A high temperature resistant electrolytic cell

Abstract

The embodiment of the application provides a high-temperature-resistant electrolytic cell, and relates to the technical field of electrolysis, which comprises an electrolytic cell body and a cathode copper plate arranged in the electrolytic cell body, an insulating and heat-insulating partition plate is arranged at the cathode copper plate, and a clamping groove for clamping the cathode copper plate is arranged on the insulating and heat-insulating partition plate. The application has the effect of preventing the cathode copper plate from being too high in temperature and having a great safety hazard.

Description

Technical Field

[0001] This utility model relates to the field of electrolysis technology, and in particular to a high-temperature resistant electrolytic cell. Background Technology

[0002] Electrolytic cells are mainly used in the industrial production of high-purity metals. They are devices that convert electrical energy into chemical energy, allowing current to pass through an electrolyte solution or molten electrolyte, causing a reduction-oxidation reaction at the cathode and anode.

[0003] During the operation of an electrolytic cell, the cathode generates a large amount of heat. Excessive temperature can affect the electrolysis efficiency and lifespan of the cell, and also cause the temperature at the contact point between the cell and the electrode to become too high, posing a significant safety hazard. Currently, solutions to the cathode overheating problem in electrolytic cells are limited, making it difficult to effectively reduce the cathode temperature and meet actual production needs. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides a high-temperature resistant electrolytic cell.

[0005] The high-temperature resistant electrolytic cell provided in this application adopts the following technical solution: A high-temperature resistant electrolytic cell includes an electrolytic cell body and a cathode copper plate disposed within the electrolytic cell body. An insulating and heat-insulating partition is provided at the cathode copper plate, and a snap-fit ​​groove for snapping the cathode copper plate is formed on the insulating and heat-insulating partition.

[0006] Furthermore, the insulating and heat-insulating partition is a plurality of separate partitions, and each separate partition is provided with the snap-fit ​​groove. Furthermore, multiple separate insulating and heat-insulating partitions are evenly distributed below the cathode copper plate. Furthermore, the insulating and heat-insulating partition is a single piece of plate, and the insulating and heat-insulating partition has multiple locking grooves for locking the cathode copper plate. Furthermore, the bottom wall of the snap-fit ​​groove is provided with a serrated groove for reducing the contact area between the cathode copper plate and the insulating heat insulation plate.

[0007] Furthermore, the surface of the insulating and heat-insulating partition is provided with heat dissipation patterns, which are distributed in a grid pattern. Furthermore, the insulating and heat-insulating partition is a Teflon board. Furthermore, the surface of the insulating and heat-insulating partition is coated with a composite coating of graphene and high-temperature resistant resin.

[0008] Furthermore, the thickness of the insulating and heat-insulating partition is 1-3 cm.

[0009] Furthermore, the insulating and heat-insulating partition is fixed with downward-bending lugs that facilitate the attachment of the insulating and heat-insulating partition to the electroplating tank.

[0010] In summary, this application includes at least one of the following beneficial technical effects: installing an insulating and heat-insulating baffle plate at the position of the cathode copper plate in the electrolytic cell to support the cathode copper plate prevents the cathode copper plate from overheating, which would cause the junction temperature between the cathode copper plate and the electrolytic cell to be too high, thus posing a significant fire and safety hazard. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this application.

[0012] Figure 2 This is a schematic diagram of the structure of the insulating and heat-insulating partition in Embodiment 1 of this application.

[0013] Figure 3 This is a schematic diagram of the insulating and heat-insulating partition in Embodiment 2 of the application.

[0014] Figure 4 This is a schematic diagram of the structure of the insulating and heat-insulating partition in Embodiment 3 of this application.

[0015] Explanation of reference numerals in the attached drawings: 1. Electrolytic cell body; 2. Cathode copper plate; 3. Insulating and heat-insulating partition; 4. Mounting hole; 5. Bolt; 6. Snap-fit ​​groove; 7. Slot; 8. Heat dissipation pattern; 9. Hanging lug. Detailed Implementation

[0016] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0017] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0018] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail. Example 2

[0019] A high-temperature resistant electrolytic cell includes an electrolytic cell body 1 and a plurality of cathode copper plates 2 fixedly installed inside the electrolytic cell body 1. Insulating and heat-insulating baffles 3 are provided at the cathode copper plates 2, and the two ends of the cathode copper plates 2 are installed on the insulating and heat-insulating baffles 3.

[0020] Reference Figure 1 and Figure 2 The insulating and heat-insulating partition 3 is made of Teflon sheet and consists of multiple separate partitions. Each partition 3 has a through-hole 4 through which a bolt 5 passes. The bolt 5 is threaded into the inner wall of the electrolytic cell, thus enabling the installation of the insulating and heat-insulating partition 3. Multiple separate insulating and heat-insulating partitions 3 are evenly distributed on the inner wall of the electrolytic cell body 1. Each partition 3 has a snap-fit ​​groove 6, and both ends of the cathode copper plate 2 are snapped into the corresponding snap-fit ​​groove 6 of the insulating and heat-insulating partition 3.

[0021] Reference Figure 2 and Figure 3 The bottom wall of the snap-fit ​​groove 6 has a serrated slot 7, which is used to reduce the contact area between the cathode copper plate 2 and the insulating heat insulation plate 3, thereby reserving a space between the cathode copper plate 2 and the insulating heat insulation plate 3 to facilitate heat dissipation.

[0022] Reference Figure 2 and Figure 3 The thickness of the insulating and heat-insulating partition 3 is 1-3cm. The surface of the insulating and heat-insulating partition 3 is provided with heat dissipation patterns 8 to facilitate heat dissipation. The heat dissipation patterns 8 are distributed in a grid pattern. The surface of the insulating and heat-insulating partition 3 is coated with a composite coating of graphene and high-temperature resistant resin. Example 3

[0023] The difference from Embodiment 1 is that the insulating and heat-insulating partition 3 is a single piece of plate, and the clamping grooves 6 for clamping the cathode copper plate 2 are evenly distributed on the entire plate. Example 4

[0024] The difference from Embodiment 1 and Embodiment 2 is that the insulating heat insulation partition 3 is fixed to the side wall of the electrolytic cell body 1 with a hanging ear 9. The hanging ear 9 is bent downward and makes it easy for the insulating heat insulation partition 3 to be hung on the electroplating cell body 1, thereby facilitating the installation and replacement of the insulating heat insulation partition 3.

[0025] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. Any equivalent modifications or variations made by those skilled in the art based on the content disclosed in the present invention should be included within the scope of protection set forth in the claims.

Claims

1. A high-temperature resistant electrolytic cell, comprising an electrolytic cell body (1) and a cathode copper plate (2) disposed within the electrolytic cell body (1), characterized in that, An insulating and heat-insulating partition (3) is provided at the cathode copper plate (2). The insulating and heat-insulating partition (3) has a snap-fit ​​groove (6) for snapping the cathode copper plate (2). The bottom wall of the snap-fit ​​groove (6) has a sawtooth-shaped slot (7) for reducing the contact area between the cathode copper plate (2) and the insulating and heat-insulating partition (3). The surface of the insulating and heat-insulating partition (3) is provided with heat dissipation patterns (8), which are distributed in a grid pattern.

2. The high-temperature resistant electrolytic cell according to claim 1, characterized in that, The insulating and heat-insulating partition (3) consists of multiple separate partitions, each of which has the snap-fit ​​groove (6).

3. The high-temperature resistant electrolytic cell according to claim 2, characterized in that, Multiple split-type insulating and heat-insulating partitions (3) are evenly distributed below the cathode copper plate (2).

4. The high-temperature resistant electrolytic cell according to claim 1, characterized in that, The insulating and heat-insulating partition (3) is a single piece of plate, and the insulating and heat-insulating partition (3) has multiple locking grooves (6) for locking the cathode copper plate (2).

5. The high-temperature resistant electrolytic cell according to claim 4, characterized in that, The insulating and heat-insulating partition (3) is a Teflon board.

6. The high-temperature resistant electrolytic cell according to claim 5, characterized in that, The thickness of the insulating and heat-insulating partition (3) is 1-3cm.

7. The high-temperature resistant electrolytic cell according to claim 6, characterized in that, The insulating heat insulation partition (3) is fixed with a downward bending lug (9) that facilitates the hanging of the insulating heat insulation partition (3) on the electroplating tank.

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