Integrated vacuum adsorption mechanical finger for semiconductor production and processing

Abstract

The utility model relates to vacuum adsorption mechanical finger technical field, concretely is a kind of integrated vacuum adsorption mechanical finger for semiconductor production and processing, it include: main finger chuck, vacuum pressure sensor main body is provided on main finger chuck;Side support finger is provided with connecting plate and side finger chuck;Beneficial effect is: plugging block carries out plugging to part main finger air passage, the quantity of main finger chuck and side finger chuck of controllable work can be controlled, cooperate connecting plate along the sliding slot sliding, change the interval between side support finger and finger main body, the wafer is adsorbed by main finger chuck and side finger chuck, so that the finger that side support finger and finger main body form can be adapted to different size wafer and carry out stable handling, strong adaptability, improve the stability when wafer is carried, and the finger main body and side support finger are all pasted into shape hot-pressing tank high-pressure curing process using carbon fiber prepreg, so that the device is more light and thin, high strength.

Description

Technical Field

[0001] This utility model relates to the field of vacuum adsorption mechanical fingers, specifically an integrated vacuum adsorption mechanical finger for semiconductor manufacturing and processing. Background Technology

[0002] Vacuum adsorption mechanical fingers are intelligent devices that use the principle of vacuum adsorption to grasp objects. With built-in vacuum pumps and suction cup structures, they are widely used in the field of industrial automation for the handling and assembly of lightweight materials.

[0003] In existing technologies, vacuum adsorption mechanical fingers are typically used to handle wafers during semiconductor manufacturing.

[0004] However, traditional vacuum adsorption mechanical fingers are made of metal or plastic, which makes them quite thick, and they are difficult to stably adsorb and transport wafers of different sizes, resulting in low adaptability. Utility Model Content

[0005] The purpose of this invention is to provide an integrated vacuum adsorption mechanical finger for semiconductor manufacturing and processing, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an integrated vacuum adsorption mechanical finger for semiconductor manufacturing and processing, comprising: a main finger suction cup, a vacuum pressure sensor body disposed on the main finger suction cup, the main finger suction cup being connected to a main finger air passage opened inside the finger body, a sealing block and a moving plate disposed in a square groove opened in the finger body, a sliding groove opened on the finger body, and the finger body and the side support fingers being manufactured using a high-pressure curing process in a thermostatic press using carbon fiber prepreg for bonding and molding; The side-supporting finger is equipped with a connecting plate and a side-finger suction cup. The side-finger suction cup is connected to the side-finger airway, and the side-finger airway is connected to the main finger airway through the connecting airway.

[0007] Preferably, the side finger suction cup is fixedly installed on the side support finger, the side support finger has a side finger air passage, a connecting air passage is fixedly connected to the side finger air passage, and a sealing gasket is fixedly connected to the connecting air passage. The sealing gasket has a square annular plate structure and can slide along one end of the main finger air passage.

[0008] Preferably, a connecting plate is fixedly connected to the side of the side-supporting finger. The connecting plate has an "I"-shaped plate structure, and one end of the connecting plate is inserted into a sliding groove opened on the finger body. The sliding groove has a "convex" groove structure.

[0009] Preferably, the connecting plate can slide along the groove, the threaded hole on the connecting plate is threadedly connected to the screw, the screw is fixedly connected to the drive shaft of the micro motor, and the micro motor is fixedly installed on the finger body.

[0010] Preferably, a square groove is provided on the finger body, the square groove has a square groove structure, a miniature electric actuator is provided in the square groove, the miniature electric actuator is fixedly installed on the finger body, and the telescopic end of the miniature electric actuator is fixedly connected to the moving plate.

[0011] Preferably, the movable plate has an "L" shaped plate structure, and a sealing block is fixedly connected to the movable plate. The sealing block and the movable plate form a complete square plate structure and can slide along the square groove.

[0012] Preferably, a vacuum pressure sensor body is fixedly installed on the main finger suction cup, the main finger suction cup is fixedly installed on the finger body, and the main finger suction cup is connected to the main finger air channel opened on the finger body, and the main finger air channel is connected to the suction hole opened on the finger body.

[0013] Compared with the prior art, the beneficial effects of this utility model are: This invention proposes an integrated vacuum adsorption mechanical finger for semiconductor manufacturing. By sealing part of the air passage of the main finger with a sealing block, the number of working main finger suction cups and side finger suction cups can be controlled. In conjunction with the connecting plate sliding along the groove, the distance between the side support finger and the finger body can be changed. The main finger suction cup and the side finger suction cups adsorb the wafer, so that the finger composed of the side support finger and the finger body can stably transport wafers of different sizes, improving the stability during wafer transport. Moreover, the finger body and the side support finger are both made of carbon fiber prepreg bonded and formed by autoclave high-pressure curing process, making the device thinner, lighter, and stronger, improving the device's performance. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the device structure of this utility model; Figure 2 This is a partial structural diagram of the device of this utility model; Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle; Figure 4 This is a schematic cross-sectional view of part of the structure of the device of this utility model; Figure 5 for Figure 4 Enlarged structural diagram at point B; Figure 6 for Figure 4 Enlarged structural diagram at point C; Figure 7 for Figure 4 Enlarged structural diagram at point D.

[0015] In the diagram: 1. Finger body; 2. Side-supporting finger; 3. Vacuum pressure sensor body; 4. Main finger suction cup; 5. Side finger suction cup; 6. Suction hole; 7. Micro motor; 8. Screw; 9. Connecting plate; 10. Slide groove; 11. Main finger air passage; 12. Micro electric actuator; 13. Square groove; 14. Moving plate; 15. Sealing block; 16. Side finger air passage; 17. Connecting air passage; 18. Sealing gasket. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0017] Example 1 Please see Figures 1-7 This utility model provides a technical solution: an integrated vacuum adsorption mechanical finger for semiconductor manufacturing and processing, comprising: a main finger suction cup 4, on which a vacuum pressure sensor body 3 is disposed, the main finger suction cup 4 being connected to a main finger air channel 11 opened in the finger body 1, a sealing block 15 and a moving plate 14 being disposed in a square groove 13 opened in the finger body 1, a sliding groove 10 being opened on the finger body 1, and the finger body 1 and the side support finger 2 being manufactured by bonding carbon fiber prepreg into a high-pressure curing process in a hot autoclave; the side support finger 2, on which a connecting plate 9 and a side finger suction cup 5 are disposed, the side finger suction cup 5 being connected to a side finger air channel 16, and the side finger air channel 16 being connected to the main finger air channel 11 through a connecting air channel 17; The vacuum pressure sensor body 3 involved in this utility model is a vacuum pressure sensor manufactured by HELM in Germany. In practical use, both the main body 1 and the side support fingers 2 are bonded and formed using carbon fiber prepreg through a high-pressure curing process in an autoclave, making the device thinner, lighter, and stronger. The main body 1 is equipped with a vacuum pressure sensor to monitor the adsorption pressure in real time, ensuring the stability and reliability of the adsorption process. The side support fingers 2 are connected to the main body 1 via a connecting plate 9 and are adjustable along the slide groove 10, allowing for flexible changes in the distance between the side support fingers 2 and the main body 1 to accommodate wafers of different sizes. Furthermore, in conjunction with the blocking of part of the main finger air passage 11, the number of working main finger suction cups 4 and side finger suction cups 5 can be flexibly controlled to optimize adsorption efficiency.

[0018] Example 2 In order to improve the adaptability of the finger, a connecting plate 9 is provided based on the first embodiment. The connecting plate 9 can slide along the slide groove 10. The threaded hole on the connecting plate 9 is threadedly connected to the screw 8. The screw 8 is fixedly connected to the drive shaft of the micro motor 7. The micro motor 7 is fixedly installed on the finger body 1. The micro motor 7 is started by an external control mechanism to drive the screw 8 to rotate. The screw 8 rotates along the threaded hole on the connecting plate 9. A connecting plate 9 is fixedly connected to the side of the side-supporting finger 2. The connecting plate 9 has an "I"-shaped plate structure. One end of the connecting plate 9 is inserted into a groove 10 opened on the finger body 1. The groove 10 has a "convex" groove structure, as shown in the example. Figure 3 The lower end of the connecting plate 9 is locked in the slide groove 10, and the connecting plate 9 can slide along the slide groove 10. The screw 8 rotates along the threaded hole on the connecting plate 9, which allows the connecting plate 9 and the side support finger 2 to slide along the slide groove 10. The connecting air passage 17 slides along one end of the main finger air passage 11, changing the distance between the side support finger 2 and the finger body 1. This makes the handling of larger wafers more stable, so that the finger composed of the side support finger 2 and the finger body 1 can be adapted to the stable handling of wafers of different sizes, thus improving the stability of wafer handling. A vacuum pressure sensor body 3 is fixedly mounted on the main finger suction cup 4. The main finger suction cup 4 is fixedly mounted on the finger body 1, and the main finger suction cup 4 is connected to the main finger air channel 11 opened on the finger body 1. The main finger air channel 11 is connected to the suction hole 6 opened on the finger body 1. Through an external suction device connected to the suction hole 6, air is drawn in, generating a negative pressure in the main finger air channel 11. The main finger suction cup 4 then adsorbs the wafer. When the main finger suction cup 4 adsorbs the wafer, a negative pressure is generated inside the main finger suction cup 4. The pressure acts directly on the diaphragm of the vacuum pressure sensor body 3, causing a change in the sensor's resistance. The electronic circuit detects this change and converts it into a standard signal corresponding to this pressure. The negative pressure is monitored by the vacuum pressure sensor body 3, which detects the negative pressure inside the main finger suction cup 4 and the pipe at the end connection of the main finger suction cup 4. When the air pressure inside the main finger suction cup 4 is too high or too low, the external suction device can be adjusted by the control device to keep the generated negative pressure at a reasonable level and ensure the stability of wafer adsorption. The vacuum pressure sensor body 3 is installed in the pipe at the end connection of the main finger suction cup 4. The vacuum pressure sensor body 3 can monitor the negative pressure in the pipe at the end connection of the main finger suction cup 4. The end connection of the main finger suction cup 4 is connected to the main finger air channel 11, and the generated negative pressure is monitored by the vacuum pressure sensor body 3 during the process. The side finger suction cup 5 is fixedly installed on the side support finger 2. The side support finger 2 has a side finger air channel 16. A connecting air channel 17 is fixedly connected to the side finger air channel 16. A sealing gasket 18 is fixedly connected to the connecting air channel 17. The sealing gasket 18 has a square annular plate structure. The sealing gasket 18 can slide along one end of the main finger air channel 11. The sealing gasket 18 can improve the sealing between the connecting air channel 17 and the main finger air channel 11. The side finger air channel 16 and the main finger air channel 11 are connected through the connecting air channel 17. The wafer is adsorbed by the side finger suction cup 5. The side finger air channel 16 and the connecting air channel 17 on the side finger suction cup 5 are isolated from the side finger air channels 16 and the connecting air channels 17 on other side finger suction cups 5. The side finger air channel 16 and the connecting air channel 17 on the side finger suction cup 5 are connected to the main finger air channel 11 on the adjacent main finger suction cup 4.

[0019] Example 3 To improve the usability of the finger based on Embodiment 2, a movable plate 14 is provided. The movable plate 14 has an "L"-shaped plate structure, and a sealing block 15 is fixedly connected to the movable plate 14. The sealing block 15 and the movable plate 14 form a complete square plate structure that can slide along the square groove 13. The main finger suction cup 4 of the finger body 1 is connected to a separate main finger air channel 11. The separate main finger air channel 11 eventually converges at the sealing block 15, as shown in the example. Figure 7The three separate main finger airways 11 shown converge and can be blocked by the blocking block 15. The main finger suction cup 4 on the main finger airway 11 closest to the blocking block 15 is closest to the suction port 6, while the main finger suction cup 4 on the main finger airway 11 furthest from the blocking block 15 is furthest from the suction port 6. A square groove 13 is provided on the finger body 1. The square groove 13 has a square groove structure. A micro electric push rod 12 is provided in the square groove 13. The micro electric push rod 12 is fixedly installed on the finger body 1. The telescopic end of the micro electric push rod 12 is fixedly connected to the moving plate 14. The wafer is usually placed on the end of the finger body 1 away from the air inlet 6. When the wafer does not completely cover all the main finger suction cups 4, the vacuum pressure sensor body 3 can detect that there is a continuous pressure loss. The control device can start the micro electric push rod 12 to push the moving plate 14 and the sealing block 15 to move along the square groove 13. The sealing block 15 blocks the main finger air passage 11 connected to the main finger suction cup 4 near the air inlet 6. The number of working main finger suction cups 4 can be controlled to avoid continuous pressure loss of the device. Through the above, the device can adapt to the adsorption and handling of wafers of different sizes.

[0020] In practical use, the sealing block 15 can be used to block part of the main finger air passage 11, which can control the number of working main finger suction cups 4 and side finger suction cups 5. With the connecting plate 9 sliding along the slide groove 10, the distance between the side support finger 2 and the finger body 1 can be changed. The main finger suction cup 4 and the side finger suction cup 5 can adsorb the wafer, so that the finger composed of the side support finger 2 and the finger body 1 can stably transport wafers of different sizes, improving the stability of wafer transport. Moreover, the finger body 1 and the side support finger 2 are both made of carbon fiber prepreg bonded and formed by autoclave high pressure curing process, making the device thinner, stronger and improving the device's performance. By adjusting the distance between the side support finger 2 and the finger body 1 and the number of working main finger suction cups 4 and side finger suction cups 5, wafers of various sizes can be stably transported to meet the diverse process requirements in semiconductor production. The vacuum pressure sensor body 3 works in conjunction with multiple suction cups to ensure that the wafer is firmly adsorbed and there is no risk of displacement or falling off during transport. The application of carbon fiber material makes the finger structure thinner and lighter, while also having excellent mechanical strength and extending the service life of the equipment.

[0021] This integrated vacuum adsorption robotic finger boasts superior performance, a compact design, and high efficiency, making it suitable for wafer handling scenarios in semiconductor manufacturing where precision and stability are paramount. By precisely matching the dynamic load and bending stiffness requirements of semiconductor manufacturing equipment, it achieves the following technological breakthroughs: 1. Gradient reinforcement material design Key stress areas: High-modulus carbon fiber unidirectional prepreg T800 grade is combined with high-performance pitch-based carbon fiber to ensure that the mechanical fingers have a bending strength of 1250MPa and an elastic modulus of 378GPa when handling wafers at high speed, meeting the stability requirements of high-precision processes such as photolithography and etching.

[0022] Non-critical parts: Multi-axial braided prepreg (±45° layup) is used to achieve an overall weight reduction of more than 35% by optimizing material density while ensuring structural integrity, and at the same time maintaining a coefficient of thermal expansion of <1ppm / °C.

[0023] 2. Precision molding process Prepreg Lamination: Laser-assisted precision lamination technology is used to ensure that the laying accuracy of each layer of prepreg is controlled within ±0.1mm, avoiding stress concentration caused by interlayer misalignment.

[0024] Autoclave curing: Through a progressive pressurization process (0.1 MPa / min) combined with real-time infrared thermal imaging monitoring, the internal porosity is reduced to below 0.2% after curing, significantly improving the homogeneity of the material.

[0025] 3. Enhanced environmental adaptability Chemical corrosion resistance: The matrix resin adopts a nano-siloxane modified epoxy system, which can operate stably for more than 8,000 hours in the etching chamber (Cl2 / CF4 environment) and the cleaning tank (SC-1 / SO2 environment).

[0026] Thermal stability: The glass transition temperature (Tg) is increased to 220°C, ensuring dimensional stability in high-temperature processes such as thin film deposition, and the radial coefficient of thermal expansion is <1ppm / °C.

[0027] 4. Balancing lightweight design and high rigidity Structural optimization: By designing internal honeycomb-shaped reinforcing ribs through topology optimization algorithm, the mechanical finger maintains a torsional stiffness of 0.8 N·m while weighing only 42% of the traditional aluminum alloy solution.

[0028] Dynamic performance: Modal analysis verifies that its natural frequency reaches 285Hz, ensuring no resonance risk during high-speed handling (≥2m / s), and the handling accuracy can reach ±25μm.

[0029] 5. Surface treatment technology Low particle release: The surface is treated with plasma to achieve a roughness Ra < 0.1 μm, ensuring no particulate contamination when in contact with the wafer and meeting Class 1 cleanroom standards.

[0030] Antistatic coating: Through the embedded conductive fiber network design, the surface resistivity is controlled between one million and one hundred million ohms, effectively preventing wafer damage caused by electrostatic adsorption.

[0031] Practical application effect When the robotic finger is fully loaded with a 300mm wafer (weighing approximately 100g): Radial deformation < 0.03 mm (better than the industry standard of 0.05 mm) Service life ≥ 20 million cycles (traditional aluminum alloy solutions have a service life of approximately 8 million cycles). The cleaning and maintenance cycle has been extended to 6 months (compared to 3 months for traditional solutions). This design, through the deep integration of materials science and precision manufacturing, provides a vacuum adsorption mechanical finger solution for semiconductor manufacturing equipment that combines lightweight, high rigidity, durability and cleanliness, and is particularly suitable for higher precision processes such as EUV lithography and advanced packaging (2.5D / 3DIC).

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated vacuum suction mechanical finger for semiconductor production processing, characterized by: The integrated vacuum adsorption mechanical finger for semiconductor manufacturing includes: a main finger suction cup (4), a vacuum pressure sensor body (3) on the main finger suction cup (4), the main finger suction cup (4) being connected to the main finger air passage (11) opened in the finger body (1), a sealing block (15) and a moving plate (14) being provided in the square groove (13) opened in the finger body (1), a sliding groove (10) being opened on the finger body (1), and the finger body (1) and the side support finger (2) being produced by bonding carbon fiber prepreg in a high-pressure curing process in an autoclave; Side support finger (2), with a connecting plate (9) and a side finger suction cup (5) provided on the side support finger (2). The side finger suction cup (5) is connected to the side finger airway (16), and the side finger airway (16) is connected to the main finger airway (11) through the connecting airway (17).

2. The integrated vacuum chucking robot finger for semiconductor production and processing according to claim 1, characterized in that: The side finger suction cup (5) is fixedly installed on the side support finger (2). The side support finger (2) has a side finger air passage (16). A connecting air passage (17) is fixedly connected to the side finger air passage (16). A sealing gasket (18) is fixedly connected to the connecting air passage (17). The sealing gasket (18) has a square ring plate structure and can slide along one end of the main finger air passage (11).

3. The integrated vacuum suction mechanical finger for semiconductor production and processing according to claim 1, characterized in that: The side support finger (2) is fixedly connected to a connecting plate (9). The connecting plate (9) has an "I" shaped plate structure. One end of the connecting plate (9) is inserted into a groove (10) opened on the finger body (1). The groove (10) has a "convex" groove structure.

4. The integrated vacuum chucking robot finger for semiconductor production and processing according to claim 1, characterized in that: The connecting plate (9) can slide along the slide groove (10). The threaded hole on the connecting plate (9) is threadedly connected to the screw (8). The screw (8) is fixedly connected to the drive shaft of the micro motor (7). The micro motor (7) is fixedly installed on the finger body (1).

5. The integrated vacuum chucking robot finger for semiconductor production and processing according to claim 1, characterized in that: The finger body (1) is provided with a square groove (13), which is a square groove structure. A miniature electric push rod (12) is provided in the square groove (13). The miniature electric push rod (12) is fixedly installed on the finger body (1), and the telescopic end of the miniature electric push rod (12) is fixedly connected to the moving plate (14).

6. The integrated vacuum chucking robot finger for semiconductor manufacturing processes according to claim 1, characterized in that: The movable plate (14) has an "L" shaped plate structure. A sealing block (15) is fixedly connected to the movable plate (14). The sealing block (15) and the movable plate (14) form a complete square plate structure and can slide along the square groove (13).

7. The integrated vacuum chucking robot finger for semiconductor manufacturing according to claim 1, wherein: The main finger suction cup (4) is fixedly installed with a vacuum pressure sensor body (3). The main finger suction cup (4) is fixedly installed on the finger body (1). The main finger suction cup (4) is connected to the main finger air passage (11) opened on the finger body (1). The main finger air passage (11) is connected to the suction hole (6) opened on the finger body (1).

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