Packaging structure of flip white light LED

Abstract

This application provides a packaging structure for flip-chip white LEDs, relating to the field of LED lighting manufacturing technology. It includes a reflector cup, a circular groove, an aluminum alloy support plate, a bracket, and a packaging sleeve. An external threaded tube is located on the top of the reflector cup, and a through-hole is provided at the top of the reflector cup. A positioning mechanism is provided on the outer side of the reflector cup. The aluminum alloy support plate engages with the outer side of the packaging sleeve via multiple sets of brackets at its top, thereby suspending and positioning the packaging sleeve and the multiple sets of LED beads inside, maintaining a preset coaxiality and gap with the reflector cup. This application provides annularly distributed heat dissipation grooves at the bottom of the support plate, breaking the full contact between the support plate and the bottom of the reflector cup, forming an air convection channel for air intake, heating, and exhaust. Cold air enters through the groove gaps, while heated air rises along the cup wall and is exhausted, accelerating heat dissipation and preventing localized high temperatures from causing LED light decay.

Description

Technical Field

[0001] This application relates to the field of LED lighting manufacturing technology, and in particular to a packaging structure for a flip-chip white LED. Background Technology

[0002] The luminous flux of traditional LEDs is far inferior to that of common light sources such as incandescent and fluorescent lamps. For LEDs to enter the lighting field, the primary task is to improve their luminous efficiency and luminous flux to the level of existing lighting sources. As the input power of LED chips continues to increase, higher requirements are placed on the packaging technology of high-power LEDs.

[0003] Currently, light sources generally use pre-packaged LED beads arrays on an aluminum substrate. High-efficiency LED lighting introduces COB substrate direct packaging technology, where flip-chip LEDs are connected to the chip pads and driver board via wires or solder paste. Traditional power supply designs have hidden dangers. Driver boards are often fixed by adhesive or simple slots, which are prone to displacement due to vibration, leading to loose terminals. Flat aluminum alloy substrates are often used, relying solely on planar heat conduction and lacking convection heat dissipation channels, making it easy for heat to accumulate in local areas. Utility Model Content

[0004] This application is made in view of the above-mentioned problems, and its purpose is to provide a packaging structure for flip-chip white LEDs to solve the problems mentioned in the background art. To achieve the above objectives, this utility model provides the following technical solution: a packaging structure for a flip-chip white LED, comprising a reflector cup, a circular groove, an aluminum alloy support plate, a bracket, and a packaging sleeve. An external threaded tube is provided on the top of the reflector cup, and a wire through hole is provided at the top of the reflector cup. A positioning mechanism is provided on the outside of the reflector cup. The aluminum alloy support plate engages with the outside of the packaging sleeve through multiple sets of brackets at its top, thereby suspending and positioning the packaging sleeve and the multiple sets of LED beads inside, so that they maintain a preset coaxiality and gap with the reflector cup.

[0005] Furthermore, the positioning mechanism includes an aluminum alloy support plate, a support base, a threaded rod, a nut, a heat dissipation groove, and a positioning hole. The top of the aluminum alloy support plate is provided with support bases at equal intervals, and the bottom of the support base is provided with a threaded rod. The outer side of the threaded rod is connected to the aluminum alloy support plate, and the outer side of the threaded rod is threaded with a nut. The heat dissipation groove is distributed in a ring at the bottom of the aluminum alloy support plate. The aluminum alloy support plate is located inside the reflector cup body, and the positioning hole is distributed in a ring on the outer side of the aluminum alloy support plate.

[0006] Furthermore, the aluminum alloy support plate is connected to the inner end of the reflector cup body by bolts through two sets of symmetrically opened positioning holes.

[0007] Furthermore, the support is rigidly connected to the aluminum alloy support plate via a threaded rod at its bottom end.

[0008] Furthermore, the circular groove, driving board, wiring terminal, encapsulating sleeve, and LED beads constitute a power supply mechanism. The circular groove is formed at the inner end of the reflector cup. The driving board is engaged with the inside of the reflector cup. The wiring terminal is provided on the outer side of the driving board. The encapsulating sleeve is symmetrically arranged inside the reflector cup. Multiple sets of LED beads are arranged inside the encapsulating sleeve.

[0009] Furthermore, the reflective cup body has a circular groove on its lower inner side, which serves as a positioning and engagement reference and engages with the annular protrusion on the outer edge of the drive plate.

[0010] Furthermore, the wiring terminals mounted on the outside of the drive board are electrically connected to the LED beads through wires, and the other end of the wires is connected to the positive and negative pads corresponding to the LED beads.

[0011] Compared with the prior art, the present invention has the following beneficial effects: 1. This application provides a ring-shaped heat dissipation channel at the bottom of the tray, breaking the full contact between the tray and the bottom of the reflector cup, forming an air convection channel for air intake, heating and exhaust. Cold air from the outside enters through the gaps in the channel, and heated air rises along the cup wall to be discharged, accelerating heat dissipation and avoiding local high temperature leading to LED light decay.

[0012] 2. The top of the tray is equipped with equally spaced support bases to form a rigid support frame for the encapsulation sleeve and internal LED beads, ensuring that its geometric center coincides with the axis of the reflector cup, avoiding light spot deviation or light efficiency loss caused by eccentricity. The suspended positioning ensures that the LED beads are not blocked by the cup wall. Combined with the microlens texture of the encapsulation sleeve, the light spot is further homogenized and glare is reduced. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this drawing or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this drawing. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of the device of this utility model; Figure 2 This is a schematic diagram of the internal structure of the reflective cup of the present invention; Figure 3 This is a schematic diagram of the aluminum alloy pallet structure of this utility model; Figure 4 This is a top view of the aluminum alloy pallet structure of this utility model.

[0015] Explanation of reference numerals: 1. Reflector cup; 2. External threaded tube; 3. Wire hole; 4. Circular groove; 5. Drive board; 6. Terminal block; 7. Positioning mechanism; 8. Aluminum alloy support plate; 9. Support; 10. Encapsulating sleeve; 11. Threaded rod; 12. Nut; 13. Heat dissipation channel; 14. LED bead; 15. Positioning hole.

[0016] The purpose, features, and advantages of this accompanying drawing will be further explained in conjunction with the embodiments and with reference to the accompanying drawing. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following description and illustration are provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.

[0018] Obviously, the following description is merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios without any inventive effort. Furthermore, it is understood that although the effort involved in such development may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0019] Unless otherwise specified, the terms "comprising" and "including" as used in this application can be open-ended or closed-ended. For example, "comprising" and "including" can mean that other components not listed may also be included, or that only the listed components may be included.

[0020] Unless otherwise specified, the term "or" is inclusive in this application. For example, the phrase "A or B" means "A, B, or both A and B". More specifically, the condition "A or B" is satisfied by any of the following conditions: A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); or both A and B are true or exist.

[0021] Terminology explanation: such as Figures 1 to 4As shown, a flip-chip white LED packaging structure includes a reflector cup 1, a circular groove 4, an aluminum alloy support plate 8, a bracket 9, and a packaging sleeve 10. An external threaded tube 2 is provided on the top of the reflector cup 1. A wire hole 3 is provided through the top of the reflector cup 1. A positioning mechanism 7 is provided on the outside of the reflector cup 1. The aluminum alloy support plate 8 engages with the outside of the packaging sleeve 10 through multiple sets of brackets 9 provided on the top, thereby suspending and positioning the packaging sleeve 10 and the multiple sets of LED beads 14 inside, so that they maintain a preset coaxiality and gap with the reflector cup 1.

[0022] The positioning mechanism 7 includes an aluminum alloy support plate 8, a support base 9, a threaded rod 11, a nut 12, a heat dissipation groove 13, and positioning holes 15. The top of the aluminum alloy support plate 8 is provided with support bases 9 at equal intervals, and the bottom of the support base 9 is provided with a threaded rod 11. The outer side of the threaded rod 11 is connected to the aluminum alloy support plate 8, and the outer side of the threaded rod 11 is threaded with a nut 12. The heat dissipation groove 13 is distributed in a ring at the bottom of the aluminum alloy support plate 8. The aluminum alloy support plate 8 is located inside the reflector cup body 1. The positioning holes 15 are distributed in a ring on the outer side of the aluminum alloy support plate 8. The aluminum alloy support plate 8 is bolted to the inner end of the reflector cup body 1 through two sets of symmetrically opened positioning holes 15. The support base 9 is rigidly connected to the aluminum alloy support plate 8 through a threaded rod 11 at its bottom end. The specific operation is as follows: This application protects the encapsulation sleeve 10: The encapsulation sleeve 10, which is symmetrically arranged inside the reflective cup body 1, is made of light-transmitting insulating material, which wraps the LED beads 14 to prevent dust and moisture. At the same time, it engages with the bracket 9 to form an overhead support, avoiding hard contact between the LED beads and the bracket. The LED beads 14 are directly connected to the wires through the solder pads, without the need for gold wire, thus avoiding the breakage of the gold wire due to thermal cycling or vibration. The overhead support of the bracket 9 on the encapsulation sleeve 10 makes the LED beads 14 float in the center of the reflective cup body 1, avoiding the risk of light absorption or short circuit caused by the contact between the LED beads and the cup wall, and at the same time, it is beneficial for the reflective cup body 1 to focus the light.

[0023] like Figures 1 to 3 As shown, the circular groove 4, the driving board 5, the terminal block 6, the encapsulating sleeve 10, and the LED beads 14 constitute the power supply mechanism. The circular groove 4 is opened at the inner end of the reflector cup 1. The driving board 5 is engaged and connected inside the reflector cup 1. The terminal block 6 is provided on the outer side of the driving board 5. The encapsulating sleeve 10 is symmetrically arranged inside the reflector cup 1. Multiple sets of LED beads 14 are arranged inside the encapsulating sleeve 10. The circular groove 4 is opened at the lower inner side of the reflector cup 1. The circular groove 4 serves as a positioning and engaging reference and engages with the annular protrusion on the outer edge of the driving board 5. The terminal block 6 assembled on the outer side of the driving board 5 is electrically connected to the LED beads 14 through wires. The other end of the wires is connected to the positive and negative electrode pads of the LED beads 14. The specific operation is as follows: The reflector cup 1 directs the white light emitted by the LED beads 14 through the inner wall of the parabolic / ellipsoidal surface to converge into the desired light spot; the top external thread tube 2 is used for external lens or mounting interface, the outer wire hole 3 allows the wire to pass through, and the outer positioning mechanism 7 assists in the connection with the heat sink or other components. The working heat of the LED beads 14 is conducted to the bracket 9 through the encapsulation sleeve 10, and then diffused through the aluminum alloy plate 8, and dissipated through the bottom heat dissipation channel 13 with air convection. The contact interface between the plate and the reflector cup 1 is coated with thermal grease to further improve the heat dissipation efficiency.

[0024] Working principle: The elastic engagement between the drive plate 5 and the circular groove 4, and the engagement between the support 9 and the encapsulating sleeve 10, all support the separation of the claws by pressing; the wiring terminal 6 is solderless and crimped for easy wire replacement. The operator uses the threaded rod 11 and nut 12 at the bottom of the support 9 to lock the bottom of multiple sets of support 9, which can be used to adapt to the array of LED beads 14 of different sizes; the bolt connection between the positioning hole 15 and the reflector cup 1 allows for fine adjustment of the overall position of the support plate; During the assembly stage, the operator inserts the drive board 5 into the circular groove 4 of the reflector cup 1, and connects the LED beads 14 to the terminal block 6; the aluminum alloy support plate 8 is fixed to the reflector cup 1 by bolts through the positioning hole 15, and the support 9 is engaged with the encapsulation sleeve 10 after the height is adjusted by the threaded rod 11, thus positioning the array of LED beads 14; the drive board 5 outputs current to light up the LED beads 14, and the reflector cup 1 reflects light for directional output; the aluminum alloy support plate 8 dissipates heat through the heat dissipation groove 13 to maintain stable operation of the LEDs.

[0025] It should be noted that this application is not limited to the above-described embodiments. The above embodiments are merely examples, and any embodiments with the same structure and effect as the technical concept within the scope of this application are included in the technical scope of this application. Furthermore, various modifications that can be conceived by those skilled in the art to the embodiments, and other ways of constructing by combining some of the constituent elements of the embodiments, without departing from the spirit of this application, are also included in the scope of this application.

Claims

1. A packaging structure for a flip-chip white LED, comprising a reflector cup (1), a circular groove (4), an aluminum alloy support plate (8), a support base (9), and a packaging sleeve (10), wherein an external threaded tube (2) is provided on the top of the reflector cup (1), and a through hole (3) is provided at the top of the reflector cup (1), characterized in that: The outer side of the reflective cup body (1) is provided with a positioning mechanism (7). The aluminum alloy plate (8) is engaged with the outer side of the encapsulation sleeve (10) through multiple sets of support seats (9) set at the top, thereby suspending and positioning the encapsulation sleeve (10) and multiple sets of LED beads (14) set inside, so that they maintain a preset coaxiality and gap with the reflective cup body (1).

2. The packaging structure of a flip-chip white LED according to claim 1, characterized in that, The positioning mechanism (7) includes an aluminum alloy support plate (8), a support base (9), a threaded rod (11), a nut (12), a heat dissipation channel (13), and a positioning hole (15). The top of the aluminum alloy support plate (8) is provided with a support base (9) at equal intervals. The bottom of the support base (9) is provided with a threaded rod (11). The outer side of the threaded rod (11) is connected to the aluminum alloy support plate (8). The outer side of the threaded rod (11) is threaded with a nut (12). The heat dissipation channel (13) is distributed in a ring at the bottom of the aluminum alloy support plate (8). The aluminum alloy support plate (8) is located inside the reflector cup body (1). The positioning hole (15) is distributed in a ring on the outer side of the aluminum alloy support plate (8).

3. The packaging structure of a flip-chip white LED according to claim 2, characterized in that, The aluminum alloy support plate (8) is connected to the inner end of the reflector cup body (1) by two sets of positioning holes (15) symmetrically provided.

4. The packaging structure of a flip-chip white LED according to claim 3, characterized in that, The support (9) is rigidly connected to the aluminum alloy support plate (8) by a threaded rod (11) at its bottom end.

5. The packaging structure of a flip-chip white LED according to claim 4, characterized in that, The circular groove (4), drive plate (5), terminal block (6), encapsulation sleeve (10), and LED beads (14) constitute the power supply mechanism. The circular groove (4) is opened at the inner end of the reflector cup (1). The drive plate (5) is engaged and connected inside the reflector cup (1). The terminal block (6) is provided on the outer side of the drive plate (5). The encapsulation sleeve (10) is symmetrically arranged inside the reflector cup (1). Multiple sets of LED beads (14) are arranged inside the encapsulation sleeve (10).

6. The packaging structure of a flip-chip white LED according to claim 5, characterized in that, The reflective cup body (1) has a circular groove (4) on its lower inner side. The circular groove (4) serves as a positioning and engagement reference and engages with the annular protrusion on the outer edge of the drive plate (5).

7. The packaging structure of a flip-chip white LED according to claim 6, characterized in that, The wiring terminal (6) mounted on the outside of the drive board (5) is electrically connected to the LED lamp bead (14) through a wire, and the other end of the wire is connected to the positive and negative electrode pads corresponding to the LED lamp bead (14).

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