A new high-voltage lamp bead

Abstract

This application discloses a novel high-voltage LED chip, including an LED bracket. The LED bracket contains a first conductive pad and a second conductive pad. A data output pin is located on the side of the first conductive pad, and positive power supply pins are located on both sides of the second conductive pad. An LED driver IC is mounted on the first conductive pad, and a light-emitting unit electrically connected to the LED driver IC is mounted on the second conductive pad. A first resistor is connected in series between the LED driver IC and the data output pin, and a second resistor is connected in series between the LED driver IC and the positive power supply pin. By connecting the second resistor in series between the LED driver IC and the external power supply pin, this application can suppress inrush current when the external power supply is connected, preventing the LED driver IC from burning out due to overcurrent or overvoltage. The first resistor connected in series between the LED driver IC and the data output pin allows for better matching between the impedance of the LED driver IC's data output terminal and the characteristic impedance of the transmission line between the pins, reducing the bit error rate of high-frequency signal transmission.

Description

[Technical Field] This utility model relates to the field of LED lamp bead technology, and in particular to a novel high-voltage lamp bead. [Background Technology] High-voltage LED chips, as core light source components in the LED lighting industry, rely on the high-voltage, low-current power supply characteristics. They achieve high brightness through a series-parallel architecture of multiple LED chips, offering advantages such as excellent energy efficiency, long lifespan, and fast response speed. They are widely used in smart home lighting, automotive headlights, and industrial visual illumination. Their working principle involves a driver IC converting an external high-voltage power supply into a constant current / constant voltage drive signal adapted to the LED chip, precisely controlling the luminous intensity and color temperature.

[0003] Existing high-voltage LED chips have a problem where the driver IC is directly coupled to the external power supply network on the power supply side. The surge current at the moment of power-on and power-off can easily cause overcurrent or overvoltage in the driver IC, leading to its breakdown and burnout. In addition, the transmission line impedance mismatch between the driver IC signal side and the external control pin causes high-frequency data signals to generate reflections, edge overshoots, and ringing noise during the interaction process, resulting in a sharp increase in the bit error rate. [Utility Model Content] To address the technical problems of high-voltage lamp beads being prone to burnout and high error rates in high-frequency signal transmission during practical applications, this utility model provides a novel high-voltage lamp bead.

[0005] To achieve the above objectives, this utility model is implemented by the following technical solution: A novel high-voltage LED chip includes an LED bracket. The LED bracket contains a first conductive pad and a second conductive pad. The first conductive pad has a data output pin on its side, and the second conductive pad has positive power pins on both sides. An LED driver IC is mounted on the first conductive pad, and a light-emitting unit electrically connected to the LED driver IC is mounted on the second conductive pad. A first resistor is connected in series between the LED driver IC and the data output pin, and a second resistor is connected in series between the LED driver IC and the positive power pin.

[0006] By adopting the above technical solution, a second resistor is connected in series between the LED driver IC and the positive power supply pin of the external power supply, which can suppress the surge current when the external power supply is connected and prevent the LED driver IC from burning out due to overcurrent or overvoltage. The first resistor connected in series between the LED driver IC and the data output pin can better match the impedance of the data output terminal of the LED driver IC with the characteristic impedance of the transmission line between the pins, reduce the reflection and radiation of high-frequency data signals during transmission, suppress signal edge overshoot and ringing, and significantly reduce the bit error rate of high-frequency signal transmission.

[0007] As described above, in a novel high-voltage lamp bead, a data input pin is also provided on the side of the first conductive pad opposite to the data output pin, and a power supply negative pin is also provided on both sides of the first conductive pad. The lamp bead driver IC is electrically connected to the data input pin and the power supply negative pin respectively.

[0008] As described above, a novel high-voltage lamp bead, wherein the light-emitting unit includes a red light chip group for emitting red light, a blue light chip group for emitting blue light, and a green light chip group for emitting green light.

[0009] As described above, a new type of high-voltage lamp bead uses 9V red, blue, and green light chipsets when the power supply voltage of the high-voltage lamp bead is 12V.

[0010] As described above, a new type of high-voltage lamp bead uses 18V red, blue, and green light chipsets when the power supply voltage of the high-voltage lamp bead is 24V.

[0011] As described above, in a novel high-voltage lamp bead, the LED bracket is further provided with an insulating adhesive layer, which is used to cover the lamp bead driver IC and the light-emitting unit.

[0012] To achieve the above objectives, this utility model also proposes another novel high-voltage lamp bead, including an LED bracket. The LED bracket has a third conductive pad, and data output pins and data input pins are respectively provided on both sides of the third conductive pad. A positive power supply pin and a negative power supply pin are also provided on both sides of the third conductive pad. A lamp bead driver IC and a light-emitting unit electrically connected to the lamp bead driver IC are also attached to the third conductive pad. A first resistor is connected in series between the lamp bead driver IC and the data output pin, and a second resistor is connected in series between the lamp bead driver IC and the positive power supply pin.

[0013] As described above, a novel high-voltage lamp bead, wherein the light-emitting unit includes a red light chip group for emitting red light, a blue light chip group for emitting blue light, and a green light chip group for emitting green light.

[0014] As described above, a new type of high-voltage lamp bead uses 9V red, blue, and green light chipsets when the power supply voltage of the high-voltage lamp bead is 12V.

[0015] As described above, a new type of high-voltage lamp bead uses 18V red, blue, and green light chipsets when the power supply voltage of the high-voltage lamp bead is 24V.

[0016] Compared with the prior art, the novel high-voltage lamp bead proposed in this utility model has the following beneficial effects: 1. The high-voltage lamp bead proposed in this utility model has a second resistor connected in series between the lamp bead driver IC and the positive power supply pin of the external power supply, which can suppress the surge current when the external power supply is connected and prevent the lamp bead driver IC from burning out due to overcurrent or overvoltage; the first resistor connected in series between the lamp bead driver IC and the data output pin can better match the impedance of the data output terminal of the lamp bead driver IC with the characteristic impedance of the transmission line between the pins, reduce the reflection and radiation of high-frequency data signals during transmission, suppress signal edge overshoot and ringing, and significantly reduce the bit error rate of high-frequency signal transmission.

[0017] 2. The light-emitting unit proposed in this utility model includes a red light chip group, a blue light chip group, and a green light chip group capable of emitting three primary colors, enabling high-voltage lamp beads to mix colors across the full spectrum. Compared to single-color high-voltage lamp beads, this better adapts to the light color requirements of various scenarios. Secondly, the red light chip group, blue light chip group, and green light chip group are all composed of multiple light-emitting chips connected in series, which increases the operating voltage of the high-voltage lamp beads. Compared to traditional low-voltage 3V light-emitting chips, this reduces the required driving current, thereby reducing energy loss during power supply step-down and improving the luminous effect of the high-voltage lamp beads. Furthermore, no additional driving circuit is required to convert and stabilize the voltage, simplifying circuit design and reducing costs. [Attached Image Description] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0019] Figure 1 This is a schematic diagram of the structure of the first embodiment of the present utility model; Figure 2 This is a schematic diagram of the structure of the second embodiment of the present utility model.

Detailed Implementation Methods

[0021] First embodiment: Please refer to Figure 1 As shown in the embodiment of this specification, a novel high-voltage lamp bead is proposed, including an LED bracket 1, wherein the LED bracket 1 is provided with a first conductive pad 21 and a second conductive pad 22.

[0022] Specifically, the first conductive pad 21 has a data output pin 211 on its side, and the second conductive pad 22 has a power positive pin 221 on both sides. The first conductive pad 21 is equipped with an LED driver IC3, and the second conductive pad 22 is equipped with a light-emitting unit 4 that is electrically connected to the LED driver IC3. A first resistor 5 is connected in series between the LED driver IC3 and the data output pin 211, and a second resistor 6 is connected in series between the LED driver IC3 and the power positive pin 221.

[0023] In this embodiment, the high-voltage lamp bead incorporates a built-in lamp bead driver IC, and a second resistor is connected in series between the lamp bead driver IC and the positive pin of the external power supply. This can suppress the surge current when the external power supply is connected, preventing the lamp bead driver IC from burning out due to overcurrent or overvoltage. Furthermore, when the lamp bead driver IC is accidentally short-circuited, the second resistor will heat up or even melt first, thereby isolating the fault point and preventing the sudden current caused by the failure of a single high-voltage lamp bead from interfering with other lamp beads on the LED strip through the power line, thus avoiding large-area lamp bead failure.

[0024] In addition, the first resistor connected in series between the LED driver IC and the data output pin can better match the impedance of the data output terminal of the LED driver IC with the characteristic impedance of the transmission line between the pins, reduce the reflection and radiation of high-frequency data signals during transmission, suppress signal edge overshoot and ringing, and significantly reduce the bit error rate of high-frequency signal transmission.

[0025] Furthermore, as a preferred embodiment of this solution and not a limitation, a data input pin 212 is also provided on the side of the first conductive pad 21 opposite to the data output pin 211, and a power supply negative pin 213 is also provided on both sides of the first conductive pad 21. The lamp driver IC3 is electrically connected to the data input pin 212 and the power supply negative pin 213 respectively.

[0026] In this embodiment, the data input pin and the data output pin form a bidirectional data channel. Thus, the LED driver IC can receive external real-time control commands through the data input pin and provide feedback on its own working status through the data output pin. For example, it can upload fault information through the data output pin, thereby accurately locating the faulty LED on the LED strip and improving the controllability of the LED strip system.

[0027] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the light-emitting unit 4 includes a red light chip group 41 for emitting red light, a blue light chip group 42 for emitting blue light, and a green light chip group 43 for emitting green light.

[0028] In a preferred embodiment, the red light chip group 41 includes multiple red light chips connected in series to increase the operating voltage of the red light chip group 41, and the multiple red light chips are connected in series by gold or silver wires. The blue light chip group 42 includes multiple blue light chips connected in series to increase the operating voltage of the blue light chip group 42, and the multiple blue light chips are connected in series by gold or silver wires. The green light chip group 43 includes multiple green light chips connected in series to increase the operating voltage of the green light chip group 43, and the multiple green light chips are connected in series by gold or silver wires.

[0029] In this embodiment, the light-emitting unit of the high-voltage lamp bead includes a red light chip group, a blue light chip group, and a green light chip group capable of emitting the three primary colors. This allows the high-voltage lamp bead to mix colors across the entire spectrum, making it better suited to the light color requirements of various scenarios compared to monochromatic high-voltage lamp beads. Secondly, the red, blue, and green light chip groups are all composed of multiple light-emitting chips connected in series, which increases the operating voltage of the high-voltage lamp bead. Compared to traditional low-voltage 3V light-emitting chips, this reduces the required driving current, thereby reducing energy loss during power supply step-down and improving the luminous effect of the high-voltage lamp bead. Furthermore, it eliminates the need for additional driving circuits to convert and stabilize the voltage, simplifying circuit design and reducing costs.

[0030] It is worth noting that the red light chip group 41, blue light chip group 42 and green light chip group 43 are connected in series with different numbers of light-emitting chips, so that the working voltage of the red light chip group 41, blue light chip group 42 and green light chip group 43 can meet the voltage requirements of 6V, 9V, 18V or even higher voltage.

[0031] Furthermore, compared to the existing mainstream 5V high-voltage lamp beads, the high-voltage lamp beads in this embodiment can be supplied with a 12V or 24V power supply voltage.

[0032] It is worth noting that when the power supply voltage of the high-voltage lamp beads in this embodiment is 12V, the 9V red light chip group 41, blue light chip group 42 and green light chip group 43 are preferred. When the power supply voltage of the high-voltage lamp beads in this embodiment is 24V, the 18V red light chip group 41, blue light chip group 42 and green light chip group 43 are preferred.

[0033] In this embodiment, when the high-voltage lamp bead is used in a scenario with a 12V power supply voltage, its internal light-emitting unit uses a 9V red light chip group, a blue light chip group, and a green light chip group, so that the forward driving voltage of the light-emitting unit is 9V. Compared with the 6V light-emitting chip, it is more compatible with the 12V power supply voltage, which significantly reduces the energy loss in the process of the high-voltage lamp bead driving the light-emitting unit to emit light. Similarly, when the high-voltage lamp bead is used in a scenario with a 24V power supply voltage, its internal light-emitting unit uses 18V red light chip group, blue light chip group and green light chip group, so that the forward driving voltage of the light-emitting unit is 18V, which is more compatible with the 12V power supply voltage and significantly reduces the energy loss in the process of the high-voltage lamp bead driving the light-emitting unit to emit light.

[0034] Furthermore, as a preferred embodiment, the LED bracket 1 is also provided with an insulating adhesive layer 7, which is used to cover the LED driver IC 3 and the light-emitting unit 4.

[0035] In this embodiment, the insulating adhesive layer completely covers the LED driver IC and the light-emitting unit, and also covers the exposed conductive areas between the pins and conductive pads of both, preventing the conductive areas from directly contacting external conductors, causing leakage, short circuits, or electric shock risks to users; at the same time, it also protects the LED driver IC and the light-emitting unit from corrosion or impact from the external environment, thereby improving the light-emitting reliability and service life of the high-voltage LED.

[0036] Second embodiment: Please refer to Figure 2 As shown in the embodiments of this specification, another novel high-voltage lamp bead is proposed. This high-voltage lamp bead differs from the high-voltage lamp bead of the first embodiment in that the pad structure is different. Specifically, this high-voltage lamp bead includes an LED bracket 1, and a third conductive pad 23 is provided inside the LED bracket 1. Data output pin 211 and data input pin 212 are respectively provided on both sides of the third conductive pad 23. A positive power supply pin 221 and a negative power supply pin 213 are also provided on both sides of the third conductive pad 23. A lamp bead driver IC 3 and a light-emitting unit 4 electrically connected to the lamp bead driver IC 3 are also attached to the third conductive pad 23. A first resistor 5 is connected in series between the lamp bead driver IC 3 and the data output pin 211, and a second resistor 6 is connected in series between the lamp bead driver IC 3 and the positive power supply pin 221.

[0037] Compared to the high-voltage lamp bead of the first embodiment, the high-voltage lamp bead of this embodiment uses a single molded third conductive pad instead of the first and second conductive pads of the first embodiment, thereby reducing the size of the high-voltage lamp bead and making it more suitable for micro devices. Secondly, by soldering the lamp bead driver IC and the light-emitting unit on the same conductive pad, the number of leads or circuit board traces can be reduced, avoiding a scattered circuit layout and avoiding signal attenuation and electromagnetic interference caused by long-distance leads.

[0038] Furthermore, as a preferred embodiment of this solution and not a limitation thereof, the light-emitting unit 4 includes a red light chip group 41 for emitting red light, a blue light chip group 42 for emitting blue light, and a green light chip group 43 for emitting green light.

[0039] In a preferred embodiment, the red light chip group 41 includes multiple red light chips connected in series to increase the operating voltage of the red light chip group 41, and the multiple red light chips are connected in series by gold or silver wires. The blue light chip group 42 includes multiple blue light chips connected in series to increase the operating voltage of the blue light chip group 42, and the multiple blue light chips are connected in series by gold or silver wires. The green light chip group 43 includes multiple green light chips connected in series to increase the operating voltage of the green light chip group 43, and the multiple green light chips are connected in series by gold or silver wires.

[0040] It is worth noting that the red light chip group 41, blue light chip group 42 and green light chip group 43 are connected in series with different numbers of light-emitting chips, so that the working voltage of the red light chip group 41, blue light chip group 42 and green light chip group 43 can meet the voltage requirements of 6V, 9V, 18V or even higher voltage.

[0041] Furthermore, compared to the existing mainstream 5V high-voltage lamp beads, the high-voltage lamp beads in this embodiment can be supplied with a 12V or 24V power supply voltage.

[0042] It is worth noting that when the power supply voltage of the high-voltage lamp beads in this embodiment is 12V, the 9V red light chip group 41, blue light chip group 42 and green light chip group 43 are preferred. When the power supply voltage of the high-voltage lamp beads in this embodiment is 24V, the 18V red light chip group 41, blue light chip group 42 and green light chip group 43 are preferred.

[0043] Furthermore, as a preferred embodiment, the LED bracket 1 is also provided with an insulating adhesive layer 7, which is used to cover the LED driver IC 3 and the light-emitting unit 4.

[0044] Those skilled in the art should understand that the above description is one embodiment provided in conjunction with specific content, and does not imply that the specific implementation of this utility model is limited to these descriptions. Furthermore, due to differences in industry naming conventions, it is not limited to the above names or English names. Any methods or structures similar to or identical to those of this utility model, or any technical deductions or substitutions made based on the concept of this utility model, should be considered within the scope of protection of this utility model.

Claims

1. A novel high-voltage lamp bead, comprising an LED bracket (1), wherein the LED bracket (1) is provided with a first conductive pad (21) and a second conductive pad (22), the first conductive pad (21) is provided with a data output pin (211) on its side, and the second conductive pad (22) is provided with a power supply positive pin (221) on both sides, characterized in that, The first conductive pad (21) is provided with a lamp driver IC (3), and the second conductive pad (22) is provided with a light-emitting unit (4) that is electrically connected to the lamp driver IC (3). A first resistor (5) is connected in series between the lamp driver IC (3) and the data output pin (211), and a second resistor (6) is connected in series between the lamp driver IC (3) and the power supply positive pin (221).

2. The novel high-voltage lamp bead according to claim 1, characterized in that, The first conductive pad (21) is provided with a data input pin (212) on the side opposite to the data output pin (211), and the first conductive pad (21) is provided with a power supply negative pin (213) on both sides. The lamp bead driver IC (3) is electrically connected to the data input pin (212) and the power supply negative pin (213) respectively.

3. The novel high-voltage lamp bead according to claim 1, characterized in that, The light-emitting unit (4) includes a red light chip group (41) for emitting red light, a blue light chip group (42) for emitting blue light, and a green light chip group (43) for emitting green light.

4. A novel high-voltage lamp bead according to claim 3, characterized in that, When the power supply voltage of the high-voltage lamp bead is 12V, the 9V red light chip group (41), blue light chip group (42) and green light chip group (43) are selected.

5. A novel high-voltage lamp bead according to claim 1, characterized in that, When the power supply voltage of the high-voltage lamp bead is 24V, the 18V red light chip group (41), blue light chip group (42) and green light chip group (43) are selected.

6. A novel high-voltage lamp bead according to claim 1, characterized in that, The LED bracket (1) is also provided with an insulating adhesive layer (7), which is used to cover the LED driver IC (3) and the light-emitting unit (4).

7. A novel high-voltage lamp bead, comprising an LED bracket (1), wherein the LED bracket (1) is provided with a third conductive pad (23), characterized in that, The third conductive pad (23) has a data output pin (211) and a data input pin (212) on both sides respectively. The third conductive pad (23) also has a power positive pin (221) and a power negative pin (213) on both sides. The third conductive pad (23) also has an LED driver IC (3) and a light-emitting unit (4) electrically connected to the LED driver IC (3). A first resistor (5) is connected in series between the LED driver IC (3) and the data output pin (211). A second resistor (6) is connected in series between the LED driver IC (3) and the power positive pin (221).

8. A novel high-voltage lamp bead according to claim 7, characterized in that, The light-emitting unit (4) includes a red light chip group (41) for emitting red light, a blue light chip group (42) for emitting blue light, and a green light chip group (43) for emitting green light.

9. A novel high-voltage lamp bead according to claim 7, characterized in that, When the power supply voltage of the high-voltage lamp bead is 12V, the 9V red light chip group (41), blue light chip group (42) and green light chip group (43) are selected.

10. A novel high-voltage lamp bead according to claim 7, characterized in that, When the power supply voltage of the high-voltage lamp bead is 24V, the 18V red light chip group (41), blue light chip group (42) and green light chip group (43) are selected.

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