A motherboard BGA soldering support carrier

Abstract

This utility model relates to a motherboard BGA soldering support carrier, including a carrier body with a centrally located receiving cavity. The carrier body has a rectangular frame structure, and the edges of the receiving cavity are provided with positioning protrusions for initial positioning with the product positioning holes. Several adjustable support components are connected to the receiving cavity, spaced apart and configured to support different parts of the product. Clamping components for pressing the sides of the product are connected to the sides of the carrier body. This utility model achieves precise positioning and stable support of the motherboard, effectively preventing motherboard displacement during soldering and improving BGA soldering yield.

Description

Technical Field

[0001] This utility model relates to the field of electronic component welding auxiliary equipment technology, and in particular to a motherboard BGA welding support carrier. Background Technology

[0002] In the manufacturing process of electronic motherboards, BGA (Ball Grid Array) soldering is one of the key steps. During BGA soldering, the motherboard needs precise positioning and stable support to ensure soldering quality and avoid defects such as cold solder joints and short circuits. Traditional support carriers suffer from insufficient positioning accuracy, poor versatility, and inadequate support stability for different areas of the motherboard, affecting BGA soldering yield and production efficiency.

[0003] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create a new type of motherboard BGA soldering support carrier with greater industrial application value. Utility Model Content

[0004] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a motherboard BGA soldering support carrier.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A motherboard BGA soldering support carrier includes a carrier body with a receiving cavity in the center. The carrier body with the receiving cavity has a rectangular frame structure. The edge of the receiving cavity is provided with a positioning protrusion for initial positioning with the product positioning hole. The receiving cavity is connected to a plurality of adjustable support components, which are spaced apart and set to support different parts of the product. The sides of the carrier body are connected to clamping components for pressing the two sides of the product. The adjustable support assembly includes a support base connected to the bottom of the receiving cavity, a lifting screw connected to the support base, and a support block for supporting the product connected to the lifting screw. The clamping assembly includes a clamping arm, one end of which is hinged to the side of the carrier body, and the other end of which is connected to an elastic pressure head for clamping the product.

[0006] Preferably, the motherboard BGA soldering support carrier has a curved surface structure or a planar structure that is adapted to the product in the support block of the product.

[0007] Preferably, in the motherboard BGA soldering support carrier, the surface of the support block is covered with a heat-insulating silicone layer.

[0008] Preferably, in the motherboard BGA soldering support carrier, the surface of the positioning protrusion is provided with anti-slip stripes.

[0009] Preferably, in the motherboard BGA soldering support carrier, a temperature sensor mounting slot is provided on the side of the carrier body, and a temperature sensor is installed in the temperature sensor mounting slot.

[0010] Preferably, in the motherboard BGA soldering support carrier, the side of the carrier body is provided with heat dissipation holes that communicate with the receiving cavity.

[0011] Preferably, in the motherboard BGA soldering support carrier, the clamping arm is connected to the elastic pressure head via an adjustment knob.

[0012] Preferably, in the motherboard BGA soldering support carrier, the elastic pressure head is made of silicone material.

[0013] By means of the above solution, this utility model has at least the following advantages: 1. This utility model achieves precise positioning and stable support of the motherboard by using positioning protrusions, adjustable support components and clamping components in combination, effectively avoiding motherboard displacement during soldering and improving BGA soldering yield.

[0014] 2. The adjustable support components can be adapted to motherboards of different thicknesses and can provide differentiated support for different areas of the motherboard, enhancing versatility and adaptability.

[0015] 3. Temperature monitoring and heat dissipation design of the main body of the vehicle ensures that the temperature is controllable during the welding process and improves the stability of the vehicle and motherboard during welding; 4. The overall structure is simple, easy to operate, reusable, reduces production costs, and is suitable for large-scale electronic motherboard BGA soldering production.

[0016] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 yes Figure 1 Side view; Figure 3This is a structural schematic diagram of the adjustable support assembly of this utility model. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] Example 1 like Figure 1 , Figure 2 and Figure 3 As shown, a motherboard BGA soldering support carrier includes a carrier body 1, a receiving cavity 2 is provided in the center of the carrier body 1, the carrier body 1 with the receiving cavity has a rectangular frame structure, the edge of the receiving cavity 2 is provided with a positioning protrusion 3 for initial positioning with the product positioning hole, the receiving cavity 2 is connected to a plurality of adjustable support components 4, which are spaced apart and set for supporting different parts of the product, and the sides of the carrier body 1 are connected to a clamping component 5 for clamping the two sides of the product; The adjustable support assembly 4 includes a support base 41, which is connected to the bottom of the receiving cavity 2. A lifting screw 42 is connected to the support base 41, and a support block 43 for supporting the product is connected to the lifting screw 42. The support base is bolted to the receiving cavity. The lifting screw is a rotary lifting screw, which is used to adjust the height of the support block, adapt to motherboards of different thicknesses, and provide differentiated support for different areas of the motherboard; The clamping assembly 5 includes a clamping arm 51, one end of which is hinged to the side of the carrier body 1, and the other end of which is connected to an elastic pressure head 52 for clamping the product. By adjusting the knob, the elastic pressure head presses down on the edge of the motherboard, and together with the positioning protrusion and adjustable support components, it ensures that the motherboard is stable and does not shift during soldering.

[0022] In this embodiment, the support block 43 is provided with an arc-shaped structure or a planar structure adapted to the product. By using different surface structures to adapt to different products, more contact is achieved, improving welding accuracy.

[0023] In this embodiment, the surface of the support block 43 is covered with a heat-insulating silicone layer, which can prevent excessive welding heat from being conducted to the main body of the vehicle and affecting the structural stability.

[0024] In this embodiment, the surface of the positioning protrusion 3 is provided with anti-slip stripes to enhance the stability of the fit with the positioning hole on the motherboard.

[0025] In this embodiment, the clamping arm 51 is connected to the elastic pressure head 52 via an adjustment knob, wherein the elastic pressure head 52 is made of silicone material.

[0026] Example 2 Based on Embodiment 1, a temperature sensor mounting slot 6 is provided on the side of the carrier body 1, and a temperature sensor is installed in the temperature sensor mounting slot 6. A heat dissipation hole communicating with the receiving cavity is also provided on the side of the carrier body 1. The temperature sensor allows for real-time monitoring of the welding area's temperature, and the heat dissipation hole enables rapid heat dissipation during welding.

[0027] The working principle of this utility model is as follows: In practice, the motherboard is placed in the carrier body's receiving cavity and initially positioned using the positioning protrusions and motherboard positioning holes. Based on the motherboard thickness and support requirements, the height of the support block is adjusted by rotating the lifting screw of the adjustable support component, ensuring the support block fits the bottom surface of the motherboard. The clamping component is then operated by adjusting the knob, allowing the elastic pressure head to press down on the edge of the motherboard, thus securing it stably. During soldering, a temperature sensor monitors the temperature, and heat dissipation holes assist in heat dissipation. The adjustable support component and the clamping mechanism work together to ensure the motherboard's stable position and improve BGA soldering quality.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0031] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A motherboard BGA soldering support carrier, characterized in that: The device includes a carrier body (1), which has a receiving cavity (2) in the center. The carrier body (1) with the receiving cavity has a rectangular frame structure. The edge of the receiving cavity (2) is provided with a positioning protrusion (3) for initial positioning with the product positioning hole. The receiving cavity (2) is connected to several adjustable support components (4), which are spaced apart and set to support different parts of the product. The sides of the carrier body (1) are connected to a pressing component (5) for pressing the two sides of the product. The adjustable support assembly (4) includes a support fixing seat (41) connected to the bottom of the receiving cavity (2), and a lifting screw (42) connected to the support fixing seat (41), and a support block (43) for supporting the product connected to the lifting screw (42). The clamping assembly (5) includes a clamping arm (51), one end of which is hinged to the side of the carrier body (1), and the other end of which is connected to an elastic pressure head (52) for clamping the product.

2. The motherboard BGA soldering support carrier according to claim 1, characterized in that: The support block (43) of the product is provided with an arc surface structure or a planar structure adapted to the product.

3. A motherboard BGA soldering support carrier according to claim 2, characterized in that: The surface of the support block (43) is covered with a heat-insulating silicone layer.

4. A motherboard BGA soldering support carrier according to claim 1, characterized in that: The surface of the positioning protrusion (3) is provided with anti-slip stripes.

5. A motherboard BGA soldering support carrier according to claim 1, characterized in that: A temperature sensor mounting slot (6) is provided on the side of the vehicle body (1), and a temperature sensor is installed in the temperature sensor mounting slot (6).

6. A motherboard BGA soldering support carrier according to claim 5, characterized in that: The side of the vehicle body (1) is provided with heat dissipation holes that communicate with the receiving cavity.

7. A motherboard BGA soldering support carrier according to claim 1, characterized in that: The clamping arm (51) is connected to the elastic pressure head (52) via an adjustment knob.

8. A motherboard BGA soldering support carrier according to claim 1, characterized in that: The elastic pressure head (52) is made of silicone material.

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