A tin storage device for end crimping and wire twisting

Abstract

This utility model relates to the field of wire crimping machine technology, specifically a solder storage device for wire crimping and twisting. It includes a solder pot body, with an oxide layer collection mechanism on the surface of the solder pot body, maintenance mechanisms on the inner wall and cover surface of the solder pot body, and a dust-proof mechanism on the top surface of the solder pot body. This utility model not only allows the solder storage device to collect the oxide layer scraped off the surface of the solder pot body during use, enabling the recycling of the scraped oxide layer, but also allows the device to shield the molten solder inside the solder pot body when not in use, preventing dust from entering the solder pot body and affecting the purity of the molten solder. Furthermore, it facilitates user inspection and maintenance of the heating element inside the heating chamber, making the solder storage device more convenient to operate.

Description

Technical Field

[0001] This utility model relates to the field of wire termination technology, specifically to a tin storage device for wire termination and twisting. Background Technology

[0002] To improve the connection performance of wires and prevent short circuits caused by wire core divergence, it is usually necessary to tin the exposed part of the wire core without crimp terminals during the wire cutting process. During tinning, the exposed part of the wire core is sent into the tin bath by a conveying device. Existing tin baths have some shortcomings in use. In order to meet the needs of the market, a tin storage device for wire twisting and crimping is needed.

[0003] Most existing solder storage devices are exposed to air, which can cause burns and poses a safety hazard. Molten solder oxidizes upon contact with air, affecting the soldering effect. These devices typically lack the function of collecting oxide layers, making it impossible to recycle and reuse the scraped oxide layer. Furthermore, they cannot be shielded from dust when not in use, allowing dust to enter the solder pot and affect the purity of the solder. In addition, existing devices are inconvenient to maintain, making it difficult for users to inspect and maintain the heating elements inside the heating chamber. Utility Model Content

[0004] The purpose of this invention is to provide a tin storage device for wire twisting and crimping, in order to solve the problems mentioned in the background art that it usually does not have the function of collecting oxide layer during short-term use, cannot be shielded to prevent dust when not in use, and is not convenient for inspection and maintenance.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a solder storage device for wire twisting and crimping, comprising a solder furnace body, a controller mounted on the surface of the solder furnace body, a fixing groove formed on the surface of the top position of the solder furnace body, mounting plates mounted on both sides of the surface of the solder furnace body, mounting studs threadedly connected to the surface of the mounting plates, one end of the mounting studs penetrating the mounting plates and extending to the bottom of the mounting plates, a heating chamber formed inside the solder furnace body, an oxide layer collection mechanism provided on the surface of the solder furnace body, a maintenance mechanism provided on the inner wall and the surface of the cover plate of the solder furnace body, and a dustproof mechanism provided on the surface of the top position of the solder furnace body.

[0006] Preferably, a temperature control probe is installed on the inner wall of the tin furnace body, and the output end of the temperature control probe is electrically connected to the input end of the controller. A fixing plate is installed inside the heating cavity, and a heating tube for heating is provided on the surface of the fixing plate. The input end of the heating tube is electrically connected to the output end of the controller. The surface of the heating tube is fastened to the surface of the fixing plate by screws. Cover plates are provided on both sides of the tin furnace body, and one end of the cover plate extends into the interior of the heating cavity. A heat-conducting plate for heat conduction is installed on the inner wall of the tin furnace body, and the heat-conducting plate is connected to the interior of the heating cavity. An aluminum silicate insulation plate for heat preservation is installed on the inner wall of the tin furnace body.

[0007] Preferably, the oxide layer collection mechanism consists of a guide plate, a collection frame, and an oxide layer collection group. The oxide layer collection group is disposed on the surface of the tin furnace body and consists of a valve, a discharge pipe, and a support base. A collection frame for collecting the oxide layer of molten tin is installed on one side of the tin furnace body. A support base is installed on the surface at the bottom of the collection frame. The surface of the support base is fixed to the surface of the tin furnace body. A discharge pipe is installed on the surface of the collection frame, and one end of the discharge pipe extends into the interior of the collection frame.

[0008] Preferably, a valve is fitted on the surface of the discharge pipe, the input end of the valve is electrically connected to the output end of the controller, and a guide plate for guiding materials is installed on one side of the tin furnace body. The guide plate is located above the collection frame and is connected to the interior of the fixed groove.

[0009] Preferably, the maintenance mechanism consists of a sealing gasket, a positioning block, a positioning slot, and a guide slot. The inner wall of the cover plate is equipped with a sealing gasket, the surface of which is in contact with the surface of the tin furnace body. The inner wall of the cover plate is equipped with a positioning block.

[0010] Preferably, positioning slots are provided on both sides of the tin furnace body, and the positioning blocks are engaged with the surfaces of the positioning slots. Guide grooves are provided on the inner walls of the tin furnace body, and the guide grooves are slidably engaged with the surfaces of the cover plate.

[0011] Preferably, the dustproof and shielding mechanism consists of a cover, a rubber pad, a silicone pad, a mounting groove, and mounting blocks. A cover for covering the surface of the tin furnace body is provided above the tin furnace body. One end of the cover extends into the interior of the tin furnace body, and mounting blocks are installed on the inner wall of the cover.

[0012] Preferably, the surface of the tin furnace body is provided with mounting grooves, the mounting grooves and the surface of the mounting blocks are engaged with each other, the inner wall of the cover is provided with a rubber gasket, the surface of the rubber gasket is adhered with a silicone gasket for sealing between the tin furnace body and the cover, and the inner wall of the silicone gasket is in contact with the inner wall of the tin furnace body.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the tin storage device for wire twisting not only allows the tin storage device to collect the oxide layer scraped off the surface of the tin furnace body during use, and can recycle and reuse the scraped oxide layer, but also allows the tin storage device to shield the molten tin inside the tin furnace body when the tin furnace body is not in use, thus preventing dust from entering the tin furnace body during use and affecting the purity of the molten tin. In addition, the tin storage device makes it convenient for users to inspect and maintain the heating tube inside the heating chamber, making the tin storage device more convenient for users to operate and use.

[0014] 1. By setting up an oxide layer collection mechanism, the oxide layer enters the surface of the guide plate through the fixed groove, and then falls into the inside of the collection frame through the guide plate. Under the action of the guide plate, the oxide layer is guided, and under the action of the collection frame, the scraped oxide layer is collected. The support base supports the bottom of the collection frame. When the oxide layer inside the collection frame is collected to a certain amount, the controller controls the valve on the surface of the discharge pipe to open, so that the oxide layer collected inside the collection frame is discharged from the inside of the collection frame through the discharge pipe. The scraped oxide layer is recycled and reused, realizing the function of collecting oxide layer of the tin storage device. Thus, when the tin storage device is used, it can collect the oxide layer scraped off the surface of the tin furnace body and recycle and reuse the scraped oxide layer.

[0015] 2. With a dustproof and shielding mechanism, the user places the cover on the surface of the top of the solder pot body, causing the cover to automatically engage with the mounting block inside the corresponding mounting slot. The cover is positioned and installed by the combined action of the mounting block and the mounting slot. At this time, the cover moves the rubber pad and silicone pad, and the silicone pad moves to contact the inner wall of the solder pot body. The rubber pad and silicone pad work together to seal the cover and the solder pot body, preventing dust and impurities from entering the molten solder through the gap between the solder pot body and the cover. This achieves the dustproof and shielding function of the solder storage device, so that when the solder pot body is not in use, the solder storage device can shield the molten solder inside the solder pot body, preventing dust from entering the solder pot body and affecting the purity of the molten solder during use.

[0016] 3. With a maintenance mechanism, users can pull the cover plate on the surface of the solder pot body, causing the cover plate to move the positioning block away from the inside of the positioning slot. At this time, the cover plate moves the sealing gasket away from the surface of the solder pot body, thus removing the cover plate from the surface of the solder pot body. When the cover plate moves, it slides inside the guide groove, which guides the cover plate, making it easier to operate when resetting the cover plate. After removing the cover plate from the surface of the solder pot body, the heating tube inside the heating chamber can be inspected, maintained, or replaced. This realizes the maintenance function of the solder storage device, making it convenient for users to inspect and maintain the heating tube inside the heating chamber, and making the solder storage device more convenient to operate. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the front cross-sectional structure of this utility model;

[0019] Figure 3 This is an enlarged side view sectional diagram of the present invention.

[0020] Figure 4 For the present utility model Figure 3 Enlarged structural diagram of the intermediate maintenance and repair mechanism;

[0021] Figure 5 For the present utility model Figure 3 Enlarged structural diagram of the dustproof and shielding mechanism.

[0022] In the diagram: 1. Tin furnace body; 101. Controller; 102. Fixing slot; 103. Temperature control probe; 104. Aluminum silicate insulation board; 105. Heat-conducting plate; 106. Heating element; 107. Heating chamber; 108. Mounting stud; 109. Mounting plate; 110. Fixing plate; 111. Cover plate; 2. Oxide layer collection mechanism; 21. Guide plate; 22. Collection frame; 23. Oxide layer collection group; 231. Valve; 232. Discharge pipe; 233. Support base; 3. Inspection and maintenance mechanism; 31. Sealing gasket; 32. Positioning block; 33. Positioning slot; 34. Guide slot; 4. Dustproof and shielding mechanism; 41. Cover; 42. Rubber gasket; 43. Silicone gasket; 44. Mounting slot; 45. Mounting block. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. In addition, the terms "first", "second", "third", "upper", "lower", "left", "right", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance. At the same time, in the description of the present utility model, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0024] The structure of the solder storage device for wire twisting and crimping provided by this utility model is as follows: Figure 1 and Figure 2 As shown, the device includes a solder pot body 1. A controller 101, which can be of the LA series, is mounted on the surface of the solder pot body 1. A fixing groove 102 is formed on the surface of the top of the solder pot body 1. Mounting plates 109 are mounted on both sides of the solder pot body 1. Mounting studs 108 are threaded onto the surface of the mounting plates 109. One end of the mounting studs 108 passes through the mounting plates 109 and extends to the bottom of the mounting plates 109. A temperature control probe 103, which can be of the PT series, is mounted on the inner wall of the solder pot body 1. The output end of the temperature control probe 103 is electrically connected to the input end of the controller 101. A heating chamber 107 is formed inside the solder pot body 1. The heating chamber 107 is equipped with a fixing plate 110. The surface of the fixing plate 110 is provided with a heating tube 106 for heating. The heating tube 106 can be of the DN series. The input end of the heating tube 106 is electrically connected to the output end of the controller 101. The surface of the heating tube 106 is fastened to the surface of the fixing plate 110 by screws. The surfaces of both sides of the tin furnace body 1 are provided with cover plates 111. One end of the cover plate 111 extends into the interior of the heating chamber 107. The inner wall of the tin furnace body 1 is equipped with a heat-conducting plate 105 for heat conduction. The heat-conducting plate 105 is connected to the interior of the heating chamber 107. The inner wall of the tin furnace body 1 is equipped with an aluminum silicate insulation plate 104 for heat preservation.

[0025] Furthermore, such as Figure 2 and Figure 3As shown, an oxide layer collecting mechanism 2 is provided on the surface of the tin furnace body 1. The oxide layer collecting mechanism 2 consists of a guide plate 21, a collecting frame 22, and an oxide layer collecting assembly 23. The oxide layer collecting assembly 23 is provided on the surface of the tin furnace body 1 and consists of a valve 231, a discharge pipe 232, and a support base 233. A collecting frame 22 for collecting the oxide layer of molten tin is installed on one side of the surface of the tin furnace body 1. A support base 233 is installed on the surface at the bottom of the collecting frame 22. The surface of the support base 233... Fixed to the surface of the tin furnace body 1, a discharge pipe 232 is installed on the surface of the collection frame 22. One end of the discharge pipe 232 extends into the interior of the collection frame 22. A valve 231 is fitted on the surface of the discharge pipe 232. The valve 231 can be of the TM series. The input end of the valve 231 is electrically connected to the output end of the controller 101. A guide plate 21 for guiding materials is installed on one side of the surface of the tin furnace body 1. The guide plate 21 is located above the collection frame 22 and is connected to the interior of the fixing groove 102.

[0026] In practice, the oxide layer enters the surface of the guide plate 21 through the fixed groove 102, and then falls into the interior of the collection frame 22 through the guide plate 21. Under the action of the guide plate 21, the oxide layer is guided, and under the action of the collection frame 22, the scraped oxide layer is collected. The support base 233 supports the bottom of the collection frame 22. When a certain amount of oxide layer is collected inside the collection frame 22, the controller 101 controls the valve 231 on the surface of the discharge pipe 232 to open, so that the oxide layer collected inside the collection frame 22 is discharged from the interior of the collection frame 22 through the discharge pipe 232, and the scraped oxide layer is recycled and reused to realize the function of collecting oxide layer of the tin storage device.

[0027] Furthermore, such as Figure 3 and Figure 4 As shown, the inner wall of the tin furnace body 1 and the surface of the cover plate 111 are provided with a maintenance mechanism 3. The maintenance mechanism 3 consists of a sealing gasket 31, a positioning block 32, a positioning groove 33, and a guide groove 34. The inner wall of the cover plate 111 is equipped with a sealing gasket 31, and the surface of the sealing gasket 31 is in contact with the surface of the tin furnace body 1. The inner wall of the cover plate 111 is equipped with a positioning block 32. The surfaces of both sides of the tin furnace body 1 are provided with positioning grooves 33. The surfaces of the positioning blocks 32 and the positioning grooves 33 are engaged with each other. The inner wall of the tin furnace body 1 is provided with a guide groove 34, and the guide groove 34 is engaged with the surface of the cover plate 111.

[0028] During implementation, the user pulls the cover plate 111 on the surface of the tin furnace body 1, causing the cover plate 111 to move the positioning block 32 away from the inside of the positioning slot 33. At this time, the cover plate 111 moves the sealing gasket 31 away from the surface of the tin furnace body 1, thereby removing the cover plate 111 from the surface of the tin furnace body 1. When the cover plate 111 moves, it slides inside the guide groove 34. Under the action of the guide groove 34, the cover plate 111 is guided, making it easier to operate when resetting the cover plate 111. After removing the cover plate 111 from the surface of the tin furnace body 1, the heating tube 106 inside the heating chamber 107 is inspected, maintained, or replaced to realize the function of inspection and maintenance of the tin storage device.

[0029] Furthermore, such as Figure 3 and Figure 5 As shown, a dust-proof mechanism 4 is provided on the surface of the top position of the solder pot body 1. The dust-proof mechanism 4 consists of a cover 41, a rubber pad 42, a silicone pad 43, a mounting groove 44, and a mounting block 45. A cover 41 is provided on the top of the solder pot body 1 to cover the surface of the solder pot body 1. One end of the cover 41 extends into the interior of the solder pot body 1. Mounting blocks 45 are installed on the inner wall of the cover 41. Mounting grooves 44 are opened on the surface of the solder pot body 1. The surfaces of the mounting grooves 44 and the mounting blocks 45 are engaged with each other. A rubber pad 42 is installed on the inner wall of the cover 41. A silicone pad 43 for sealing between the solder pot body 1 and the cover 41 is adhered to the surface of the rubber pad 42. The inner wall of the silicone pad 43 is in contact with the inner wall of the solder pot body 1.

[0030] In practice, when the molten solder inside the solder pot body 1 is not in use, dust and impurities can easily fall into the molten solder, causing a decline in the quality of the molten solder. The user places the cover 41 on the surface of the top position of the solder pot body 1, so that the cover 41 drives the mounting block 45 to automatically snap into the corresponding mounting slot 44. Under the joint action of the mounting block 45 and the mounting slot 44, the cover 41 is positioned and installed. At this time, the cover 41 drives the rubber pad 42 and the silicone pad 43 to move. The silicone pad 43 moves to contact the inner wall of the solder pot body 1. Under the joint action of the rubber pad 42 and the silicone pad 43, the cover 41 and the solder pot body 1 are sealed to prevent dust and impurities from entering the interior of the molten solder through the gap between the solder pot body 1 and the cover 41, so as to realize the function of dust prevention and shielding of the solder storage device.

[0031] Working principle: In use, first place the solder pot body 1 in the designated position. The user then tightens the mounting studs 108 on the surface of the mounting plate 109. The mounting studs 108 and the mounting plate 109 work together to install the solder pot body 1 in the designated position. Then, the user operates the controller 101, which controls the heating element 106 inside the heating chamber 107 to operate. The heating element 106 heats the interior of the heating chamber 107, and the heat is transferred to the surface of the molten solder inside the solder pot body 1 through the heat-conducting plate 105, providing even heat distribution to the solder pot. The molten solder inside the body 1 is heated to ensure more complete melting and better soldering of the wires. The temperature of the molten solder inside the body 1 is monitored in real time by the temperature control probe 103. When the temperature control probe 103 detects that the temperature of the molten solder inside the body 1 is too high, the temperature control probe 103 sends a signal to the controller 101. After receiving the signal from the temperature control probe 103, the controller 101 automatically controls the heating tube 106 to stop working, thus precisely controlling the temperature inside the body 1. The aluminum silicate insulation board 104 keeps the inside of the body 1 warm and reduces heat loss.

[0032] Subsequently, the user scrapes off the oxide layer on the surface of the molten tin using a tool. The oxide layer enters the surface of the guide plate 21 through the fixing groove 102, and then falls into the interior of the collection frame 22 through the guide plate 21. Under the action of the guide plate 21, the oxide layer is guided, and under the action of the collection frame 22, the scraped oxide layer is collected. The support base 233 supports the bottom of the collection frame 22. When a certain amount of oxide layer is collected inside the collection frame 22, the controller 101 controls the valve 231 on the surface of the discharge pipe 232 to open, so that the oxide layer collected inside the collection frame 22 is discharged from the interior of the collection frame 22 through the discharge pipe 232. The scraped oxide layer is recycled and reused to realize the function of collecting oxide layer of the tin storage device. Thus, when the tin storage device is used, it can collect the oxide layer scraped off the surface of the tin furnace body 1 and recycle and reuse the scraped oxide layer.

[0033] Subsequently, when the molten solder inside the solder pot body 1 is not in use, dust and impurities can easily fall into the molten solder, causing a decline in its quality. The user places the cover 41 on the surface of the top position of the solder pot body 1, causing the cover 41 to automatically engage with the mounting block 45 in the corresponding mounting slot 44. Under the combined action of the mounting block 45 and the mounting slot 44, the cover 41 is positioned and installed. At this time, the cover 41 moves the rubber pad 42 and the silicone pad 43. The silicone pad 43 moves to contact the inner wall of the solder pot body 1. Under the combined action of the rubber pad 42 and the silicone pad 43, a seal is formed between the cover 41 and the solder pot body 1, preventing dust and impurities from entering the molten solder through the gap between the solder pot body 1 and the cover 41. This achieves the function of dust prevention and shielding of the solder storage device. Thus, when the solder pot body 1 is not in use, the solder storage device can shield the molten solder inside the solder pot body 1, preventing dust from entering the solder pot body 1 and affecting the purity of the molten solder during use.

[0034] Subsequently, after prolonged use, the heating element 106 requires regular maintenance by the user. If a malfunction occurs, the heating element 106 needs timely repair or replacement. The user pulls the cover plate 111 on the surface of the solder pot body 1, causing the cover plate 111 to move the positioning block 32 away from the inside of the positioning slot 33. At this time, the cover plate 111 moves the sealing gasket 31 away from the surface of the solder pot body 1, thereby removing the cover plate 111 from the surface of the solder pot body 1. When the cover plate 111 moves, it moves in the guide groove 34... The internal sliding mechanism guides the cover plate 111 under the action of the guide groove 34, making it easier to operate the cover plate 111 when resetting. After removing the cover plate 111 from the surface of the tin furnace body 1, the heating tube 106 inside the heating chamber 107 can be inspected, maintained, or replaced to realize the function of tin storage device inspection and maintenance. This makes it convenient for users to inspect and maintain the heating tube 106 inside the heating chamber 107 when using the tin storage device, making the tin storage device more convenient for users to operate and use, and finally completing the short-term use work.

[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A solder storage device for twisting and twisting wire, comprising a solder furnace body (1), characterized in that: A controller (101) is installed on the surface of the tin furnace body (1). A fixing groove (102) is opened on the surface of the top position of the tin furnace body (1). Mounting plates (109) are installed on both sides of the tin furnace body (1). Mounting studs (108) are threadedly connected to the surface of the mounting plates (109). One end of the mounting studs (108) passes through the mounting plates (109) and extends to the bottom of the mounting plates (109). A heating chamber (107) is opened inside the tin furnace body (1). An oxide layer collection mechanism (2) is provided on the surface of the tin furnace body (1). An inspection and maintenance mechanism (3) is provided on the inner wall of the tin furnace body (1) and the surface of the cover plate (111). A dustproof and shielding mechanism (4) is provided on the surface of the top position of the tin furnace body (1).

2. The solder storage device for twisting and twisting wires according to claim 1, characterized in that: A temperature control probe (103) is installed on the inner wall of the tin furnace body (1). The output end of the temperature control probe (103) is electrically connected to the input end of the controller (101). A fixing plate (110) is installed inside the heating chamber (107). A heating tube (106) for heating is provided on the surface of the fixing plate (110). The input end of the heating tube (106) is electrically connected to the output end of the controller (101). The surface of the heating tube (106) is threaded to the surface of the fixing plate (110) by screws. A cover plate (111) is provided on both sides of the tin furnace body (1). One end of the cover plate (111) extends into the interior of the heating chamber (107). A heat-conducting plate (105) for heat conduction is installed on the inner wall of the tin furnace body (1). The heat-conducting plate (105) is connected to the interior of the heating chamber (107). An aluminum silicate insulation plate (104) for heat preservation is installed on the inner wall of the tin furnace body (1).

3. The solder storage device for twisting and twisting wires according to claim 1, characterized in that: The oxide layer collection mechanism (2) consists of a guide plate (21), a collection frame (22) and an oxide layer collection group (23). The oxide layer collection group (23) is set on the surface of the tin furnace body (1). The oxide layer collection group (23) consists of a valve (231), a discharge pipe (232) and a support base (233). A collection frame (22) for collecting the oxide layer of molten tin is installed on one side of the tin furnace body (1). A support base (233) is installed on the surface at the bottom of the collection frame (22). The surface of the support base (233) is fixed to the surface of the tin furnace body (1). A discharge pipe (232) is installed on the surface of the collection frame (22). One end of the discharge pipe (232) extends into the interior of the collection frame (22).

4. A solder storage device for wire twisting and crimping according to claim 3, characterized in that: The surface of the discharge pipe (232) is fitted with a valve (231), the input end of the valve (231) is electrically connected to the output end of the controller (101), and a guide plate (21) for guiding materials is installed on one side of the tin furnace body (1). The guide plate (21) is located above the collection frame (22), and the guide plate (21) is connected to the interior of the fixing groove (102).

5. A solder storage device for twisting and twisting wires according to claim 1, characterized in that: The maintenance mechanism (3) consists of a sealing gasket (31), a positioning block (32), a positioning slot (33), and a guide slot (34). The inner wall of the cover plate (111) is equipped with a sealing gasket (31). The surface of the sealing gasket (31) is in contact with the surface of the tin furnace body (1). The inner wall of the cover plate (111) is equipped with a positioning block (32).

6. A solder storage device for twisting and twisting wires according to claim 5, characterized in that: The tin furnace body (1) has positioning slots (33) on both sides of its surface. The positioning block (32) and the surface of the positioning slot (33) are engaged with each other. The inner wall of the tin furnace body (1) has guide grooves (34). The guide grooves (34) and the surface of the cover plate (111) are engaged with each other.

7. A solder storage device for twisting and twisting wires according to claim 1, characterized in that: The dustproof and shielding mechanism (4) consists of a cover (41), a rubber pad (42), a silicone pad (43), a mounting groove (44), and a mounting block (45). A cover (41) for covering the surface of the tin furnace body (1) is provided above the tin furnace body (1). One end of the cover (41) extends into the interior of the tin furnace body (1), and mounting blocks (45) are installed on the inner wall of the cover (41).

8. A solder storage device for twisting and twisting wires according to claim 7, characterized in that: The surface of the tin furnace body (1) is provided with mounting grooves (44), and the mounting grooves (44) and the surface of the mounting block (45) are engaged with each other. A rubber pad (42) is installed on the inner wall of the cover (41), and a silicone pad (43) for sealing between the tin furnace body (1) and the cover (41) is adhered to the surface of the rubber pad (42). The inner wall of the silicone pad (43) is in contact with the inner wall of the tin furnace body (1).

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