Joint module and robot

Abstract

The utility model relates to the technical field of electronic device heat dissipation, and provide a joint module and robot, the joint module includes bladeless fan, heat conducting layer, PCB board, drive mechanism and casing, the drive mechanism sets up in the casing, the PCB board sets up above the drive mechanism, and is located the upper end opening department of casing, the heat conducting layer is attached to the PCB board upper surface, and the lower surface shape of heat conducting layer is compatible with the upper surface shape of the PCB board (40) of contact part, the bladeless fan is flat structure, the lower surface of bladeless fan is attached to the upper surface of heat conducting layer, the upper end of bladeless fan is opened with first air inlet, the side end of bladeless fan is opened with first air outlet. Through the cooperation of heat conducting layer and flat structure's bladeless fan, and the installation position relation of drive mechanism, PCB board and casing, the overall installation space is saved, and the heat dissipation efficiency is improved in the limited space.

Description

Technical Field

[0001] This utility model relates to the field of robot joint technology, and more specifically, to a joint module and a robot. Background Technology

[0002] Heat dissipation is a critical factor affecting the performance of robot joints. During operation, robot joints generate significant heat, primarily from the power devices in their actuators. If this heat cannot be dissipated promptly, the entire actuator temperature will rise continuously. When the temperature reaches the device's threshold thermal throttling temperature, the device automatically enters a power-reducing operation state. Furthermore, when the temperature climbs further to the device's maximum junction temperature, the device triggers a protection mechanism and stops operation. Neither power-reducing operation nor protection-based shutdown meets the requirements for continuous robot joint operation, severely impacting its output performance and operational stability.

[0003] However, the heat dissipation structure of robot joints is not yet perfect. Most of them improve heat dissipation capacity by adding more complex channels and cooling components, but this goes against the trend of robot joints developing towards intensification and miniaturization. Utility Model Content

[0004] The technical problem to be solved by this invention is: how to improve heat dissipation within a limited space.

[0005] This utility model provides a joint module, including a bladeless fan, a heat-conducting layer, a PCB board, a drive mechanism, and a housing. The drive mechanism is disposed inside the housing, and the PCB board is disposed above the drive mechanism and located at the upper opening of the housing. The heat-conducting layer is attached to the upper surface of the PCB board, and the shape of the lower surface of the heat-conducting layer is adapted to the shape of the upper surface of the PCB board (40) at the contact portion. The bladeless fan has a flat structure, and the lower surface of the bladeless fan is attached to the upper surface of the heat-conducting layer. A first air inlet is opened at the upper end of the bladeless fan, and a first air outlet is opened at the side end of the bladeless fan.

[0006] Optionally, the thermally conductive layer is a thermally conductive silicone layer, and the bladeless fan is bonded to the upper surface of the thermally conductive layer; or, the bladeless fan is used to connect to the PCB board.

[0007] Optionally, the PCB board is provided with a pre-drive module, a resistor and a transistor, and the thermal conductive layer covers the pre-drive module, the resistor and the transistor respectively.

[0008] Optionally, the joint module further includes an end cap that covers the bladeless fan and is connected to the housing.

[0009] Optionally, the upper end of the end cap is provided with a second air inlet corresponding to the first air inlet, and the side end of the end cap is provided with a second air outlet corresponding to the first air outlet.

[0010] Optionally, the edge of the end cap is connected to the upper end of the housing via a connector, and the position on the end cap corresponding to the bladeless fan is configured with a protruding structure adapted to the shape of the bladeless fan.

[0011] Optionally, the driving mechanism includes a motor and a reducer, the motor and the reducer are driven together, and the motor is electrically connected to the PCB board.

[0012] Optionally, the joint module further includes a heat spreader plate disposed between the bladeless fan and the heat-conducting layer.

[0013] Optionally, the bladeless fan includes a housing, and the bottom of the housing has an air duct that communicates with the first air inlet and the first air outlet respectively.

[0014] Compared with the prior art, the joint module provided by this utility model has the following technical effects: The joint module provided by this utility model can be applied to robot joints. By setting a drive mechanism inside the housing and placing a PCB board above the drive mechanism at the upper opening of the housing, the drive mechanism and PCB board serve as the drive power devices of the joint module. Heat generated during operation can be dissipated through the upper opening of the housing, i.e., the PCB board, while maintaining a compact overall structure. Furthermore, by attaching a heat-conducting layer to the upper surface of the PCB board, with the lower surface of the heat-conducting layer conforming to the shape of the upper surface of the PCB board at the contact point, the heat generated during PCB board operation and the heat transferred to the PCB board by the drive mechanism can be conducted more evenly and efficiently, thus compensating for the PC... The unevenness of the upper surface of the B-board facilitates the installation of a bladeless fan on the upper surface of the heat-conducting layer. By designing a flat bladeless fan with a first air inlet at the top and a first air outlet at the side, its flat structure saves installation space. Furthermore, the elimination of blades for air intake and exhaust further conserves space. Simultaneously, fresh air drawn in from outside the housing through the first air inlet at the top is directly blown towards the lower end, the end attached to the heat-conducting layer, for effective cooling. Heat is then expelled through the first air outlet at the side, which is also the side of the opening at the top of the housing. This avoids interfering with the intake of fresh air at the top and prevents it from being blown back into the housing, thus improving the heat dissipation efficiency of this joint module. Through this structural design, the cooperation between the heat-conducting layer and the flat bladeless fan, as well as the installation positions of the drive mechanism, PCB board, and housing, overall installation space is saved, the structure is more compact and rational, and heat dissipation efficiency is improved within a limited space.

[0015] In addition, this utility model also provides a robot, including the aforementioned joint module.

[0016] Compared with the prior art, the robot provided by this utility model, by setting the above-mentioned joint module, has roughly the same technical effect as the above-mentioned joint module, and will not be described in detail here. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of the joint module according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the joint module in an embodiment of the present invention. Figure 1 ; Figure 3 This is a schematic diagram of the joint module in an embodiment of the present invention. Figure 2 ; Figure 4 This is a schematic diagram of the joint module in an embodiment of the present invention. Figure 3 ; Figure 5 This is a schematic diagram of the joint module in an embodiment of the present invention. Figure 4 ; Figure 6 This is a schematic diagram of the structure of the bladeless fan according to an embodiment of the present invention. Figure 1 ; Figure 7 This is a schematic cross-sectional view of the bladeless fan according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the bladeless fan according to an embodiment of the present invention. Figure 2 ; Figure 9 This is a schematic diagram of the vibration unit of the bladeless fan according to an embodiment of the present invention. Figure 1 ; Figure 10 This is a schematic diagram of the vibration unit of the bladeless fan according to an embodiment of the present invention. Figure 2 ; Figure 11 This is a schematic diagram of the vibration unit of the bladeless fan according to an embodiment of the present invention. Figure 3 .

[0018] Explanation of reference numerals in the attached figures: 10-Bladeless fan, 11-First air inlet, 12-First air outlet, 13-Casing, 14-Air duct, 15-Groove, 16-Spring, 17-Piezoelectric ceramic, 20-Heat-conducting layer, 30-End cap, 31-Second air inlet, 32-Second air outlet, 40-PCB board, 41-Pre-drive module, 42-Resistor, 43-Transistor, 50-Motor, 60-Reducer, 70-Housing. Detailed Implementation

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0020] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in sequences other than those illustrated or described herein.

[0021] In the description of this utility model, the orientation or positional relationship indicated by terms such as "up", "down", "left", "right", "top", "bottom", "front", "back", "inner" and "outer" is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing this utility model and is not intended to indicate or imply that the device referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the scope of protection of this utility model.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] In the description of this specification, references to terms such as "embodiment," "one embodiment," and "one implementation" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or implementation is included in at least one embodiment or illustrative embodiment of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or implementation. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or implementations.

[0024] To solve the above technical problems, such as Figures 1 to 3 As shown, this utility model embodiment provides a joint module, including a bladeless fan 10, a heat-conducting layer 20, a PCB board 40, a drive mechanism, and a housing 70. The drive mechanism is disposed inside the housing 70, and the PCB board 40 is disposed above the drive mechanism and located at the upper opening of the housing 70. The heat-conducting layer 20 is attached to the upper surface of the PCB board 40, and the shape of the lower surface of the heat-conducting layer 20 is adapted to the shape of the upper surface of the PCB board 40 at the contact portion. The bladeless fan 10 has a flat structure, and the lower surface of the bladeless fan 10 is attached to the upper surface of the heat-conducting layer 20. A first air inlet 11 is opened at the upper end of the bladeless fan 10, and a first air outlet 12 is opened at the side end of the bladeless fan 10.

[0025] It should be noted that, as Figure 2 As shown, taking the joint module of a humanoid robot as an example, its drive unit, namely the PCB board 40, is equipped with components such as a pre-drive module 41, resistors 42, and transistors 43. During operation, these components generate a large amount of heat, and their shapes are varied and uneven. At this time, such as... Figure 3 As shown, by attaching a heat-conducting layer 20 that is adapted to the shape of the PCB board 40, on the one hand, the heat-conducting layer 20 can fill the gaps between high-power components, enabling efficient and uniform heat conduction; on the other hand, it can compensate for the unevenness of the upper surface of the PCB board 40 to a certain extent, making it easier to attach and connect the heat-conducting layer 20 to the bladeless fan 10 without gaps. This not only facilitates installation but also makes heat conduction more efficient and reliable.

[0026] Specifically, such as Figure 4 As shown, the bladeless fan 10 has a flat overall structure. Its upper first air inlet 11 is for fresh air intake, and its side first air outlet 12 is for hot air exhaust. Unlike traditional bladed fans, the bladeless fan 10 has no blades inside. It draws in air through multiple internal vibration units, creating internal airflow that is then exhausted through the first air outlet, carrying away heat. Figures 9 to 11 As shown, the bladeless fan 10 has multiple vibration units inside. Each vibration unit includes two opposing reeds 16, and piezoelectric ceramics 17 are respectively disposed on the reeds 16. During operation, as... Figure 10 As shown, when a positive voltage is applied to the piezoelectric ceramic 17, the piezoelectric ceramics 17 repel each other under the influence of the electric field, causing the two spring plates 16 to bend outwards, as shown. Figure 11 As shown, when a reverse voltage is applied, the piezoelectric ceramics 17 attract each other under the influence of the electric field, causing the two spring plates 16 to bend inward. This alternating application of voltage causes the spring plates 16 to vibrate at high frequency, generating a fan-like effect that propels airflow and creates wind pressure, causing air to flow in through the first air inlet 11 and exit through the first air outlet 12. Simultaneously, heat conducted through the heat-conducting layer 20 is transferred to the bladeless fan 10, which then dissipates the heat.

[0027] Furthermore, the housing 70 is a groove-shaped structure with an opening at the top. The drive mechanism and the PCB board 40 are both drive components of the joint module, which will generate a lot of heat during operation. By arranging the bladeless fan 10, the heat-conducting layer 20, the PCB board 40 and the drive mechanism from top to bottom, a heat dissipation path is formed from bottom to top, that is, to the opening at the top of the housing 70. The structure is compact and does not occupy extra space.

[0028] In related technologies, the heat dissipation methods for robot joints are mainly divided into two categories: one is passive heat dissipation, which uses thermally conductive silicon pads to conduct the heat generated by the power devices to the metal back cover housing. However, this method has low heat dissipation power and is difficult to meet actual heat dissipation needs. The other is active heat dissipation, which cools the power devices by adding bladed fans or external air sources. However, this method not only increases the complexity of the mechanism, but also has a large demand for structural space, which is contrary to the trend of robot joints developing towards intensification and miniaturization.

[0029] In this embodiment, the joint module provided can be applied to robot joints. By setting a drive mechanism within the housing 70 and placing the PCB board 40 above the drive mechanism at the upper opening of the housing 70, the drive mechanism and PCB board 40 serve as the drive power devices for the joint module. Heat generated during operation can be dissipated from the upper opening of the housing 70, i.e., the PCB board 40, while maintaining a compact overall structure. Furthermore, by attaching a heat-conducting layer 20 to the upper surface of the PCB board 40, with the lower surface of the heat-conducting layer 20 conforming to the shape of the upper surface of the PCB board 40 at the contact portion, the heat generated during operation of the PCB board 40 and the heat transferred from the drive mechanism to the PCB board 40 can be conducted more evenly and efficiently, thus mitigating the heat loss caused by the PCB board 40. The unevenness on the upper surface of the PCB board 40 is compensated to facilitate the installation of the bladeless fan 10 on the upper surface of the heat-conducting layer 20. By setting the bladeless fan 10 with a flat structure and a first air inlet 11 at its upper end and a first air outlet 12 at its side end, its flat structure saves more installation space and eliminates the need for blades for air intake and exhaust, further saving installation space. At the same time, fresh air is drawn in from outside the housing 70 through the first air inlet 11 at the upper end and blown directly to its lower end, which is the end attached to the heat-conducting layer 20, for direct and effective cooling and heat dissipation. The heat is discharged from the first air outlet 12 at the side end, which is also the side of the opening at the upper end of the housing 70. This does not affect the intake of fresh air at the upper end, nor does it blow it back into the housing 70, thus improving the heat dissipation efficiency of this joint module. Through the above structural design, the cooperation between the heat-conducting layer 20 and the flat bladeless fan 10, as well as the installation position relationship between the drive mechanism, PCB board 40 and housing 70, the overall installation space is saved, the structure is more compact and reasonable, and the heat dissipation efficiency is improved in a limited space.

[0030] Optionally, such as Figures 1 to 3 As shown, the thermal conductive layer 20 is a thermally conductive silicone layer, and the bladeless fan 10 is bonded to the upper surface of the thermal conductive layer 20, or the bladeless fan 10 is used to connect to the PCB board 40.

[0031] Specifically, the heat-conducting layer 20 can be made of silicone grease with thermal conductivity, which is convenient for production and assembly. At the same time, the bladeless fan 10 can be connected to the PCB board 40 by means of fasteners such as screws, which is convenient for connection.

[0032] In this embodiment, by setting the heat-conducting layer 20 as a heat-conducting silicone layer, it is convenient to purchase, produce and assemble. The silicone material is easy to mold, that is, easy to fill the gaps on the upper surface of the PCB board 40, and easy to form a plane, which is conducive to the installation of the bladeless fan 10. It also has a certain degree of adhesion, which is convenient to bond the bladeless fan 10. In addition, by connecting the bladeless fan 10 to the PCB board 40, the overall connection strength can be improved and the stability of the structure can be improved.

[0033] Optionally, such as Figures 1 to 3 As shown, the PCB board 40 is provided with a pre-drive module 41, a resistor 42 and a transistor 43, and the heat-conducting layer 20 covers the pre-drive module 41, the resistor 42 and the transistor 43 respectively.

[0034] Specifically, the PCB board 40 is also provided with other power devices that generate heat during operation. At the same time, the heat-conducting layer 20 can cover the other power devices to further improve the uniformity of heat conduction.

[0035] In this embodiment, a pre-drive module 41, a resistor 42, and a transistor 43 are provided on the PCB board 40 to meet the functional requirements of the PCB board 40 as a joint module driver. The heat-conducting layer 20 covers these core heat-generating devices, allowing the heat generated by each power device to be directly and centrally conducted to the bladeless fan 10 through the heat-conducting layer 20, avoiding local heat accumulation on the PCB board 40. This targeted coverage design ensures that the heat from different heat-generating devices can be efficiently discharged, and the overall heat-conducting layer 20 achieves balanced heat transfer. Combined with the active heat dissipation of the bladeless fan 10, the cooling efficiency of the heat dissipation system for each core device is further improved, effectively preventing individual devices from affecting the overall module's operating performance due to overheating. The synergistic effect of the heat dissipation components is maximized within a limited space.

[0036] Optionally, such as Figure 1 and Figure 4 As shown, the joint module also includes a heat spreader plate, which is disposed between the bladeless fan 10 and the heat-conducting layer 20.

[0037] Specifically, the heat spreader is an aluminum plate with good thermal conductivity, and it is a thin plate. It should also be noted that, for example... Figure 2 As shown, components such as the pre-drive module 41, resistor 42, and transistor 43 on the PCB board 40 of the joint module generate varying amounts of heat due to their different power and functions, resulting in uneven heat distribution on the same plane. This means that uneven heat distribution occurs on the upper surface of the heat-conducting layer 20. However, the heat absorption surface formed by the cooling air on the lower surface of the bladeless fan 10 is relatively uniform. In this case, by adding a heat spreader, the heat generated by multiple components with uneven heat distribution can be effectively balanced and homogenized onto the heat spreader, further improving the uniformity and efficiency of heat dissipation.

[0038] In this embodiment, by setting a heat spreader between the bladeless fan 10 and the heat-conducting layer 20, the different heat in different parts of the PCB board 40 can be effectively balanced and homogenized. Through the heat conduction of the heat spreader itself, the different heat in different parts is evenly conducted on the heat spreader, so that the bladeless fan 10 itself evenly absorbs heat and cools the heat spreader, which improves the heat dissipation balance performance, that is, makes more reasonable use of the cold source and improves the heat dissipation efficiency.

[0039] Optionally, such as Figure 1 and Figure 4 As shown, the lower surface of the heat spreader is provided with a concave-convex structure that matches the shape of the upper surface of the PCB board 40 and / or the thermal conductive layer 20.

[0040] It should be noted that the thermal conductive layer 20 itself is a soft structure, such as a thermally conductive silicone layer. During installation and use, components on the PCB board 40 may protrude from the thermal conductive layer 20, causing gaps between the thermal conductive layer 20 and the heat spreader. Alternatively, the protrusions of components on the PCB board 40 may cause the surface of the thermal conductive layer 20 to be uneven, thereby affecting heat conduction.

[0041] In this embodiment, when the components on the PCB board 40 protrude from the heat-conducting layer 20, the surface opposite to the lower surface of the vapor chamber includes both the upper surface of the PCB board 40 and the upper surface of the heat-conducting layer 20. By setting the lower surface of the vapor chamber to a concave-convex structure that matches the shape of the upper surfaces of the PCB board 40 and the heat-conducting layer 20, it can fit more tightly with the components on the PCB board 40 and the heat-conducting layer 20, preventing gaps between them and ensuring more effective and reliable heat conduction, further improving heat dissipation efficiency. Alternatively, when the heat-conducting layer 20 completely covers the components to be cooled on the PCB board 40, that is, when the surface opposite to the lower surface of the vapor chamber is only the upper surface of the heat-conducting layer 20, the lower surface of the vapor chamber only matches the shape of the upper surface of the heat-conducting layer 20.

[0042] Optionally, such as Figure 1 and Figure 5 As shown, the joint module also includes an end cap 30, which covers the bladeless fan 10 and is connected to the housing 70.

[0043] Specifically, the end cap 30 is made of aluminum with good thermal conductivity, and its shape is adapted to the bladeless fan 10 to cover and protect the bladeless fan 10. At the same time, the edge of the end cap 30 is connected to the upper opening of the housing 70, for example, by screws or bolts, to ensure structural strength. Furthermore, the specific shape of the end cap 30 can be adapted to the specific structure of the application. For example, the end cap 30 also has a notch to avoid the power supply of the joint module, etc., which are not specifically limited here.

[0044] In this embodiment, by covering the bladeless fan 10 with an end cap 30, interference from other foreign objects or other components with the bladeless fan 10 or the PCB board 40 can be prevented, effectively protecting the bladeless fan 10, the heat-conducting layer 20 and the PCB board 40, and improving the structural stability of this joint module.

[0045] Optionally, such as Figure 1 , Figure 4 and Figure 5 As shown, the upper end of the end cover 30 is provided with a second air inlet 31 corresponding to the first air inlet 11, and the side end of the end cover 30 is provided with a second air outlet 32 ​​corresponding to the first air outlet 12.

[0046] Specifically, there are multiple first air inlets 11 and multiple second air inlets 31, with their locations and shapes adapted to each other, such as... Figure 4 and Figure 5 As shown, both the first air inlet 11 and the second air inlet 31 are slit-shaped, which effectively prevents foreign objects from entering the bladeless fan 10 without affecting air intake. Of course, the shapes of the first air inlet 11 and the second air inlet 31 can also be other, and are not specifically limited here. Simultaneously, multiple first air outlets 12 and second air outlets 32 can be provided, and the number is not specifically limited. Preferably, the gap between the end cover 30 and the bladeless fan 10 is set as small as possible to further save installation space without affecting heat conduction. Furthermore, dustproof nets can be installed at the positions of the second air inlet 31 and the second air outlet 32 ​​inside the end cover 30 to more effectively prevent foreign objects from entering the bladeless fan 10, further improving overall stability.

[0047] In this embodiment, by providing a second air inlet 31 corresponding to the first air inlet 11 at the upper end of the end cover 30 and a second air outlet 32 ​​corresponding to the first air outlet 12 at the side end, the space is further effectively utilized, so that the air inlet and exhaust channels are not affected by the end cover 30, thus ensuring efficient heat dissipation.

[0048] Optionally, such as Figure 1 and Figure 5 As shown, the edge of the end cap 30 is connected to the upper end of the housing 70 through a connector, and the end cap 30 is provided with a protruding structure at the position corresponding to the bladeless fan 10, which is adapted to the shape of the bladeless fan 10.

[0049] Specifically, the end cap 30 has an overall circular structure with a flange structure at its edge. It is connected to the upper end face of the housing 70 by means of fasteners such as screws or bolts, making the structure more stable and robust.

[0050] In this embodiment, by connecting the end cap 30 to the upper end of the housing 70 via a connector, the stability of the structure is ensured, and the protection of components such as the bladeless fan 10 and the PCB board 40 is strengthened. Furthermore, the position on the end cap 30 corresponding to the bladeless fan 10 is set as a protruding structure that adapts to the shape of the bladeless fan 10, while the rest of the structure is relatively recessed. This ensures that the end cap 30 fits more closely to the upper surface of the housing 70, reducing the gap between the end cap 30 and components such as the bladeless fan 10 and the PCB board 40, which is more conducive to heat transfer, further improving heat dissipation efficiency, and taking up less structural space.

[0051] Optionally, such as Figure 1 As shown, the driving mechanism includes a motor 50 and a reducer 60, which are driven together. The motor 50 is electrically connected to the PCB board 40.

[0052] Specifically, the drive mechanism may also include other components, such as transmission elements and circuits. The motor 50 and the reducer 60 are the core components of the drive mechanism and are also components that generate a lot of heat during operation. They are both located below the PCB board 40. The heat transfer path is also through the PCB board 40 to the heat conduction layer 20, and active heat dissipation is carried out by the bladeless fan 10 to ensure the effectiveness of the heat dissipation path.

[0053] In this embodiment, by configuring the drive mechanism to include a motor 50 and a reducer 60, and connecting them in a drive connection and electrically connecting them to the PCB board 40, the power transmission path of the motor 50 and the reducer 60 is made more direct and efficient, ensuring stable drive performance. Both are positioned below the PCB board 40, forming a compact vertical layout with the PCB board 40, the heat-conducting layer 20, and the bladeless fan 10, further optimizing the overall space utilization and meeting the miniaturization requirements of the joint module. The electrical connection between the motor 50 and the PCB board 40 ensures efficient transmission of control signals. Combined with the aforementioned heat dissipation structure for targeted heat dissipation of the core components on the PCB board 40, the drive mechanism can dissipate heat in a timely manner while operating efficiently, avoiding the problem of excessively high temperatures caused by the superposition of heat generated by the motor 50 and the reducer 60 with the heat of the PCB board 40. Thus, a synergistic improvement in drive performance and heat dissipation efficiency is achieved within a limited space, ensuring the continuous and stable operation of the joint module.

[0054] Optionally, such as Figure 4 , Figure 6 and Figure 7 As shown, the bladeless fan 10 includes a housing 13, and the bottom of the housing 13 has an air duct 14 that communicates with the first air inlet 11 and the first air outlet 12 respectively.

[0055] Specifically, the housing 13, especially its lower base plate, can be made of a material with good thermal conductivity, such as aluminum or copper, to improve heat transfer efficiency. Furthermore, it should be noted that several vibration units are also installed inside the housing 13, located above the air duct 14. These vibration units vibrate to draw in fresh air, introducing it into the air duct 14 and accelerating its flow. Figure 7 The solid arrow in the middle points to the direction of airflow, and heat is exchanged and carried away from the bottom of its air duct 14, which is the bottom of the housing 13, and discharged from the first air outlet 12. The air duct 14 is formed by the lower surface of several vibration units and the bottom plate of the housing 13, as well as the side wall of the housing 13. Of course, the housing 13 also contains structures such as a drive circuit board, as well as a power supply that can be connected to the joint module to ensure the effective operation of the bladeless fan 10.

[0056] In this embodiment, by setting a bladeless fan 10 with a housing 13, on the one hand, the structural strength of the bladeless fan 10 is guaranteed, making it sturdy and durable. On the other hand, the bottom inside the housing 13 can form an air duct 14 that communicates with the first air inlet 11 and the first air outlet 12 through the bottom plate of the housing 13 itself, making reasonable use of the structural space and improving the heat dissipation efficiency in a limited space.

[0057] Optionally, such as Figure 4 and Figure 8 As shown, the lower surface of the bladeless fan 10 is provided with a groove 15, and the groove 15 is connected to the first air inlet 11 and the first air outlet 12 respectively.

[0058] It should be noted that the bladeless fan 10 can be used without the housing 13, as long as its lower surface has a groove 15. When the bladeless fan 10 without the housing 13 is attached to the heat-conducting layer 20 or the heat spreader, the groove 15 on its lower surface is equivalent to being snapped onto the heat-conducting layer 20 or the heat spreader, thereby forming a channel structure for airflow and enabling more direct heat exchange. Specifically, the bottom of the groove 15 is connected to the first air inlet 11, and the first air outlet 12 is opened on the side wall of the groove 15.

[0059] In this embodiment, by providing grooves 15 on the lower surface of the bladeless fan 10 that communicate with the first air inlet 11 and the first air outlet 12 respectively, the bladeless fan 10 can be directly attached to the heat-conducting layer 20 or the heat-spreading plate during use. This is equivalent to fastening the grooves 15 onto the heat-conducting layer 20 or the heat-spreading plate, thereby forming a channel structure for airflow between the grooves 15 and the upper surface of the heat-conducting layer 20 or the heat-spreading plate. This allows the heat from the heat-conducting layer 20 or the heat-spreading plate to be carried away directly during airflow, enabling more direct heat exchange and further improving heat dissipation efficiency.

[0060] In addition, such as Figures 1 to 5 As shown, another embodiment of the present invention provides a robot including the joint module described above.

[0061] For example, the robot is a humanoid robot, comprising multiple joint modules as described above.

[0062] In this embodiment, the robot provided by this embodiment, by setting the above-mentioned joint module, has roughly the same technical effect as the above-mentioned joint module, and will not be described again here.

[0063] Although the present invention has been disclosed above, its protection scope is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the protection scope of the present invention.

Claims

1. A joint module, characterized in that, The device includes a bladeless fan (10), a heat-conducting layer (20), a PCB board (40), a drive mechanism, and a housing (70). The drive mechanism is located inside the housing (70). The PCB board (40) is located above the drive mechanism and at the upper opening of the housing (70). The heat-conducting layer (20) is attached to the upper surface of the PCB board (40), and the shape of the lower surface of the heat-conducting layer (20) is adapted to the shape of the upper surface of the PCB board (40) at the contact portion. The bladeless fan (10) has a flat structure, and the lower surface of the bladeless fan (10) is attached to the upper surface of the heat-conducting layer (20). The upper end of the bladeless fan (10) is provided with a first air inlet (11), and the side end of the bladeless fan (10) is provided with a first air outlet (12).

2. The joint module according to claim 1, characterized in that, The heat-conducting layer (20) is a heat-conducting silicone layer. The bladeless fan (10) is bonded to the upper surface of the heat-conducting layer (20), or the bladeless fan (10) is connected to the PCB board (40).

3. The joint module according to claim 2, characterized in that, The PCB board (40) is provided with a pre-drive module (41), a resistor (42) and a transistor (43), and the heat-conducting layer (20) covers the pre-drive module (41), the resistor (42) and the transistor (43) respectively.

4. The joint module according to claim 1, characterized in that, The joint module also includes an end cap (30), which covers the bladeless fan (10) and is connected to the housing (70).

5. The joint module according to claim 4, characterized in that, The upper end of the end cap (30) is provided with a second air inlet (31) corresponding to the first air inlet (11), and the side end of the end cap (30) is provided with a second air outlet (32) corresponding to the first air outlet (12).

6. The joint module according to claim 4, characterized in that, The edge of the end cap (30) is connected to the upper end of the housing (70) by a connector, and the position on the end cap (30) corresponding to the bladeless fan (10) is set with a protruding structure adapted to the shape of the bladeless fan (10).

7. The joint module according to claim 1, characterized in that, The driving mechanism includes a motor (50) and a reducer (60), the motor (50) and the reducer (60) are driven together, and the motor (50) is electrically connected to the PCB board (40).

8. The joint module according to claim 1, characterized in that, The joint module also includes a heat spreader plate, which is disposed between the bladeless fan (10) and the heat-conducting layer (20).

9. The joint module according to claim 1, characterized in that, The bladeless fan (10) includes a housing (13), and the bottom of the housing (13) has an air duct (14) that communicates with the first air inlet (11) and the first air outlet (12) respectively.

10. A robot, characterized in that, Includes the joint module as described in any one of claims 1-9.

Images