Cooling device for semiconductor power device mold

Abstract

The utility model discloses a cooling device for semiconductor power device mould relates to device mould cooling technical field, including four threaded support column and the multiple base plate of sliding of threaded support column on, four threaded support column all equidistance screw joint have multiple adjusting nut, and the base plate bottom abuts at adjusting nut top end face, and one base plate side wall fixedly connected with connecting plate, the utility model discloses the setting of adjusting nut can realize base plate height adjustment, ensure that the base plate interval is fixed when stacking, through the setting of the radiating fin, can absorb the mould concrete heat and quickly dissipate to the air, through the setting of circumferential pressure plate, through the setting of temperature -conducting pipe, can utilize the cooling medium flowing in the inside absorption base plate transmission mould concrete heat, realize mould concrete's initiative water -cooling cooling, solved the long heat transfer path, low efficiency in traditional cooling mode, mould concrete cooling slowly, influence processing efficiency and the problem of forming quality.

Description

Technical Field

[0001] This utility model relates to the field of device mold cooling technology, and in particular to a cooling device for semiconductor power device molds. Background Technology

[0002] During the semiconductor power device mold processing, the mold body will continuously generate a lot of heat due to the high temperature forming process. If the heat cannot be dissipated in time, it will not only prolong the processing cycle, but also cause the mold cavity to deform, affecting the device forming accuracy. Traditional mold cooling often employs a simple method called "external air cooling," which uses a fan to blow air onto the mold surface, using airflow to remove heat. However, this method only works on the mold surface, and heat must be slowly conducted from the inside of the mold to the surface. Furthermore, air has a very low thermal conductivity, resulting in a slow cooling rate that is far from meeting the efficiency requirements of mass production. At the same time, air cooling is easily affected by ambient temperature, and its cooling efficiency will further decrease in high-temperature environments in summer, even leading to a situation where "the more you blow, the hotter it gets," resulting in large temperature fluctuations in the mold and excessive deviations in the dimensional accuracy of the molded parts. Therefore, these problems need to be addressed. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a cooling device for semiconductor power device molds.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a cooling device for a semiconductor power device mold, comprising four threaded support columns and multiple substrates slidably disposed on the threaded support columns, multiple adjusting nuts being screwed onto each of the four threaded support columns at equal intervals, the bottom of the substrate abutting against the top surface of the adjusting nuts, a connecting plate being fixedly connected to the side wall of one of the substrates, a cooling component being provided on one side of the connecting plate, and multiple mounting holes being symmetrically opened on the bottom of the substrate.

[0005] Preferably, the substrate has an internal mounting cavity, and a temperature-conducting tube is installed in the mounting cavity. The temperature-conducting tube is snake-shaped, and one end of the temperature-conducting tube is connected to the side wall of the substrate.

[0006] Preferably, the top surface of the connecting plate is fixed with connecting pipes at both ends, and multiple connecting pipes are fixed vertically at equal intervals on one side of the connecting pipes, and the multiple connecting pipes are threaded to one end of their corresponding temperature-conducting pipes.

[0007] Preferably, the cooling component includes a cooling box disposed on one side of the substrate, a water supply pipe fixedly connected to one side of the cooling box, a reversing valve installed on the water supply pipe, and the other end of the water supply pipe fixedly connected to the bottom of the connecting pipe.

[0008] Preferably, the substrate has sliding holes at its four corners for sliding on the threaded support post, and the top surface of the substrate has a plurality of mounting holes at equal intervals.

[0009] Preferably, the substrate has four limiting plates on the top, a mold body is placed between the four limiting plates, multiple heat dissipation fins are fixed to the side walls of the limiting plates, and bolts are screwed onto the limiting plates, with the bottom of the bolts communicating with the mounting holes.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: In this utility model, the height of the substrate can be adjusted by the cooperation of the threaded support column and the adjusting nut, while providing stable support for the substrate and ensuring that the spacing between the substrates is fixed when multiple substrates are stacked; the combination of the limiting plate and the heat dissipation fins can quickly dissipate the heat of the mold body absorbed by the limiting plate into the air, assisting the heat conduction pipe for cooling; the setting of the heat conduction pipe can utilize the internally flowing cooling medium to absorb the heat of the mold body transferred by the substrate, realizing active water cooling of the mold body, solving the problems of long heat transfer path, low efficiency, slow cooling of the mold body, and impact on processing efficiency and molding quality in traditional cooling methods. Attached Figure Description

[0011] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall first-view structure proposed in this utility model; Figure 2 This is a schematic diagram of the internal second-view structure proposed in this utility model; Figure 3 This is a schematic diagram of the structure of some parts proposed in this utility model; Figure 4 This is a schematic diagram of the substrate structure proposed in this utility model.

[0012] The following are the labels in the diagram: 1. Cooling box; 2. Base plate; 3. Water supply pipe; 4. Connecting pipe; 5. Threaded support column; 6. Reversing valve; 7. Mold body; 8. Heat dissipation fins; 9. Connecting pipe; 10. Sliding hole; 11. Mounting hole; 12. Temperature guide pipe; 13. Adjusting nut. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0014] Example: See Figures 1 to 4The cooling device for semiconductor power device molds of this utility model includes four threaded support columns 5 and multiple substrates 2 slidably disposed on the threaded support columns 5. Multiple adjusting nuts 13 are screwed onto each of the four threaded support columns 5 at equal intervals. The adjusting nuts 13 facilitate the height adjustment of the substrates 2 and provide stable support for the substrates 2, ensuring that the spacing between the substrates 2 is fixed when multiple substrates 2 are stacked. The bottom of the substrate 2 abuts against the top surface of the adjusting nut 13. A connecting plate is fixed to the side wall of one substrate 2. A cooling component is provided on one side of the connecting plate. Multiple mounting holes 11 are symmetrically opened on the bottom of the substrate 2. The mounting holes 11 facilitate the secure installation of the limiting plate on the substrate 2, ensuring the fixing effect of the limiting plate on the mold body 7.

[0015] In this invention, a mounting cavity is provided inside the substrate 2, and a heat-conducting pipe 12 is installed inside the mounting cavity. The heat-conducting pipe 12 is snake-shaped, and one end of the heat-conducting pipe 12 is connected to the side wall of the substrate 2. The heat-conducting pipe 12 facilitates the absorption of heat from the mold body 7 transferred by the substrate 2 by the internally flowing cooling medium, thereby achieving active water cooling of the mold body 7. Connecting pipes 4 are fixed to both ends of the top surface of the connecting plate, and multiple connecting pipes 9 are fixed vertically at equal intervals on one side of the connecting pipes 4. The multiple connecting pipes 9 are threaded to one end of their respective corresponding heat-conducting pipes 12. The connecting pipes 4 facilitate the diversion and convergence of the cooling medium, and evenly distribute the cooling medium transported by the water supply pipe 3 to each heat-conducting pipe 12. The cooling component includes a cooling box 1 located on one side of the substrate 2, and a water supply pipe 3 is fixed to one side of the cooling box 1. A reversing valve is installed on the water supply pipe 3. 6. The other end of the water supply pipe 3 is fixed to the bottom of the connecting pipe 4. The cooling component helps to stably maintain the low temperature of the cooling medium and ensure that the cooling medium has a continuous high-efficiency heat absorption capacity. The four corners of the base plate 2 are provided with sliding holes 10 for sliding on the threaded support column 5. The top surface of the base plate 2 is provided with multiple mounting holes 11 at equal intervals. The sliding holes 10 facilitate the height adjustment of the base plate 2 and the stacking of multiple base plates 2, while limiting the horizontal displacement of the base plate 2. The top of the base plate 2 is provided with four limiting plates. The mold body 7 is placed between the four limiting plates. Multiple heat dissipation fins 8 are fixed to the side walls of the limiting plates. Bolts are screwed onto the limiting plates. The bottom of the bolts is connected to the mounting holes 11. The heat dissipation fins 8 facilitate the rapid dissipation of the heat absorbed by the mold body 7 by the limiting plates to the air, and assist the heat conduction pipe 12 in cooling.

[0016] Working Principle: When using this utility model, first connect each electrical component in this application to the power supply. Then, before cooling, debug the device. The device uses four threaded support columns 5 as the overall support frame. The operator first adjusts the height of the substrate 2 according to the thickness of the mold body 7 and the cooling requirements: by rotating the adjusting nut 13 on the threaded support column 5, the nut moves along the axial direction of the support column, and the top surface of the nut abuts against the bottom of the substrate 2, driving the substrate 2 to slide up and down along the sliding holes 10 at the four corners until the height of the substrate 2 is adapted to the mold body 7. If multiple sets of mold bodies 7 need to be cooled at the same time, multiple substrates 2 can be stacked. By adjusting the adjusting nuts 13 between adjacent substrates 2, the spacing between each substrate 2 is fixed to ensure sufficient heat dissipation space between the substrates 2. At the same time, the mold body 7 is placed between the four limiting plates on the top of the substrate 2. Bolts are screwed through the limiting plates into the mounting holes 11 on the top surface of the substrate 2 to achieve a firm connection between the limiting plates and the substrate 2, thereby fixing the mold body 7 and preventing displacement of the mold body 7 during cooling. Meanwhile, the heat dissipation fins 8 on the side walls of the limiting plates prepare for subsequent auxiliary heat dissipation. Next, the cooling medium is circulated and distributed. After the cooling system is started, the low-temperature cooling medium in the cooling box 1 is delivered through the water pipe 3. Connecting pipe 4, which delivers cooling medium to the top surface of the connecting plate: The reversing valve 6 on the water supply pipe 3 adjusts the flow direction of the medium according to the cooling requirements. Connecting pipe 4 evenly distributes the cooling medium to multiple vertically equidistantly fixed connecting pipes 9. Connecting pipes 9 are threadedly connected to the corresponding heat-conducting pipes 12 inside the substrate 2, ensuring that the cooling medium enters the serpentine heat-conducting pipe 12 of each substrate 2 without leakage. The serpentine structure of the heat-conducting pipe 12 forms a dense heat dissipation channel inside the substrate 2, greatly increasing the contact area with the substrate 2 and preparing for heat absorption. The mold body 7 generates a large amount of heat during the semiconductor power device molding process. The heat is transferred through the mold. The heat is transferred from the bottom of the body 7 to the substrate 2: The substrate 2 is made of a high thermal conductivity material, which can quickly conduct heat to the internal heat conduction pipe 12. Finally, the low temperature cooling medium flowing in the heat conduction pipe 12 comes into contact with the pipe wall and absorbs heat through heat exchange, so that the temperature of the heat conduction pipe 12 drops rapidly. In turn, it continuously absorbs the heat of the mold body 7 transferred by the substrate 2, realizing the active water cooling of the mold body 7. At the same time, the heat dissipation fins 8 on the side wall of the limiting plate dissipate the absorbed heat of the mold body 7 into the air, forming a dual cooling effect of "water cooling + air cooling" to ensure cooling efficiency. This concludes the use of the cooling device for semiconductor power device molds.

[0017] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A cooling device for a semiconductor power device mold, comprising four threaded support pillars (5) and a plurality of substrates (2) slidably disposed on the threaded support pillars (5), characterized in that: Each of the four threaded support columns (5) is screwed with multiple adjusting nuts (13) at equal intervals. The bottom of the base plate (2) abuts against the top surface of the adjusting nut (13). A connecting plate is fixed to the side wall of one of the base plates (2). A cooling component is provided on one side of the connecting plate. Multiple mounting holes (11) are symmetrically opened at the bottom of the base plate (2).

2. The cooling device for a semiconductor power device mold according to claim 1, characterized in that: The substrate (2) has an installation cavity inside, and a temperature-conducting tube (12) is installed in the installation cavity. The temperature-conducting tube (12) is snake-shaped, and one end of the temperature-conducting tube (12) is connected to the side wall of the substrate (2).

3. The cooling device for a semiconductor power device mold according to claim 2, characterized in that: The top surface of the connecting plate is fixed with connecting pipes (4) at both ends. Multiple connecting pipes (9) are fixed vertically at equal intervals on one side of the connecting pipes (4). The multiple connecting pipes (9) are threaded to one end of the corresponding temperature-conducting pipes (12).

4. The cooling device for a semiconductor power device mold according to claim 3, characterized in that: The cooling component includes a cooling box (1) located on one side of the substrate (2), a water supply pipe (3) fixedly connected to one side of the cooling box (1), a reversing valve (6) installed on the water supply pipe (3), and the other end of the water supply pipe (3) fixedly connected to the bottom of the connecting pipe (4).

5. The cooling device for a semiconductor power device mold according to claim 4, characterized in that: The substrate (2) has sliding holes (10) at its four corners for sliding on the threaded support column (5), and a plurality of mounting holes (11) are equally spaced on the top surface of the substrate (2).

6. The cooling device for a semiconductor power device mold according to claim 5, characterized in that: The substrate (2) has four limiting plates on its top, and a mold body (7) is placed between the four limiting plates. Multiple heat dissipation fins (8) are fixed to the side walls of the limiting plates. Bolts are screwed onto the limiting plates, and the bottom of the bolts is connected to the mounting hole (11).

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