A domain control module and a robot

Abstract

The embodiment of the application relates to the technical field of heat dissipation, and discloses a domain control module and a robot, the domain control module comprising a mainboard, a heat dissipation assembly, a fan and a heat conduction plate; the mainboard comprising a first electronic component, a second electronic component and opposite first and second surfaces, the first electronic component being arranged on the first surface, and the second electronic component being arranged on the second surface; the heat dissipation assembly comprising a bottom plate and a fin, the bottom plate having opposite third and fourth surfaces, the fin being arranged on the third surface, and the fourth surface abutting against the first electronic component; the fan having an air outlet facing the heat dissipation assembly; and the heat conduction plate abutting against the second electronic component. In the above manner, the embodiment of the application can improve the heat dissipation efficiency of the domain control module.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a domain control module and a robot. Background Technology

[0002] In today's era of rapid development in robotics technology, robots are widely used in many fields such as industrial production, logistics and distribution, medical services, and family companionship, playing an increasingly important role. From complex and precise industrial manufacturing environments to medical scenarios with extremely high requirements for flexibility and safety, and to all aspects of daily family life, robots are gradually replacing or assisting humans in completing various tasks.

[0003] The domain control module, as the core component of a robot, is like the human brain, controlling and coordinating the robot's various functions. The domain control module integrates a large number of electronic components. These components continuously perform high-speed data processing, signal processing, and command transmission during the robot's tasks, inevitably generating a significant amount of heat. If this heat cannot be dissipated in time, it can easily lead to slow operation of the domain control module, or even burn out and cause a fire, resulting in a disaster.

[0004] Traditional natural heat dissipation methods rely solely on air convection and the motherboard's own thermal radiation for heat dissipation, which is extremely inefficient and cannot meet the heat dissipation requirements of domain control modules operating under high loads. Utility Model Content The main technical problem addressed by the embodiments of this application is to provide a domain control module and robot that can improve the heat dissipation efficiency of the domain control module.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: providing a domain control module, including a motherboard, a heat dissipation component, a fan, and a heat conduction plate; the motherboard includes a first electronic component, a second electronic component, and opposing first and second surfaces, the first electronic component being disposed on the first surface, and the second electronic component being disposed on the second surface; the heat dissipation component includes a base plate and fins, the base plate having opposing third and fourth surfaces, the fins being disposed on the third surface, and the fourth surface abutting against the first electronic component; the fan's air outlet faces the heat dissipation component; the heat conduction plate abuts against the second electronic component.

[0006] In this embodiment, by placing the first electronic component on the first surface of the motherboard and the second electronic component on the second surface of the motherboard, abutting the base plate of the heat dissipation assembly against the first electronic component of the motherboard, placing fins on the base plate, and directing the air outlet of the fan toward the heat dissipation assembly, the heat dissipation efficiency of the heat dissipation assembly for the first electronic component can be improved, thereby enhancing the heat dissipation efficiency of the domain control module. In addition, by setting a heat-conducting plate and abutting it against the second electronic component, the heat dissipation efficiency for the second electronic component can be improved, which is beneficial to further improving the heat dissipation effect of the domain control module.

[0007] In some embodiments, there are multiple fins, which are spaced apart on the fourth surface along a first direction parallel to the fourth surface and perpendicular to the extension direction of each individual fin. By providing multiple fins, the heat dissipation area of ​​the heat dissipation component can be increased. The spacing between the multiple fins facilitates contact between each fin and the air or airflow, thereby improving the heat dissipation capacity of the heat dissipation component.

[0008] In some embodiments, the distance between any two adjacent fins is equal. This arrangement reduces the resistance difference to airflow in each fluid channel, allowing airflow to be distributed more evenly to each fluid channel. This helps to reduce the temperature difference between the fins, making the heat dissipation performance of each fin more balanced, and thus helping to make the temperature inside the first electronic component more balanced.

[0009] In some embodiments, the fins are parallel to each other. This arrangement helps to improve the consistency of the shape and size of each fluid channel, thereby reducing the difference in airflow resistance between different fluid channels, making the heat dissipation performance of each fin more balanced, and helping to make the temperature inside the first electronic component more balanced.

[0010] In some embodiments, the fins are perpendicular to the base plate. This arrangement helps reduce the manufacturing difficulty of the heat dissipation components.

[0011] In some embodiments, the heat dissipation assembly includes a cover that covers the heat dissipation assembly. A base plate, the cover, and each pair of adjacent fins enclose a fluid channel. The air outlet of the fan is connected to one end of the fluid channel, and the other end of the fluid channel is open to the atmosphere. By providing the cover, and the cover, base plate, and each pair of adjacent fins enclosing the fluid channel, the airflow generated by the fan moves within the fluid channel. This facilitates more thorough contact between the airflow and the base plate and the fins, accelerates the heat exchange rate between the heat dissipation assembly and the atmosphere, and thus improves the heat dissipation efficiency of the heat dissipation assembly for the first electronic component.

[0012] In some embodiments, the domain control module further includes fasteners; in the first direction, the two fins furthest apart are a first fin and a second fin, at least one of the first fin and the second fin is provided with a clearance notch, and a fixing hole is provided on the base plate corresponding to the clearance notch; the fastener passes through the fixing hole and is fixedly connected to the motherboard. By providing clearance notches to avoid the fasteners, it is not necessary to reserve a position on the base plate for fastener locking, which helps to reduce the size of the heat dissipation component.

[0013] In some embodiments, the cover includes a cover plate, a first side plate, and a second side plate. The first side plate is connected to one end of the cover plate, and the second side plate is connected to the other end of the cover plate. The cover plate is located on the side of each fin facing away from the base plate. The first side plate abuts against the first fin and covers the clearance notch of the first fin. The second side plate abuts against the second fin and covers the clearance notch of the second fin. By covering the clearance notch with the first and second side plates, the risk of leakage at the clearance notch is reduced by reducing airflow in the fluid channel.

[0014] In some embodiments, a heat-conducting protrusion is provided on the surface of the heat-conducting plate near the motherboard. The heat-conducting protrusion abuts against the second electronic component so that the heat in the second electronic component can be transferred to the heat-conducting plate through the heat-conducting protrusion, and then transferred to other heat dissipation components or directly dissipated into the atmosphere through the heat-conducting plate.

[0015] In some embodiments, a gap exists between each fin and the cover plate in the second direction, which is perpendicular to the third surface. This arrangement helps to reduce the machining precision required for each fin and decreases the risk of interference between the fins and the cover plate, which could lead to cover plate deformation.

[0016] To address the aforementioned technical problems, another technical solution adopted in this application embodiment is: providing a robot including a shell, a battery module, and the aforementioned domain control module, both of which are housed within the shell; the battery module includes a battery cell and a battery casing, the shell and the battery casing are fixedly connected, a heat-conducting plate abuts against the battery casing on the surface opposite to the motherboard, the battery cell is housed within the battery casing, and a thermally conductive material is disposed between the battery cell and the battery casing. In this embodiment, by making the heat-conducting plate contact the battery casing, the surface area of ​​the battery casing is typically larger than the area of ​​the heat-conducting plate. Therefore, the second electronic component transfers heat to the battery casing through the heat-conducting plate, which is beneficial for improving the heat dissipation efficiency of the second electronic component.

[0017] The beneficial effects of this application embodiment are as follows: Unlike the prior art, in this application embodiment, by setting the first electronic component on the first surface of the motherboard, setting the second electronic component on the second surface of the motherboard, abutting the base plate of the heat dissipation assembly with the first electronic component of the motherboard, setting the fins on the base plate, and directing the air outlet of the fan toward the heat dissipation assembly, the heat dissipation efficiency of the heat dissipation assembly for the first electronic component can be improved, thereby improving the heat dissipation efficiency of the domain control module; in addition, by setting a heat-conducting plate and abutting the heat-conducting plate with the second electronic component, the heat dissipation efficiency for the second electronic component can be improved, which is conducive to further improving the heat dissipation effect of the domain control module. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0019] Figure 1 This is a schematic diagram of the structure of a domain control module provided in an embodiment of this application; Figure 2 This is a schematic diagram of the exploded structure of a domain control module provided in an embodiment of this application; Figure 3 This is an exploded structural diagram of a domain control module after the cover is hidden, provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a base plate and fins provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a robot provided in an embodiment of this application; Figure 6 This is an exploded structural diagram of a robot provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of a battery module provided in an embodiment of this application; Figure 8 It is along Figure 7 A schematic diagram of the structure after AA is cut open.

[0020] Attached icon number 1000, Robot; 100. Domain Controller Module; 1. Motherboard; 11. First surface; 12. Second surface; 13. First electronic component; 14. Second electronic component; 15. First screw hole; 2. Heat dissipation assembly; 21. Base plate; 211. Third surface; 212. Fourth surface; 213. Mounting hole; 22. Fin; 221. First fin; 222. Second fin; 223. Clearance notch; 23. Cover assembly; 231. Cover plate; 232. First side plate; 233. Second side plate; 24. Fluid channel; 3. Fan; 31. Air inlet; 32. Air outlet; 4. Heat-conducting plate; 41. Heat-conducting protrusion; 5. Fasteners; 6. Screw connectors; 200. Outer casing; 201. Air inlet; 202. Opening; 300. Battery module; 301. Battery cell; 302. Battery casing; 3021. Receiving slot; 400, bracket; 401, weight reduction hole; X, first direction; Y, the second direction. Detailed Implementation

[0021] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0023] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0024] Please see Figure 1 and Figure 2The domain control module 100 includes a motherboard 1, a heat dissipation component 2, a fan 3, and a heat conduction plate 4. The heat dissipation component 2 abuts against the motherboard 1 and is used to dissipate heat from the motherboard 1. The fan 3 has an air outlet 32 ​​facing the heat dissipation component 2, thereby improving the heat dissipation efficiency of the heat dissipation component 2 on the motherboard 1. The heat conduction plate 4 abuts against the motherboard 1 and is located on the side of the motherboard 1 away from the heat dissipation component 2. The heat conduction plate 4 is used to dissipate heat from the motherboard 1.

[0025] For motherboard 1 mentioned above, please refer to... Figure 2 and Figure 3 The motherboard 1 includes a first electronic component 13, a second electronic component 14, a first surface 11, and a second surface 12. The first surface 11 and the second surface 12 are opposite to each other. The first electronic component 13 is disposed on the first surface 11, and the second electronic component 14 is disposed on the second surface 12. The aforementioned heat dissipation assembly 2 abuts against the first electronic component 13, so that the first electronic component 13 can transfer heat to the heat dissipation assembly 2. The aforementioned heat-conducting plate 4 abuts against the second electronic component 14, so that the second electronic component 14 can transfer heat to the heat-conducting plate 4. In this embodiment, the heat dissipation assembly 2 dissipates heat from the first electronic component 13, and the heat-conducting plate 4 dissipates heat from the second electronic component 14, which helps to improve the heat dissipation efficiency of the domain control module 100.

[0026] In some embodiments, the first electronic component 13 may be at least one of a microcontroller unit, a digital signal processor, a chip, and a programmable gate array. The first electronic component 13 has a large computational load and generates a lot of heat. Cooling the first electronic component 13 through the heat dissipation component 2 and the heat dissipation component 2 through the fan 3 helps to improve the computing speed of the first electronic component 13, thereby improving the performance of the domain control module 100.

[0027] In some embodiments, to improve the computing power of the domain control module 100, the number of first electronic components 13 can be multiple, and multiple first electronic components 13 are in contact with the heat dissipation component 2 so that the heat dissipation component 2 can dissipate heat from multiple first electronic components 13 at the same time.

[0028] In some embodiments, the second electronic component 14 may be at least one of a MOSFET, diode, transistor, and thyristor. The second electronic component 14 generates a large amount of heat, but the heat generated by the second electronic component 14 is less than that of the first electronic component 13. Therefore, the second electronic component 14 can be cooled by the heat-conducting plate 4 without the need for an additional fan, thereby simplifying the structure of the domain control module 100 while meeting the heat dissipation requirements.

[0029] In some embodiments, the number of second electronic components 14 can be multiple, and all of the multiple second electronic components 14 are in contact with the heat-conducting plate 4 so that the heat-conducting plate 4 can dissipate heat from multiple second electronic components 14 at the same time.

[0030] For the heat dissipation component 2 mentioned above, please refer to... Figure 2 and Figure 4 The heat dissipation assembly 2 includes a base plate 21 and fins 22. The base plate 21 has a third surface 211 and a fourth surface 212 facing each other. The fins 22 are disposed on the third surface 211, and the fourth surface 212 abuts against the first electronic component 13, so that the heat of the first electronic component 13 can be transferred to the fins 22 through the base plate 21. In this embodiment, by providing the base plate 21 and fins 22, it is beneficial to increase the heat dissipation area of ​​the heat dissipation assembly 2, thereby improving the heat dissipation capacity.

[0031] In some embodiments, there are multiple fins 22, all disposed on the fourth surface 212. Along a first direction X, the multiple fins 22 are spaced apart, with the first direction X parallel to the fourth surface 212 and perpendicular to the extension direction of each individual fin 22. By providing multiple fins 22, the heat dissipation area of ​​the heat dissipation assembly 2 can be increased. The spacing between the multiple fins 22 facilitates contact between each fin 22 and the air or airflow, thereby improving the heat dissipation capacity of the heat dissipation assembly 2.

[0032] In this application, the extension direction of a single fin 22 refers to the direction that the single fin 22 points from one end to the other when viewed along the second direction Y, wherein the second direction Y is perpendicular to the third surface 211.

[0033] In some embodiments, the fin 22 may extend in a straight line from one end to the other, in which case each fin 22 is generally flat and plate-shaped.

[0034] In some embodiments, the fin 22 can be bent and extended from one end to the other, in which case each fin 22 is generally a wavy plate.

[0035] In some embodiments, please refer to Figure 1 and Figure 2 The fan 3 is located at one end of the fin 22, and the air outlet 32 ​​of the fan 3 faces the extension direction of the fin 22. The air outlet 32 ​​faces the fin 22 so that the airflow generated by the fan 3 moves along the extension direction of the fin 22, which facilitates the airflow to contact each fin 22, thereby removing the heat from the fin 22 and improving the heat dissipation efficiency of the first electronic component 13.

[0036] In some embodiments, there are multiple fans 3, each located at one end of the fin 22. The multiple fans 3 are distributed along the first direction X, and the air outlet 32 ​​of each fan 3 is parallel to the extension direction of the fin 22. Each air outlet 32 ​​faces the fin 22, so that the airflow generated by each fan 3 moves along the extension direction of the fin 22, which facilitates the airflow to contact each fin 22, thereby removing the heat from the fin 22 and improving the heat dissipation efficiency of the first electronic component 13.

[0037] In some embodiments, please refer to Figure 1 and Figure 2 The heat dissipation assembly 2 also includes a cover 23, which covers the heat dissipation assembly 2. The base plate 21, the cover 23, and each pair of adjacent fins 22 enclose a fluid channel 24. The air outlet 32 ​​of the fan 3 is connected to one end of the fluid channel 24, and the other end of the fluid channel 24 is open to the atmosphere. This allows the airflow generated by the fan 3 to flow from one end of the fluid channel 24 to the other end. During the flow through the fluid channel 24, the airflow comes into contact with the fins 22 and the base plate 21, thereby carrying away the heat from the fins 22 and the base plate 21, and then flows into the atmosphere. In this embodiment, by setting the cover 23, the cover 23, the base plate 21, and each pair of adjacent fins 22 enclose a fluid channel 24, allowing the airflow generated by the fan 3 to move within the fluid channel 24. This facilitates more thorough contact between the airflow and the base plate 21 and each fin 22, accelerating the heat exchange rate between the heat dissipation assembly 2 and the atmosphere, thereby improving the heat dissipation efficiency of the heat dissipation assembly 2 for the first electronic component 13.

[0038] In some embodiments, the distance between any two adjacent fins 22 is equal along the first direction X. That is, the dimensions of each fluid channel 24 are equal along the first direction X. This arrangement reduces the resistance difference to airflow in each fluid channel 24, allowing airflow to be distributed more evenly to each fluid channel 24. This helps to reduce the temperature difference between each fin 22, making the heat dissipation performance of each fin 22 more balanced, and thus helping to make the temperature inside the first electronic component 13 more balanced.

[0039] It is worth noting that, due to manufacturing errors, when the difference in distance between any two adjacent fins 22 does not exceed 1%, the distance between any two adjacent fins 22 should be considered equal.

[0040] In some embodiments, the fins 22 are parallel to each other. If the fins 22 are not parallel, it can easily lead to inconsistent cross-sectional shapes and dimensions of the fluid channels 24, resulting in inconsistent resistance to airflow in each fluid channel 24. This causes airflow to concentrate in the fluid channel 24 with lower resistance, which in turn can lead to large temperature differences between the fins 22, resulting in inconsistent heat dissipation performance and uneven temperature inside the first electronic component 13. Therefore, in this embodiment, the fins 22 are parallel to each other, which helps to improve the consistency of the shape and size of the fluid channels 24, thereby reducing the differences in airflow resistance between different fluid channels 24, making the heat dissipation performance of each fin 22 more balanced, and thus helping to make the temperature inside the first electronic component 13 more balanced.

[0041] It is worth noting that, due to manufacturing errors, when the included angle between the two fins 22 is less than 5°, the two fins 22 should be considered to be parallel to each other.

[0042] In some embodiments, as shown in the figure, the fins 22 and the base plate 21 are perpendicular to each other, which helps to reduce the processing difficulty of the heat dissipation assembly 2.

[0043] In some embodiments, the included angle between the fins 22 and the base plate 21 can also be an acute angle. With this configuration, the surface area of ​​the fins 22 can be increased without increasing the size of the heat dissipation assembly 2 in the second direction Y, thereby increasing the heat dissipation area of ​​the fins 22 and improving the heat dissipation capacity.

[0044] In some embodiments, please refer to Figure 2 and Figure 4 In the first direction X, the two fins 22 furthest apart are the first fin 221 and the second fin 222, respectively. At least one of the first fin 221 and the second fin 222 is provided with a clearance notch 223. A fixing hole 213 is provided on the base plate 21 corresponding to the clearance notch 223, and the fixing hole 213 penetrates the base plate 21. The domain control module 100 also includes a fastener 5, which passes through the fixing hole 213 and is connected to the motherboard 1, thereby fixing the heat dissipation component 2 to the motherboard 1. In this embodiment, by providing a clearance notch 223 to avoid the fastener 5, it is not necessary to reserve a position on the base plate 21 for the fastener 5 to be locked, which helps to reduce the size of the heat dissipation component 2.

[0045] It is worth noting that the clearance notch 223 can be provided only on the first fin 221, or only on the second fin 222, or the clearance notch 223 can be provided on both the first fin 221 and the second fin 222. This application does not limit the location and number of clearance notches 223.

[0046] In some embodiments, the fastener 5 may be a bolt. The motherboard 1 is provided with a first screw hole 15. The bolt passes through the fixing hole 213 and is screwed into the first screw hole 15, thereby fixing the heat dissipation component 2 to the motherboard 1.

[0047] In some embodiments, the cover member 23 includes a cover plate 231, a first side plate 232, and a second side plate 233. The first side plate 232 is connected to one end of the cover plate 231, and the second side plate 233 is connected to the other end of the cover plate 231. The first side plate 232 and the second side plate 233 are located on the same side of the cover plate 231. The cover plate 231 is located on the side of each fin 22 facing away from the bottom plate 21, so that the cover plate 231, the bottom plate 21, and each pair of adjacent fins 22 together enclose and form the fluid channel 24 described above. The first side plate 232 abuts against the first fin 221, and along the first direction X, the first side plate 232 covers the clearance notch 223 of the first fin 221; the second side plate 233 abuts against the second fin 222, and along the first direction X, the second side plate 233 covers the clearance notch 223 of the second fin 222. In this embodiment, by covering the clearance gap 223 with the first side plate 232 and the second side plate 233, it is beneficial to reduce the airflow in the fluid channel 24 and thus avoid the risk of leakage at the clearance gap 223.

[0048] In some embodiments, the domain control module 100 further includes a plurality of screw connectors 6, the first fin 221 is provided with a second screw hole, the second fin 222 is provided with a third screw hole, some screw connectors 6 pass through the first side plate 232 and are screwed into the second screw hole, and some screw connectors 6 pass through the second side plate 233 and are screwed into the third screw hole.

[0049] In some embodiments, the cover plate 231, the first side plate 232, and the second side plate 233 are integrally formed, and the connection between the first side plate 232 and the cover plate 231 is an arc transition, and the connection between the second side plate 233 and the cover plate 231 is an arc transition, thereby reducing the stress at the connection between the first side plate 232 and the cover plate 231 and the connection between the second side plate 233 and the cover plate 231.

[0050] In some embodiments, in the second direction Y, there is a gap between each fin 22 and the cover plate 231, that is, each fin 22 does not need to abut against the cover plate 231, which is beneficial to reduce the processing precision of each fin 22 and reduce the risk of interference between the fin 22 and the cover plate 231 causing deformation of the cover plate 231.

[0051] For the heat-conducting plate 4 mentioned above, please refer to... Figure 3 The heat-conducting plate 4 is provided with heat-conducting protrusions 41, which abut against the second electronic component 14 so that the heat in the second electronic component 14 can be transferred to the heat-conducting plate 4 through the heat-conducting protrusions 41, and then transferred to other heat dissipation components or directly dissipated into the atmosphere through the heat-conducting plate 4.

[0052] It is worth noting that the second surface 12 of the motherboard 1 is typically provided with multiple second electronic components 14, and due to the different shapes of the second electronic components 14, the different sizes of the protrusions of the second electronic components 14 onto the fourth surface 212 are different. In order to enable the second electronic components 14 of different shapes to contact the heat-conducting plate 4, in some embodiments, the number of heat-conducting protrusions 41 is multiple, with one heat-conducting protrusion 41 corresponding to one second electronic component 14, and in the second direction Y, the sum of the size of each heat-conducting protrusion 41 and the size of the corresponding second electronic component 14 is equal. This arrangement is beneficial to enable the second electronic components 14 of different shapes to abut against the heat-conducting plate 4, thereby transferring heat to the heat-conducting plate 4.

[0053] In some embodiments, at least one of thermally conductive adhesive or thermally conductive silicone grease is disposed between the first electronic component 13 and the second surface 12 of the base plate 21, thereby accelerating the heat transfer efficiency between the first electronic component 13 and the base plate 21.

[0054] In some embodiments, at least one of thermally conductive adhesive or thermally conductive grease is also provided between the second electronic component 14 and the thermally conductive protrusion 41, thereby accelerating the heat transfer efficiency between the second electronic component 14 and the heat-conducting plate 4.

[0055] In this embodiment, by setting the first electronic component 13 on the first surface 11 of the motherboard 1, setting the second electronic component 14 on the second surface 12 of the motherboard 1, abutting the base plate 21 of the heat dissipation assembly 2 against the first electronic component 13 of the motherboard 1, setting the fins 22 on the base plate 21, and directing the air outlet 32 ​​of the fan 3 toward the heat dissipation assembly 2, the heat dissipation efficiency of the heat dissipation assembly 2 for the first electronic component 13 can be improved, thereby improving the heat dissipation efficiency of the domain control module 100. In addition, by setting the heat conduction plate 4 and abutting the heat conduction plate 4 against the second electronic component 14, the heat dissipation efficiency for the second electronic component 14 can be improved, which is conducive to further improving the heat dissipation effect of the domain control module 100.

[0056] This application also provides robot embodiments; please refer to [link / reference]. Figure 5 , Figure 6 and Figure 8The robot includes a shell 200, a battery module 300, and the aforementioned domain control module 100. Both the battery module 300 and the domain control module 100 are housed within the shell 200. The battery module 300 includes a battery cell 301 and a battery casing 302. The shell 200 is fixedly connected to the battery casing 302. A heat-conducting plate 4, facing away from the main board 1, abuts against the battery casing 302 to transfer heat from the heating plate to the battery casing 302. Heat from the second electronic component 14 is also transferred to the battery casing 302 via the heat-conducting plate 4. The battery cell 301 is housed within the battery casing 302. A thermally conductive material (not shown) is disposed between the battery cell 301 and the battery casing 302. This thermally conductive material improves the heat transfer efficiency between the battery cell 301 and the battery casing 302. In this embodiment, by making the heat-conducting plate 4 contact the battery case 302, the surface area of ​​the battery case 302 is usually larger than the area of ​​the heat-conducting plate 4. Therefore, the second electronic component 14 transfers heat to the battery case 302 through the heat-conducting plate 4, which is beneficial to improving the heat dissipation efficiency of the second electronic component 14.

[0057] In some embodiments, the thermally conductive material may be thermally conductive cotton, which is elastic and easily compressed, making it easy to fill the gap between the battery cell 301 and the battery casing 302. The surface of the battery cell 301 is usually provided with wires or circuit boards. When the thermally conductive cotton fills the gap between the battery cell 301 and the battery casing 302, it can reduce the compression on the wires or circuit boards.

[0058] In some embodiments, the housing 200 is provided with an air inlet 201, which is connected to the air inlet 31 of the fan 3 and is connected to the atmosphere, so that the fan 3 can drive air in the atmosphere to enter the fluid channel 24 from the air inlet 201.

[0059] In some embodiments, the battery housing 302 is provided with a receiving groove 3021, and the end of the heat-conducting plate 4 facing away from the main board 1 is received in the receiving groove 3021. With this arrangement, on the one hand, the sidewall of the receiving groove 3021 can abut against the heat-conducting plate 4, which is beneficial to increase the contact area between the heat-conducting plate 4 and the battery housing 302; on the other hand, the size of the battery module 300 and the domain control module 100 in the second direction Y can be reduced.

[0060] In some embodiments, thermally conductive adhesive or thermally conductive grease is provided between the heat-conducting plate 4 and the battery casing 302, thereby accelerating the heat transfer efficiency between the heat-conducting plate 4 and the battery casing 302.

[0061] In some embodiments, the housing 200 has an opening 202 communicating with the atmosphere. The end of the fluid channel 24 facing away from the fan 3 is connected to the opening 202, so that the airflow from the fluid channel 24 can flow into the atmosphere through the opening 202. Furthermore, the battery housing 302 is housed within the housing 200, allowing atmospheric gas to enter the interior of the housing 200 through the opening 202, thereby contacting the battery housing 302 and carrying away at least a portion of the heat from the battery housing 200.

[0062] In some embodiments, the robot 1000 further includes a support 400 disposed on the battery housing 302, and the aforementioned fan 3 is fixedly disposed on the support 400, thereby keeping the air outlet 32 ​​of the fan 3 connected to the fluid channel 24.

[0063] In some embodiments, the support 400 is provided with a weight reduction hole 401. The hole 401 can reduce the weight of the support 400, which is beneficial to reducing the weight of the robot 1000.

[0064] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A domain controller module, characterized in that, include: The motherboard includes a first electronic component, a second electronic component, and opposing first and second surfaces, wherein the first electronic component is disposed on the first surface and the second electronic component is disposed on the second surface. A heat dissipation assembly, comprising a base plate and fins, the base plate having opposing third and fourth surfaces, the fins being disposed on the third surface, and the fourth surface abutting against the first electronic component; A fan, the air outlet of which faces the heat dissipation assembly; The heat-conducting plate comes into contact with the second electronic component.

2. The domain control module according to claim 1, characterized in that, The number of fins is multiple, and the multiple fins are spaced apart on the fourth surface along a first direction, which is parallel to the fourth surface and perpendicular to the extension direction of a single fin.

3. The domain control module according to claim 2, characterized in that, The distance between any two adjacent fins is equal; or The fins described are parallel to each other.

4. The domain control module according to claim 2, characterized in that, The fins are perpendicular to the base plate.

5. The domain control module according to claim 2, characterized in that, The heat dissipation assembly includes a cover that covers the heat dissipation assembly. The base plate, the cover, and each pair of adjacent fins enclose a fluid channel. The air outlet of the fan is connected to one end of the fluid channel, and the other end of the fluid channel is in communication with the atmosphere.

6. The domain control module according to claim 5, characterized in that, The domain control module also includes fasteners; In the first direction, the two fins that are furthest apart are the first fin and the second fin, at least one of the first fin and the second fin is provided with an avoidance notch, and the base plate is provided with a fixing hole at the location corresponding to the avoidance notch; The fastener passes through the fixing hole and is fixedly connected to the motherboard.

7. The domain control module according to claim 6, characterized in that, The cover assembly includes a cover plate, a first side plate, and a second side plate. The first side plate is connected to one end of the cover plate, and the second side plate is connected to the other end of the cover plate. The cover plate is located on the side of each fin that faces away from the bottom plate. The first side plate abuts against the first fin, and the first side plate covers the clearance notch of the first fin; the second side plate abuts against the second fin, and the second side plate covers the clearance notch of the second fin.

8. The domain control module according to claim 1, characterized in that, The heat-conducting plate has heat-conducting protrusions on its surface near the motherboard, and the heat-conducting protrusions abut against the second electronic component.

9. The domain control module according to claim 7, characterized in that, In the second direction, there is a gap between each of the fins and the cover plate, and the second direction is perpendicular to the third surface.

10. A robot, characterized in that, The device includes a housing, a battery module, and a domain control module as described in any one of claims 1-9, wherein the battery module and the domain control module are both housed within the housing. The battery module includes a battery cell and a battery casing. The outer casing is fixedly connected to the battery casing. The heat-conducting plate abuts against the battery casing on the surface away from the main board. The battery cell is housed in the battery casing. A heat-conducting material is disposed between the battery cell and the battery casing.

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