Hybrid package light source and electronic device

Abstract

The utility model discloses a kind of hybrid packaging light source and electronic equipment, and the hybrid packaging light source includes: substrate, at least one laser assembly, at least one LED chip and at least one optical assembly being set on the substrate;Optical assembly is set in the side of each laser assembly and each LED chip, for receiving laser beam emitted by laser assembly, and received laser is reflected or refracted to each LED chip.The light source provided in the application hybrid packaging laser light source and LED light source, so that the light source after packaging considers the high light intensity and high luminous flux of two different types of light source, and the hybrid packaging light source uses same optical assembly to adjust the transmission direction of laser and LED light, realizes the construction miniaturization and integration of light source, so the light source of the application considers the advantages of high light intensity, high luminous flux and miniaturization, can be widely applied to diversified optical scene.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, and in particular to a hybrid packaged light source and electronic device. Background Technology

[0002] In existing lighting and optical applications, single LED light sources have significant limitations. For example, while a single LED light source can provide a certain luminous flux, it is difficult to meet the demands for high luminous intensity. On the other hand, while a single laser light source has a significant advantage in high luminous intensity, it lacks luminous flux. Traditional technology for hybrid packaging of LED and laser light sources typically involves packaging the LED and laser light sources separately, and then combining the packaged LED and laser light sources together. Although this packaging method can achieve both high luminous intensity and high luminous flux, the resulting hybrid light source is relatively large, limiting the miniaturized integration of light sources required in high-end lighting and optical equipment.

[0003] Therefore, the existing technology needs further improvement. Utility Model Content

[0004] The purpose of this invention is to provide a hybrid packaged light source and electronic device that overcomes the shortcomings of being incompatible with the high light intensity, high luminous flux, and small size of laser light sources and LED light sources.

[0005] The technical solution adopted by this utility model to solve the technical problem is as follows: In a first aspect, this utility model discloses a hybrid packaged light source, comprising: a substrate, at least one laser component, at least one LED chip and at least one optical component disposed on the substrate, a phosphor layer disposed above the LED chip, and a metal dam disposed on the substrate surrounding the laser component, the LED chip and the optical component. The optical component is disposed on the side of each laser component and is used to receive the laser beam emitted by the laser component and reflect or refract the received laser light to the center of the fluorescent layer. The fluorescent layer is used to receive LED light emitted by the LED chip and laser light emitted by the laser component, and to convert the LED light and the laser light into light of the target wavelength for emission. The fluorescent layer is disposed above the area enclosed by the metal dam, and together with the metal dam and the substrate, forms a sealed space to encapsulate each of the laser components, each of the LED chips and each of the optical components.

[0006] Optionally, the optical component is located at the center of the substrate, and the laser component and the LED chip are arranged around the optical component.

[0007] Optionally, the fluorescent layer is a glass sheet coated with phosphor.

[0008] Optionally, the fluorescent layer is a fluorescent sheet, which is a phosphor-based fluorescent sheet, a quantum dot fluorescent sheet, or a ceramic fluorescent sheet.

[0009] Optionally, the number of optical components is one, and the number of LED chips is multiple; the laser component and each of the LED chips are distributed around the optical component.

[0010] Optionally, the metal dam may be in the shape of a circular cylindrical shape, a square cylindrical shape, or a polygonal prism shape.

[0011] Optionally, the LED chip includes multiple LED chips, each LED chip having a first lens covering its surface, and each first lens being used to focus the light emitted by the corresponding LED chip onto a phosphor sheet.

[0012] Optionally, the LED chip includes multiple LED chips, and a lens group adapted to the arrangement of each LED chip is covered on the surface of each LED chip. The lens group is formed by connecting first lenses corresponding to multiple LED chips, and is used to focus the light emitted by each LED chip onto the phosphor sheet.

[0013] Optionally, the optical component is a second lens, which is disposed in the laser light path of the laser component to receive the laser and adjust the transmission direction of the reflected or refracted laser light to be in the same direction as the LED light emitted by each LED chip; after the laser light emitted by the laser component is adjusted by the optical component, the transmission direction is coaxial with the direction of the central axis of the phosphor sheet.

[0014] Secondly, this utility model also provides an electronic device, which includes: the aforementioned hybrid packaged light source.

[0015] Beneficial effects: This utility model provides a hybrid packaged light source and electronic device. The hybrid packaged light source includes: a substrate, at least one laser component, at least one LED chip, and at least one optical component disposed on the substrate; the optical component is disposed on the side of each laser component and each LED chip, for receiving the laser beam emitted by the laser component and reflecting or refracting the received laser to each LED chip, thereby realizing the hybridization of laser light source and LED light source in the same light source, taking into account the high light intensity and high light flux of the two different types of light sources. Furthermore, the hybrid packaged light source provided by this application uses the same optical component to adjust the transmission direction of the laser and LED light sources, thereby making the light source construction more miniaturized and integrated, and can be widely used in light source scenarios that require high light intensity, high light flux, and miniaturization. Attached Figure Description

[0016] Figure 1 A three-dimensional structural diagram of the hybrid packaged light source provided by this utility model; Figure 2 This is a schematic diagram of the internal structure of the first embodiment of the hybrid packaged light source provided by this utility model; Figure 3 A schematic diagram of the internal structure of the first embodiment of the hybrid packaged light source provided by this utility model; Figure 4 A three-dimensional schematic diagram of the internal structure of the first embodiment of the hybrid packaged light source provided by this utility model; Figure 5 A three-dimensional schematic diagram of the internal structure of the second embodiment of the hybrid packaged light source provided by this utility model; Figure 6 A schematic diagram of the internal structure of the second embodiment of the hybrid packaged light source provided by this utility model; Figure 7 A three-dimensional structural diagram of the appearance of the third embodiment of the hybrid packaged light source provided by this utility model; Figure 8 This is a schematic diagram of the internal structure of the third embodiment of the hybrid encapsulated light source provided by this utility model; Figure 9 A three-dimensional schematic diagram of the internal structure of the third embodiment of the hybrid packaged light source provided by this utility model; Figure 10 A schematic diagram of the internal structure of the third embodiment of the hybrid packaged light source provided by this utility model. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0018] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein.

[0019] Current lighting technologies typically use single light sources, such as LED or laser light sources. While a single LED light source can provide a certain luminous flux, it cannot provide high luminous intensity, thus failing to simultaneously meet the requirements of high luminous flux and high luminous intensity. Similarly, while a single laser light source can meet the requirement of high luminous intensity, it cannot meet the requirement of high luminous flux, and therefore cannot simultaneously meet the requirements of high luminous intensity and high luminous flux.

[0020] In existing technologies, when constructing light sources that balance high luminous intensity and high luminous flux, individual LED and laser light sources are typically packaged separately and then integrated together. This results in a large hybrid light source. While achieving both high luminous intensity and high luminous flux, the large size limits its application in high-end lighting and optical equipment. Therefore, existing hybrid light sources cannot yet achieve effective integration.

[0021] On the other hand, existing hybrid light sources simply integrate a single laser and a single LED light source into a single device, controlling the laser and LED light sources separately to emit different types of light beams from the same device, thus achieving high light intensity and high luminous flux. However, this method results in the laser and LED light sources not emitting light on the same emitting surface, which can easily lead to uneven light spot overlap, local color distortion, or brightness gaps due to positional differences. Moreover, since different types of light sources are located on different emitting surfaces, a separate adaptation structure needs to be designed for each light source, resulting in optical path redundancy and complex debugging.

[0022] To overcome the above problems, this embodiment provides a hybrid packaged light source and electronic device. The hybrid packaged light source includes: a substrate, at least one laser component disposed on the substrate, at least one LED chip and at least one optical component, a phosphor layer and a metal dam; the optical component receives the laser beam emitted by the laser component and reflects or refracts the received laser light to the center of the phosphor layer; the phosphor layer receives the LED light emitted by the LED chip and the laser light emitted by the laser component, and converts the LED light and the laser light into light of the target wavelength for emission, so as to realize the hybrid packaging of laser light source and LED light source in the same light source device, taking into account the high light intensity and high luminous flux of two different types of light sources. Furthermore, the hybrid packaged light source provided in this application uses the same optical component to adjust the transmission direction of laser and LED light sources, thereby making the light source construction more miniaturized and integrated, and can be widely used in light source scenarios requiring high light intensity, high luminous flux and miniaturization, thus having wide applicability.

[0023] The following is a detailed description of a hybrid packaged light source and electronic device provided in this embodiment, with reference to the accompanying drawings.

[0024] Firstly, this embodiment discloses a hybrid packaged light source, such as... Figure 1 and Figure 2 As shown, it includes: a substrate 10, at least one laser component 103, at least one LED chip 101 and at least one optical component 102 disposed on the substrate, a phosphor layer 30 disposed above the LED chip 101, and a metal dam 20 disposed on the substrate surrounding the laser component, the LED chip and the optical component.

[0025] The optical component 102 is disposed on the side of each of the laser components 103 and each of the LED chips 101, and is used to receive the laser beam emitted by the laser component 103 and reflect or refract the received laser beam to the center of each phosphor layer 30.

[0026] Furthermore, such as Figure 1 As shown, the fluorescent layer is disposed above each LED chip and is used to receive the LED light emitted by each LED chip and the laser light emitted by each laser component, and to convert the LED light and the laser light into light of the target wavelength for emission.

[0027] The metal dam 20 is disposed on the periphery above the substrate 10, and the fluorescent layer is disposed above the area enclosed by the metal dam. The metal dam and the substrate encapsulate each laser component, each LED chip and each optical component in a sealed space.

[0028] Furthermore, such as Figure 1 and Figure 2 As shown, the metal dam 20 surrounds the laser component 103, the LED chip 101, and the optical component 102.

[0029] The fluorescent layer is disposed above the area enclosed by the metal dam, and together with the metal dam and the substrate, forms a sealed space to encapsulate each laser component, each LED chip and each optical component.

[0030] In specific implementations, the fluorescent layer is a fluorescent sheet, which can be any one of a phosphor-based fluorescent sheet, a quantum dot fluorescent sheet, or a ceramic fluorescent sheet. The fluorescent layer can also be a glass sheet coated with phosphor.

[0031] Furthermore, in the hybrid light source device disclosed in this application, there is one optical component, one or more laser components, and multiple LED chips; the laser components and each of the LED chips are distributed around the optical component. Figure 2 and Figure 3As shown, in this embodiment, the optical component 102 is disposed at the center of the substrate, and the laser component and each LED chip are located around the optical component. In order to obtain more uniform output light, the laser component and each LED chip are evenly distributed. The laser emitted from the laser component 103 is transmitted to the optical component 102. The optical component 102 reflects or refracts the received laser light so that the reflected or refracted laser light illuminates the center of each phosphor layer, thereby realizing that the light emitted by the phosphor layer has both laser light and LED light, resulting in a hybrid light source with both high light intensity and high luminous flux.

[0032] Furthermore, the light-emitting characteristics of lasers and LED chips in a hybrid light source are complementary (lasers have high brightness and strong directionality, but a narrow spectrum; LEDs have a wide spectrum and good color rendering, but lower brightness). In practical implementation, a reflector can be used to reflect the laser onto the LED or into its output path, achieving coupled output of the two lights to form a composite light source. For example, in certain special lighting scenarios (such as stage lighting and emergency lighting), lasers provide high-brightness directional light, while LEDs provide broad-spectrum ambient light. The reflector guides the laser and LED light to mix in the same optical path, balancing brightness and color rendering. The angle and reflectivity of the reflector can precisely control the proportion of laser light in the composite light, flexibly adjusting the luminous efficacy, color temperature, or directionality of the light source.

[0033] Furthermore, if the LED chip is a semiconductor chip (such as GaN-based or InGaN-based), its light-emitting principle is electroluminescence (current injection causes electron-hole pair recombination to emit light). However, the semiconductor material itself may also produce photoluminescence under external light irradiation. For example, if the optical component is a reflector, when a laser is precisely reflected onto the LED chip through the reflector, if the laser wavelength matches the absorption spectrum of the LED chip material (such as irradiating a GaN-based LED with an ultraviolet laser, where GaN has strong absorption of ultraviolet light), it can excite the LED chip to produce additional photoluminescence, which, combined with the LED's own electroluminescence, enhances the overall luminous intensity.

[0034] In specific implementation, such as Figure 1 and Figure 7 As shown, the metal dam can be in the shape of a circular cylinder, a square cylinder, a polygonal prism, or a cylinder with an irregular cross-section. The specific shape can be designed according to the needs of the specific application scenario. The material of the metal dam can be pure copper, brass, aluminum, or aluminum alloy, etc., and can be selected according to the different devices used for the light source application.

[0035] like Figure 4As shown, to achieve miniaturization and integration of the hybrid light source device provided in this embodiment, each LED chip, laser component, and optical component is disposed within a fixed groove in the central region of the substrate. By fixing each component within the groove, precise installation of each component is achieved, ensuring its stable position on the circuit board. Furthermore, other connecting elements or modules, such as sensors and connectors, can be physically positioned using the groove, ensuring accurate positioning after assembly and facilitating subsequent connections and functional implementation.

[0036] Furthermore, in order to avoid the accumulation of heat in the groove and thus affect the performance of the hybrid light source device, a heat sink can also be installed in the groove to dissipate the heat inside the device.

[0037] Furthermore, to enable the hybrid light source device provided in this application to output a more uniform beam of brightness, each LED chip has a first lens covering its surface. Each first lens is used to focus the light emitted by the corresponding LED chip onto the phosphor sheet. In one implementation, the first lens can be a convex lens. Figure 5 As shown, a convex lens is covered on each LED chip. The light emitted by the corresponding LED chip is adjusted by the convex lens so that the light output from each convex lens is more concentrated and input to the phosphor sheet, thereby improving the light utilization rate and obtaining a high-intensity and high-luminous-flux output beam.

[0038] like Figure 6 As shown, the first lens 104 covering each LED chip is a cylindrical convex lens. One surface of the cylindrical convex lens is cylindrical (convex), and the other surface is usually flat. It can realize the convergence of the light output from the LED chip in a single direction, so that the light emitted by each LED chip moves closer to the center of the phosphor sheet, thereby improving the light utilization rate and reducing light loss.

[0039] Combination Figure 7 and Figure 8 As shown, in one implementation, the metal dam can be configured as a square columnar structure, forming a cubic dam 21. Its edges align with the edges of the substrate 10 and the phosphor sheet, resulting in a cubic shape for the entire hybrid light source device. This cubic structure not only facilitates storage and transportation but also provides strong overall structural stability, making it suitable for various applications.

[0040] To achieve better packaging results and simplify the packaging process, in another implementation, a lens group adapted to the arrangement of each LED chip is placed over the surface of each LED chip. This lens group is constructed by connecting first lenses corresponding to multiple LED chips together to form a whole, used to focus the light emitted by each LED chip onto the phosphor sheet. For example... Figure 9 and Figure 10 As shown, the lens assembly is integrally formed and covers the upper surface of each LED chip to adjust the beam emitted by each LED chip, thereby improving light utilization and reducing light loss.

[0041] Furthermore, the optical component is a second lens, which is disposed in the laser light path of the laser component to receive the laser and adjust the transmission direction of the reflected or refracted laser light to be in the same direction as the LED light emitted by each LED chip; after the laser light emitted by the laser component is adjusted by the optical component, the transmission direction is coaxial with the direction of the central axis of the phosphor sheet.

[0042] The laser light emitted by the laser component is parallel to the plane of the phosphor layer. After the optical component adjusts the laser (reflecting or refracting the laser light), the transmission direction of the reflected or refracted laser light is coaxial with the central axis of the phosphor sheet. The central axis of the phosphor sheet is a straight line passing through the center of the phosphor sheet and perpendicular to the plane of the phosphor sheet. The optical component reflects or refracts the laser light emitted by the laser to the center of the phosphor sheet, and the phosphor sheet converts the received laser light into light of the target wavelength for emission.

[0043] The following describes the hybrid light source device provided by this utility model in further detail using three specific embodiments as examples.

[0044] First Application Example Combination Figure 1 and Figure 2 As shown in this application embodiment, the metal dam has a cylindrical shape, which is a hollow cylinder without a top or bottom, formed by metal sheets. A fluorescent layer is disposed above the metal dam, which can receive the light emitted by the LED chip and laser components and emit the received light on the same surface. The LED chip, optical components, and laser components are located within the sealed space formed by the fluorescent layer, the metal dam, and the substrate.

[0045] Furthermore, in this embodiment, there are multiple LED chips, one laser component, and one optical component. The optical component is located at the center, and the LED chips and laser component are distributed around the optical component. The light emitted by the laser component is reflected by the optical component onto the LED chip, or reflected onto the optical path of the LED light emitted by the LED chip, so that the light source device integrates LED light and laser light.

[0046] Second Application Example Combination Figures 5 to 8As shown in this embodiment, a cylindrical convex lens is covered on each LED chip. The transmission path of the light beam emitted by the LED chip is adjusted by the cylindrical convex lens so that the light emitted by each LED chip can be concentrated on the phosphor sheet, thereby reducing light loss and improving light utilization.

[0047] In addition, in this embodiment, the metal dam is set as a columnar structure to achieve a cubic shape for the entire hybrid light source device, which is more suitable for storage and transportation.

[0048] Third Application Example Combination Figure 9 and Figure 10 As shown, in this embodiment, the individual convex lenses set on each LED chip are replaced with a lens group constructed as a whole, so as to receive the light emitted by each LED chip, which is more conducive to the installation of the hybrid light source device, and the components of the whole device are more integrated, and it is more convenient to adjust the light emitted by each LED chip.

[0049] This invention provides a hybrid light source device that combines laser chips and LED chips to specifically address the problems of insufficient luminous flux from single lasers and inadequate luminous intensity from LEDs. While single laser light sources possess strong directionality and potential for long-range illumination, their limited range and insufficient luminous flux (total light energy emitted per unit time) due to the high collimation of the laser beam make it difficult to meet the uniform illumination needs of large areas, such as during campsite setup, search and rescue operations, and vehicle turns, where they cannot simultaneously cover large spaces. Traditional LED light sources, while offering a relatively wide illumination range and superior luminous flux for large-area illumination, suffer from significant luminous intensity (light energy per unit area) at long distances due to their large beam divergence angle and rapid energy dispersion. This prevents them from penetrating distant darkness to accurately illuminate distant targets, limiting their effectiveness in scenarios such as long-distance obstacle recognition in the wild and detecting distant road conditions while driving at high speeds. The hybrid packaging technology of this invention, by rationally integrating the advantages of laser and LED chips, achieves a balance between long range and large-area illumination. Laser chips can provide strong light intensity, ensuring sufficient brightness at long distances to meet the detection needs of distant targets; LED chips, on the other hand, can provide high light flux, enabling wide-area illumination and covering a large area at close range.

[0050] On the other hand, the LED chip disclosed in this embodiment is also covered with a columnar convex lens or lens group to bring the light emitted by the LED chip closer to the center of the beam and improve the light efficiency by collecting the light.

[0051] Secondly, this utility model also provides an electronic device, including: the aforementioned hybrid packaged light source.

[0052] The electronic devices involved in this utility model can be portable devices, such as flashlights, headlamps, or hand lamps; they can also be vehicle-mounted or outdoor mobile devices, such as vehicle searchlights or mobile lighting vehicles; or they can be mobile fixed light sources, such as rechargeable table lamps, emergency lights, or camping lights.

[0053] In mobile lighting scenarios, flashlights, as handheld devices, are commonly used for route exploration during outdoor adventures, water surface illumination during nighttime fishing, and rubble search during emergency rescue operations. Headlamps, with their advantages of being easy to wear and freeing up the hands, are widely used for equipment maintenance in mining operations, road condition illumination during mountain biking, and campsite setup during camping. Vehicle lights, as key lighting components of vehicles, play a crucial role in scenarios such as nighttime driving, travel in inclement weather (such as heavy rain and fog), and driving on rural roads or unpaved roads in the wild. They need to illuminate the road conditions for the driver at a distance to identify obstacles and intersections ahead, while also ensuring illumination of a certain range around the vehicle to handle maneuvers such as passing oncoming traffic, turning, and parking. These scenarios present diverse lighting requirements, needing sufficient brightness at a distance to identify targets, and also requiring uniform illumination over a wide area at close range.

[0054] Specifically, in flashlights, this hybrid technology allows users to obtain clear, long-range illumination via a laser chip when detecting distant obstacles, while the LED chip provides wide-area coverage to illuminate the surrounding environment. In headlamps, the wide-area illumination provided by the LED chip ensures a bright working area when the user is performing close-range work, while the strong light from the laser chip comes into play when focusing on distant situations. In vehicle lights, when the vehicle is traveling at high speed, the laser chip provides strong light, clearly illuminating the road ahead and allowing the driver to spot the situation ahead in advance. When the vehicle is turning, meeting oncoming traffic, or parking, the LED chip provides wide-area illumination, covering the area around the vehicle and improving driving safety.

[0055] The hybrid light source design composed of laser chip, LED chip and optical components provided by this utility model fully combines the characteristics of the two types of chips. It perfectly solves the defects of single light source in various scenarios of electronic lighting equipment, and brings better lighting effect to electronic devices such as flashlights, headlamps and car lights, greatly improving the applicability and practicality of electronic lighting equipment in different scenarios.

[0056] This invention aims to provide a laser hybrid packaging solution, which achieves a hybrid light source that balances high light intensity and high light flux by rationally arranging optical components, laser chips and LED chips, metal dams, phosphor sheets, etc., to meet the needs of diverse optical application scenarios.

[0057] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0058] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A hybrid packaged light source, characterized by, include: A substrate, at least one laser component, at least one LED chip and at least one optical component disposed on the substrate, a phosphor layer disposed above the LED chip, and a metal dam disposed on the substrate surrounding the laser component, the LED chip and the optical component. The optical component is disposed on the side of each laser component and is used to receive the laser beam emitted by the laser component and reflect or refract the received laser light to the center of the fluorescent layer. The fluorescent layer is used to receive LED light emitted by each LED chip and laser light emitted by each laser component, and to convert the LED light and the laser light into light of the target wavelength for emission. The fluorescent layer is disposed above the area enclosed by the metal dam, and together with the metal dam and the substrate, forms a sealed space to encapsulate each of the laser components, each of the LED chips and each of the optical components.

2. The hybrid packaged light source of claim 1, wherein, The optical component is located at the center of the substrate, and the laser component and the LED chip are arranged around the optical component.

3. The hybrid packaged light source of claim 1, wherein, The fluorescent layer is a glass sheet coated with phosphor.

4. The hybrid packaged light source of claim 1, wherein The fluorescent layer is a fluorescent sheet, which is a phosphor-based fluorescent sheet, a quantum dot fluorescent sheet, or a ceramic fluorescent sheet.

5. The hybrid packaged light source of claim 1, wherein, The optical component is one in number, and the LED chip is multiple in number; the laser component and each of the LED chips are arranged around the optical component.

6. The hybrid packaged light source of claim 1, wherein, The metal dam is in the shape of a circular cylindrical shape, a square cylindrical shape, or a polygonal prism.

7. The hybrid packaged light source of claim 6, wherein, Each LED chip has a first lens covering its surface, and each first lens is used to focus the light emitted by the corresponding LED chip onto the phosphor sheet.

8. The hybrid packaged light source of claim 6, wherein, The LED chip includes multiple LED chips, and each LED chip has a lens group that matches the arrangement of each LED chip on its surface. The lens group is formed by connecting first lenses corresponding to multiple LED chips and is used to focus the light emitted by each LED chip onto the phosphor sheet.

9. The hybrid packaged light source of claim 4, wherein, The optical component is a second lens, which is disposed in the laser light path of the laser component to receive the laser and adjust the transmission direction of the reflected or refracted laser light to be in the same direction as the LED light emitted by each LED chip; after being adjusted by the optical component, the transmission direction of the laser light emitted by the laser component is coaxial with the direction of the central axis of the phosphor sheet.

10. An electronic device, comprising: include: The hybrid packaged light source as described in any one of claims 1-9.

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