A plate separating jig

CN224725249UActive Publication Date: 2026-09-08SHENZHEN SHIXING INFORMATION TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202522105445.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-29
Publication Date
2026-09-08
Estimated Expiration
2035-09-29

AI Technical Summary

Technical Problem

但其在分板流程的终端仍存在问题,被分离的板框、连接筋等废料仍停留在承载盘上,若电路板的连接筋过多,产生的废料过散,操作人员需要手动夹取废料进行清除,这种清除方式缓慢,无法适应高效生产

Benefits of technology

通过设置的底座、固定件以及设有挡料区和排料区的盖板盖板相互配合,使得电路板分板后无需操作人员手动夹取清除废料,只需将分板治具翻转后即可排除每个相邻电路板单元之间的废料,实现快速清除废料,大大提高了生产效率。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224725249U_ABST
    Figure CN224725249U_ABST
Patent Text Reader

Abstract

The utility model relates to laser cutting auxiliary tool technical field, specifically disclose a kind of board dividing fixture, comprising: base, is provided with multiple accommodating grooves, one the accommodating groove is used to accommodate one circuit board unit;Fixing piece, set up on the base, for fixing circuit board on the predetermined position of the base;Cover plate, at the side of the accommodating groove mouth, the cover plate is matched with the base and is formed with material blocking area and material discharge area, the material blocking area is used to limit circuit board unit to leave the accommodating groove, and the material discharge area is passed by waste material. Through the base, fixing piece and the cover plate with material blocking area and material discharge area of being provided and being mutually matched, so that circuit board is divided into board without manual clamping and removing waste material by operating personnel, just need to remove waste material between each adjacent circuit board unit after flipping board dividing fixture, realize quickly removing waste material, greatly improve production efficiency.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application belongs to the field of laser cutting auxiliary tool technology, and more specifically, relates to a plate separating fixture. Background Technology

[0002] Laser separation technology, as the mainstream process to replace traditional mechanical milling cutters and stamping separation, is widely used in precision electronic components due to its significant advantages such as non-contact, stress-free, and high precision.

[0003] Existing laser PCB separation fixtures typically employ the following structure: a fixture with honeycomb-shaped through-holes is placed on the vacuum platform of the laser PCB separation machine. During operation, the vacuum system is activated, using negative pressure to adsorb and fix the entire PCB product onto the fixture surface, and finally, the laser cuts along a preset path.

[0004] The patent, CN206302638U, is titled "A Special Fixture for Laser Separation of Circuit Boards." It features a rectangular support tray for holding circuit boards, with designated areas for placing circuit board units. The cut circuit board units fall into these units, facilitating the transfer of the entire fixture to the next process for automated mounting, thus enabling automated transfer after separation. However, a problem remains at the end of the separation process: separated board frames, connecting ribs, and other waste materials remain on the support tray. If there are too many connecting ribs on the circuit board, the waste is too scattered, requiring manual removal by operators. This removal method is slow and unsuitable for efficient production. Utility Model Content

[0005] The purpose of this application is to provide a board separation fixture to solve the technical problems existing in the prior art.

[0006] To achieve the above objectives, the technical solution adopted in this application is: to provide a panel separation fixture, comprising: The base is provided with multiple receiving slots, one of which is used to receive a circuit board unit; A fastener, provided on the base, is used to fix the circuit board at a predetermined position on the base; A cover plate is located on one side of the receiving groove opening. The cover plate and the base cooperate to form a material blocking area and a material discharge area. The material blocking area is used to restrict the circuit board unit from leaving the receiving groove, and the material discharge area is for waste material to pass through.

[0007] Optionally, the receiving groove is used to fit with the circuit board unit with a clearance.

[0008] Optionally, the bottom of the receiving tank is provided with a positioning air hole, which is used to connect the airflow of the adsorption circuit board unit.

[0009] Optionally, the material blocking area is a plurality of abutment blocks disposed on the side of the cover plate near the base, and the gap between the cover plate, the base and the abutment blocks is the material discharge area.

[0010] Optionally, the cover plate is attached to the base, the area of ​​the cover plate that abuts against the circuit board unit is the material blocking area, and the material discharge area is a plurality of material discharge holes provided on the cover plate.

[0011] Optionally, the discharge hole of a circuit board is divided into two corner holes and multiple diagonal holes. The two corner holes are used to mate with two opposite corners of the circuit board. The diagonal holes extend along the line perpendicular to the connection between the two corner holes, and the multiple diagonal holes are arranged in parallel with each other.

[0012] Optionally, the fastener includes at least two fixing posts connected to the base and passing through the circuit board.

[0013] Optionally, the cover plate is provided with a cover guide hole, which allows the fixing post to pass through in a limiting manner.

[0014] Optionally, the cover plate is magnetically attached to the base.

[0015] The beneficial effects of the panel separation fixture provided in this application are as follows: By using a base, fixing parts, and cover plates with material blocking and discharge areas in a coordinated manner, the waste material can be removed without the need for operators to manually pick it up after the circuit board is separated. Simply flipping the separation fixture will remove the waste material between each adjacent circuit board unit, achieving rapid waste removal and greatly improving production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of opening the cover after mounting the circuit board in Embodiment 1 of this application. Figure 1 ; Figure 2 This is a cross-sectional view of the structure after the cover plate is installed in Embodiment 1 of this application. Figure 2 .

[0018] The following are the labeling elements in the figure: 1. Base; 11. Receiving slot; 111. Positioning air hole; 2. Fixing column; 3. Cover plate; 31. Material blocking area; 32. Material discharge area; 321. Corner hole; 322. Diagonal hole; 33. Cover guide hole; 4. Magnet; 5. Circuit board unit; 6. Scrap material; 7. Handle position. Detailed Implementation

[0019] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0020] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0021] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for mutual communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] A Chinese patent, CN206302638U, entitled "A Special Fixture for Laser Separation of Circuit Boards," describes a special fixture for laser separation of circuit boards. It includes a rectangular support plate with a support area in the center. This support area supports the circuit panels to be cut and each circuit board unit after cutting. The edge of the support area has several upward-protruding positioning posts. The support area includes several support units arranged in a rectangular array, each supporting one circuit board unit after cutting. Upward-protruding limiting posts are provided between two adjacent horizontally adjacent support units, and also between two adjacent vertically adjacent support units. Each support unit has at least one vacuum adsorption through-hole. The support area also has several vacuum adsorption through-holes corresponding to the laser cutting positions on the supported circuit panels. This improves production efficiency, reduces labor costs, and provides a foundation for automated production.

[0024] Although existing technologies provide conditions for automated flow after board separation, problems still exist at the end of the board separation process. The separated board frames, connecting ribs, and other waste materials remain on the support plate. If there are too many connecting ribs on the circuit board, the waste materials generated are too scattered, and operators need to manually pick up the waste materials for removal. This removal method is slow and cannot be adapted to efficient production. Therefore, this embodiment proposes a board separation fixture.

[0025] Example 1, in conjunction with the following Figures 1 to 2 This application describes a board separation fixture, including a base 1, a fixing member, and a cover plate 3. The base 1 has multiple receiving slots 11, each receiving slot 11 for accommodating a circuit board unit 5. The fixing member includes two or more fixing posts 2, which are fixedly connected to the base 1 and pass through the circuit board to fix it in a predetermined position on the base 1. The cover plate 3 is located on one side of the receiving slot 11. The cover plate 3 cooperates with the base 1 to form a retaining area 31 and a discharge area 32. The retaining area 31 restricts the circuit board unit 5 from leaving the receiving slot 11, and the discharge area 32 allows waste material 6 to pass through. Specifically, the discharge area 32 consists of multiple discharge holes on the cover plate 3, each corresponding to the waste material 6 between any two adjacent circuit board units 5 on the circuit board. The retaining area 31 is the interval between any two adjacent discharge holes and the area abutting against the circuit board unit 5.

[0026] The predetermined position refers to the area that the laser can process. Regarding the fixing components, bolts or other structures capable of fixing the circuit board can be used; the key is to secure the circuit board to the predetermined position on the base 1. The receiving slot 11 not only has a receiving function but also addresses the arrangement of the circuit board units 5, ensuring that each circuit board unit 5 after separation is neatly and orderly arranged in the base 1. This neat arrangement greatly facilitates the subsequent gripping and handling of the circuit board units 5 by automated equipment, improving the efficiency and accuracy of the overall production process.

[0027] In summary, by inserting the fixing post 2 through the circuit board, horizontal movement of the circuit board is prevented, ensuring its stable mounting on the base 1. Two different operating methods can then be employed. The first method involves separating the circuit board into individual units 5, allowing them to fall smoothly into the pre-designed receiving slot 11, achieving initial physical separation from the waste material 6 on the surface of the base 1. Then, the cover plate 3 is installed to ensure the stability and protection of the circuit board. Subsequently, by flipping the entire separating fixture, the retaining area 31 confines the circuit board to the base 1, allowing the waste material 6 between adjacent circuit board units 5 to be smoothly discharged through the discharge area 32, thereby greatly improving the efficiency of waste material removal and optimizing the entire production process.

[0028] The second method involves installing a cover plate 3 before the circuit board is separated, pressing it onto the circuit board. Then, a laser is used to precisely cut the waste material 6 in the discharge area 32. After cutting, the circuit board unit 5 falls into the receiving groove 11. During this process, the retaining area 31 presses down on and fixes the circuit board unit 5 in the receiving groove 11 of the base 1, ensuring its position remains unchanged, while the waste material 6 generated by cutting remains in the discharge area 32. When it is necessary to remove this waste material 6, the operator only needs to flip the entire separation fixture. The waste material 6 between each adjacent circuit board unit 5 will automatically fall off from the discharge area 32 under the action of gravity, thereby greatly improving the efficiency of waste material 6 removal and optimizing the entire production process.

[0029] Furthermore, the fixing post 2 provides clear physical guidance for the operator. When placing the circuit board, simply align the process holes on the circuit board with the fixing post 2 and place it down to complete the initial positioning of the circuit board.

[0030] In this embodiment, to ensure that the circuit board unit 5, after being separated, can smoothly and accurately fall into the predetermined receiving groove 11, thereby ensuring the smooth progress of the entire assembly process, and to prevent waste material 6 or other impurities from entering the receiving groove 11 due to its excessive size, which could affect the normal operation of the circuit board unit 5 or cause unnecessary cleaning trouble, a clearance fit is used between the receiving groove 11 and the circuit board unit 5 in this embodiment. The clearance fit ensures the smooth installation of the circuit board unit 5 and effectively prevents waste material 6 from entering, thereby improving the overall assembly quality and efficiency.

[0031] Although laser cutting is a "non-contact" process, the micro-impact force generated by the instantaneous vaporization of the material and the movement of the equipment itself can still cause slight displacement or vibration of the circuit board. This is especially true for thinner circuit boards, which can lead to poor cutting quality. Therefore, in this embodiment, a positioning air hole 111 is provided at the bottom of the receiving groove 11. The positioning air hole 111 is used to connect the airflow adsorbing the circuit board unit 5. This allows the circuit board to be stably fixed for precise cutting before separation, and the circuit board unit 5 to fall stably into the receiving groove 11 after separation.

[0032] Although multiple discharge holes allow waste material 6 to be discharged smoothly, when using laser cutting to process the discharge holes on the cover plate 3, each discharge hole needs to be processed one by one, resulting in low production efficiency of the cover plate 3. Based on this, the following configuration is provided: the discharge hole for a circuit board also includes two corner holes 321, which are used to cooperate with the two opposite corners of the circuit board; the diagonal holes 322 extend along the line perpendicular to the connection between the two corner holes 321. The multiple diagonal holes 322 are arranged in parallel. The discharge holes are formed by the corner holes 321 and the diagonal holes 322, so that a single diagonal hole 322 can cover multiple pieces of waste material 6. In this way, when the operator uses laser cutting to process the discharge holes on the cover plate 3, the processing time is shorter, thereby improving the production efficiency of the cover plate 3. At the same time, the diagonal holes 322 cover multiple pieces of waste material 6, which allows the waste material 6 on a diagonal line on the circuit board to be discharged simultaneously, improving the discharge efficiency of waste material 6.

[0033] In other embodiments, if the shape and size of the circuit board units 5 on the same circuit board are different, the shape and size of the individual circuit board units 5 can be adapted to the material discharge hole.

[0034] To achieve rapid positioning between the cover plate 3 and the base 1, the cover plate 3 is provided with a cover guide hole 33, which allows the fixing post 2 to be inserted in a limiting manner. This limiting insertion means that during the insertion process, the fixing post 2 is tightly engaged with the base 1 through the guide hole, ensuring that the cover plate 3 and the base 1 are relatively fixed after insertion. This design effectively prevents possible misalignment between the discharge area 32 and the waste material 6 during operation, ensuring the accuracy and reliability of discharge and waste material 6 processing.

[0035] To adapt to rapid production lines, the cover plate 3 and base 1 need to be able to be quickly installed and removed. Therefore, the connection method between the cover plate 3 and base 1 needs to be as simple as possible. Specifically, the cover plate 3 and base 1 are magnetically attached. Magnets 4 are embedded in the cover plate 3 and base 1, allowing them to automatically attract each other during installation. After the circuit board is pressed onto the cover plate 3, a gap is left between the cover plate 3 and base 1. The magnets 4 provide a continuous and stable clamping force during the board separation process, ensuring that the material blocking area 31 and the circuit board unit 5 are tightly fitted. To facilitate quick removal of the cover plate 3, the base 1 is equipped with a handle 7, allowing workers to easily remove the cover plate 3.

[0036] Example 2 differs from Example 1 in that the material blocking area 31 consists of multiple abutting blocks disposed on the side of the cover plate 3 near the base 1. Each abutting block corresponds to a multiple receiving groove 11 on the base 1 and is used to extend into the receiving groove 11 to abut the circuit board unit 5. The abutting blocks also leave a certain gap between the cover plate 3 and the base 1, which is the material discharge area 32.

[0037] In summary, by setting the abutment block and fixing post 2 through the circuit board, the horizontal movement of the circuit board is prevented, so that the circuit board is stably installed on the base 1. After the board separation is completed, the waste material 6 is separated from the circuit board unit 5. At this time, the cover plate 3 is placed on the base 1, so that the abutment block extends into the receiving groove 11 to abut the circuit board unit 5. At the same time, there is a certain gap between the cover plate 3 and the base 1, forming the discharge area 32. Then, the cover plate 3 and the base 1 are placed vertically, and then the cover plate 3 and the base 1 are shaken, so that the waste material 6 between each adjacent circuit board unit 5 is separated from the base 1 and falls from the discharge area 32, thereby greatly improving the efficiency of waste material 6 removal and optimizing the entire production process.

[0038] In summary, as Figures 1 to 2In the structure shown, the process holes of the circuit board are positioned at predetermined locations on the base 1 corresponding to the fixing posts 2. The circuit board is then pressed by the cover plate 3, and the separation fixture is placed on the vacuum chuck to begin laser cutting. At this time, the vacuum chuck firmly adheres the circuit board to the base 1 through the positioning air holes 111. The cut circuit board unit 5 falls into the receiving groove 11 under the combined action of gravity and vacuum suction, while the waste material 6 remains in the discharge area 32. After separation, the waste material 6 between each adjacent circuit board unit 5 can be discharged uniformly by simply rotating the separation fixture. This process is efficient and convenient. After removing the cover plate 3, the long strip of waste material 6 where the process holes of the circuit board are located is discharged. Then, the separation fixture is moved to the next station for automatic mounting of the circuit board unit 5.

[0039] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A plate-separating fixture, characterized in that, include: The base (1) is provided with a plurality of receiving slots (11), one of the receiving slots (11) being used to receive a circuit board unit (5); A fastener is provided on the base (1) for fixing the circuit board at a predetermined position on the base (1); The cover plate (3) is located on the side where the groove of the receiving groove (11) is located. The cover plate (3) cooperates with the base (1) to form a material blocking area (31) and a material discharge area (32). The material blocking area (31) is used to restrict the circuit board unit (5) from leaving the receiving groove (11), and the material discharge area (32) is used for waste material (6) to pass through.

2. The plate-separating fixture as described in claim 1, characterized in that: The receiving groove (11) is used to fit with the circuit board unit (5) with clearance.

3. The plate-separating fixture as described in claim 1, characterized in that: The bottom of the receiving groove (11) is provided with a positioning air hole (111), which is used to connect the airflow of the adsorption circuit board unit (5).

4. The plate-separating fixture as described in claim 1, characterized in that: The material blocking area (31) consists of a plurality of abutting blocks disposed on the side of the cover plate (3) near the base (1), and the gap between the cover plate (3), the base (1) and the abutting blocks is the material discharge area (32).

5. The plate-separating fixture as described in claim 1, characterized in that: The cover plate (3) is attached to the base (1). The area of ​​the cover plate (3) that abuts against the circuit board unit (5) is the baffle area (31). The discharge area (32) is a plurality of discharge holes provided on the cover plate (3).

6. The plate-separating fixture as described in claim 5, characterized in that: The discharge holes of a circuit board are divided into two corner holes (321) and multiple diagonal holes (322). The two corner holes (321) are used to fit the two opposite corners of the circuit board. The diagonal holes (322) extend along the line perpendicular to the connection between the two corner holes (321), and the multiple diagonal holes (322) are arranged in parallel.

7. The plate-separating fixture as described in claim 1, characterized in that: The fastener includes at least two fixing posts (2), which are connected to the base (1) and pass through the circuit board.

8. The plate-separating fixture as described in claim 7, characterized in that: The cover plate (3) is provided with a cover guide hole (33), which is used for the fixed column (2) to pass through in a limiting manner.

9. The plate-separating fixture as described in claim 8, characterized in that: The cover plate (3) and the base (1) are magnetically attached together.

Citation Information

Patent Citations

  • Circuit board laser divides board special tool

    CN206302638U