An electronic component soldering apparatus

Abstract

The utility model discloses an electronic component welding device belongs to electronic component welding equipment technical field. Including bottom frame, the both sides of bottom frame are equipped with clamping piece, and clamping piece fixes circuit board on the top surface of bottom frame, and the top surface of bottom frame is equipped with pressing plate, and the bottom surface of pressing plate is equipped with a plurality of sliding slot, and the inside all sliding connections of sliding slot have slide rod, and the top surface of slide rod and the top surface of sliding slot are connected with spring, and the bottom surface of slide rod is installed with rubber plate, and the interval between adjacent rubber plate is 1~2 millimeter, and pressing plate fixed mounting is in the top surface of bottom frame, and the length and width of pressing plate are less than the length and width of bottom frame, and the length and width of pressing plate are greater than the length and width of the center cavity of bottom frame, the pressing device that this technical scheme is composed of bottom frame, pressing plate, slide rod, spring and rubber plate, has realized the even, reliable, flexible fixation of all elements on circuit board, no matter how the element height is, can be pressed with appropriate pressure by corresponding rubber plate, therefore operator can overturn whole device and carries out back welding.

Description

Technical Field

[0001] This utility model relates to the field of electronic component welding equipment technology, specifically to an electronic component welding device. Background Technology

[0002] In the field of electronics manufacturing and repair, soldering through-hole components is a fundamental and critical process. The core steps include: precisely threading the component's leads through pre-drilled vias on the printed circuit board (PCB); then attaching the component body to the PCB pads; securing it with hot glue; and finally heating the leads and pads with a soldering iron and adding solder to form a strong and reliable solder joint.

[0003] Because components are initially positioned only by the tiny gap between the pins and vias, they are very prone to falling off the board under gravity when the board is flipped. To solve this problem, the industry currently uses the following two methods, but both have drawbacks:

[0004] One method involves the operator holding the component down on the front of the circuit board with one hand after flipping it over, while soldering on the back with the other. This method reduces operational flexibility, as soldering requires holding the soldering iron in one hand and feeding the solder wire in the other. Manually pressing down the component forces the operator to perform this complex task with one hand, reducing soldering efficiency and accuracy, and increasing the risk of errors due to fatigue. Another method involves temporarily fixing the component to the front of the circuit board with hot melt adhesive before flipping. This method adds an extra step, reduces production efficiency, and improper adhesive application can contaminate the solder pads, affecting soldering quality. Furthermore, residual adhesive needs to be cleaned after soldering, increasing process complexity and cost. In summary, current methods of component fixing during circuit board flipping in through-hole component soldering generally suffer from reduced operational flexibility or decreased production efficiency. This, to some extent, restricts the improvement of soldering efficiency and the user experience. Utility Model Content

[0005] The purpose of this invention is to provide an electronic component welding device to solve the problems mentioned in the background art.

[0006] In view of the above problems, the technical solution proposed by this utility model is as follows:

[0007] An electronic component welding device includes a base frame with clamping members on both sides for fixing a circuit board to the top surface of the base frame. A pressure plate is provided on the top surface of the base frame, and the bottom surface of the pressure plate has several sliding grooves. A sliding rod is slidably connected within each groove. A spring connects the top surface of the sliding rod to the top surface of the groove. A rubber plate is installed on the bottom surface of the sliding rod, with adjacent rubber plates spaced 1-2 mm apart. The pressure plate is fixedly installed on the top surface of the base frame, and its length and width are both smaller than the length and width of the base frame, but larger than the length and width of the central cavity of the base frame. The combination of the sliding rods and springs forms multiple independent elastic holding units. When there are components of different heights on the circuit board, each unit can automatically adjust the pressure according to the component height to ensure that all components are evenly and reliably fixed, preventing some components from being not pressed tightly or damaged due to uneven component heights. At the same time, the rubber plate directly contacts the component surface, and its soft material can effectively prevent the component surface from being scratched during the pressing process. In addition, the high coefficient of friction of rubber can also increase the static friction between the rubber and the component, further preventing the component from being horizontally displaced. The length and width of the pressure plate are larger than the length and width of the central cavity of the bottom frame, ensuring full coverage pressing of the central area of ​​the circuit board.

[0008] Furthermore, a pair of fixing blocks are installed on the side of the base frame. The top surface of the fixing blocks is provided with a first threaded hole. A first screw is threadedly connected to the first threaded hole. A pressure plate is coaxially fixed to the outside of the first screw. The pressure plate and the base frame have overlapping surfaces when viewed from above. The pressure plate can apply pressure from both sides of the circuit board to firmly fix it in the center of the base frame, effectively preventing horizontal displacement of the circuit board during the soldering process, ensuring the accuracy of the solder joint position. The position of the pressure plate can be adjusted by rotating the first screw to adapt to circuit boards of various widths, improving the versatility and applicability of the device.

[0009] Furthermore, the top surface of the pressure plate is provided with a pair of through holes, and the top surface of the bottom frame is provided with a pair of second threaded holes. A second screw slides in the through holes, and the second screw and the second threaded hole are threadedly engaged. Through the rigid connection of the second screw, the pressure plate and the bottom frame are formed into a stable whole, ensuring that the pressure plate remains stable in position throughout the welding process and does not loosen or shake.

[0010] Furthermore, support rods are installed on the top surface of the pressure plate near its four corners. Anti-slip pads are installed on the top surface of the support rods. The anti-slip pads installed on the top of the support rods are usually made of materials such as rubber or silicone, and their surfaces have a high coefficient of friction. This can increase the static friction between the device and the workbench, effectively resist the thrust or vibration generated during welding operations, and prevent the device from accidentally sliding on the workbench.

[0011] Furthermore, a pair of grooves are provided on the side of the pressure plate, and the pressure plate slides in the grooves. The design of the grooves provides the pressure plate with room to move, so that the pressure plate can partially enter the outline of the pressure plate. Thus, without increasing the overall size, the functions of the pressure plate and the pressure plate are integrated, and the spatial layout is optimized.

[0012] Furthermore, the bottom surface of the pressure plate is adhered with anti-slip rubber. The anti-slip rubber pad directly contacts the edge of the circuit board. Its high coefficient of friction significantly increases the static friction between the pressure plate and the circuit board, which can more effectively prevent the circuit board from slipping when subjected to external force, ensuring the stability of clamping. At the same time, the anti-slip rubber pad is soft and elastic. While providing strong friction, it can effectively buffer the rigid pressure of the pressure plate on the edge of the circuit board, avoiding leaving indentations or causing structural damage to the edge of the board.

[0013] Furthermore, the diameters of the slide rod and the slide groove are the same, which can effectively restrict the degree of freedom of the slide rod, so that it can only perform linear reciprocating motion along the axis of the slide groove, thus avoiding lateral swaying or tilting of the slide rod during the up and down sliding process.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This electronic component welding device, consisting of a multi-point adaptive elastic holding device composed of a base frame, pressure plate, slide rod, spring and rubber plate, combined with a lateral rigid clamping mechanism composed of a fixing block, first screw and pressure plate, achieves uniform, reliable and flexible fixation of all components on the circuit board. Regardless of the height of the component, it can be pressed down by the corresponding rubber plate with appropriate pressure. Therefore, the operator can flip the entire device for back soldering without worrying about the component falling off, thus freeing the operator's hands and allowing them to use both soldering iron and solder wire at the same time, thereby improving welding efficiency and solder joint quality. At the same time, it eliminates the extra steps of applying hot melt glue and cleaning residual glue after welding, which not only improves production efficiency, but also avoids the risk of contaminating the solder pad and affecting the welding quality due to improper glue control, and also reduces material costs. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural schematic diagram of the electronic component welding device disclosed in an embodiment of the present utility model;

[0016] Figure 2 This is an exploded structural diagram of the electronic component welding apparatus disclosed in an embodiment of the present utility model;

[0017] Figure 3 This is a side view of the electronic component welding apparatus disclosed in an embodiment of the present utility model;

[0018] Figure 4 This is a cross-sectional structural schematic diagram of the electronic component welding device disclosed in an embodiment of the present utility model;

[0019] Figure 5 for Figure 4 A magnified schematic diagram of structure A in the middle.

[0020] In the diagram: 1. Base frame; 2. Pressure plate; 3. Support rod; 4. Second screw; 5. First screw; 6. Pressure plate; 7. Fixing block; 8. Through hole; 9. Second threaded hole; 10. Groove; 11. Rubber plate; 12. Slide rod; 13. Spring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1 - Figure 5 This utility model provides a technical solution: an electronic component welding device, including a base frame 1, with clamping members on both sides of the base frame 1, the clamping members fixing the circuit board to the top surface of the base frame 1, a pressure plate 2 on the top surface of the base frame 1, and a plurality of sliding grooves on the bottom surface of the pressure plate 2, each groove having a sliding rod 12 slidably connected therein, a spring 13 connecting the top surface of the sliding rod 12 and the top surface of the sliding groove, a rubber plate 11 installed on the bottom surface of the sliding rod 12, with adjacent rubber plates 11 spaced 1-2 mm apart, the pressure plate 2 fixedly installed on the top surface of the base frame 1, and the length and width of the pressure plate 2 being smaller than the length and width of the base frame 1. The length and width of plate 2 are greater than the length and width of the central cavity of the base frame 1. The circuit board to be soldered is placed on the top surface of the base frame 1 and initially positioned and fixed by the clamping members on both sides. Each slide bar 12 on the bottom surface of the pressure plate 2 extends downward into the slide groove under the preload of the spring 13 at its top, and applies pressure to the components below through the rubber plate 11 at its bottom. When the components on the circuit board are of different heights, the taller components will push the corresponding slide bar 12 upward, further compressing the spring 13 above it; while the shorter components correspond to springs 13 with smaller compression and greater elasticity. This adaptive mechanism allows each rubber plate 11 to adhere to the surface of the component with appropriate pressure, forming a uniform and reliable multi-point pressure, thereby effectively preventing the components from falling due to gravity when the entire device is flipped over for back soldering.

[0023] Specifically, the minimum working load of spring 13 is greater than the total weight of slide bar, rubber plate and compressed electronic component, ensuring that spring is still in pre-compression state after flipping. The distribution density of rubber plate 11 is greater than the density of circuit board vias, ensuring that each component is pressed by at least two rubber plates at the same time. Even if the component height is different, a stable clamping force can be obtained from both sides, avoiding the problem of low-height component fixation failure caused by a single rubber plate 11 contacting components of different heights at the same time.

[0024] As an embodiment of this utility model, a pair of fixing blocks 7 are further installed on the side of the base frame 1. The top surface of the fixing block 7 has a first threaded hole, and a first screw 5 is threadedly connected to the first threaded hole. A pressure plate 6 is coaxially fixed to the outside of the first screw 5, and the pressure plate 6 and the top view projection of the base frame 1 have overlapping surfaces. When it is necessary to fix the circuit board, the operator rotates the head of the first screw 5. Since the first screw 5 and the first threaded hole on the fixing block 7 are engaged with each other, the rotational motion is converted into linear motion of the first screw 5 along its axis. The pressure plate 6, which is coaxially fixed with the first screw 5, moves towards the center of the base frame 1. When the pressure plate 6 contacts the edge of the circuit board, the first screw 5 is rotated until appropriate resistance is felt, indicating that the circuit board has been firmly clamped. At this time, the circuit board is reliably fixed in the horizontal direction by the pressure plates 6 on both sides.

[0025] As an embodiment of this utility model, the top surface of the pressure plate 2 is provided with a pair of through holes 8, and the top surface of the bottom frame 1 is provided with a pair of second threaded holes 9. A second screw 4 slides in the through holes 8, and the second screw 4 and the second threaded holes 9 are threadedly engaged. The pressure plate 2 is placed above the bottom frame 1, and the two through holes 8 on the pressure plate 2 are adjusted visually or by touch to make them completely aligned with the two second threaded holes 9 on the top surface of the bottom frame 1. Then, the screw part of the second screw 4 is passed through the through hole 8, and its end is aligned with the entrance of the second threaded hole 9. The second screw 4 is rotated clockwise using a screwdriver or other tool. As the threads engage, the head of the second screw 4 will gradually press against the top surface of the pressure plate 2 until the pressure plate 2 is firmly fixed to the bottom frame 1. To disassemble, simply rotate the second screw 4 counterclockwise.

[0026] As an embodiment of this utility model, further, support rods 3 are installed on the top surface of the pressure plate 2 near its four corners. Anti-slip pads are installed on the top surface of the support rods 3. The support rods 3 serve as support legs, and their length design ensures that the entire device can remain stable when placed on a horizontal workbench. The anti-slip pads are in direct contact with the workbench surface, and their material properties provide a friction force much greater than that between metal and the workbench surface. When an external force attempts to push the device, the static friction force generated between the anti-slip pads and the workbench surface will resist this tendency to move, thereby firmly fixing the device in its original position.

[0027] As an embodiment of this utility model, the pressure plate 2 is further provided with a pair of grooves 10 on its side. The pressure plate 6 slides in the grooves 10. When the second screw 4 is rotated to push the pressure plate 2 toward the center of the circuit board, the pressure plate 6 will gradually enter the grooves 10. The width and depth of the grooves 10 are slightly larger than the corresponding dimensions of the pressure plate 6, thereby providing sufficient accommodating space and sliding allowance for the pressure plate 6, thus avoiding interference with the pressure plate 2.

[0028] As an embodiment of this utility model, the bottom surface of the pressure plate 6 is further coated with anti-slip rubber. When the pressure plate 6 presses the edge of the circuit board under the push of the first screw 5, the anti-slip rubber pad on the bottom surface of the pressure plate 6 will be in close contact with the surface of the circuit board. Since the rubber material has a high coefficient of friction, the static friction force generated between it and the circuit board is much greater than the friction force when the metal pressure plate is in direct contact. This friction force constitutes the main force to resist the displacement of the circuit board, thereby achieving more reliable clamping. At the same time, the elastic deformation of the rubber also makes the contact pressure distribution more uniform, protecting the fragile edge of the circuit board.

[0029] As one embodiment of this utility model, the diameters of the slide rod 12 and the slide groove are consistent, and during assembly, the slide rod 12 is precisely inserted into the slide groove. Due to the matching dimensions, the inner wall of the slide groove forms an all-round constraint and guide on the outer wall of the slide rod 12. When the slide rod 12 is lifted by the spring 13 or by the component, it can only make a purely vertical movement along the central axis of the slide groove. This gapless fit ensures the consistency and stability of the entire multi-point pressing system.

[0030] Specifically, the device provides various sizes of base frame 1 and pressure plate 2 combinations to accommodate circuit boards of different sizes.

[0031] It should be noted that all standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The control method is automatic control through a control cabinet. The control circuit can be implemented by simple programming by those skilled in the art and is common knowledge in the field. Furthermore, since this application is mainly used to protect mechanical devices, this application will not explain the control method and circuit connection in detail.

Claims

1. An electronic component welding apparatus, characterized in that, The device includes a base frame (1), with clamping members on both sides. The clamping members fix the circuit board to the top surface of the base frame (1). The top surface of the base frame (1) is provided with a pressure plate (2), and the bottom surface of the pressure plate (2) is provided with several sliding grooves. Each sliding groove is slidably connected with a sliding rod (12). A spring (13) is connected between the top surface of the sliding rod (12) and the top surface of the sliding groove. A rubber plate (11) is installed on the bottom surface of the sliding rod (12), and the adjacent rubber plates (11) are spaced 1-2 mm apart. The pressure plate (2) is fixedly installed on the top surface of the base frame (1), and the length and width of the pressure plate (2) are smaller than the length and width of the base frame (1). The length and width of the pressure plate (2) are larger than the length and width of the central cavity of the base frame (1).

2. An electronic component soldering apparatus according to claim 1, wherein A pair of fixing blocks (7) are installed on the side of the bottom frame (1). The top surface of the fixing block (7) is provided with a first threaded hole. A first screw (5) is threadedly connected to the first threaded hole. A pressure plate (6) is coaxially fixed to the outside of the first screw (5). The pressure plate (6) and the bottom frame (1) have overlapping surfaces when viewed from above.

3. The electronic component bonding apparatus according to claim 1, wherein The top surface of the pressure plate (2) is provided with a pair of through holes (8), and the top surface of the bottom frame (1) is provided with a pair of second threaded holes (9). A second screw (4) slides in the through hole (8), and the second screw (4) and the second threaded hole (9) are threadedly engaged.

4. The electronic component welding apparatus according to claim 1, characterized in that, The top surface of the pressure plate (2) is equipped with support rods (3) near its four corners, and the top surface of the support rods (3) is equipped with anti-slip pads.

5. The electronic component bonding apparatus according to claim 2, wherein The pressure plate (2) has a pair of grooves (10) on its side, and the pressure plate (6) slides in the grooves (10).

6. The electronic component bonding apparatus according to claim 2, wherein The bottom surface of the pressure plate (6) is covered with anti-slip rubber.

7. The electronic component welding apparatus according to claim 1, characterized in that, The diameter of the slide bar (12) and the slide groove are the same.

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