An auxiliary tool for power semiconductor device pin bending
Patent Information
- Application Number
- CN202521952471.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-11
- Publication Date
- 2026-09-08
- Estimated Expiration
- 2035-09-11
AI Technical Summary
[0003]实用新型的主要目的是提出一种功率半导体器件引脚折弯的辅助工装，能辅助折弯机折弯过程中保证引脚尺寸精度和一致性，同时可以防止引脚根部损伤的问题，还能提高工作效率，方便高度受限的空间内插件式功率半导体安装
本实用新型的技术方案解决了器件引脚在弯曲成形时需要保证的尺寸精度和尺寸一致性， 同时也解决了折弯过程操作不当引起器件引脚根部处封装损伤的问题，提高了安装可靠性和工艺稳定性。同时可以辅助多个功率半导体器件的引脚折弯成需要的长度；方便成形后和电路板的焊接，提高了生产效率。
Smart Images
Figure CN224724893U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a tooling for auxiliary processing before component installation, specifically an auxiliary tooling for bending and forming the pins of plug-in power semiconductor devices. Background Technology
[0002] With the rapid development of power electronics technology, the market demand for small-size, high-power-density medium-to-high-power switching power supplies is increasing. However, the increased heat generation resulting from increased power creates a contradiction with the need for device miniaturization. For high-power applications, traditional surface-mount power devices are no longer sufficient to meet design requirements due to their limited heat dissipation performance, necessitating the use of larger through-hole power semiconductor devices. The larger size of these devices poses a challenge to the mounting space on printed circuit boards. To address this issue, through-hole power semiconductor switching transistors are typically mounted horizontally. This requires bending the device leads to 90° to accommodate the mounting and soldering hole dimensions on the printed circuit board. However, current mainstream lead bending processes primarily employ manual fixing of the power device combined with simple machine bending, leading to the following problems: the instability of manually fixing the power device results in poor consistency in lead bending, affecting dimensional accuracy; improper operation during bending can cause excessive bending stress at the lead root, damaging the device package and potentially leading to device malfunction. Utility Model Content
[0003] The main purpose of this utility model is to provide an auxiliary tooling for bending the pins of power semiconductor devices. This tooling can help the bending machine ensure the pin size accuracy and consistency during the bending process, prevent damage to the pin roots, improve work efficiency, and facilitate the installation of plug-in power semiconductors in height-restricted spaces.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: The tooling includes a substrate, a limiting block, and fasteners. The substrate has several positioning grooves arranged side by side. The bottom connecting part of the positioning groove has a boss. The power semiconductor device body is placed in the groove, and its pins are placed flat on the boss and extend to the outside of the substrate. The edge of the opening end of the groove has a mounting countersunk hole. The limiting block has a fixing hole corresponding to the mounting countersunk hole. The limiting block is placed in the opening end of the groove and is fixed by the fastener after contacting the device body.
[0005] As a priority, in order to ensure that the stress generated when bending the pin is below the threshold that would damage the device body, the width of the bottom connecting boss of the groove is not less than 5 mm.
[0006] Furthermore, the boss is located on the outer surface of the substrate and has a rounded corner structure.
[0007] As a priority, the length of the limiting block can be selected according to the required bending pin length to adapt to the installation requirements of devices of different heights.
[0008] As a priority, to ensure the structural strength and surface accuracy of the substrate, several positioning grooves on the substrate are integrally formed.
[0009] As a preferred option, the substrate may be made of stainless steel or aluminum alloy.
[0010] Beneficial effects of this utility model This invention solves the problem of ensuring dimensional accuracy and consistency when bending device leads, and also addresses the issue of damage to the lead root packaging caused by improper bending operations, thus improving installation reliability and process stability. Furthermore, it can assist in bending the leads of multiple power semiconductor devices to the required lengths, facilitating post-forming soldering to the circuit board and improving production efficiency. Attached Figure Description
[0011] Figure 1 This is a schematic diagram illustrating the actual use of an embodiment of the utility model; Figure 2 This is a three-dimensional schematic diagram of the substrate in an embodiment of the present invention.
[0012] Figure 3 This is a three-dimensional schematic diagram of the limiting block in an embodiment of the present invention.
[0013] Figure 4 This is a schematic diagram of a semiconductor switch tube, formed using the tooling of this invention, mounted on a circuit board.
[0014] In the figure: 1. Substrate; 11. Groove; 111. Boss; 12. Mounting countersunk hole; 2. Limiting block; 21. Fixing hole; 3. Power semiconductor switch; 31. Body of power semiconductor switch; 32. Pin of power semiconductor switch; 4. Mounting screw; 5. Circuit board. Detailed Implementation
[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.
[0016] like Figures 1-3As shown, this utility model embodiment provides a tooling for bending the pins of a power semiconductor device, including a substrate 1 and a limiting block 2. The substrate 1 is provided with a plurality of parallel grooves 11, and the bottom end of each groove 11 has a boss 111. When the power semiconductor device body is placed in the groove, its pins can be laid flat on the boss and extend to the outside of the substrate. A mounting countersunk hole 12 is provided at the edge of the opening end of the groove 11, and the limiting block 2 is provided with a fixing hole 21 corresponding to the mounting countersunk hole. After the power semiconductor switch body 31 to be processed is placed in the groove, its pins 32 are placed flat on the boss and extend to the outside of the substrate 1. The limiting block 2 is placed at the opening end of the groove. The power device body is moved. When the limiting block 2 contacts the power semiconductor device body 31, the limiting block 2 is fixed to the substrate 1 using the mounting screw 4, so that the power device body 31 is limited in the groove 11. The length of its pins 32, which are placed flat on the boss and extend to the outside of the substrate, is the length that the pins need to be bent. Then, the device pins 32 are bent vertically downwards towards the substrate by a bending machine, and the bending of the device pins is completed.
[0017] As shown in Figure 4, this is a schematic diagram of the semiconductor switch 3 pins being mounted on the circuit board 5 after being shaped with the aid of the tooling of this invention.
[0018] In a preferred embodiment of the present invention, in order to ensure that the stress generated by the power semiconductor device when bending the pin is lower than the threshold that would damage the device body, the width of the boss 111 at the bottom end of the groove 11 is generally not less than 5mm, and the boss 111 is provided with a rounded corner structure on the outer surface of the substrate 1. The rounded corner structure plays a protective role and avoids wear on the pin during bending.
[0019] In this embodiment of the invention, the length of the limiting block 2 can be selected according to the required bending pin length. This means that by changing the limiting block 2 to different lengths, the pin length of the molded plug-in semiconductor switch 3 can be controlled to adapt to device installation requirements of different heights and meet the spacing requirements between the semiconductor switch 3 and the circuit board 6 during circuit board assembly. If the required bending length of pin 32 is short (i.e., the length of pin 32 lying flat on the boss and extending to the outside of the substrate is short), a short limiting block is selected, causing the power device body to move closer to the opening end of the groove 11. If the required bending length of pin 32 is long (i.e., the length of pin 32 lying flat on the boss and extending to the outside of the substrate is long), a long short limiting block is selected, causing the power device body to move closer to the bottom end of the groove 11.
[0020] In a preferred embodiment of this utility model, to ensure the structural strength and surface accuracy of the substrate, several positioning grooves on the substrate are integrally formed; and the substrate can be made of stainless steel or aluminum alloy to ensure structural strength and prevent static electricity.
[0021] The specific embodiments of this utility model have been described above. This utility model fixes the position of power semiconductor device leads during bending, ensuring bending accuracy and installation requirements while preventing device damage. It can complete the bending of multiple device leads in a single operation, improving work efficiency. The use of limit blocks of different lengths also facilitates the auxiliary processing of power devices with varying lead length requirements. The technical solution of this utility model is economical and has greater applicability.
[0022] Finally, it should be noted that the above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. An auxiliary tooling for bending the leads of a power semiconductor device, wherein the power semiconductor device includes a device body and leads connected to the device body, characterized in that, The auxiliary tooling includes a substrate, a limiting block, and fasteners. The substrate has several positioning grooves arranged in parallel. The bottom connecting part of the positioning groove has a boss. The power semiconductor device body is placed in the groove, and its pins are placed flat on the boss and extend to the outside of the substrate. The edge of the opening end of the groove has a mounting countersunk hole. The limiting block has a fixing hole corresponding to the mounting countersunk hole. The limiting block is placed in the opening end of the groove and is fixed by the fastener after contacting the device body.
2. The power semiconductor device pin bending auxiliary tool according to claim 1, characterized in that: The width of the bottom connecting boss of the groove is not less than 5mm.
3. The power semiconductor device pin bending auxiliary tool according to claim 2, characterized in that: The bottom connecting boss of the groove is located on the outer surface of the substrate and has a rounded corner structure.
4. The auxiliary tooling for bending the pins of a power semiconductor device according to claim 1, characterized in that: The length of the limiting block can be selected according to the required bending pin length to adapt to the installation requirements of devices of different heights.
5. The auxiliary tooling for bending the pins of a power semiconductor device according to claim 1, characterized in that: Several positioning grooves on the substrate are integrally formed to ensure the structural strength and surface precision of the substrate.
6. The auxiliary tooling for bending the pins of a power semiconductor device according to claim 1, characterized in that: The substrate can be made of stainless steel or aluminum alloy.