A structure for cleaning the inter-die residue after cutting

Abstract

The utility model relates to display screen manufacturing technical field discloses a kind of structures of cleaning after cutting Die piece interstock, including pinout base, pinout, iron ring, magnetic material, drop recovery module and material removing device;Pinout is located pinout base lower surface and corresponds with Wafer cutting lane, pinout base can be horizontally adjusted vertically;The whole of iron ring, UV film and Wafer is fixed by magnetic material;Material removing device is located in recovery module and corresponds with pinout one to one.Operation, after magnetic fixation whole, pinout is aligned cutting lane extrusion UV film, then excess material is ejected, and material removing device removes excess material horizontally.The utility model reaches the effect of removing after cutting slender excess material, improves the work efficiency of Die bonding, both can make excess material flat protrude downward, also reduce the risk of breaking UV film, finally, through drop recovery device, the excess material protruding downward is dropped and cleaned.

Description

Technical Field

[0001] This utility model patent belongs to the field of display screen manufacturing technology, specifically relating to a structure for cleaning up residual material between die pieces after cutting. Background Technology

[0002] In the field of micro-display technology, especially in high-end applications such as AR / VR near-eye displays and micro-projectors, silicon-based Micro OLEDs have become core display devices due to their ultra-high pixel density and tiny chip size. In the fabrication process of these devices, wafer dicing and die bonding are crucial steps determining mass production yield. The wafer needs to be cut into individual dies along a pre-defined dicing path using a laser or diamond cutting wheel. After dicing, the dies are temporarily fixed with a UV film, and after UV debonding, they are transferred to a drive substrate by a pick-up device to complete bonding. However, during the dicing process, thin, elongated remnants with a width of only 0.225mm remain between the dies. These remnants consist of silicon substrate or metal electrode cutting residue. Furthermore, due to the localized temperature increase during dicing, the adhesive on the UV film surface is prone to slight secondary curing, resulting in a significantly higher adhesion between the remnants and the UV film compared to the dies. This becomes a core bottleneck restricting the efficiency and yield of subsequent die bonding.

[0003] In existing processes, there is no specific procedure or method for removing excess material after cutting between debonding and die bonding. Currently, similar methods involve using ejector pins to push the die sheet out for easy machine adhesion. If the excess material is not removed, operators must use tweezers to slowly remove it bit by bit during die bonding, reducing work efficiency. Therefore, a method for cleaning up small pieces of excess material is needed to solve the aforementioned problem. Utility Model Content

[0004] The purpose of this invention is to use a magnetic material to attract a wafer with an iron ring, align the pins with the cutting path, and push the pins to open the detachment and recycling module under the wafer, thereby realizing a method to clean up the long and thin scraps between the cut die pieces.

[0005] Based on the above concept, the technical solution adopted by this utility model is as follows: A structure for cleaning up residual material between die pieces after cutting includes a pin base, pins, an iron ring, magnetic material, a detachment and recycling module, and a material removal device; The pin header is disposed on the lower surface of the pin header base; The iron ring, UV film, and wafer are connected as a whole and placed on the magnetic material; The detachment and recycling module is funnel-shaped and contains a material detachment device. The detachment and recycling module is located below the iron ring.

[0006] Preferably, the lower surface of the pin header base is provided with a plurality of pin headers for fixed connection.

[0007] Preferably, the positions of the plurality of needle rows correspond to the positions of the cutting channels on the wafer.

[0008] Preferably, the pin header base has degrees of freedom in the horizontal and vertical directions.

[0009] Preferably, the spacing between the pins is 0.1~0.2mm.

[0010] Optionally, the material of the pin header can be any one of tungsten steel, silicon carbide, and high-speed steel.

[0011] Preferably, an iron ring is fixed around the UV film, the wafer is adhered to the UV film, and the iron ring is attracted and fixed by a magnetic material.

[0012] Preferably, the shedding and recycling module is equipped with several material removal devices.

[0013] Preferably, the position of the unloading device corresponds one-to-one with the needle array, and the unloading device can move in the horizontal direction.

[0014] Preferably, the method for cleaning the structure includes the following steps: S1. Place the iron ring on the magnetic material and fix it in place; S2. Adjust the needle array base to align the needle array with the cutting track on the wafer; S3. Adjust the position of the needle array base and the needle array up and down so that the needle array contacts and presses against the UV film; S4. Adjust the detachment and recovery module to align the detachment device with the residual material. After alignment, move the pin base and pins downward. After the residual material is detached, the detachment device moves horizontally to carry away the residual material.

[0015] The beneficial effects of this utility model are as follows: 1. This utility model uses magnetic material to attract the wafer with iron rings. After alignment, the pins are aligned with the cutting channel. Pushing the pins open the detachment and recycling module under the wafer, which can push out and clean the thin and long residual material between the dies. This solution achieves the effect of removing thin and long residual material after cutting and improves the working efficiency of die bonding.

[0016] 2. This utility model pushes the excess material downwards by using a pin array, which not only allows the excess material to protrude downwards smoothly, but also reduces the risk of puncturing the UV film. Finally, the excess material that protrudes downwards is removed and cleaned up by a detachment and recycling device. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a top view of the needle array device of this utility model.

[0019] Figure 3 This is a schematic diagram of the ejection of residual material for unloading according to this utility model.

[0020] Figure 4 This is a schematic diagram of the structure of the wafer, UV film and iron ring of this utility model.

[0021] In the diagram: 1. Pin header base; 2. Pin header; 3. Iron ring; 4. Wafer; 5. Magnetic material; 6. Drop-off and recycling module; 8. Material removal device; 9. Residual material; and 10. UV film. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0023] like Figures 1 to 4 As shown, this utility model includes a pin array base, pin array, iron ring, magnetic material, a detachment and recycling module, and a material unloading device; The pin header is disposed on the lower surface of the pin header base; The iron ring, UV film, and wafer are connected as a whole and placed on the magnetic material; The detachment and recycling module is funnel-shaped and contains a material detachment device. The detachment and recycling module is located below the iron ring.

[0024] In this embodiment, several pins 2 are fixed on the lower surface of the pin base 1. The pins 2 are made of tungsten steel and are fixedly connected by precision bonding. The pins 2 are spaced apart, and their arrangement positions correspond exactly to the cutting tracks on a typical wafer 4, ensuring that they can accurately act on the area above the waste material 9. At the same time, the pin base 1 is equipped with horizontal and vertical drive mechanisms, giving it degrees of freedom in the horizontal (X / Y axis) and vertical (Z axis) directions, and enabling position adjustment with an accuracy of ±0.01mm.

[0025] Furthermore, the pin header 2 is made of silicon carbide, high-speed steel, and other hard materials.

[0026] Furthermore, the spacing of the pin header 2 is 0.1~0.2mm, and in this embodiment the spacing of the pin header 2 is 0.15mm.

[0027] In this embodiment, the magnetic material 5 is fixed in the center of the workbench, and its adsorption area matches the outer diameter of the iron ring 3, ensuring that the iron ring 3 can be stably adsorbed after placement without any risk of displacement.

[0028] In this embodiment, the detachment and recovery module 6 is designed as a funnel-shaped structure to facilitate the centralized collection of residual material 9 and prevent it from scattering. Several material removal devices 8 are installed inside the detachment and recovery module 6. The number of material removal devices 8 is the same as that of the pin header 2, and their positions correspond one-to-one with the pin header 2. The material removal devices 8 are equipped with horizontal driving components so that they can move in the horizontal direction. When the detached residual material 9 comes into contact with the material removal device 8, the residual material 9 falls off the pin header 2 under the action of horizontal friction.

[0029] In this embodiment, the specific operation is as follows: The pre-assembled "iron ring 3-UV film 10-Wafer 4" is placed on the magnetic material 5, wherein the Wafer 4 is initially adhered to the upper surface of the UV film 10, forming an inseparable whole. When the iron ring 3 contacts the magnetic material 5, it is firmly attracted and fixed under the action of magnetic force, preventing the Wafer 4 from undergoing horizontal displacement or tilting in subsequent operations, and providing a stable reference for subsequent alignment and pushing.

[0030] In this embodiment, the horizontal drive mechanism of the pin header base 1 is activated, and the position of the pin header base 1 in the X / Y axis direction is adjusted. Using the cutting mark on the surface of the wafer 4 as a visual reference, the pin header base 1 is gradually moved so that the pins 2 below are precisely aligned with the cutting marks on the wafer 4, ensuring that the axis of each pin 2 coincides with the center line of the corresponding cutting mark. If it is necessary to adapt to different sizes of wafer 4, the arrangement spacing of the pins 2 can be adjusted or the pin header base 1 can be replaced, always ensuring that the pins 2 correspond to the cutting marks.

[0031] In this embodiment, the vertical drive mechanism of the pin header base 1 is activated, and the positions of the pin header base 1 and the pin header 2 are slowly adjusted downwards: the pin header 2 is controlled to approach the UV film 10 at a speed of 0.02 mm / s until the pin header 2 contacts the lower surface of the UV film 10 and generates slight pressure. At this time, the UV film 10 is slightly deformed locally by the pressure, creating space for the subsequent removal of the excess material 9, while avoiding excessive pressure that could damage the UV film 10. The pressure is continued for 10 seconds, causing the contact area between the UV film 10 and the excess material 9 to show a slight tendency to separate due to deformation, thus weakening the adhesion between the two.

[0032] In this embodiment, the position of the detachment and recycling module 6 is adjusted: the funnel-shaped detachment and recycling module 6 is moved directly below the iron ring 3 so that the detachment device 8 inside the module is aligned with the remaining material 9 on the wafer 4. Visual calibration is used to ensure that the gripping port of the detachment device 8 is facing the area below the remaining material 9.

[0033] After alignment, the vertical drive mechanism of the pin header base 1 is restarted to control the pin header 2 to continue moving downward by 0.5mm: the pin header 2 pushes the excess material 9 through the deformation area of ​​the UV film 10, so that the excess material 9 overcomes the residual adhesion with the UV film 10 and comes out from the cutting channel of the wafer 4.

[0034] When the residual material 9 is completely ejected and reaches the upper surface of the ejector device 8, the horizontal drive component of the ejector device 8 is activated: the ejector device 8 moves horizontally, causing the residual material 9 to fall off the pin 2 and enter the funnel area of ​​the ejection and recycling module 6, and finally send the residual material 9 into the preset waste collection box.

[0035] After all the unloading devices 8 have finished removing the remaining material 9, reverse the adjustment of the pin base 1 to the initial position, turn off the magnetic force of the magnetic material 5, and remove the cleaned "iron ring 3-UV film 10-Wafer 4" as a whole to complete the single remaining material cleaning operation.

[0036] In this embodiment, the entire process requires no manual intervention. Through the precise coordination of each component, the inefficiency and error of traditional tweezers cleaning can be avoided, and the risk of the ejector pin puncturing the UV film can be reduced. At the same time, the funnel-shaped detachment and recovery module 6 can ensure that the remaining material 9 does not scatter. The one-to-one correspondence between the material detachment device 8 and the pin 2 ensures the integrity of the cleaning and significantly improves the efficiency of subsequent Diebonding.

[0037] As is known from common technical knowledge, this utility model can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

Claims

1. A structure for cleaning up residual material between die sheets after cutting, characterized in that, It includes a pin base (1), pins (2), iron ring (3), magnetic material (5), a detachment and recycling module (6), and a material removal device (8); The pin header (2) is disposed on the lower surface of the pin header base (1); The iron ring (3), UV film (10) and wafer (4) are connected as a whole and placed on the magnetic material (5); The detachment and recycling module (6) is funnel-shaped and has a material removal device (8) inside. The detachment and recycling module is located below the iron ring (3).

2. The structure for cleaning residual material between die pieces after cutting, as described in claim 1, is characterized in that, The lower surface of the pin base (1) is provided with several pins (2) fixedly connected, and the positions of the pins (2) correspond to the cutting channels on the wafer (4).

3. The structure for cleaning up residual material between die pieces after cutting, as described in claim 1, is characterized in that, The pin header base (1) has degrees of freedom in the horizontal and vertical directions.

4. The structure for cleaning up residual material between cut die sheets according to claim 1, characterized in that, The center-to-center spacing of the pin array (2) is 0.1~0.2mm.

5. The structure for cleaning residual material between die pieces after cutting, as described in claim 1, is characterized in that, An iron ring (3) is fixed around the UV film (10), a wafer (4) is adhered to the UV film (10), and the iron ring (3) is attracted and fixed by a magnetic material (5).

6. The structure for cleaning residual material between die pieces after cutting, as described in claim 1, is characterized in that, The shedding and recycling module (6) is equipped with several shedding devices (8), the positions of the shedding devices (8) correspond one-to-one with the needles (2), and the shedding devices (8) can move in the horizontal direction.

7. The structure for cleaning up residual material between die pieces after cutting, as described in claim 1, is characterized in that, The material of the pin header (2) can be any one of tungsten steel, silicon carbide and high-speed steel.

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