Electronic water pump

Abstract

The utility model provides a kind of electronic water pump, the electronic water pump includes: casing, with flow-through cavity, flow-through cavity has import;Insulating sleeve is arranged in flow-through cavity, and flow-through cavity is separated into dry cavity and wet cavity, insulating sleeve has flow-through port away from one end of import, and flow-through port is communicated with wet cavity;Control panel assembly is located in dry cavity;Heat dissipation piece is arranged between insulating sleeve and control panel assembly, and is sealed with insulating sleeve, and the side of heat dissipation piece close to wet cavity has accommodating cavity, accommodating cavity has opening, accommodating cavity is located in flow-through port, and opening is communicated with flow-through port, and heat dissipation piece is used to radiate for control panel assembly.The technical scheme of the utility model can solve the problem of poor heat dissipation effect of the electronic water pump in the prior art, which uses natural air cooling to cool the control panel.

Description

Technical Field

[0001] This utility model relates to the field of water pump technology, and more specifically, to an electronic water pump. Background Technology

[0002] In existing electronic water pump designs, the heat dissipation of the control board has always been a key factor affecting product performance and lifespan. Especially when the ambient temperature rises, the heat dissipation efficiency of the control board decreases significantly. This not only limits the application of electronic water pumps in high-temperature environments but may also cause the electronic components on the control board to overheat and be damaged, thus shortening the overall lifespan of the water pump.

[0003] Currently, most electronic water pumps use natural air cooling to cool the control board. This involves heat dissipation through contact between the control board and a metal heat sink, with thermal adhesive applied between the heat sink and the heat-generating components on the control board to enhance heat conduction. However, natural air cooling has relatively low heat dissipation efficiency, especially in high-temperature environments. The heat sink's heat dissipation capacity is limited, making it difficult to effectively control the control board temperature, thus affecting the board's operational stability and lifespan. Utility Model Content

[0004] This invention provides an electronic water pump to solve the problem of poor heat dissipation in existing electronic water pumps that use natural air cooling to cool the control board.

[0005] To address the aforementioned problems, this utility model provides an electronic water pump, comprising: a housing having a flow cavity with an inlet; an isolation sleeve disposed within the flow cavity, dividing the flow cavity into a dry cavity and a wet cavity, the end of the isolation sleeve away from the inlet having a flow port communicating with the wet cavity; a control board assembly located within the dry cavity; and a heat sink disposed between the isolation sleeve and the control board assembly, and sealingly fitted with the isolation sleeve, the side of the heat sink near the wet cavity having a receiving cavity with an opening, the receiving cavity being located within the flow port and the opening communicating with the flow port, the heat sink being used to dissipate heat from the control board assembly.

[0006] Furthermore, the heat dissipation component includes a body and a receiving sleeve. The body has a first surface and a second surface arranged opposite to each other. The first surface is located in the wet cavity, and the second surface is located in the dry cavity. The receiving sleeve is disposed on the first surface and extends toward the inlet. The receiving sleeve cooperates with the first surface to form a receiving cavity. An opening is formed at the end of the receiving sleeve away from the first surface. The control board assembly is disposed close to the second surface. The isolation sleeve has a main body section and a connecting section connected in sequence. The main body section communicates with the inlet. The connecting section is sleeved on the outer periphery of the receiving sleeve and is sealed with the receiving sleeve. A flow port is formed at the end of the connecting section away from the inlet. The receiving sleeve and the connecting section cooperate with each other to separate the dry cavity and the wet cavity.

[0007] Furthermore, the isolation sleeve also has an end plate located between the main body section and the connecting section. The extension direction of the end plate forms an angle with the extension direction of the main body section. Multiple openings are spaced apart on the end plate for connecting the wet cavity and the receiving cavity.

[0008] Furthermore, the first surface has heat dissipation protrusions and / or heat dissipation grooves.

[0009] Furthermore, the housing includes a pump head and a pump casing connected to each other. The pump casing also includes a support platform with an assembly hole on the support platform. The receiving sleeve and the connecting section are both inserted into the assembly hole. The body has a positioning hole, and the support platform has a positioning post. The positioning post and the positioning hole are correspondingly arranged. The positioning hole is fixedly connected to the positioning post by fasteners.

[0010] Furthermore, the electronic water pump also includes a pump shaft located inside the wet chamber. One end of the pump shaft is positioned near the inlet and connected to the housing. The end of the isolation sleeve away from the inlet has a support portion, and the other end of the pump shaft is located inside the support portion. Part of the support portion is located inside the receiving cavity, and the end of the support portion is spaced from the first surface.

[0011] Furthermore, the electronic water pump also includes a rotating component located inside the wet chamber and rotating around the pump shaft. The rotating component is driven and connected to the control board assembly. The rotating component has a flow channel, and the two ends of the flow channel are respectively connected to the inlet and the flow port. Part of the rotating component is located inside the main body section.

[0012] Furthermore, the rotating component includes: a sensing part, which is drivenly connected to the control panel assembly; an impeller, including a plastic-sealed part and an impeller cover, the plastic-sealed part having a first section and a second section distributed in sequence, the first section extending radially along the pump shaft, the second section being rotatably connected to the pump shaft via a bearing component, the second section covering the outside of the sensing part and extending axially along the bearing component, the second section having a perforation, the pump shaft being located within the perforation, and a flow channel being provided on the second section; the impeller cover being provided at the end of the first section near the inlet.

[0013] Furthermore, the inner wall of the bearing component has at least one through hole, which extends through the second section along the axial direction of the pump shaft and forms a flow channel. Along the radial direction of the isolation sleeve, the maximum distance from the center of the perforation to the inner wall of the through hole is less than the radius of the main body section. When there are multiple through holes, the multiple through holes are spaced apart circumferentially along the second section.

[0014] Furthermore, the control board assembly includes a circuit board and electronic components, with the electronic components located on the side of the circuit board away from the heat sink.

[0015] Furthermore, the side of the circuit board away from the electronic components has a gap L with the second surface, 0.3mm≤L≤1mm; or, the side of the circuit board away from the electronic components is attached to the second surface.

[0016] Furthermore, a thermal adhesive layer is provided between the side of the circuit board away from the electronic components and the second side.

[0017] Furthermore, the housing also includes a rear cover, with the pump head and rear cover respectively located at both ends of the pump housing. The pump head, pump housing, and rear cover cooperate to form a flow cavity. An isolation sleeve is located between the pump housing and the pump head. The pump head, isolation sleeve, and heat sink cooperate to form a wet cavity. The pump housing, rear cover, isolation sleeve, and heat sink cooperate to form a dry cavity.

[0018] In this design, after the liquid enters the wet chamber through the inlet, it flows into the receiving cavity of the heat sink through the flow port of the isolation sleeve. The heat exchange between the liquid and the heat sink removes the heat generated by the control board assembly, reducing its temperature and extending the lifespan of the electric water pump. The receiving cavity is located within the flow port, allowing the liquid to fill the entire cavity as it flows out, contacting the inner wall of the cavity. This increases the heat exchange area and improves the heat dissipation efficiency of the heat sink. This allows the heat from the control board assembly to be more quickly dissipated through the inner wall of the receiving cavity and carried away by the liquid, improving the heat dissipation effect of the electric water pump. Simultaneously, the heat dissipation structure is simplified, not only avoiding excessive space occupation within the pump but also reducing production and subsequent maintenance costs. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0020] Figure 1 A cross-sectional view of an electronic water pump provided in an embodiment of the present invention is shown;

[0021] Figure 2 A schematic diagram of the structure of the isolation sleeve provided in an embodiment of the present invention is shown;

[0022] Figure 3 A schematic diagram of the structure of a heat sink provided in one embodiment of the present invention is shown;

[0023] Figure 4 A schematic diagram of the structure of a heat sink provided in another embodiment of the present invention is shown;

[0024] Figure 5 A partial cross-sectional view of an electronic water pump provided in an embodiment of the present invention is shown;

[0025] Figure 6 A partial structural schematic diagram of the housing provided in an embodiment of the present invention is shown;

[0026] Figure 7 A schematic diagram of the second side of the heat sink provided in an embodiment of the present invention is shown;

[0027] Figure 8 A partial cross-sectional view of an electronic water pump provided in an embodiment of the present invention is shown;

[0028] Figure 9 A top-view structural schematic diagram of the rotating component provided in an embodiment of the present invention is shown;

[0029] Figure 10 A schematic diagram of the rotating component from another perspective, provided by an embodiment of the present invention, is shown.

[0030] The above figures include the following reference numerals:

[0031] 10. Casing; 101. Inlet; 102. Dry Chamber; 103. Wet Chamber; 104. Support Platform; 1041. Assembly Hole; 11. Positioning Column; 12. Pump Shaft; 13. Mounting Hole;

[0032] 20. Isolation sleeve; 201. Flow port; 21. Main body section; 22. End plate; 221. Opening; 222. Support section; 23. Connecting section;

[0033] 30. Control board assembly; 31. Circuit board; 32. Electronic components;

[0034] 40. Heat sink; 401. Receiving cavity; 402. Receiving sleeve; 403. First surface; 404. Second surface; 41. Heat dissipation fin; 42. Heat dissipation boss; 43. Positioning hole; 44. Positioning boss;

[0035] 50. Rotating component; 501. Flow channel; 51. Sensing unit; 52. First section; 53. Second section; 54. Impeller cover; 55. Through hole;

[0036] 60. Bearing component; 61. First bearing; 62. Rotating part; 63. Second bearing. Detailed Implementation

[0037] The technical solutions in at least one embodiment will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. The following description of at least one embodiment is merely illustrative and is not intended to limit this application or its applications. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are all within the scope of protection of this application.

[0038] like Figures 1 to 10As shown, an embodiment of this utility model provides an electronic water pump, which includes a housing 10, an isolation sleeve 20, a control board assembly 30, and a heat sink 40. The housing 10 has a flow cavity with an inlet 101 and an outlet communicating with each other. The isolation sleeve 20 is disposed within the flow cavity and divides it into a dry cavity 102 and a wet cavity 103. The end of the isolation sleeve 20 away from the inlet 101 has a flow port 201, which communicates with the wet cavity 103. The control board assembly 30 is located within the dry cavity 102. The heat sink 40 is disposed between the isolation sleeve 20 and the control board assembly 30 and is sealed to the isolation sleeve 20. The side of the heat sink 40 near the wet cavity 103 has a receiving cavity 401 with an opening. The receiving cavity is located within the flow port 201, and the opening communicates with the flow port 201. The heat sink 40 is used to dissipate heat from the control board assembly 30. The heat sink 40 is made of metal, which has good thermal conductivity.

[0039] In this design, after the liquid enters the wet chamber 103 through the inlet 101, it enters the receiving cavity 401 of the heat sink 40 through the flow port 201 of the isolation sleeve 20. The heat exchange between the liquid and the heat sink 40 carries away the heat generated by the control board assembly 30, reducing its temperature and extending the service life of the electric water pump. The receiving cavity 401 is located within the flow port 201, allowing the liquid to fill the entire cavity when flowing out, contacting the inner wall of the cavity. This increases the heat exchange area and improves the heat dissipation efficiency of the heat sink 40, enabling the heat from the control board assembly 30 to be more quickly dissipated through the inner wall of the cavity 401 and carried away by the liquid, thus improving the heat dissipation effect of the electric water pump. Simultaneously, the heat dissipation structure is simplified, not only avoiding excessive space occupation within the pump but also reducing production and subsequent maintenance costs.

[0040] like Figure 1As shown, the heat sink 40 includes a body and a receiving sleeve 402. The body is a flat plate structure with a first surface 403 and a second surface 404 arranged opposite to each other. Both the first surface 403 and the second surface 404 are planar. The first surface 403 is located in the wet cavity 103, and the second surface 404 is located in the dry cavity 102. The receiving sleeve 402 is disposed on the first surface 403 and extends toward the inlet 101. The receiving sleeve 402 and the first surface 403 cooperate to form a receiving cavity 401. The end of the receiving sleeve 402 away from the first surface 403 forms an opening. The control board assembly 30 is disposed close to the second surface 404. In this way, the heat of the control board assembly 30 can be transferred more evenly and quickly through the plane. The isolation sleeve 20 has a main body section 21 and a connecting section 23 connected in sequence. The main body section 21 communicates with the inlet 101. The connecting section 23 is fitted around the outer periphery of the receiving sleeve 402 and is sealed to the receiving sleeve 402. The end of the connecting section 23 away from the inlet 101 has a flow port 201. The receiving sleeve 402 and the connecting section 23 cooperate to separate the dry chamber 102 and the wet chamber 103. Through the cooperation between the receiving sleeve 402 and the first surface 403, a closed receiving chamber 401 is formed, allowing the liquid to circulate within this chamber, improving the uniformity and efficiency of heat dissipation. When the liquid flows in the receiving chamber 401, it can fully contact the first surface 403 of the heat sink 40 and the inner wall of the connecting section 23, transferring heat from the control board assembly 30 to the liquid through thermal conduction. At the same time, the sealed cooperation ensures that the liquid will not leak into the dry chamber 102, improving the reliability of the electronic water pump.

[0041] In this embodiment, the receiving sleeve 402 is located in the middle of the body, and most of the heat generated by the control board assembly 30 is concentrated in the middle. The heat generated by the control board assembly 30 is transferred to the first surface 403 through the second surface 404, and then to the receiving sleeve 402. The above structure enables the heat generated by the control board assembly 30 to be quickly and evenly transferred to the inner wall of the receiving cavity 401 of the heat sink 40, so that the heat exchange effect of the heat sink 40 is more uniform and the local overheating of the control board assembly 30 is avoided.

[0042] Specifically, the receiving sleeve 402 is sealed to the connecting section 23 by a sealing ring, and a corresponding mounting groove is provided on the outer wall of the receiving sleeve 402 to accommodate the sealing ring. The mounting groove on the receiving sleeve 402 facilitates machining.

[0043] In other embodiments, the mounting groove may also be provided on the inner sidewall of the connecting section 23.

[0044] like Figure 1 and Figure 2As shown, the isolation sleeve 20 also has an end plate 22, which is located between the main body section 21 and the connecting section 23. The extension direction of the end plate 22 forms an angle with the extension direction of the main body section 21. The structural design of the end plate 22 can buffer the flow of liquid, preventing the liquid from directly impacting the heat sink 40 and the control board assembly 30, thus avoiding excessive vibration of the heat sink 40 and the control board assembly 30. At the same time, it can reduce the noise generated by vibration and ensure the stability of the electric water pump operation. The end plate 22 has multiple openings 221 distributed at intervals, which are used to connect the wet chamber 103 and the receiving chamber 401. Through the openings 221 on the end plate 22, the liquid can enter the receiving chamber 401 from the wet chamber 103, exchange heat with the heat sink 40, and then flow back to the wet chamber 103 from the receiving chamber 401 through the openings 221. The multiple openings 221 increase the liquid flow rate and improve the heat dissipation efficiency.

[0045] In this embodiment, the main body segment 21 and the connecting segment 23 extend along the axial direction of the isolation sleeve 20, and the end plate 22 extends along the radial direction of the isolation sleeve 20. The angle between the end plate 22 and the main body segment 21 and the connecting segment 23 is a right angle, and the right angle structure is convenient for processing.

[0046] In this application, the number and shape of the openings 221 are not limited. The shape of the openings 221 can be a circular hole, a semi-circular hole, or a square hole, etc.

[0047] In this embodiment, the end plate 22 is provided with four openings 221, which are symmetrically distributed along the circumference of the isolation sleeve 20. The openings 221 are oblong. This makes the flow rate and pressure of the liquid passing through the end plate 22 more uniform, avoiding excessive pressure difference at different positions of the end plate 22, which could cause the isolation sleeve 20 to vibrate or the end plate 22 to break.

[0048] Furthermore, the first surface 403 has heat dissipation protrusions or grooves. This design increases the contact area between the liquid and the first surface 403, allowing for more thorough contact between the liquid and the heat sink 40, thus improving heat dissipation efficiency.

[0049] There are no restrictions on the number or structure of the heat dissipation protrusions or grooves. The structure of the heat dissipation protrusions and grooves can be conical, curved, or polyhedral, etc.

[0050] like Figure 3 As shown, in one embodiment of this application, a plurality of heat dissipation ribs 41 are provided on the first surface 403. The plurality of heat dissipation ribs 41 extend radially along the isolation sleeve 20, and the heat dissipation ribs 41 are strip-shaped structures.

[0051] like Figure 4As shown, in another embodiment of this application, a plurality of heat dissipation protrusions 42 are provided on the first surface 403. The heat dissipation protrusions 42 are cylindrical structures. The plurality of heat dissipation protrusions 42 are arranged at intervals along the circumference of the receiving sleeve 402, and the size of the heat dissipation protrusions 42 gradually decreases from the edge of the first surface 403 near the receiving sleeve 402 toward the center line of the isolation sleeve 20.

[0052] In other embodiments of this application, heat dissipation protrusions and heat dissipation grooves can be processed simultaneously on the first surface 403.

[0053] like Figures 5 to 7 As shown, the housing 10 includes a pump head and a pump casing connected to each other. An inlet 101 is located on the pump head. The pump casing includes a support platform 104 with an assembly hole 1041. The receiving sleeve 402 and the connecting section 23 both pass through the assembly hole 1041. The main body has a positioning hole 43, and the support platform 104 has a positioning post 11. The positioning post 11 corresponds to the positioning hole 43, and the positioning hole 43 is fixedly connected to the positioning post 11 by fasteners. Through the cooperation of the positioning hole 43 and the positioning post 11, precise positioning and fixation of the heat sink 40 and the housing 10 are achieved, preventing the heat sink 40 from shifting during the locking process, improving assembly accuracy, simplifying the assembly process, and facilitating disassembly and assembly.

[0054] The housing 10 also includes a rear cover. The pump head and the rear cover are respectively disposed at both ends of the pump housing. The pump head, pump housing and rear cover cooperate to form a flow cavity. The isolation sleeve 20 is disposed between the pump housing and the pump head. The pump head, isolation sleeve 20 and heat sink 40 cooperate to form a wet cavity 103. The isolation sleeve 20 is sealed to the pump head. The pump housing, rear cover, isolation sleeve 20 and heat sink 40 cooperate to form a dry cavity 102.

[0055] Specifically, the main body is provided with two positioning holes 43, and the support platform 104 is provided with two corresponding positioning posts 11. The two positioning posts 11 are spaced apart on both sides of the assembly hole 1041 along the circumferential direction, which can increase the stability of the connection between the heat sink 40 and the housing 10.

[0056] like Figure 5 As shown, the main body is also provided with a positioning boss 44, and the support platform 104 is provided with a number of mounting holes 13. The mounting holes 13 are fixedly connected to the positioning boss 44 by screws, which further improves the reliability of the fixed connection between the heat sink 40 and the support platform 104.

[0057] Specifically, the support platform 104 is provided with three mounting holes 13 and three positioning bosses 44, and the three mounting holes 13 are spaced apart in the circumference of the assembly hole 1041.

[0058] like Figure 8As shown, the electronic water pump also includes a pump shaft 12, which is located within the wet chamber 103. One end of the pump shaft 12 is positioned near the inlet 101 and connected to the housing 10. The end of the isolation sleeve 20 away from the inlet 101 has a support portion 222, and the other end of the pump shaft 12 is located within the support portion 222. Part of the support portion 222 is located within the receiving cavity 401, and the end of the support portion 222 away from the inlet 101 is spaced from the first surface 403. This expands the flow range of the liquid within the receiving cavity 401, increases the flow velocity of the liquid within the receiving cavity 401, and prevents the liquid temperature from rising and the heat exchange efficiency from decreasing due to slow liquid flow. At the same time, the aforementioned spacing can prevent the support portion 222 from colliding and rubbing against the first surface 403 when the isolation sleeve 20 or the heat sink 40 vibrates, thus extending the service life of the electronic water pump.

[0059] Furthermore, the electronic water pump also includes a rotating component 50, which is located within the wet chamber 103 and sleeved on the outer periphery of the pump shaft 12. The rotating component 50 rotates around the pump shaft 12 along its axis. The rotating component 50 is driven by the control board assembly 30, which drives the rotating component 50 to rotate. When the rotating component 50 rotates within the wet chamber 103, it creates a negative pressure, drawing external liquid into the electronic water pump from the inlet 101. The liquid flows through the wet chamber 103 and then flows out from the outlet. The rotating component 50 has a flow channel 501, with its two ends connected to the inlet 101 and the outlet 201, respectively. A portion of the rotating component 50 is located within the main body section 21. The rotating component 50 allows liquid to flow between the inlet 101 and the outlet 201 via the flow channel 501, increasing the liquid flow path, improving the liquid flow rate, optimizing the heat dissipation path, and further improving heat dissipation efficiency.

[0060] like Figures 8 to 10 As shown, a stator assembly is disposed within the dry chamber 102. The stator assembly is electrically connected to the control board assembly 30, and generates a magnetic field when energized. The rotating component 50 includes a sensing part 51 and an impeller. The sensing part 51 is drivenly connected to the control board assembly 30. Specifically, the magnetic field generated by the stator assembly interacts with the sensing part 51, driving the sensing part 51 to rotate around the pump shaft 12. The impeller includes a plastic-sealed part and an impeller cover 54. The plastic-sealed part has a first section 52 and a second section 53 distributed sequentially. The second section 53 is rotatably connected to the pump shaft 12 via a bearing component 60. The first section 52 extends radially along the bearing component 60, and the second section 53 covers the outside of the sensing part 51 and extends axially along the bearing component 60. A perforation is provided on the second section 53, and the pump shaft 12 is located within the perforation. A flow channel 501 is disposed on the second section 53, thus facilitating the processing of the flow channel 501. Impeller cover 54 is located at the end of the first section 52 near the inlet 101. The first section 52 is connected to the impeller cover 54, and the first section 52 forms an impeller seat.

[0061] Specifically, the inner ring of the bearing component 60 is interference-fitted with the pump shaft 12, and the outer ring of the bearing component 60 is interference-fitted with the encapsulation part.

[0062] In this embodiment, the bearing component 60 includes a first bearing 61, a rotating part 62, and a second bearing 63 arranged in sequence. The rotating part 62 can be a rotating structure such as a shaft.

[0063] In other embodiments, the bearing component 60 is a one-piece rotating part.

[0064] In this application, the location and specific structure of the flow channel 501 are not limited. The inlet of the flow channel 501 can be located at the middle or edge of the end face of the second section 53 facing the inlet 101, or on the side wall of the second section 53 facing the inner side wall of the main body section 21. The outlet of the flow channel 501 can be located at the middle or edge of the end face of the second section 53 facing the heat sink 40, or on the side wall of the second section 53 facing the inner side wall of the main body section 21. The structure of the flow channel 501 can be a flow structure with one inlet and multiple outlets, or a flow structure with multiple inlets and one outlet.

[0065] Furthermore, the inner wall of the bearing component 60 has at least one through hole 55. The through hole 55 extends through the second section 53 along the axial direction of the encapsulation part, forming a flow channel 501. Along the radial direction of the isolation sleeve 20, the maximum distance from the center of the perforation to the inner wall of the through hole 55 is less than the radius of the main body section 21. After the liquid enters the wet cavity 103 through the inlet 101, it flows into the receiving cavity 401 through the gap between the inner wall of the main body section 21 and the outer wall of the rotating component 50, and then flows out through the flow channel 501. The second section 53 is located inside the main body section 21, and the pressure at the through hole 55 is less than that at the gap between the inner wall of the main body section 21 and the outer wall of the rotating component 50. This allows most of the liquid to flow out of the receiving cavity 401 through the flow hole 55, avoiding collision with the liquid entering the receiving cavity 401, accelerating the liquid flow rate, optimizing the heat dissipation path, and further preventing the liquid from staying in the receiving cavity 401 for too long, resulting in excessively high temperature and inability to exchange heat.

[0066] When there are multiple through holes 55, the multiple through holes 55 are arranged at intervals along the circumference of the encapsulation part, which can increase the flow rate of the liquid and improve the heat dissipation efficiency. In addition, the through holes 55 extend along the axial direction of the isolation sleeve 20, which can not only improve the smoothness of liquid flow, but also improve the convenience of processing.

[0067] In this embodiment, there are three through holes 55, which are evenly distributed along the axial direction of the perforation.

[0068] In a preferred embodiment, the projection of the through hole 55 along the axial direction of the isolation sleeve 20 is located inside the opening 221. The above design makes the pressure at the through hole 55 less than the pressure at the opening 221. As a result, when the liquid flows out from the opening 221, it will preferentially enter the through hole 55 and flow out, further optimizing the liquid flow path and improving the heat exchange rate.

[0069] like Figure 5 As shown, the control board assembly 30 includes a circuit board 31 and electronic components 32, with the electronic components 32 positioned on the side of the circuit board 31 away from the heat sink 40. This arrangement, with the circuit board 31 in contact with the heat sink 40, increases the contact area between the heat sink 40 and the electronic components 32, improving heat dissipation. It also avoids uneven heat dissipation caused by inconsistent heights of the electronic components 32.

[0070] A thermal adhesive layer is provided between the side of the circuit board 31 away from the electronic component 32 and the second surface 404. The thermal adhesive layer has good thermal conductivity and can transfer heat from the circuit board 31 to the second surface 404, thereby transferring heat from the control board assembly 30 to the liquid through thermal conduction.

[0071] like Figure 5 As shown, there is a gap L between the circuit board 31 and the second surface 404, where 0.3mm ≤ L ≤ 1mm. If L is greater than 1mm, the distance between the circuit board 31 and the second surface 404 is too large, and the heat on the circuit board 31 cannot be quickly transferred to the second surface 404. If L is less than 1mm, the distance between the circuit board 31 and the second surface 404 is too small, and the thermal adhesive is prone to overflow when applied, affecting the assembly between components. This application sets the gap L between 0.3mm and 1mm, which ensures both proper application of the thermal adhesive and the speed of heat transfer. L can be 0.3mm, 0.5mm, 0.6mm, or 1mm.

[0072] In other embodiments of this application, the side of the circuit board 31 away from the electronic component 32 is attached to the second surface 404, and heat is transferred through the direct contact between the circuit board 31 and the second surface 404.

[0073] The above descriptions are merely some embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0074] The technical features of the embodiments described above can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification.

[0075] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0076] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as exemplary only and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0077] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0078] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0079] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application.

Claims

1. An electronic water pump, characterized in that, The electronic water pump includes: The housing (10) has a flow cavity having an inlet (101); An isolation sleeve (20) is disposed in the flow cavity and divides the flow cavity into a dry cavity (102) and a wet cavity (103). The end of the isolation sleeve (20) away from the inlet (101) has a flow port (201) and the flow port (201) communicates with the wet cavity (103). The control panel assembly (30) is located within the dry chamber (102); A heat sink (40) is disposed between the isolation sleeve (20) and the control board assembly (30) and is sealed to the isolation sleeve (20). The heat sink (40) has a receiving cavity (401) on the side near the wet cavity (103). The receiving cavity (401) has an opening. The receiving cavity (401) is located inside the flow port (201) and the opening communicates with the flow port (201). The heat sink (40) is used to dissipate heat for the control board assembly (30).

2. The electronic water pump according to claim 1, characterized in that, The heat sink (40) includes a body and a receiving sleeve (402). The body has a first surface (403) and a second surface (404) disposed opposite to each other. The first surface (403) is located in the wet cavity (103), and the second surface (404) is located in the dry cavity (102). The receiving sleeve (402) is disposed on the first surface (403) and extends toward the inlet (101). The receiving sleeve (402) cooperates with the first surface (403) to form the receiving cavity (401). The end of the receiving sleeve (402) away from the first surface (403) forms the opening. The control board assembly (30) is disposed close to the second surface (404). The isolation sleeve (20) has a main body section (21) and a connecting section (23) connected in sequence. The main body section (21) communicates with the inlet (101). The connecting section (23) is sleeved on the outer periphery of the receiving sleeve (402) and is sealed with the receiving sleeve (402). The end of the connecting section (23) away from the inlet (101) forms the flow port (201). The receiving sleeve (402) and the connecting section (23) cooperate with each other to separate the dry chamber (102) and the wet chamber (103).

3. The electronic water pump according to claim 2, characterized in that, The isolation sleeve (20) also has an end plate (22) located between the main body section (21) and the connecting section (23). The extension direction of the end plate (22) forms an angle with the extension direction of the main body section (21). The end plate (22) has a plurality of openings (221) spaced apart, which are used to connect the wet cavity (103) and the receiving cavity (401).

4. The electronic water pump according to claim 2, characterized in that, The first surface (403) has heat dissipation protrusions and / or heat dissipation grooves.

5. The electronic water pump according to claim 2, characterized in that, The housing (10) includes a pump head and a pump casing connected to each other. The pump casing also includes a support platform (104). The support platform (104) has an assembly hole (1041). The receiving sleeve (402) and the connecting section (23) are both inserted into the assembly hole (1041). The main body has a positioning hole (43). The support platform (104) has a positioning post (11). The positioning post (11) is correspondingly arranged with the positioning hole (43). The positioning hole (43) is fixedly connected to the positioning post (11) by fasteners.

6. The electronic water pump according to claim 2, characterized in that, The electronic water pump also includes a pump shaft (12), which is located in the wet chamber (103). One end of the pump shaft (12) is located near the inlet (101) and connected to the housing (10). The end of the isolation sleeve (20) away from the inlet (101) has a support portion (222). The other end of the pump shaft (12) is located in the support portion (222). Part of the support portion (222) is located in the receiving cavity (401), and the end of the support portion (222) is spaced from the first surface (403).

7. The electronic water pump according to claim 6, characterized in that, The electronic water pump also includes a rotating component (50), which is located in the wet chamber (103) and rotates around the pump shaft (12). The rotating component (50) is driven to be connected to the control board assembly (30). The rotating component (50) has a flow channel (501), and the two ends of the flow channel (501) are respectively connected to the inlet (101) and the flow port (201). Part of the rotating component (50) is located in the main body section (21).

8. The electronic water pump according to claim 7, characterized in that, The rotating component (50) includes: The sensing unit (51) is driven to be connected to the control board assembly (30); The impeller includes a plastic seal and an impeller cover (54). The plastic seal has a first section (52) and a second section (53) distributed in sequence. The first section (52) extends radially along the pump shaft (12). The second section (53) is rotatably connected to the pump shaft (12) via a bearing component (60). The second section (53) covers the outside of the sensing part (51) and extends axially along the bearing component (60). A perforation is provided on the second section (53). The pump shaft (12) is located in the perforation. The flow channel (501) is provided on the second section (53). The impeller cover (54) is provided at the end of the first section (52) near the inlet (101).

9. The electronic water pump according to claim 8, characterized in that, The perforation has at least one through hole (55) on the inner wall of the bearing component (60), the through hole (55) penetrates the second section (53) along the axial direction of the pump shaft (12), the through hole (55) forms the flow channel (501), along the radial direction of the isolation sleeve (20), the maximum distance from the center of the perforation to the inner wall of the through hole (55) is less than the radius of the main body section (21); when there are multiple through holes (55), the multiple through holes (55) are arranged circumferentially spaced along the second section (53).

10. The electronic water pump according to claim 2, characterized in that, The control board assembly (30) includes a circuit board (31) and electronic components (32), the electronic components (32) being disposed on the side of the circuit board (31) away from the heat sink (40).

11. The electronic water pump according to claim 10, characterized in that, The side of the circuit board (31) away from the electronic component (32) has a gap L with the second surface (404), where 0.3mm≤L≤1mm; or, the side of the circuit board (31) away from the electronic component (32) is attached to the second surface (404).

12. The electronic water pump according to claim 10, characterized in that, A heat-dissipating adhesive layer is provided between the side of the circuit board (31) away from the electronic component (32) and the second surface (404).

13. The electronic water pump according to claim 5, characterized in that, The housing (10) also includes a rear cover. The pump head and the rear cover are respectively disposed at both ends of the pump housing. The pump head, the pump housing and the rear cover cooperate to form the flow cavity. The isolation sleeve (20) is disposed between the pump housing and the pump head. The pump head, the isolation sleeve (20) and the heat sink (40) cooperate to form the wet cavity (103). The pump housing, the rear cover, the isolation sleeve (20) and the heat sink (40) cooperate to form the dry cavity (102).

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