IC material pipe extrusion molding die

Abstract

The utility model discloses an IC material pipe extrusion molding mould relates to extrusion molding mould technical field, including butt joint mechanism, the surface of butt joint mechanism is provided with temperature maintenance mechanism, the inside of butt joint mechanism one end is provided with shaping mechanism, and the shaping mechanism includes the mounting piece. The utility model discloses through the shaping assembly design of multiple groups different forming cavity, when replacing the specification, need not integral dismounting the connection of butt joint pipe and extruding machine, just need to dismount the bolt of mounting piece and mounting frame, plug the external shape frame, can replace target shaping assembly, and the die changing process is simplified, and the time consumption is significantly reduced compared with traditional integral dismounting mode, positioning deviation caused by the frequent dismounting of butt joint mechanism is avoided simultaneously, and production efficiency is improved, and the fan -shaped flow cavity of butt joint mechanism can feed to multiple shaping assemblies simultaneously, and according to the demand, the same specification or different specification shaping assembly is selected, and a variety of different models IC material pipes can be produced in single time.

Description

Technical Field

[0001] This utility model relates to the field of extrusion molding die technology, specifically to an IC tube extrusion molding die. Background Technology

[0002] Traditional IC tube extrusion molds are mainly used in the electronics manufacturing industry to form plastic tubes for IC chip packaging through extrusion. Through a specific structure within the mold cavity, molten plastic is molded into a tubular structure with precise slots that fit the IC pin spacing, providing physical protection for the IC chip and preventing pin deformation or chip damage due to collisions or friction during transportation and storage. It is a key production equipment for post-production packaging of IC components.

[0003] However, in the scenario of small-batch, multi-specification IC tube production, traditional molds are mostly fixed integrated structures. Tubes with different internal cavity shapes require different molds. When changing them, the connection with the extruder needs to be completely disassembled. The mold change alone is time-consuming and affects the molding accuracy. At the same time, only one type of IC tube can be produced at a time, resulting in low production efficiency and difficulty in adapting to the rapidly iterating multi-specification needs of the electronics manufacturing industry. Utility Model Content

[0004] This invention provides an IC tube extrusion molding die to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] An IC tube extrusion molding die includes a docking mechanism, a temperature maintaining mechanism on the surface of the docking mechanism, a shaping mechanism inside one end of the docking mechanism, a mounting component, a mounting cavity inside the mounting component, a shaping component inserted into the mounting cavity, the shaping component including an outer frame, an inner core inside the outer frame, and a molding cavity formed between the inner wall of the outer frame and the inner core.

[0007] A further improvement of the present invention is that the docking mechanism includes a connecting pipe, a fan-shaped flow cavity is provided on one side of the connecting pipe, an installation frame is provided on one side of the fan-shaped flow cavity, and the end of the connecting pipe away from the fan-shaped flow cavity is connected to the discharge end of the extruder through a connecting flange.

[0008] A further improvement of the present invention is that the temperature maintaining mechanism includes a protective cover, the protective cover is disposed on the surface of the mounting frame, and a display screen is disposed on the surface of the protective cover.

[0009] A further improvement of this utility model is that an electric heating plate with a built-in temperature sensor is fixedly connected inside the protective cover and on the surface of the mounting frame, and the temperature sensor inside the electric heating plate is electrically connected to the display screen.

[0010] A further improvement of this utility model is that: the surface of the outer frame is inserted into the interior of the mounting cavity, the end of the inner core is fixedly connected to the inner wall of the outer frame, and the other end of the outer frame is bolted to the interior of the mounting component.

[0011] A further improvement of this utility model is that the shaping component is provided with multiple sets of internal molding cavities of different shapes, and one side of the inner cavity of the molding cavity is connected to the interior of the fan-shaped flow cavity.

[0012] A further improvement of this utility model is that: the surface of one end of the mounting component is inserted into the interior of the mounting frame, and one end of the mounting component is bolted to the end of the mounting frame away from the fan-shaped flow cavity.

[0013] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0014] This utility model provides an IC tube extrusion molding die. Through the design of multiple sets of molding components with different molding cavities, it is not necessary to completely disassemble the connection between the connecting tube and the extruder when changing specifications. Only the bolts of the mounting parts and the mounting frame need to be removed and the outer frame needs to be plugged in to replace the target molding component. The mold change process is simplified and the time consumption is significantly reduced compared to the traditional whole mold disassembly. At the same time, it avoids the positioning deviation caused by frequent disassembly and assembly of the docking mechanism, thus improving production efficiency. The fan-shaped flow cavity of the docking mechanism can simultaneously supply material to multiple sets of molding components. According to the needs, the same or different specifications of molding components can be selected. Multiple different models of IC tubes can be produced in a single batch. Compared with the traditional single-model production mode, the production efficiency is significantly improved. It is suitable for small-batch, multi-specification production scenarios, taking into account both efficiency and versatility. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a side view of the present invention.

[0017] Figure 3 This is an exploded structural diagram of the present invention;

[0018] Figure 4 This is a side view of the disassembled structure of this utility model;

[0019] Figure 5 This is an exploded structural diagram of the shaping component of this utility model.

[0020] In the diagram: 11. Connecting pipe; 12. Fan-shaped flow cavity; 13. Mounting frame; 21. Protective cover; 22. Display screen; 23. Electric heating plate; 31. Mounting component; 32. Mounting cavity; 33. Outer frame; 34. Inner core; 35. Molding cavity. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to embodiments:

[0022] Example 1, as Figures 1-5 As shown, this utility model provides an IC tube extrusion molding die, including a docking mechanism, a temperature maintaining mechanism on the surface of the docking mechanism, and a shaping mechanism inside one end of the docking mechanism. The shaping mechanism includes a mounting component 31, an mounting cavity 32 is opened inside the mounting component 31, and a shaping component is inserted into the mounting cavity 32. The shaping component includes an outer frame 33, an inner core 34 is provided inside the outer frame 33, and a molding cavity 35 is formed between the inner wall of the outer frame 33 and the inner core 34.

[0023] In this embodiment, the molding component corresponding to the molding cavity 35 is selected and inserted into the mounting cavity 32 of the mounting component 31, and the outer frame 33 is fixed to the mounting component 31 by bolts; then, one end of the mounting component 31 is inserted into the mounting frame 13 of the docking mechanism, and the connecting bolts between the mounting component 31 and the mounting frame 13 are tightened to complete the assembly of the molding mechanism and the docking mechanism; at the same time, the end of the connecting pipe 11 away from the fan-shaped flow cavity 12 is sealed and connected to the extruder discharge end through the connecting flange to ensure that the raw material conveying channel is unobstructed.

[0024] Example 2, as Figures 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the docking mechanism includes a connecting pipe 11, a fan-shaped flow cavity 12 is provided on one side of the connecting pipe 11, and a mounting frame 13 is provided on one side of the fan-shaped flow cavity 12. The end of the connecting pipe 11 away from the fan-shaped flow cavity 12 is connected to the discharge end of the extruder through a connecting flange. The temperature maintaining mechanism includes a protective cover 21, which is disposed on the surface of the mounting frame 13. A display screen 22 is disposed on the surface of the protective cover 21. An electric heating plate 23 with a built-in temperature sensor is fixedly connected inside the protective cover 21 and located on the surface of the mounting frame 13. The temperature sensor inside the electric heating plate 23 is electrically connected to the display screen 22.

[0025] In this embodiment, by activating the temperature maintenance mechanism, the electric heating plate 23 with a built-in temperature sensor inside the protective cover 21 is energized and heats up, heating the mounting frame 13 and the internal molding components. The temperature sensor inside the electric heating plate 23 collects mold temperature data in real time and transmits the data to the display screen 22 on the surface of the protective cover 21. The operator can monitor the temperature through the display screen. After the temperature stabilizes at the extrusion molding temperature suitable for the raw material, the extrusion preparation state is entered to avoid deviations in the molding dimensions of the IC tube due to temperature fluctuations. The extruder is started to heat and melt the granular raw material into a flowable state. Under the pressure of the extruder, the molten raw material enters the fan-shaped flow cavity 12 through the connecting pipe 11. The fan-shaped flow cavity 12 buffers and diverts the molten raw material, so that the raw material is evenly distributed and flows smoothly into the molding cavity 35 of the molding component.

[0026] Example 3, as Figures 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the surface of the outer frame 33 is inserted into the interior of the mounting cavity 32, the end of the inner core 34 is fixedly connected to the inner wall of the outer frame 33, the other end of the outer frame 33 is bolted to the interior of the mounting component 31, the molding component is provided with multiple sets of internal molding cavities 35 with different shapes, one side of the inner cavity of the molding cavity 35 is connected to the interior of the fan-shaped flow cavity 12, the surface of one end of the mounting component 31 is inserted into the interior of the mounting frame 13, and one end of the mounting component 31 is bolted to the end of the mounting frame 13 away from the fan-shaped flow cavity 12.

[0027] In this embodiment, the molten raw material is fully filled in the molding cavity 35. Constrained by the inner wall of the outer frame 33 and the inner core 34, a tubular structure with the same shape as the molding cavity 35 is gradually formed. The tubular structure is then continuously extruded and cooled and shaped to obtain the IC tube of the target specification. When different models of IC tubes need to be produced, there is no need to disassemble the connection between the connecting pipe 11 and the extruder. First, the raw material conveying of the extruder is turned off, the fixing bolts of the outer frame 33 and the mounting part 31 are removed, and the molding component with the target molding cavity 35 is replaced. After the electric heating plate 23 stabilizes the mold temperature again, the extruder can be restarted to produce IC tubes of the new specification, which greatly shortens the mold change time and improves the production efficiency of multiple specifications.

[0028] The working principle of this IC tube extrusion molding die will be explained in detail below.

[0029] like Figures 1-5As shown, according to the specifications of the IC material tube to be produced, the molding component corresponding to the molding cavity 35 is selected and inserted into the mounting cavity 32 of the mounting part 31. The outer frame 33 is fixed to the mounting part 31 with bolts. Then, one end of the mounting part 31 is inserted into the mounting frame 13 of the docking mechanism, and the connecting bolts between the mounting part 31 and the mounting frame 13 are tightened to complete the assembly of the molding mechanism and the docking mechanism. At the same time, the end of the docking pipe 11 away from the fan-shaped flow cavity 12 is sealed and connected to the extruder discharge end through the connecting flange to ensure that the raw material conveying channel is unobstructed. Then, the temperature maintenance mechanism is activated. The electric heating plate 23 with the built-in temperature sensor inside the protective cover 21 is energized and heats up to heat the mounting frame 13 and the internal molding component. The temperature sensor in the electric heating plate 23 collects the mold temperature data in real time and transmits the data to the display screen 22 on the surface of the protective cover 21. The operator can monitor the temperature through the display screen. After the temperature stabilizes at the extrusion molding temperature suitable for the raw material, the extrusion preparation state is entered to avoid the IC material from being damaged due to temperature fluctuations. If the tube forming dimensions are off, start the extruder to heat and melt the granular raw material into a flowable state. Under the pressure of the extruder, the molten raw material enters the fan-shaped flow chamber 12 through the connecting pipe 11. The fan-shaped flow chamber 12 buffers and diverts the molten raw material, ensuring that the raw material is evenly distributed and flows smoothly into the forming chamber 35 of the molding component. The molten raw material fully fills the forming chamber 35 and, constrained by the inner wall of the outer frame 33 and the inner core 34, gradually forms a tubular structure consistent with the shape of the forming chamber 35. The continuously extruded tubular structure is then cooled and shaped to obtain the IC tube of the target specification. When different models of IC tubes need to be produced, there is no need to disassemble the connection between the connecting pipe 11 and the extruder. First, shut down the raw material conveying of the extruder, remove the fixing bolts of the outer frame 33 and the mounting part 31, replace the molding component with the target forming chamber 35, and after the electric heating plate 23 stabilizes the mold temperature again, the extruder can be restarted to produce IC tubes of the new specification, which greatly shortens the mold change time and improves the production efficiency of multiple specifications.

[0030] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. An IC tube extrusion molding die, characterized in that: The assembly includes a docking mechanism, a temperature maintaining mechanism on its surface, a shaping mechanism inside one end of the docking mechanism, a mounting component (31) inside the mounting component (31), a mounting cavity (32) inside the mounting cavity (32), a shaping component inserted into the mounting cavity (32), the shaping component including an outer frame (33), an inner core (34) inside the outer frame (33), and a forming cavity (35) formed between the inner wall of the outer frame (33) and the inner core (34).

2. The IC tube extrusion molding die according to claim 1, characterized in that: The docking mechanism includes a connecting pipe (11), a fan-shaped flow cavity (12) is provided on one side of the connecting pipe (11), an installation frame (13) is provided on one side of the fan-shaped flow cavity (12), and the end of the connecting pipe (11) away from the fan-shaped flow cavity (12) is connected to the discharge end of the extruder through a connecting flange.

3. The IC tube extrusion molding die according to claim 1, characterized in that: The temperature maintaining mechanism includes a protective cover (21) disposed on the surface of the mounting frame (13), and a display screen (22) is disposed on the surface of the protective cover (21).

4. The IC tube extrusion molding die according to claim 3, characterized in that: An electric heating plate (23) with a built-in temperature sensor is fixedly connected inside the protective cover (21) and on the surface of the mounting frame (13). The temperature sensor inside the electric heating plate (23) is electrically connected to the display screen (22).

5. The IC tube extrusion mold according to claim 1, characterized in that: The surface of the outer frame (33) is inserted into the interior of the mounting cavity (32), the end of the inner core (34) is fixedly connected to the inner wall of the outer frame (33), and the other end of the outer frame (33) is bolted to the interior of the mounting component (31).

6. The IC tube extrusion mold according to claim 1, characterized in that: The shaping component is provided with multiple sets of internal molding cavities (35) with different shapes, and one side of the inner cavity of the molding cavity (35) is connected to the inside of the fan-shaped flow cavity (12).

7. The IC tube extrusion mold according to claim 1, characterized in that: One end of the mounting component (31) is inserted into the interior of the mounting frame (13), and one end of the mounting component (31) is bolted to the end of the mounting frame (13) away from the fan-shaped flow cavity (12).

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