading pickup.

[0008] Furthermore, the chip pickup pin module mainly consists of a Z-axis motion axis, a Z-axis rotation axis position sensor, a Z-axis fixed mounting plate, a pin holder fixed mounting plate, a pin holder, a pin holder push rod, a push rod shaft position sensor, and a push rod electric shaft.

[0009] Furthermore, the chip loading motion platform mainly consists of an X-axis motion axis, an X-axis motion axis position sensor, a Y-axis motion axis, an X-axis motion axis position sensor, a motion axis drag chain, a C-axis rotation position sensor, a C-axis rotation motor, a rotary table, and a chip blue film mother-daughter ring fixing fixture.

[0010] Furthermore, the chip OK / NG classification module mainly consists of a Y-axis motion axis, a Y-axis rotation axis position sensor, a Y-axis motion axis drag chain, a chip tray fixing frame, and a chip blue film mother-daughter ring fixing fixture.

[0011] This invention provides a device for intelligent multi-faceted detection and sorting of optical chips. It has the following beneficial effects:

[0012] This intelligent multi-faceted detection and sorting equipment for optical chips improves upon current multi-faceted detection and sorting equipment for optical chips by incorporating a chip vision inspection module, a chip inspection platform, a chip transfer module, a chip pick-up pin module, a chip loading motion platform, a chip OK / NG classification module, and a chip unloading camera. This results in increased automation, automatic detection capabilities, and higher product yield. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This utility model Figure 1 Schematic diagram of the mid-chip vision inspection module;

[0015] Figure 3 This utility model Figure 1 Schematic diagram of the chip testing platform;

[0016] Figure 4 This utility model Figure 1 Schematic diagram of the chip transfer module;

[0017] Figure 5 This utility model Figure 1 Schematic diagram of the chip pickup pin module;

[0018] Figure 6 This utility model Figure 1 Schematic diagram of the chip loading motion platform;

[0019] Figure 7 This utility model Figure 1Schematic diagram of the OK / NG classification module in the chip.

[0020] The components include: 100 chip vision inspection module, 101 chip A-side inspection vision module, 102 chip B-side inspection vision module, 103 chip C-side inspection vision module, 104 chip D-side inspection vision module, 105 marble platform, 106 shock-absorbing air cushion, 200 chip inspection stage, 201 X-axis motion axis, 202 Y-axis motion axis, 203 C-axis rotation axis, 204 chip stage nozzle, 205 C-axis rotation axis position sensor, 206 Y-axis motion axis position sensor, and 207 cable chain bracket. 208 Cable Carrier, 300 Chip Transfer Module, 301 Chip Scanning Camera Module, 302 Chip Precision Positioning Camera Module, 303 Loading Mover Cable Carrier, 304 Loading Linear Motor Mover, 305 Loading Mover Position Sensor, 306 Unloading Linear Motor Mover, 307 Unloading Mover Cable Carrier, 308 Unloading Mover Position Sensor, 309 Chip Unloading Pickup Device, 310 Marble Gantry Frame, 311 Dual Mover Linear Motor, 312 Chip Loading Pickup Device, 400 Chip Pickup Pin Module, 401 Z-axis motion axis, 402 Z-axis rotary axis position sensor, 403 Z-axis fixed mounting plate, 404 ejector pin fixed mounting plate, 405 ejector pin, 406 ejector pin rod, 407 ejector rod axis position sensor, 408 ejector rod electric axis, 500 chip loading motion platform, 501 X-axis motion axis, 502 X-axis motion axis position sensor, 503 Y-axis motion axis, 504 X-axis motion axis position sensor, 505 motion axis cable chain, 506 C rotary axis position sensor, 507 C rotary axis motor, 508 rotation, 509 chip blue film mother-daughter ring fixing fixture, 600 chip OK / NG classification module, 601 Y-axis motion axis, 602 Y-axis rotary axis position sensor, 603 Y-axis motion axis cable chain, 604 chip tray fixing frame, 605 chip blue film mother-daughter ring fixing fixture, 700 chip unloading camera. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0023] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] like Figure 1-7 As shown, this utility model embodiment provides a device for multi-face intelligent detection and sorting of optical chips, including a chip vision inspection module 100, a chip inspection stage 200, a chip transfer module 300, a chip pick-up pin module 400, a chip loading motion platform 500, a chip OK / NG classification module 600, and a chip unloading camera 700. The chip vision inspection module 100 mainly consists of a chip A-side detection vision module 101, a chip B-side detection vision module 102, a chip C-side detection vision module 103, a chip D-side detection vision module 104, and a chip loading motion platform 500. The system consists of a marble platform 105 and shock-absorbing air cushions 106. Chip A-side inspection vision module 101, chip B-side inspection vision module 102, chip C-side inspection vision module 103, and chip D-side inspection vision module 104 are fixedly connected to the marble platform 105. Six shock-absorbing air cushions 106 are installed under the marble platform 105. These air cushions effectively mitigate vibrations from the moving axis on the marble platform 105 and the external environment, ensuring the microscopic inspection of the chip's A, B, C, and D sides by the chip vision inspection module 100.

[0026] The chip inspection stage 200 mainly consists of an X-axis motion axis 201, a Y-axis motion axis 202, a C-axis rotation axis 203, a chip stage suction nozzle 204, a C-axis rotation axis position sensor 205, a Y-axis motion axis position sensor 206, a cable chain bracket 207, and a cable chain 208. The chip stage suction nozzle 204 picks up the chip, and under the combined movement of the X-axis motion axis 201, the Y-axis motion axis 202, and the C-axis rotation axis 203, the chip visual inspection module 100 completes the visual microscopic inspection of the B, C, and D sides of the product.

[0027] The chip transfer module 300 mainly consists of a chip scanning camera module 301, a chip precision positioning camera module 302, a loading actuator drag chain 303, a loading linear motor actuator 304, a loading actuator position sensor 305, a unloading linear motor actuator 306, an unloading actuator drag chain 307, an unloading actuator position sensor 308, a chip unloading pickup 309, a marble gantry frame 310, a dual-actuator linear motor 311, and a chip loading pickup 312. This device mainly completes the incoming chip pickup and OK / NG unloading to the corresponding blue film mother and daughter rings. The chip pickup function is completed by the chip scanning camera module 301, the chip precision positioning camera module 302, the loading actuator drag chain 303, the loading linear motor actuator 304, and the chip loading pickup 312. The unloading function is completed by the unloading linear motor actuator 306, the unloading actuator drag chain 307, and the chip unloading pickup 309.

[0028] The chip pickup ejector module 400 mainly consists of a Z-axis motion axis 401, a Z-axis rotation axis position sensor 402, a Z-axis fixed mounting plate 403, an ejector mounting plate 404, an ejector 405, an ejector ejector rod 406, an ejector rod axis position sensor 407, and an ejector rod electric shaft 408. The function of this device is to lift the chip from the blue film, so that the nozzle can better pick up the chip and improve the chip pickup rate.

[0029] The chip loading motion platform 500 mainly consists of an X-axis motion 501, an X-axis motion position sensor 502, a Y-axis motion 503, an X-axis motion position sensor 504, a motion axis cable chain 505, a C-axis rotation position sensor 506, a C-axis rotation motor 507, a rotary table 508, and a chip blue film ring fixing fixture 509. The function of this device is to fix the blue film rings of the chips to be inspected onto the chip blue film ring fixing fixture 509. Automatic motion control of the X-axis motion 501, Y-axis motion 503, and C-axis rotation motor 507 adjusts the position of each chip, so that the chips are picked up efficiently.

[0030] The chip OK / NG sorting module 600 mainly consists of a Y-axis motion axis 601, a Y-axis rotation axis position sensor 602, a Y-axis motion axis drag chain 603, a chip tray fixing frame 604, and a chip blue film ring fixing fixture 605. This device uses the chip blue film ring fixing fixture 605 to fix the unloading blue film ring to unload the chips OK / NG, and the Y-axis motion axis 601 moves back and forth to move the unloading blue film ring to the unloading point for unloading.

[0031] Working principle: (1) First, manually apply the blue film ring to the chip blue film ring fixing fixture 509, and press the equipment operation button to start the intelligent detection program; (2) The X motion axis 501 and Y motion axis 503 move the chip to be detected to the chip scanning camera module 301 for scanning, determine the X and Y coordinates of each chip, and then through the X motion axis 501 and Y motion axis 503 and the C rotation axis motor 507, accurately position and rotate the chip under the chip precision positioning camera module 302 to correct the posture. Then, the chip is lifted off the blue film by the ejector 405 of the chip picking ejector module 400; and then the chip is lifted off the blue film by the chip picking ejector module 400. The chip loading picker 312 of the chip transfer module 300 picks up the chip; the chip loading picker 312 picks up the chip and moves to the chip A-side detection vision module 101 of the chip vision detection module 100 via the loading linear motor mover 304 to perform intelligent vision detection of the chip A-side. After the chip A-side detection is completed, the chip loading picker 312 picks up the chip and moves to the chip stage nozzle 204 of the chip detection stage 200 via the loading linear motor mover 304 to pick up the chip. The chip loading picker 312 then transfers the chip onto the chip stage nozzle 204; (3) chip loading After the chip is picked up from the nozzle 204, it is moved by the X-axis motion axis 201 and the Y-axis motion axis 202 to the area directly below the chip C-side detection vision module 103 for intelligent visual detection of the chip C-side. After the intelligent visual detection of the chip C-side is completed, the C-axis rotation axis 203 is used to precisely adjust the posture, and then the chip B-side detection vision module 102 and the chip D-side detection vision module 104 complete the intelligent visual detection of the chip B and D sides; (4) After the chip completes the intelligent visual detection, the chip detection stage 200 mainly uses the X-axis motion axis 201 and the Y-axis motion axis 202 to move the chip from the nozzle 204 on the chip stage. The chip moves to the chip unloading pickup position of the chip transfer module 300, where the chip unloading pickup 309 picks up the chip from the chip stage nozzle 204 to complete the chip transfer. After picking up the chip, the chip unloading pickup 309 moves to the chip unloading camera 700 above the unloading camera by the unloading linear motor 306 to adjust and position the chip center position. Then, the unloading linear motor 306 moves to the top of the corresponding OK / NG material tray mother ring and unloads the chip onto the unloading mother ring blue film fixed by the chip blue film mother ring fixing fixture 605 of the chip OK / NG classification module 600.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for multi-faceted intelligent detection and sorting of optical chips, comprising a chip vision inspection module (100), a chip inspection stage (200), a chip transfer module (300), a chip pick-up pin module (400), a chip loading motion platform (500), a chip OK / NG classification module (600), and a chip unloading camera (700), characterized in that: The chip vision inspection module (100) mainly consists of a chip A-side inspection vision module (101), a chip B-side inspection vision module (102), a chip C-side inspection vision module (103), a chip D-side inspection vision module (104), a marble platform (105), and shock-absorbing air cushions (106). The chip A-side inspection vision module (101), chip B-side inspection vision module (102), chip C-side inspection vision module (103), and chip D-side inspection vision module (104) are installed and fixedly connected on the marble platform (105), and six shock-absorbing air cushions (106) are installed under the marble platform (105).

2. The device for multi-faceted intelligent detection and sorting of optical chips according to claim 1, characterized in that: The chip inspection stage (200) mainly consists of an X-axis motion axis (201), a Y-axis motion axis (202), a C-axis rotation axis (203), a chip stage nozzle (204), a C-axis rotation axis position sensor (205), a Y-axis motion axis position sensor (206), a drag chain bracket (207), and a drag chain (208). The chip stage nozzle (204) picks up the chip and, under the combined movement of the X-axis motion axis (201), the Y-axis motion axis (202), and the C-axis rotation axis (203), performs visual microscopic inspection of the B, C, and D sides of the product in the chip vision inspection module (100).

3. The device for multi-faceted intelligent detection and sorting of optical chips according to claim 1, characterized in that: The chip transfer module (300) mainly consists of a chip scanning camera module (301), a chip precision positioning camera module (302), a loading mover cable chain (303), a loading linear motor mover (304), a loading mover position sensor (305), a unloading linear motor mover (306), an unloading mover cable chain (307), an unloading mover position sensor (308), a chip unloading pick-up device (309), a marble gantry frame (310), a dual-motor linear motor (311), and a chip loading pick-up device (312).

4. The device for multi-faceted intelligent detection and sorting of optical chips according to claim 1, characterized in that: The chip pickup pin module (400) mainly consists of a Z-axis motion axis (401), a Z-axis rotation axis position sensor (402), a Z-axis fixed mounting plate (403), a pin holder fixed mounting plate (404), a pin holder (405), a pin holder push rod (406), a push rod axis position sensor (407), and a push rod electric shaft (408).

5. The device for multi-faceted intelligent detection and sorting of optical chips according to claim 1, characterized in that: The chip loading motion platform (500) mainly consists of an X-axis (501), an X-axis position sensor (502), a Y-axis (503), an X-axis position sensor (504), a motion axis drag chain (505), a C-axis position sensor (506), a C-axis motor (507), a rotary table (508), and a chip blue film mother-daughter ring fixing fixture (509).

6. The device for multi-faceted intelligent detection and sorting of optical chips according to claim 1, characterized in that: The chip OK / NG classification module (600) mainly consists of a Y-axis motion axis (601), a Y-axis rotation axis position sensor (602), a Y-axis motion axis drag chain (603), a chip tray fixing frame (604), and a chip blue film mother-daughter ring fixing fixture (605).

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