A laser adhesive removal apparatus

Abstract

This utility model provides a laser adhesive removal device, including a laser emitter, an adhesive removal platform, a cooling plate, and a heat dissipation mechanism. The adhesive removal platform is used to place the adhesive-coated magnetic component. The laser emitter is positioned facing the adhesive removal platform to emit laser light to remove the adhesive from the magnetic component. A cooling plate is provided at the bottom of the adhesive removal platform, and a heat dissipation mechanism is provided at the bottom of the cooling plate. This application achieves rapid cooling of the adhesive removal platform through the cooling plate, enabling the removal of adhesive from large ring-shaped components with low coercivity.

Description

Technical Field

[0001] This utility model belongs to the field of laser adhesive removal technology, and specifically relates to a laser adhesive removal device. Background Technology

[0002] After magnets are glued together to form a magnetic component, there will be excess glue residue on the surface of the magnetic component, which needs to be removed with a laser glue removal device. However, the laser glue removal device generates high temperature during the glue removal process, which causes the magnetic properties of the magnets to weaken. Therefore, existing technologies will set up a cooling device on the glue removal platform to solve this problem.

[0003] Chinese patent CN223128809U discloses a laser adhesive removal device. This patent features a heat dissipation grid and a cooling fan at the bottom of the adhesive removal platform, using the cooling fan to draw heat away from the grid for cooling. However, this structure has limited cooling effect, a slow cooling rate, and difficulty in stabilizing the temperature. Furthermore, the adhesive removal platform can only be used to place rectangular fixtures and can only remove adhesive from small magnetic components with high coercivity. It cannot remove adhesive from large magnetic components with low coercivity, especially large Heilbeck wireless charging ring magnet components, such as... Figure 1 As shown, the wireless charging ring magnet assembly is a ring magnetic assembly 1 composed of 48 arc magnets 11 and a ring body 12. It has low coercivity and requires de-adhesion at various positions of the ring. Currently, there is no suitable equipment for de-adhesion of this assembly, and it is usually done manually, which is inefficient and prone to producing defective products. Utility Model Content

[0004] The purpose of this invention is to provide a laser adhesive removal device that uses a cooling plate to rapidly cool the adhesive removal platform, enabling the removal of adhesive from large ring-shaped components with low coercivity.

[0005] To achieve the above objectives, the solution of this utility model is as follows: a laser adhesive removal device is provided, including a laser emitter, an adhesive removal platform, a cooling plate, and a heat dissipation mechanism. The adhesive removal platform is used to place the magnetic component with adhesive, and the laser emitter is positioned facing the adhesive removal platform to emit laser light to remove adhesive from the magnetic component. A cooling plate is provided at the bottom of the adhesive removal platform, and a heat dissipation mechanism is provided at the bottom of the cooling plate.

[0006] Furthermore, the adhesive-coated magnetic component is a ring-shaped magnetic component, which consists of multiple arc-shaped magnets and a ring-shaped iron piece. The multiple arc-shaped magnets are arranged in a Hellbeck array to form a ring and are glued to the ring-shaped iron piece. The adhesive removal platform is provided with a circular boss for placing the ring-shaped magnetic component, and a positioning iron piece for positioning the ring-shaped magnet is provided on the inner circumference of the boss.

[0007] Furthermore, the adhesive removal platform includes a first adhesive removal platform and a second adhesive removal platform. The first adhesive removal platform has an annular groove on the inner circumference of its boss, and a plurality of arc-shaped positioning iron pieces are provided in the annular groove. The annular magnetic assembly is placed on the arc-shaped positioning iron pieces with the side of the annular iron pieces facing down. The second adhesive removal platform has a plurality of circular positioning iron pieces arranged in annular intervals below the inner circumference of its boss, and the annular magnetic assembly is placed on the boss of the second adhesive removal platform with the magnet side facing down.

[0008] Furthermore, the annular magnetic component has a notch, and the boss has a notch groove corresponding to the position of the notch.

[0009] Furthermore, the bottom surface of the second adhesive removal platform is provided with multiple blind holes, and the circular positioning iron piece is fixed inside the blind holes.

[0010] Furthermore, a rotating module is provided at the bottom of the heat dissipation mechanism. The rotating module includes a rotating platform and a rotating frame. The adhesive removal platform is detachably fixed to the top of the rotating frame. The cooling chip and the heat dissipation mechanism are located inside the rotating frame, and the rotating frame is fixed to the rotating platform.

[0011] Furthermore, the rotating module is tilted and fixed on a Z-axis moving module so that the adhesive removal platform tilts towards the laser emitter.

[0012] Furthermore, a cooling plate mounting plate is provided between the cooling plate and the adhesive removal platform. The adhesive removal platform is fixed to the cooling plate mounting plate with bolts. The cooling plate mounting plate is fixed to the top of the rotating frame with bolts. The cooling plate is fixed to the bottom of the cooling plate mounting plate. Both the adhesive removal platform and the cooling plate mounting plate are made of thermally conductive material.

[0013] Furthermore, the cooling chip is a semiconductor cooling chip, and the adhesive removal temperature is controlled at 3-7°C.

[0014] Furthermore, the heat dissipation mechanism includes a heat sink and a cooling fan, wherein the heat sink is disposed at the bottom of the cooling plate and the cooling fan is disposed at the bottom of the heat sink.

[0015] After adopting the above solution, the beneficial effects of this utility model are as follows: 1. This utility model has a cooling plate installed at the bottom of the adhesive removal platform. The cooling plate can quickly cool the adhesive removal platform and stabilize the adhesive removal temperature in the range of 3-7℃. This effectively eliminates the influence of the high temperature generated by the laser emitter on the magnetic properties of the magnetic components and is suitable for large ring magnetic components with low coercivity.

[0016] 2. A heat dissipation device is also provided at the bottom of the cooling chip. When the cooling chip is working, its top surface is cooled and its bottom surface is heated. The heat dissipation device can dissipate heat from the bottom surface of the cooling chip to prevent the heat from affecting the cooling effect of the cooling chip.

[0017] 3. This application also includes a rotating module. While laser adhesive removal is being performed, the rotating module can drive the adhesive removal platform to rotate, so that adhesive can be removed from all positions on the ring magnet, thereby improving the adhesive removal effect. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the annular magnetic assembly of this utility model; Figure 2 This is a schematic diagram of the adhesive removal equipment of this utility model; Figure 3 This is a schematic diagram of the adhesive removal platform of this utility model installed on the Z-axis module; Figure 4 This is a schematic diagram showing the assembly and coordination of the adhesive removal platform, cooling chip, and heat dissipation mechanism of this utility model. Figure 5 This is a schematic diagram of the annular magnetic component of this utility model placed on the first adhesive removal platform; Figure 6 This is a schematic diagram of the structure of the first adhesive removal platform of this utility model; Figure 7 This is a schematic diagram of the annular magnetic component of this utility model placed on the second adhesive removal platform; Figure 8 This is a schematic diagram of the structure of the second adhesive removal platform of this utility model. Figure 1 (Top surface); Figure 9 This is a schematic diagram of the structure of the second adhesive removal platform of this utility model. Figure 2 (bottom); Figure 10 This is a cross-sectional view of the annular magnetic assembly of this utility model placed on the second adhesive removal platform.

[0019] Label Explanation: 1. Ring magnetic assembly; 11. Arc magnet; 12. Ring iron piece; 2. Laser emitter; 3. Adhesive removal platform; 31. Through hole; 32. Boss; 33. First adhesive removal platform; 331. Ring groove; 332. Arc positioning iron piece; 34. Second adhesive removal platform; 341. Circular positioning iron piece; 342. Blind hole; 35. Notch groove; 4. Cooling element; 5. Heat dissipation mechanism; 51. Heat sink; 52. Cooling fan; 6. Rotating module; 61. Rotating platform; 62. Rotating frame; 7. Z-axis moving module; 8. Cooling element mounting plate. Detailed Implementation

[0020] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] like Figure 1-10As shown, this application provides a laser adhesive removal device, including a laser emitter 2, an adhesive removal platform 3, a cooling chip 4, and a heat dissipation mechanism 5. The adhesive removal platform 3 is used to place the magnetic component with adhesive residue, and the laser emitter 2 is fixedly positioned facing the adhesive removal platform 3. The cooling chip 4 is located at the bottom of the adhesive removal platform 3, and the heat dissipation mechanism 5 is located at the bottom of the cooling chip 4. During adhesive removal, the cooling chip 4 and the heat dissipation mechanism 5 are first activated to lower the temperature of the adhesive removal platform 3. Then, the magnetic component with adhesive residue is placed on the adhesive removal platform 3, and the laser emitter 2 is activated. The laser emitter 2 emits laser light onto the residual adhesive on the surface of the magnetic component to remove the adhesive. This application uses the cooling chip 4 to control the temperature of the adhesive removal platform 3. The cooling chip 4 is preferably a semiconductor cooling chip 4, such as a 12V / 8.5A model. In addition, other cooling chips 4, such as electrochemical cooling chips 4 or thermoacoustic cooling chips 4, can also be used. The semiconductor cooling chip 4 can cool down rapidly before adhesive removal and stabilize the temperature in the range of 3-7℃ during adhesive removal, effectively eliminating the influence of the high temperature generated by the laser emitter 2 on the magnetic properties of the magnetic component. It is suitable for large toroidal magnetic components 1 with low coercivity.

[0022] Key references Figure 4 The heat dissipation mechanism 5 includes a heat sink 51 and a cooling fan 52. The heat sink 51 is disposed at the bottom of the cooling plate 4, and the cooling fan 52 is disposed at the bottom of the heat sink 51. When the cooling plate 4 is working, its top surface cools the adhesive removal platform 3, while its bottom surface heats up. The cooling fan 52 and the heat sink 51 dissipate heat from the bottom surface of the cooling plate 4 to prevent heat from affecting the cooling effect of the cooling plate 4. The cooling fan 52 can be 12V / 1.25A with a speed of 12,500 revolutions per minute.

[0023] Key references Figure 3 The bottom of the heat dissipation mechanism 5 is provided with a rotating module 6, which includes a rotating platform 61 and a rotating frame 62. The adhesive removal platform 3 is detachably fixed to the top of the rotating frame 62. The cooling chip 4 and the heat dissipation mechanism 5 are located inside the rotating frame 62. The rotating frame 62 is fixed on the rotating platform 61. The adhesive removal platform 3 can be driven to rotate by the rotating platform 61, and adhesive removal can be performed at various positions on the ring magnet, improving the adhesive removal effect. It is suitable for adhesive removal of the ring magnetic assembly 1.

[0024] The rotating platform 61 is tilted and mounted on a Z-axis moving module 7. The distance between the adhesive removal platform 3 and the laser emitter 2 can be adjusted via the Z-axis moving module 7, i.e., the focal length can be automatically adjusted. Furthermore, the tilted arrangement of the rotating platform 61 allows the adhesive removal platform 3 to be tilted relative to the laser. The angle between the adhesive removal platform 3 and the horizontal plane is approximately 55-65°. This tilting arrangement prevents the laser from directly targeting the glue seam, reducing damage to the glue at the seam and minimizing the production of defective products with delamination.

[0025] Key references Figure 4 A cooling plate mounting plate 8 is also provided between the cooling chip 4 and the adhesive removal platform 3. The adhesive removal platform 3 has multiple through holes 31 for bolts to pass through, and the cooling plate mounting plate 8 has multiple threaded holes. The adhesive removal platform 3 is fixed to the cooling plate mounting plate 8 by bolts. The cooling plate mounting plate 8 can also be fixed to the top of the rotating frame 62 by bolts, and the cooling chip 4 is fixed to the bottom of the cooling plate mounting plate 8. Both the adhesive removal platform 3 and the cooling plate mounting plate 8 are made of thermally conductive materials, which can efficiently conduct the cooling temperature to the annular magnetic component 1 to avoid damage to the magnetic properties caused by high temperature.

[0026] like Figure 1 As shown, the annular magnetic component 1 of this utility model is a ring composed of 48 arc-shaped magnets 11 arranged in a Heilbeck array and glued together. Then it is glued to one side of an annular iron piece 12. As a result, there will be glue residue on both the upper and lower surfaces of the annular magnetic component 1, and both need to be removed. In this application, the glue removal platform 3 is set up with two structures to place the annular magnetic component 1 respectively. The specific structures are detailed below.

[0027] Key references Figure 5-10 The adhesive removal platform 3 is made of aluminum alloy and has no adsorption force with the annular magnetic component 1. Therefore, a circular boss 32 for placing the annular magnetic component 1 is provided on the adhesive removal platform 3, and a positioning iron piece for positioning the annular magnetic component 1 is provided on the inner circumference of the boss 32. The annular magnetic component 1 is placed on the boss 32 and fixed by adsorption force with the positioning iron piece.

[0028] Specifically, the adhesive removal platform 3 is configured with two structures, including a first adhesive removal platform 33 and a second adhesive removal platform 34. For example... Figure 5-6 As shown, an annular groove 331 is provided on the inner circumference of the boss 32 of the first adhesive removal platform 33. Several arc-shaped positioning iron pieces 332 are provided in the annular groove 331. The side of the annular magnetic component 1 with the annular iron piece 12 (the annular iron piece side) is placed on the arc-shaped positioning iron piece 332 with the annular iron piece 12 facing down. The annular iron piece 12 directly contacts the arc-shaped positioning iron piece 332 to achieve adsorption and fixation. At this time, the magnetic surface of the annular magnetic component 1 can be de-adhesive. The arc-shaped positioning iron piece 332 can be a strip-shaped block structure.

[0029] like Figure 7-10As shown, the second adhesive removal platform 34 has multiple circular positioning iron pieces 341 arranged in a ring at intervals below the inner circumference of its boss 32. That is, the circular positioning iron pieces 341 are located inside the second adhesive removal platform 34. The magnet face of the annular magnetic assembly 1 is placed on the boss 32 of the second adhesive removal platform 34, and the arc-shaped magnet 11 of the annular magnetic assembly 1 is attracted and fixed to the circular positioning iron pieces 341 through the boss 32. At this time, adhesive can be removed from the iron surface of the annular magnetic assembly 1. The circular positioning iron piece 341 has a circular plate structure and its area is smaller than that of the arc-shaped positioning iron piece 332.

[0030] The reason for setting the adhesive removal platform 3 in the above two structures is as follows: The annular magnetic component 1 is composed of multiple arc-shaped magnets 11 arranged in a Heilbeck array. According to the characteristics of the Heilbeck magnetic component, the magnetic force of the magnet surface of the annular magnetic component 1 is high, and the magnetic force of the iron surface is weak. That is, the magnetic force of the magnet surface of the annular magnetic component 1 is strong, and it can be attracted and fixed by the small circular positioning iron piece 341 with interval contact. If the adsorption area is too large, the annular magnetic component 1 will be difficult to remove and will easily damage the material. On the other hand, the adsorption force of the iron surface is weak, and a large area of ​​adsorption contact is required. Therefore, it can be directly adsorbed with the larger arc-shaped positioning iron piece 332, and it is easy to remove without damaging the material.

[0031] Since the two sides of the annular magnetic assembly 1 require adhesive removal platforms 3 with different structures, after removing the adhesive from one side of the annular magnetic assembly 1, the annular magnetic assembly 1 needs to be removed and the adhesive removal platform 3 replaced before the annular magnetic assembly 1 is placed back in place for adhesive removal. Therefore, this application uses bolts to detachably fix the adhesive removal platform 3 to the cooling chip mounting plate 8, which facilitates the disassembly and replacement of the adhesive removal platform 3.

[0032] Key references Figure 9-10 Multiple blind holes 342 can be set on the bottom surface of the second adhesive removal platform 34, and then the circular positioning iron piece 341 is fixed inside the blind hole 342. The closed surface of the blind hole 342 is located on the bottom surface of the inner ring of the boss 32. The height of the closed surface can be approximately flush with the height of the adhesive removal platform 3, thereby reducing the distance between the annular magnetic component 1 and the circular positioning iron piece 341 and ensuring sufficient adsorption force to fix the annular magnetic component 1.

[0033] In a preferred embodiment, the annular magnetic component 1 is provided with a notch, and the circular boss 32 is provided with a notch groove 35 corresponding to the position of the notch. The notch groove 35 has the function of preventing mistaken positioning. When placing the annular magnetic component 1, the notch of the annular magnetic component 1 is aligned with the notch groove 35 to correctly position the annular magnetic component 1.

[0034] The above description is only a preferred embodiment of this utility model and is not intended to limit the design of this case. All equivalent changes made based on the key design of this case shall fall within the protection scope of this case.

Claims

1. A laser adhesive removal apparatus, characterized by: The device includes a laser emitter, a glue removal platform, a cooling plate, and a heat dissipation mechanism. The glue removal platform is used to place the magnetic component with glue on it. The laser emitter is positioned facing the glue removal platform to emit laser light to remove the glue from the magnetic component. A cooling plate is provided at the bottom of the glue removal platform, and a heat dissipation mechanism is provided at the bottom of the cooling plate.

2. The laser adhesive removal apparatus of claim 1, wherein: The adhesive-coated magnetic assembly is a ring-shaped magnetic assembly, which consists of multiple arc-shaped magnets and a ring-shaped iron piece. The multiple arc-shaped magnets are arranged in a Hellbeck array to form a ring and are glued to the ring-shaped iron piece. The adhesive removal platform is provided with a circular boss for placing the ring-shaped magnetic assembly, and a positioning iron piece for positioning the ring-shaped magnet is provided on the inner circumference of the boss.

3. The laser adhesive removal apparatus of claim 2, wherein: The adhesive removal platform includes a first adhesive removal platform and a second adhesive removal platform. The first adhesive removal platform has an annular groove on the inner circumference of its boss, and a plurality of arc-shaped positioning iron pieces are provided in the annular groove. The annular magnetic assembly is placed on the arc-shaped positioning iron pieces with the side with the annular iron pieces facing down. The second adhesive removal platform has a plurality of circular positioning iron pieces arranged in annular intervals below the inner circumference of its boss, and the annular magnetic assembly is placed on the boss of the second adhesive removal platform with the magnet side facing down.

4. The laser adhesive removal apparatus of claim 3, wherein: The annular magnetic component has a notch, and the boss has a notch groove corresponding to the position of the notch.

5. The laser adhesive removal apparatus of claim 3, wherein: The bottom surface of the second adhesive removal platform is provided with multiple blind holes, and the circular positioning iron piece is fixed inside the blind holes.

6. A laser adhesive removal apparatus as claimed in any one of claims 1 to 5, wherein: The bottom of the heat dissipation mechanism is provided with a rotating module, which includes a rotating platform and a rotating frame. The adhesive removal platform is detachably fixed to the top of the rotating frame. The cooling chip and the heat dissipation mechanism are located inside the rotating frame, and the rotating frame is fixed to the rotating platform.

7. The laser adhesive removal equipment as described in claim 6, characterized in that: The rotating module is tilted and fixed on a Z-axis moving module so that the adhesive removal platform is tilted toward the laser emitter.

8. The laser adhesive removal apparatus of claim 6, wherein: A cooling plate mounting plate is provided between the cooling plate and the adhesive removal platform. The adhesive removal platform is fixed to the cooling plate mounting plate with bolts. The cooling plate mounting plate is fixed to the top of the rotating frame with bolts. The cooling plate is fixed to the bottom of the cooling plate mounting plate. Both the adhesive removal platform and the cooling plate mounting plate are made of thermally conductive material.

9. The laser adhesive removal apparatus of claim 1, wherein: The cooling chip is a semiconductor cooling chip, and the descaling temperature is controlled at 3-7℃.

10. The laser adhesive removal equipment as described in claim 1, characterized in that: The heat dissipation mechanism includes a heat sink and a cooling fan. The heat sink is located at the bottom of the cooling plate, and the cooling fan is located at the bottom of the heat sink.

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