A bearing ball mounting device for a semiconductor thermal annealing apparatus

Abstract

This utility model discloses a ball bearing mounting device for semiconductor thermal annealing equipment. The mounting device includes a handle component, a frustum component, and a cylindrical component connected in sequence. A ball mounting part is provided inside the bearing cup of the bearing, and a shaft hole is opened in the middle of the bearing cup. The cylindrical component of the mounting device is inserted into the shaft hole, and the bottom of the frustum component is placed on the edge of the ball mounting part. The ball mounting part is an annular mounting platform. This utility model provides a ball bearing mounting device for semiconductor thermal annealing equipment, which can realize the rapid installation of balls on the bearing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a bearing ball mounting device for semiconductor thermal annealing equipment. Background Technology

[0002] Rapid thermal annealing is a key thermal processing technology in semiconductor manufacturing. It utilizes high-power light sources (such as halogen lamp arrays) to radiate heat to semiconductor wafers, raising the silicon wafer to the target temperature (typically 650-1150°C) in a very short time, followed by rapid cooling. This process is mainly used for annealing and activation after ion implantation, and for the formation of metal silicides. Compared to traditional furnace tube annealing, it has significant advantages such as lower thermal budget, shorter processing time, and less process contamination, and is therefore widely used in advanced processes.

[0003] In order to achieve uniform annealing temperature on wafers, rapid thermal annealing equipment typically uses a rotating tray with a rotation function to drive the wafer to rotate. The quartz rotary bearing assembly in the rotating tray is an important component of the rotating tray.

[0004] Quartz rotary bearing assemblies include bearing cups, ball bearing assemblies, and cages. During installation, the small size of the balls makes them prone to falling out, which not only makes installation inconvenient but also makes collecting the fallen balls difficult.

[0005] Therefore, it is necessary to design a bearing ball mounting device that facilitates the installation of balls in quartz rotary bearing assemblies. Utility Model Content

[0006] This invention provides a bearing ball mounting device for semiconductor thermal annealing equipment, which enables rapid installation of the balls on the bearing.

[0007] One technical solution adopted by this utility model is: a bearing ball mounting device for semiconductor thermal annealing equipment, the mounting device comprising a handle component, a frustum component, and a cylindrical component connected in sequence; a ball mounting part is provided inside the bearing cup of the bearing, and a shaft hole is opened in the middle of the bearing cup; the cylindrical component of the mounting device is inserted into the shaft hole, and the bottom of the frustum component is placed on the edge of the ball mounting part; the ball mounting part is a circular mounting platform.

[0008] The top diameter of the frustum component is smaller than the bottom diameter; the side wall of the frustum component is provided with a sliding groove, and the sliding groove provided on the side wall of the frustum component is arranged at equal intervals on the side wall of the frustum component.

[0009] The number of grooves formed on the side wall of the frustum component is equal to the number of balls required on the ball bearing mounting component.

[0010] The groove has a semi-circular cross-section, and the diameter of the semi-circular groove cross-section is larger than the diameter of the ball.

[0011] The bearing includes a cage with a plurality of pockets for holding the balls; when the frustum component is placed on the ball mounting part, the bottom of the groove on the side wall of the frustum component points to the position of the cage pocket.

[0012] The handle component is located on the upper part of the frustum component, and the handle component is cylindrical.

[0013] The bottom of the cylindrical component is provided with a suction cup assembly, and the mounting device is provided with a top rod.

[0014] The frustum component and the cylindrical component are provided with mounting holes, and the top rod passes through the mounting holes; the handle component is a cylindrical sleeve, and a pressure plate is provided inside the handle component; a spring is provided at the lower part of the pressure plate.

[0015] The bottom of the push rod is provided with a top plate, and the bottom of the cylindrical component is provided with a sealing groove; after the spring pushes up the pressure plate, the push rod drives the top plate to press into the sealing groove.

[0016] A sealing ring is provided on the top plate. When the top plate is pressed into the sealing groove, the sealing ring fits tightly with the sealing groove.

[0017] The beneficial effects of the bearing ball mounting device for semiconductor thermal annealing equipment of this utility model are as follows: 1. The bearing ball mounting device of this utility model includes a handle component, a frustum component, and a cylindrical component connected in sequence. After the cylindrical component is inserted into the bearing cup shaft hole, the frustum component contacts the ball mounting part on the bearing cup. At this time, the ball falls in the area between the side wall of the frustum component and the ball mounting part. Therefore, using the bearing ball mounting device facilitates the placement of the ball on the bearing mounting part and prevents the ball from falling off. 2. By setting a suction cup assembly at the bottom of the cylindrical component, in conjunction with the push rod assembly, this application ensures that the bearing ball mounting device will not wobble when placed on the bearing cup, maintaining a stable state during ball installation. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the installation of the rotating tray and the quartz rotary bearing.

[0019] Figure 2 This is a schematic diagram of the bearing cup structure of the device of this utility model.

[0020] Figure 3 This is a schematic diagram of the bearing ball mounting device of this utility model.

[0021] Figure 4This is a schematic diagram of the internal structure of the bearing ball mounting device of this utility model.

[0022] In the diagram: 1. Quartz plate; 2. Bearing cup; 21. Shaft hole; 22. Ball bearing mounting part; 3. Ball; 4. Cage; 5. Connecting shaft; 6. Rotary tray; 7. Bearing ball mounting device; 71. Frustum component; 711. Slide groove; 72. Cylindrical component; 721. Sealing groove; 73. Handle component; 74. Mounting hole; 8. Suction cup assembly; 9. Top rod; 91. Pressure plate; 92. Top plate; 93. Sealing ring; 10. Spring. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the drawings. The embodiments of this utility model shown in and described with reference to the drawings are merely exemplary, and this utility model is not limited to these embodiments.

[0024] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0025] Example 1 Embodiment 1 provides a bearing ball 3 mounting device for a semiconductor thermal annealing equipment. The mounting device includes a handle component 73, a frustum component 71, and a cylindrical component 72 connected in sequence. The bearing cup 2 of the bearing is provided with a ball mounting part 22, and a shaft hole 21 is opened in the middle of the bearing cup 2. The cylindrical component 72 of the mounting device is inserted into the shaft hole 21, and the bottom of the frustum component 71 is placed on the edge of the ball mounting part 22. The ball mounting part 22 is a circular mounting platform.

[0026] In this embodiment, the frustum component 71 of the bearing ball mounting device is placed at the edge of the ball mounting portion 22 (e.g., ...). Figure 1 As shown, the ball bearing mounting part 22 is a circular platform with a narrow width, so the ball bearing 3 is very easy to fall off when placed. At this time, the ball bearing mounting part 22 and the frustum component 71 at its edge actually form a closed area, so the ball bearing 3 will not fall off when placed, which facilitates the installation of the ball bearing 3.

[0027] The following section provides a detailed explanation of a bearing ball mounting device for a semiconductor thermal annealing equipment according to the accompanying drawings.

[0028] like Figure 1As shown, in order to achieve uniform annealing temperature on the wafer, the rapid thermal annealing equipment uses a rotating tray 6 with a rotation function to drive the wafer to rotate. The rotating tray 6 is equipped with a connecting shaft 5, which also includes a bearing for rotation. The bearing is fixedly mounted on a quartz plate 1. The bearing is also equipped with balls 3 (made of sapphire) and a cage 4. The cage 4 is equipped with several equally spaced pockets, and the balls 3 are installed in the pockets. The cage 4 and the balls 3 are both set on the bearing cup 2. The connecting shaft 5 on the rotating tray 6 is inserted into the shaft hole 21 of the bearing cup 2 and cooperates with the cage 4 to achieve rotation.

[0029] like Figure 2 As shown, there is a ball bearing mounting portion 22 on the inner side of the shaft hole 21. This ball bearing mounting portion 22 is an annular platform with a narrow width, so the ball bearing 3 is very easy to fall off when placed. To solve the above problem, this application provides a mounting device that facilitates the installation of the ball bearing 3. The mounting device is as follows: Figure 3 as well as Figure 4 As shown, the mounting device includes a handle component 73, a frustum component 71, and a cylindrical component 72 connected in sequence. The cylindrical component 72 of the mounting device is inserted into the shaft hole 21. The bottom of the frustum component 71 is placed on the edge of the ball mounting part 22. The ball mounting part 22 and the frustum component 71 at its edge actually form a closed area, so the ball 3 will not fall off when placed.

[0030] The frustum component 71 has a top diameter smaller than its bottom diameter. The sidewalls of the frustum component 71 are provided with grooves 711, which are equidistantly arranged on the sidewalls. The number of grooves 711 on the sidewalls of the frustum component 71 is equal to the number of balls 3 required for the ball bearing mounting part 22. On one hand, these grooves 711 facilitate the sliding of the balls 3, preventing them from falling off due to clamping issues when held in the ball bearing mounting part 22, thus making the installation of the balls 3 more efficient. On the other hand, when the frustum component 71 is placed at the edge of the ball bearing mounting part 22, the bottom of the grooves 711 on the sidewalls of the frustum component 71 points towards the pocket of the retainer 4. Therefore, during installation, the balls 3 can easily slide into the pocket, facilitating their installation on the retainer 4.

[0031] The slide groove 711 has a semi-circular cross-section, and the diameter of the semi-circular cross-section of the slide groove 711 is larger than the diameter of the ball 3. Setting the cross-section of the slide groove 711 to be semi-circular makes it less likely for the ball 3 to fall off when sliding down.

[0032] To facilitate the removal of the installation device, a handle component 73 is also provided on the installation component. The handle component 73 is located on the upper part of the frustum component 71. The handle component 73 is cylindrical, specifically, the handle component 73 is a cylindrical sleeve with a hollow structure in the middle.

[0033] A suction cup assembly 8 is provided at the bottom of the cylindrical component 72. When the mounting device is installed on the bearing cup 2, the mounting device can be firmly fixed and will not loosen or rotate, thus preventing the ball 3 from falling off when it is installed on the cage 4.

[0034] To facilitate the release of the suction cup assembly 8 from the quartz plate 1, a push rod 9 is also provided inside the mounting device. By lifting the push rod 9 assembly, the suction cup assembly 8 can be released from the quartz plate 1. Figure 4 As shown, mounting holes 74 are provided in the frustum component 71 and the cylindrical component 72, and the push rod 9 passes through the mounting holes 74; a pressure plate 91 is provided inside the handle component 73. The pressure plate 91 is a circular plate, and a spring 10 is provided at the lower part of the pressure plate 91. The pressure plate 91 presses on the spring 10, and the spring 10 drives the pressure plate 91 to rebound, which can be reset after the push rod 9 pushes the suction cup downward.

[0035] A top plate 92 is provided at the bottom of the push rod 9, and a sealing groove 721 is provided at the bottom of the cylindrical component 72. After the spring 10 pushes up the pressure plate 91, the push rod 9 drives the top plate 92 to press into the sealing groove 721. Through the sealing between the top plate 92 and the sealing groove 721, it is ensured that there is no air leakage between the suction cup and the quartz plate 1, which would affect the adsorption effect between the suction cup and the quartz plate 1.

[0036] To further ensure the sealing effect between the top plate 92 and the sealing groove 721, a sealing ring 93 is also provided on the top plate 92. When the top plate 92 is pressed onto the sealing groove 721, the sealing ring 93 fits tightly with the sealing groove 721 to achieve a better sealing effect.

[0037] In the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] Furthermore, it should be noted that in this specification, "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0039] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A bearing ball mounting device for a semiconductor thermal annealing apparatus, characterized by, The mounting device comprises a handle part (73), a circular table part (71) and a cylindrical part (72) connected in sequence; The bearing cup (2) of the bearing is internally provided with a ball mounting portion (22), and a shaft hole (21) is formed in the middle of the bearing cup (2); The cylindrical part (72) of the mounting device is inserted into the shaft hole (21), and the bottom of the circular table part (71) is placed at the edge of the ball mounting portion (22); The ball mounting portion (22) is a circular ring mounting platform.

2. A bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 1, wherein The top of the circular table part (71) has a smaller diameter than the bottom; The sidewall of the circular table part (71) is provided with a sliding groove (711), and the sliding grooves (711) arranged on the sidewall of the circular table part are equidistantly arranged on the sidewall.

3. A bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 2, wherein The number of the sliding grooves (711) formed on the sidewall of the circular table part (71) is equal to the number of the balls (3) required on the ball mounting portion (22).

4. The bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 2, wherein The cross section of the sliding groove (711) is semicircular, and the diameter of the semicircular cross section of the sliding groove (711) is greater than the diameter of the ball (3).

5. A bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 4, wherein The bearing comprises a retainer (4) provided with a plurality of pockets for placing the balls (3); When the circular table part (71) is placed on the ball mounting portion (22), the bottoms of the sliding grooves (711) formed on the sidewall of the circular table part (71) point to the positions of the pockets of the retainer (4).

6. A bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 1, wherein The handle part (73) is provided on the upper part of the circular table part (71), and the handle part (73) is cylindrical.

7. The bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 1, wherein The bottom of the cylindrical part (72) is provided with a suction disc assembly (8), and the inside of the mounting device is provided with a top rod (9).

8. A bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 7, wherein The inside of the circular table part (71) and the cylindrical part (72) is provided with a mounting hole (74), and the top rod (9) is arranged in the mounting hole (74); The handle part (73) is a cylindrical sleeve, and the inside of the handle part (73) is provided with a pressing plate (91); The lower part of the pressing plate (91) is provided with a spring (10).

9. A bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 8, wherein The bottom of the top rod (9) is provided with a top plate (92), and the bottom of the cylindrical part (72) is provided with a sealing groove (721); After the spring (10) lifts the pressing plate (91), the top rod (9) drives the top plate (92) to be pressed into the sealing groove (721).

10. A bearing ball mounting device for a semiconductor thermal annealing apparatus according to claim 9, wherein The top plate (92) is provided with a sealing ring (93), and when the top plate (92) is pressed into the sealing groove (721), the sealing ring (93) is tightly attached to the sealing groove (721).

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