Flexible circuit board film tearing device

Abstract

The utility model discloses a flexible circuit board tear open film device, including tear open film transfer platform and tear open film unit, tear open film transfer platform includes tear open film bearing platform, and tear open film bearing platform has adjacent first side edge and second side edge and is located in the corner part of first side edge and second side edge intersection, first side edge is connected with clamping subassembly, and corner part is connected with film starting subassembly, and second side edge is connected with film shoveling subassembly. After loading the flexible circuit board of tearing open film on tear open film transfer platform, first by film starting subassembly from the corner of flexible circuit board shoveling into makes the protective film located at the corner from the flexible circuit board peeling, again by film shoveling subassembly from the edge of flexible circuit board shoveling into makes the protective film located at the edge from the flexible circuit board peeling, finally tear open film unit again control will entire protective film from the flexible circuit board peeling tear, can more smoothly tear open film, improve tear open film success rate, improve production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of display screen manufacturing, and specifically relates to a flexible circuit board film peeling device. Background Technology

[0002] In the production process of LCD displays, the assembly of flexible printed circuit boards (FPCs) is involved. When FPCs arrive, their surfaces are covered with a protective film, which needs to be removed before assembly. Existing technology includes equipment that uses easy-tear film removal mechanisms to automatically remove the protective film from FPCs. However, in production practice, it has been found that in some FPC products, when the adhesion between the protective film and the FPC is too strong, the film removal mechanism has difficulty removing the film smoothly, requiring repeated removal processes, which affects the continuity of the process and reduces production efficiency. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a flexible circuit board film-removing device that can more easily remove the protective film and thus improve production efficiency.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A flexible circuit board film removal device includes a film removal and transfer platform and a film removal unit connected to a frame platform. The film removal and transfer platform is used to feed the flexible circuit board into the film removal unit, and the film removal unit is used to remove the protective film from the surface of the flexible circuit board loaded on the film removal and transfer platform. The film removal and transfer platform includes a first linear drive module and a film removal support platform. The first linear drive module extends to the film removal unit, and the film removal support platform is movably connected to the first linear drive module. The film-peeling support platform has adjacent first and second side edges and a corner portion located at the intersection of the first and second side edges; wherein, the first side edge is connected to a clamping assembly for clamping and fixing the flexible circuit board mounted on the film-peeling support platform; the corner portion is connected to a film-removing assembly configured to scoop in from the corner of the flexible circuit board to peel the protective film located at the corner from the flexible circuit board; the second side edge is connected to a film-scraping assembly configured to scoop in from the edge of the flexible circuit board to peel the protective film located at the edge from the flexible circuit board.

[0005] In a specific embodiment, the clamping assembly includes two rotary clamping cylinders spaced apart from each other along the first side edge.

[0006] In the specific embodiment, the film-lifting assembly includes a first transverse drive mechanism, a first longitudinal drive mechanism, a cutter mounting bracket, and a film-lifting blade; the first transverse drive mechanism is fixedly connected to the corner portion, the first longitudinal drive mechanism is movably connected to the first transverse drive mechanism, the cutter mounting bracket is movably disposed and its first end is connected to the first longitudinal drive mechanism, the second end of the cutter mounting bracket extends above the film-tearing support platform, and the film-lifting blade is connected to the second end of the cutter mounting bracket. In the specific embodiment, the film-scraping assembly includes a second transverse drive mechanism, a second longitudinal drive mechanism, and a scraper; the second transverse drive mechanism is fixedly connected to the second side edge, the second longitudinal drive mechanism is movably connected to the second transverse drive mechanism, the scraper is movably disposed and its first end is connected to the second longitudinal drive mechanism, and the second end of the scraper is formed into a blade head and extends above the film-tearing support platform.

[0007] In the specific design, a plasma fan bar is mounted above the first linear drive module.

[0008] In a specific embodiment, the flexible circuit board film-removing device further includes a first hopper, a second hopper, and a transfer robot unit connected to the frame platform; wherein, the transfer robot unit extends from above the first hopper across the film-removing transfer platform along a first direction to above the second hopper, and is used to transfer the flexible circuit board to be peeled from the first hopper to the film-removing transfer platform and to transfer the peeled flexible circuit board from the film-removing transfer platform to the second hopper for storage; wherein, the first linear drive module extends along a second direction, the first end of the first linear drive module is located below the transfer robot unit, and the second end of the first linear drive module extends to the film-removing unit.

[0009] In the specific solution, the flexible circuit board film-removing device includes two film-removing transfer platforms, and each film-removing transfer platform is provided with a corresponding film-removing unit.

[0010] In the specific embodiment, the transfer robot unit includes a second linear drive module, a first gripping robot, and a second gripping robot. The second linear drive module is a dual-actuator linear drive module, which extends from above the first hopper across the film-tearing transfer platform in a first direction to above the second hopper. The first gripping robot and the second gripping robot are movably connected to the second linear drive module. The first gripping robot is used to transfer the flexible circuit board to be peeled from the first hopper to the film-tearing transfer platform, and the second gripping robot is used to transfer the peeled flexible circuit board from the film-tearing transfer platform to the second hopper for storage.

[0011] The flexible circuit board film-removing device provided in this embodiment includes a film-removing transfer platform and a film-removing unit. The edge of the film-removing transfer platform is connected to a film-lifting component and a film-scraping component. After the flexible circuit board to be peeled is loaded onto the film-removing transfer platform, the film-lifting component first scrapes in from the corner of the flexible circuit board to peel the protective film located at the corner off the flexible circuit board. Then, the film-scraping component scrapes in from the edge of the flexible circuit board to peel the protective film located at the edge off the flexible circuit board. After the film-lifting component and the film-scraping component have peeled part of the protective film off the flexible circuit board, the film-removing unit is controlled to peel off and remove the entire protective film from the flexible circuit board. This allows for smoother removal of the protective film, improves the success rate of film removal, and increases production efficiency. Attached Figure Description

[0012] Figure 1 This is a planar layout diagram of the flexible circuit board film-peeling device according to an embodiment of the present utility model; Figure 2 This is a first-view perspective perspective view of the flexible circuit board film-removing device according to an embodiment of the present utility model; Figure 3 This is a second-view perspective perspective view of the flexible circuit board film-peeling device according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the film-tearing transfer platform according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the film-tearing support platform according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the film-forming component according to an embodiment of the present invention; Figure 7 This is a side view of the film-forming component according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the film scraper assembly according to an embodiment of the present invention; Figure 9 This is a side view of the film scraper assembly according to an embodiment of the present utility model; Figure 10 This is a schematic diagram of the transfer robot unit according to an embodiment of the present invention. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this utility model clearer, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the drawings. The embodiments of this utility model shown in and described with reference to the drawings are merely exemplary, and this utility model is not limited to these embodiments.

[0014] It should be noted that the same or similar reference numerals in the accompanying drawings of the embodiments of this utility model correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0015] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0016] This utility model embodiment provides a flexible circuit board film peeling device, see reference. Figures 1 to 3 The flexible circuit board film-removing device includes a frame platform 100 and a film-removing transfer platform 1 and a film-removing unit 2 connected to the frame platform. The film-removing transfer platform 1 is used to feed the flexible circuit board into the film-removing unit 2, and the film-removing unit 2 is used to remove the protective film from the surface of the flexible circuit board loaded on the film-removing transfer platform 1. Further, the flexible circuit board film-removing device in this embodiment also includes a first hopper 3, a second hopper 4, and a transfer robot unit 5 connected to the frame platform 100.

[0017] The first hopper 3 is used to stack and store flexible circuit boards with film to be peeled, and the second hopper 4 is used to stack and store flexible circuit boards after film peeling. The transfer robot unit 5 extends from above the first hopper 3 across the film peeling transfer platform 1 along a first direction (the length direction of the frame platform 100 in this embodiment) to above the second hopper 4. The transfer robot unit 5 is used to transfer the flexible circuit boards with film to be peeled stored in the first hopper 3 to the film peeling transfer platform 1 and to transfer the flexible circuit boards after film peeling from the film peeling transfer platform 1 to the second hopper 4 for storage. After receiving the flexible circuit boards with film to be peeled from the transfer robot unit 5, the film peeling transfer platform 1 sends the flexible circuit boards with film to be peeled into the film peeling unit 2. The film peeling unit 2 peels the film off the flexible circuit boards loaded on the film peeling transfer platform 1. After the film peeling is completed, the film peeling transfer platform 1 then transfers the flexible circuit boards to the transfer robot unit 5.

[0018] As a preferred embodiment, the flexible circuit board film-removing device includes two film-removing transfer platforms 1, each of which is equipped with a corresponding film-removing unit 2. Since the film-removing operation requires a relatively long time, providing two sets of film-removing transfer platforms 1 and film-removing units 2 that can perform the film-removing operation in parallel improves the operating efficiency of the film-removing device.

[0019] In this embodiment, see Figure 4 and Figure 5 and combined Figures 1 to 3 As shown, the film-tearing transfer platform 1 mainly includes a first linear drive module 11 and a film-tearing support platform 12. The first linear drive module 11 extends to the film-tearing unit 2, and the film-tearing support platform 12 is movably connected to the first linear drive module 11. Specifically, the first linear drive module 11 extends along a second direction (in this embodiment, the width direction of the frame platform 100), with its first end located below the transfer robot unit 5 and its second end extending to the film-tearing unit 2. The film-tearing support platform 12 is a vacuum adsorption platform used to carry and adsorb the flexible circuit board. The first linear drive module 11 drives the film-tearing support platform 12 to reciprocate between the transfer robot unit 5 and the film-tearing unit 2, thereby realizing the transport of the flexible circuit board.

[0020] In this embodiment, the film-peeling support platform 12 has adjacent first side edges 12a and second side edges 12b, and a corner portion 12c located at the intersection of the first side edges 12a and the second side edges 12b. The first side edge 12a is connected to a clamping assembly 13, which is used to clamp and fix the flexible circuit board mounted on the film-peeling support platform 12. The corner portion 12c is connected to a film-removing assembly 14, which is configured to scoop into the corner of the flexible circuit board to peel the protective film located at that corner from the flexible circuit board. The second side edge 12b is connected to a film-scraping assembly 15, which is configured to scoop into the edge of the flexible circuit board to peel the protective film located at that edge from the flexible circuit board.

[0021] Based on the film-peeling support platform 12 as described above, after the flexible circuit board to be peeled is transferred to the film-peeling unit 2, the film-peeling process includes the following steps: S1, controlling the clamping assembly 13 to press against the flexible circuit board from above the protective film for clamping and fixing; S2, controlling the film-removing assembly 14 to scrape into the corner of the flexible circuit board so that the protective film located at the corner is peeled off from the flexible circuit board; S3, controlling the film-scraping assembly 15 to scrape into the edge of the flexible circuit board so that the protective film located at the edge is peeled off from the flexible circuit board; S4, controlling the clamping assembly 13 to release from the flexible circuit board. Clamping: At this time, based on the adsorption and fixation of the film-tearing support platform 12, and with the film-lifting component 14 and the film-scraping component 15 in the scraping state pressing against the surface of the flexible circuit board, the flexible circuit board can still be stably fixed; S5, control the film-tearing unit 2 to grab the protective film located at the corners peeled off by the film-lifting component 14, and peel off the entire protective film from the flexible circuit board; S6, after the film is peeled off, control the film-lifting component 14 and the film-scraping component 15 to withdraw from the flexible circuit board, and the film-tearing support platform 12 transfers the film-teared flexible circuit board to the transfer robot unit 5.

[0022] In the film-peeling process described above, the protective film at the corners, which are the easiest to peel off, is first peeled off and lifted by the film-lifting component 14. Then, while keeping the corners lifted, the film-scraping component 15 peels off and lifts the protective film from the entire edge connecting the corners, breaking the adsorption state (vacuum adsorption or electrostatic adsorption, etc.) between the protective film and the surface of the flexible circuit board. On this basis, the film-peeling unit 2 peels off the entire protective film from the flexible circuit board, thereby making it easier to peel off the protective film, improving the success rate of film peeling, and improving production efficiency.

[0023] In this embodiment, the film-tearing unit 2 adopts an easy-tear adhesive film-tearing mechanism commonly used in the art, which will not be described in detail here. A waste frame 21 is provided on the second end side of the first linear drive module 11, and the waste frame 21 is used to place the protective film torn off by the film-tearing unit 2.

[0024] In specific plans, such as Figure 5 As shown, the clamping assembly 13 includes two rotary clamping cylinders spaced apart from each other along the first side edge 12a.

[0025] For specific details, please refer to the following: Figure 6 and Figure 7 and combined Figure 5 As shown, the film-lifting assembly 14 includes a first lateral drive mechanism 141, a first longitudinal drive mechanism 142, a tool mounting bracket 143, and a film-lifting blade 144. The first lateral drive mechanism 141 is fixedly connected to the corner portion 12c. The first longitudinal drive mechanism 142 is movably connected to the first lateral drive mechanism 141. The tool mounting bracket 143 is movably disposed with its first end connected to the first longitudinal drive mechanism 142, and its second end extends above the film-lifting support platform 12. The film-lifting blade 144 is connected to the second end of the tool mounting bracket 143. The first longitudinal drive mechanism 142 drives the tool mounting bracket 143 to move longitudinally, thereby adjusting the height of the film-lifting blade 144 on the film-lifting support platform 12. The first lateral drive mechanism 141 drives the first longitudinal drive mechanism 142 to move laterally, thereby causing the tool mounting bracket 143 and the film-lifting blade 144 to move laterally, thus controlling whether the film-lifting blade 144 scoops into or exits the flexible circuit board.

[0026] For specific details, please refer to the following: Figure 8 and Figure 9 and combined Figure 5As shown, the film-scraping assembly 15 includes a second lateral drive mechanism 151, a second longitudinal drive mechanism 152, and a scraper 153. The second lateral drive mechanism 151 is fixedly connected to the second side edge 12b, the second longitudinal drive mechanism 152 is movably connected to the second lateral drive mechanism 151, and the scraper 153 is movably disposed with its first end connected to the second longitudinal drive mechanism 152. The second end of the scraper 153 is formed as a blade and extends above the film-tearing support platform 12. The second longitudinal drive mechanism 152 is used to drive the scraper 153 to move longitudinally, thereby adjusting the height of the scraper 153 on the film-tearing support platform 12. The second lateral drive mechanism 151 is used to drive the second longitudinal drive mechanism 152 to move laterally, thereby driving the scraper 153 to move laterally, thereby controlling the scraper 153 to scrape into or out of the flexible circuit board.

[0027] In this embodiment, see Figure 8 and combined Figures 1 to 3 As shown, the transfer robot unit 5 includes a second linear drive module 51, a first gripping robot 52, and a second gripping robot 53. Specifically, the second linear drive module 51 is a dual-actuator linear drive module, extending from above the first hopper 3 across the film-tearing transfer platform 1 in a first direction to above the second hopper 4. The first gripping robot 52 and the second gripping robot 53 are movably connected to the second linear drive module 51. The first gripping robot 52 and the second gripping robot 53 are respectively configured to adsorb and grip flexible circuit boards. The first gripping robot 52 is used to transfer the flexible circuit board with the film to be peeled from the first hopper 3 to the film-tearing transfer platform 1, and the second gripping robot 53 is used to transfer the peeled flexible circuit board from the film-tearing transfer platform 1 to the second hopper 4 for storage.

[0028] In this embodiment, a plasma air bar 6 is also provided above the film-tearing transfer platform 1. Specifically, as shown... Figure 8 As shown, the frame platform 100 is equipped with a gantry frame for supporting the transfer robot unit 5. The plasma air blower 6 is connected to the gantry frame and spans across above the first linear drive module 11. When the film-tearing support platform 12 transfers the flexible circuit board loaded with film to be peeled to the plasma air blower 6, the plasma air blower 6 blows plasma air onto the flexible circuit board to remove dust and static electricity.

[0029] In summary, the flexible circuit board film-removing device provided in this embodiment first peels part of the protective film off the flexible circuit board through the film-lifting component and the film-scraping component, thereby breaking the adsorption state between the protective film and the surface of the flexible circuit board. Then, the film-removing unit peels off the entire protective film from the flexible circuit board. This allows for smoother removal of the protective film, improves the success rate of film removal, and increases production efficiency.

[0030] The above description is only a specific embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A flexible circuit board film tearing device characterized by, The device includes a film-removing transfer platform and a film-removing unit connected to a rack platform. The film-removing transfer platform is used to feed a flexible circuit board into the film-removing unit, and the film-removing unit is used to remove the protective film from the surface of the flexible circuit board loaded on the film-removing transfer platform. The film-removing transfer platform includes a first linear drive module and a film-removing support platform. The first linear drive module extends to the film-removing unit, and the film-removing support platform is movably connected to the first linear drive module. The film-peeling support platform has adjacent first and second side edges and a corner portion located at the intersection of the first and second side edges; wherein, the first side edge is connected to a clamping assembly for clamping and fixing the flexible circuit board mounted on the film-peeling support platform; the corner portion is connected to a film-removing assembly configured to scoop in from the corner of the flexible circuit board to peel the protective film located at the corner from the flexible circuit board; the second side edge is connected to a film-scraping assembly configured to scoop in from the edge of the flexible circuit board to peel the protective film located at the edge from the flexible circuit board.

2. The flexible circuit board film tearing device according to claim 1, wherein, The clamping assembly includes two rotary clamping cylinders spaced apart from each other along the first side edge.

3. The flexible circuit board film tearing apparatus of claim 1, wherein, The film-lifting assembly includes a first transverse drive mechanism, a first longitudinal drive mechanism, a cutter mounting bracket, and a film-lifting blade; the first transverse drive mechanism is fixedly connected to the corner portion, the first longitudinal drive mechanism is movably connected to the first transverse drive mechanism, the cutter mounting bracket is movably disposed and its first end is connected to the first longitudinal drive mechanism, the second end of the cutter mounting bracket extends above the film-lifting support platform, and the film-lifting blade is connected to the second end of the cutter mounting bracket.

4. The flexible circuit board film tearing apparatus according to claim 1, wherein The film-scraping assembly includes a second transverse drive mechanism, a second longitudinal drive mechanism, and a scraper; the second transverse drive mechanism is fixedly connected to the second side edge, the second longitudinal drive mechanism is movably connected to the second transverse drive mechanism, the scraper is movably disposed and its first end is connected to the second longitudinal drive mechanism, and the second end of the scraper is formed into a blade and extends above the film-tearing support platform.

5. The flexible circuit board film tearing apparatus of claim 1, wherein, A plasma fan bar is mounted above the first linear drive module.

6. The flexible circuit board film tearing apparatus according to any one of claims 1 to 5, wherein The flexible circuit board film-peeling device further includes a first hopper, a second hopper, and a transfer robot unit connected to the frame platform; wherein, the transfer robot unit extends from above the first hopper across the film-peeling transfer platform along a first direction to above the second hopper, and is used to transfer the flexible circuit board to be peeled from the first hopper to the film-peeling transfer platform and to transfer the peeled flexible circuit board from the film-peeling transfer platform to the second hopper for storage; wherein, the first linear drive module extends along a second direction, the first end of the first linear drive module is located below the transfer robot unit, and the second end of the first linear drive module extends to the film-peeling unit.

7. The flexible circuit board film tearing apparatus of claim 6, wherein, The flexible circuit board film-removing device includes two film-removing transfer platforms, and each film-removing transfer platform is provided with a corresponding film-removing unit.

8. The flexible circuit board film tearing apparatus of claim 6, wherein, The transfer robot unit includes a second linear drive module, a first gripping robot, and a second gripping robot. The second linear drive module is a dual-actuator linear drive module, which extends from above the first hopper across the film-tearing transfer platform in a first direction to above the second hopper. The first gripping robot and the second gripping robot are movably connected to the second linear drive module. The first gripping robot is used to transfer the flexible circuit board to be peeled from the first hopper to the film-tearing transfer platform, and the second gripping robot is used to transfer the peeled flexible circuit board from the film-tearing transfer platform to the second hopper for storage.

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