Polishing and scrap removing device for valve box of fracturing pump

CN224725613UActive Publication Date: 2026-09-08ANHUI TIANYU PETROLEUMEQUIPMENT MFG CO LTD
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Patent Information

Application Number
CN202521703194.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-12
Publication Date
2026-09-08
Estimated Expiration
2035-08-12

AI Technical Summary

Technical Problem

[0004]一是工序间隔长,打磨后碎屑易残留于阀孔深处或死角,清屑不彻底,后续装配时可能因碎屑磨损密封件;

Benefits of technology

[0018] (1) The grinding component and the negative pressure chip removal function are integrated into the same device. Through the negative pressure channel opened in the shaft, while the grinding head is rotating and grinding, the negative pressure is generated by the closed space formed by the corrugated sealing cover to directly suck out the metal chips. This "grinding and chip removal at the same time" mechanism breaks through the limitations of the traditional step-by-step operation of "grinding first and then chip removal", and solves the problems of chip residue, secondary pollution and long process interval.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to fracturing pump valve box polishes and removes the device of scrap, include: the casing, polishing assembly, polishing assembly includes the axle rod, negative pressure channel and polishing head, wherein, the axle rod rotation sets up on the casing, negative pressure channel is opened in the axle rod, and one end is connected to the negative pressure source, the corrugated sealing cover, the corrugated sealing cover installs on the casing and is sealed up the valve hole and forms the closed space when the axle rod stretches into the valve hole, the other end of negative pressure channel is linked with this closed space, and drive assembly, the utility model will polish assembly and negative pressure remove the scrap function integration in the same device, through the negative pressure channel that opens in the axle rod, produces the negative pressure by the closed space of corrugated sealing cover when polishing head rotates and polishes, directly absorbs the metal scrap, this '' the mechanism of removing the scrap of edge polishing edge '', breaks through the limitation of traditional '' first polishing and then removes the scrap '' step -by -step operation, solves the problem of the residual of the debris, secondary pollution and long process interval.
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Description

Technical Field

[0001] This utility model belongs to the field of fracturing pump valve box processing technology, and specifically relates to a fracturing pump valve box grinding and chip removal device. Background Technology

[0002] As a key component for high-pressure fluid transmission, the smoothness of the valve orifice inner wall of the fracturing pump valve box directly affects its sealing performance and service life. During valve box processing or maintenance, the inner wall of the valve orifice needs to be ground to remove burrs, rust, and machining marks, followed by cleaning up the generated metal shavings to ensure the valve orifice is clean.

[0003] Currently, valve hole grinding and chip removal are mostly performed separately: first, grinding is done with a handheld grinding tool, and then chip removal is done separately using a brush, air blower, or negative pressure equipment. This method has obvious drawbacks:

[0004] Firstly, the long interval between processes means that after grinding, debris is easily left deep in the valve hole or in dead corners, and the debris is not thoroughly removed. During subsequent assembly, the debris may wear down the seals.

[0005] Secondly, during the cleaning process, debris is easily splashed, polluting the surrounding environment or scratching operators, and the efficiency of negative pressure cleaning is low in open environments. Utility Model Content

[0006] This utility model addresses the problems of existing technologies by providing a grinding and chip removal device for fracturing pump valve boxes. The specific technical solution is as follows:

[0007] The fracturing pump valve box grinding and chip removal device includes:

[0008] case;

[0009] A grinding assembly, comprising a shaft, a negative pressure channel, and a grinding head, wherein the shaft is rotatably mounted on a housing, the negative pressure channel is formed inside the shaft, and one end is connected to a negative pressure source.

[0010] A corrugated sealing cover is installed on the housing and seals the valve hole and forms a closed space when the shaft extends into the valve hole; the other end of the negative pressure channel is connected to the closed space.

[0011] and driving components.

[0012] As a further technical solution of this utility model, the drive assembly includes a drive motor, an active bevel gear and a driven bevel gear. The drive motor is installed in the housing, the active bevel gear is driven and connected to the output end of the drive motor, and the driven bevel gear is coaxially connected to the shaft and meshes with the active bevel gear.

[0013] As a further technical solution of this utility model, the drive assembly also includes a control switch, which is disposed on the housing and electrically connected to the drive motor.

[0014] As a further technical solution of this utility model, the housing includes a handle and an output part;

[0015] The drive assembly is located on the grip;

[0016] Both the grinding assembly and the corrugated sealing cover are located in the output section.

[0017] The beneficial effects of this utility model are as follows:

[0018] (1) The grinding component and the negative pressure chip removal function are integrated into the same device. Through the negative pressure channel opened in the shaft, while the grinding head is rotating and grinding, the negative pressure is generated by the closed space formed by the corrugated sealing cover to directly suck out the metal chips. This "grinding and chip removal at the same time" mechanism breaks through the limitations of the traditional step-by-step operation of "grinding first and then chip removal", and solves the problems of chip residue, secondary pollution and long process interval.

[0019] (2) The corrugated sealing cover automatically seals the valve hole when the shaft extends into the valve hole, forming a closed space to ensure that the suction of the negative pressure channel is concentrated on the grinding area, avoiding the decrease in chip removal efficiency caused by negative pressure leakage. At the same time, the corrugated structure can adapt to valve holes of different depths, ensuring the sealing effect without affecting the extension and retraction of the shaft.

[0020] (3) The drive assembly uses a meshing transmission of active and driven bevel gears to convert the axial power of the drive motor into the radial rotation of the shaft, allowing the motor to be integrated into the grip and achieving a compact layout of "grip-power source-output end". This design not only reduces the size of the device, but also enables one-handed operation through the integration of the control switch. Attached Figure Description

[0021] Figure 1 A schematic diagram of the overall structure of the fracturing pump valve box grinding and chip removal device is shown.

[0022] Figure 2 A schematic diagram of the shell structure is shown;

[0023] Figure 3 A schematic diagram of the drive component is shown.

[0024] Legend:

[0025] 100. Housing; 110. Handle; 120. Output section; 200. Grinding assembly; 210. Shaft; 220. Negative pressure channel; 230. Grinding head; 300. Corrugated sealing cover; 400. Drive assembly; 410. Drive motor; 420. Active bevel gear; 430. Driven bevel gear; 440. Control switch. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0027] Figure 1 A schematic diagram of the overall structure of the fracturing pump valve box grinding and chip removal device is shown. Figure 2 A schematic diagram of the structure of the housing 100 is shown; Figure 3 A schematic diagram of the drive component 400 is shown.

[0028] Figure 1 The fracturing pump valve box grinding and chip removal device includes a housing 100, a grinding assembly 200, a corrugated sealing cover 300, and a drive assembly 400. The grinding assembly 200 is rotatably mounted on the housing 100 and is used to extend into the valve hole to grind and suck out metal chips. The corrugated sealing cover 300 is mounted on the housing 100 and is used to block the valve hole and prevent the sucked-out metal chips. The drive assembly 400 is disposed inside the housing 100 and is used to drive the grinding assembly 200 to rotate.

[0029] The device adopts an integrated design of "grinding-chip removal-sealing". The power provided by the drive component 400 drives the grinding component 200 to rotate at high speed to grind the inner wall of the valve box. At the same time, the metal chips generated by grinding are adsorbed by negative pressure, and the corrugated sealing cover 300 fits against the surface of the valve box to form a closed space, preventing chips from splashing and ensuring that the negative pressure is effectively applied to the grinding area. The four work together to achieve a continuous operation process of "grinding, chip removal and preventing diffusion".

[0030] Figure 2 In the case 100, the housing includes a handle portion 110 and an output portion 120, wherein the handle portion 110 is used for the operator to hold, and the output portion 120 is used for grinding.

[0031] The handle 110 is ergonomically designed with anti-slip textures on the surface, conforming to the operator's hand grip posture and reducing fatigue during long-term operation.

[0032] Figure 1 Combination Figure 2 The grinding assembly 200 includes a shaft 210, a negative pressure channel 220, and a grinding head 230. The shaft 210 is rotatably mounted on the output section 120. The negative pressure channel 220 is opened inside the shaft 210 and one end is connected to a negative pressure source. The grinding head 230 is detachably mounted on the insertion end of the shaft 210.

[0033] The shaft 210 rotates at high speed under the drive assembly 400, and the grinding head 230 at its front end contacts the inner wall of the valve hole to achieve grinding. At the same time, the negative pressure source generates negative pressure in the sealed space through the negative pressure channel 220 in the shaft 210, which sucks out the metal chips generated by grinding from the valve hole and transports them to the collection device. The grinding head 230 is connected to the shaft 210 by a threaded or snap-fit ​​structure, and different models can be replaced according to the valve hole size. The coaxial design of the negative pressure channel 220 and the grinding head 230 ensures that the chips are directly sucked away and avoids residue in the valve hole.

[0034] Figure 3 In the drive assembly 400, there are drive motor 410, active bevel gear 420, driven bevel gear 430 and control switch 440. Drive motor 410 is installed in handle portion 110 of housing 100. Active bevel gear 420 is drivenly connected to the output end of drive motor 410. Driven bevel gear 430 is coaxially connected to shaft 210 and meshes with active bevel gear 420. Control switch 440 is provided on handle portion 110 of housing 100 and electrically connected to drive motor 410.

[0035] The operator starts the drive motor 410 through the control switch 440. The torque output by the motor is transmitted to the driven bevel gear 430 through the active bevel gear 420. The direction of power is changed through the meshing of the bevel gears, which drives the shaft 210 and the grinding head 230 to rotate at high speed. The control switch 440 can realize the start and stop of the motor and the speed adjustment to adapt to the grinding needs of different materials.

[0036] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A fracturing pump valve box grinding and chip removal device, characterized in that, include: Casing (100); A grinding assembly (200) includes a shaft (210), a negative pressure channel (220), and a grinding head (230). The shaft (210) is rotatably mounted on the housing (100), and the negative pressure channel (220) is opened inside the shaft (210), with one end connected to a negative pressure source. A corrugated sealing cover (300) is mounted on the housing (100) and seals the valve hole and forms a closed space when the shaft (210) extends into the valve hole. The other end of the negative pressure channel (220) is connected to the closed space. and drive components (400).

2. The fracturing pump valve box grinding and chip removal device according to claim 1, characterized in that: The drive assembly (400) includes a drive motor (410), an active bevel gear (420), and a driven bevel gear (430). The drive motor (410) is installed in the housing (100). The active bevel gear (420) is connected to the output end of the drive motor (410). The driven bevel gear (430) is coaxially connected to the shaft (210) and meshes with the active bevel gear (420).

3. The fracturing pump valve box grinding and chip removal device according to claim 2, characterized in that: The drive assembly (400) further includes a control switch (440) which is disposed on the housing (100) and electrically connected to the drive motor (410).

4. The fracturing pump valve box grinding and chip removal device according to claim 3, characterized in that: The housing (100) includes a handle (110) and a delivery portion (120); The drive assembly (400) is disposed on the handle portion (110); Both the grinding assembly (200) and the corrugated sealing cover (300) are located in the output section (120).