Chip transfer device for chip production

Abstract

The utility model provides a kind of chip transfer device for chip production, in particular to the field of chip transfer device. To solve the chip transfer device for chip production in prior art, chip cannot be classified and stored, and poor protection performance, will cause chip to appear when transferring, will influence the problem of chip transfer effect. Including: transfer board, the top of the transfer board is equipped with transfer frame, the inner chamber of the transfer frame is sequentially provided with frame from left to right, the front of the frame is penetrated through the front of transfer frame, the front of the frame is equipped with pull plate, the back of the pull plate is in contact with the front of transfer frame, the inner chamber of the frame is horizontally equipped with horizontal plate, the top of the horizontal plate and the bottom of frame inner chamber are all provided with storage drawer. Compared with original transfer device, the transfer device can classify and store chip, and has good protection performance, will not cause chip to appear when transferring, will not affect the transfer effect of chip.

Description

Technical Field

[0001] This utility model relates to devices in the field of chip transfer devices, and more particularly to a chip transfer device for chip production. Background Technology

[0002] A chip, also known as an integrated circuit, microcircuit, microchip, or wafer / chip, is a way to miniaturize circuits in electronics. It is often manufactured on the surface of a semiconductor wafer. During chip production, transfer devices are needed to facilitate the later transfer and storage of chips, or to transfer and process them.

[0003] Current chip transport devices used in chip manufacturing cannot classify and store chips, and their poor protection performance can cause chips to shake during transport, which affects the transport efficiency.

[0004] Therefore, it is necessary to provide a chip transfer device for chip production to solve the above-mentioned technical problems. The information disclosed in this background section is only intended to enhance the understanding of the overall background of this utility model, and is not necessarily to be regarded as an admission or to imply in any way that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a chip transfer device for chip manufacturing, addressing the problems of existing chip transfer devices that cannot classify and store chips, have poor protective performance, and cause chip shaking during transfer, thus affecting the transfer efficiency. The various technical effects of the preferred solutions provided by this invention are detailed below.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] This utility model provides a chip transfer device for chip production, comprising: a transfer plate, a transfer frame installed on the top of the transfer plate, a frame arranged sequentially from left to right in the inner cavity of the transfer frame, the front of the frame penetrating the front of the transfer frame, a pull plate installed on the front of the frame, the back of the pull plate contacting the front of the transfer frame, a horizontal plate installed horizontally in the inner cavity of the frame, a storage drawer provided on the top of the horizontal plate and the bottom of the inner cavity of the frame, a partition plate arranged vertically from front to back in the bottom of the inner cavity of the storage drawer, positioning grooves provided around the top of the horizontal plate and around the bottom of the inner cavity of the frame, an L-shaped positioning block provided in the inner cavity of the positioning groove, the inner side of the L-shaped positioning block contacting the perimeter of the storage drawer.

[0008] Preferably, the number of frames is three, and the three frames are evenly spaced within the cavity of the transfer frame.

[0009] Preferably, both sides of the front and both sides of the back of the transfer plate are movably connected to traveling wheels via movable shafts.

[0010] Preferably, push rods are installed on both the front and rear sides of the left side of the transfer plate, and a push handle is installed on the top of the left side of the push rods.

[0011] Preferably, a connecting plate is installed on the inner side of the L-shaped positioning block.

[0012] Preferably, a handle is installed on the front of the pull plate, and the surface of the handle is provided with an anti-slip sleeve.

[0013] The advantages of the chip transfer device for chip production provided by this utility model are: compared with the original transfer device, this transfer device can classify and store chips, and has good protection performance, so as not to cause shaking during chip transfer and not to affect the transfer effect of chips. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a chip transfer device for chip production according to this utility model.

[0015] Figure 2 This is a schematic diagram of the left side of the transfer plate and transfer frame structure of a chip transfer device for chip production according to this utility model.

[0016] Figure 3 This is a left-side view of the transfer frame and frame structure of a chip transfer device for chip production according to this utility model.

[0017] Figure 4 This is a top view of the transfer frame and frame structure of a chip transfer device for chip production according to this utility model.

[0018] Figure 5 This is a cross-sectional view of the frame and storage drawer structure of a chip transfer device for chip production according to this utility model.

[0019] In the diagram: 1. Transfer plate; 2. Transfer frame; 3. Frame; 4. Pull-out plate; 5. Horizontal plate; 6. Storage drawer; 7. Divider; 8. Positioning groove; 9. L-shaped positioning block; 10. Wheels; 11. Push rod; 12. Connecting plate; 13. Push handle; 14. Handle. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] The specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. In the drawings, the same reference numerals indicate the same or corresponding technical features. The drawings are for illustrative purposes only and are not necessarily drawn to scale.

[0022] See Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown in the figure, a chip transfer device for chip production includes: a transfer plate 1, a transfer frame 2 installed on the top of the transfer plate 1, a frame 3 arranged sequentially from left to right in the inner cavity of the transfer frame 2, the front of the frame 3 penetrating through the front of the transfer frame 2, a pull plate 4 installed on the front of the frame 3, the back of the pull plate 4 contacting the front of the transfer frame 2, a horizontal plate 5 installed horizontally in the inner cavity of the frame 3, a storage drawer 6 provided on the top of the horizontal plate 5 and the bottom of the inner cavity of the frame 3, a partition plate 7 arranged vertically from front to back in the bottom of the inner cavity of the storage drawer 6, positioning grooves 8 opened around the top of the horizontal plate 5 and around the bottom of the inner cavity of the frame 3, an L-shaped positioning block 9 provided in the inner cavity of the positioning groove 8, the inner side of the L-shaped positioning block 9 contacting the perimeter of the storage drawer 6.

[0023] Furthermore, there are three frames 3, and the three frames 3 are evenly spaced within the cavity of the transfer frame 2.

[0024] In this embodiment, the worker first puts the chips that need to be transferred into the storage drawer 6. The divider 7 in the storage drawer 6 can classify and store the chips, and also protect the chips to prevent them from shaking during transfer, thus increasing the stability of the chips during transfer.

[0025] Furthermore, there are three frames 3, and the three frames 3 are evenly spaced within the cavity of the transfer frame 2.

[0026] In this embodiment, the L-shaped positioning block 9 is inserted into the inner cavity of the positioning slot 8 by the connecting plate 12. The inner side of the L-shaped positioning block 9 contacts the periphery of the storage drawer 6, which increases the stability of the storage drawer 6 during transportation. The storage drawer 6 will not be displaced due to the bumps during transportation, nor will it affect the stability of the chip inside the storage drawer 6 during transportation.

[0027] Furthermore, push rods 11 are installed on the front and rear sides of the left side of the transfer plate 1, and push handles 13 are installed on the top left side of the push rods 11.

[0028] In this embodiment, the transfer plate 1 is moved by the push handle 13 and the push rod 11, and the traveling wheel 10 drives the transfer frame 2 above to move, which facilitates the transfer of chips in the transfer frame 2.

[0029] Furthermore, a connecting plate 12 is installed on the inner side of the L-shaped positioning block 9.

[0030] In this embodiment, after moving to the designated area, the frame 3 is moved by the handle 14 and the pull plate 4. The frame 3 moves out of one side of the transfer frame 2, and the L-shaped positioning block 9 moves out of one side of the positioning groove 8 by the connecting plate 12.

[0031] Furthermore, a handle 14 is installed on the front of the pull plate 4, and the surface of the handle 14 is provided with an anti-slip sleeve.

[0032] In this embodiment, the storage drawer 6 is moved out of one side of the frame 3 and the horizontal plate 5, and the transferred chip is taken out from one side of the transfer frame 2 to facilitate the storage and further processing of the chip.

[0033] During use, workers first place the chips to be transported into storage drawer 6. The dividers 7 inside drawer 6 allow for categorized storage of the chips and also provide protection, preventing movement during transport and increasing stability. Connecting plate 12 drives L-shaped positioning blocks 9 into the inner cavity of positioning slots 8. The inner side of the L-shaped positioning blocks 9 contacts the perimeter of storage drawer 6, further enhancing stability during transport and preventing displacement due to bumps or disturbances, thus ensuring the chips remain securely in place. The system operates stably. The transfer plate 1 is moved by the push handle 13 and the push rod 11, and the traveling wheels 10 drive the transfer frame 2 above to move, which facilitates the transfer of chips in the transfer frame 2. After moving to the designated area, the frame 3 is moved by the handle 14 and the pull plate 4. The frame 3 moves out of one side of the transfer frame 2. The L-shaped positioning block 9 moves out of one side of the positioning groove 8 by the connecting plate 12, and the storage drawer 6 moves out of one side of the frame 3 and the horizontal plate 5. The transferred chips are taken out of one side of the transfer frame 2 for easy storage and further processing.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0035] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A chip transfer device for chip manufacturing, characterized in that, include: A transfer plate (1) is provided, and a transfer frame (2) is installed on the top of the transfer plate (1). A frame (3) is arranged in the inner cavity of the transfer frame (2) from left to right. The front of the frame (3) penetrates the front of the transfer frame (2). A pull plate (4) is installed on the front of the frame (3). The back of the pull plate (4) contacts the front of the transfer frame (2). A horizontal plate (5) is installed in the inner cavity of the frame (3). A storage drawer (6) is provided on the top of the horizontal plate (5) and the bottom of the inner cavity of the frame (3). A partition plate (7) is arranged vertically from front to back in the bottom of the inner cavity of the storage drawer (6). A positioning groove (8) is provided around the top of the horizontal plate (5) and around the bottom of the inner cavity of the frame (3). An L-shaped positioning block (9) is provided in the inner cavity of the positioning groove (8). The inner side of the L-shaped positioning block (9) contacts the periphery of the storage drawer (6).

2. The chip transfer device for chip manufacturing according to claim 1, characterized in that: The number of frames (3) is three, and the three frames (3) are evenly spaced inside the transfer frame (2).

3. The chip transfer device for chip manufacturing according to claim 1, characterized in that: The two sides of the front and the two sides of the back of the transfer plate (1) are movably connected to the traveling wheels (10) via movable shafts.

4. The chip transfer device for chip manufacturing according to claim 1, characterized in that: Push rods (11) are installed on the front and rear sides of the left side of the transfer plate (1), and push handles (13) are installed on the top of the left side of the push rods (11).

5. A chip transfer device for chip manufacturing according to claim 1, characterized in that: A connecting plate (12) is installed on the inner side of the L-shaped positioning block (9).

6. A chip transfer device for chip manufacturing according to claim 1, characterized in that: A handle (14) is installed on the front of the pull plate (4), and the surface of the handle (14) is provided with an anti-slip sleeve.

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