Cooling device for a target sintering furnace

Abstract

The utility model relates to a cooling device technical field, concretely relates to a kind of cooling device of target material sintering furnace, including sintering furnace body and cooling assembly, cooling assembly includes support frame, cooling liquid tank, heat exchange pipe frame, cooling jacket and circulation pipeline;Support frame provides support and installation place to heat exchange pipe frame, cooling liquid tank, after sintering target material of sintering furnace body, cooling liquid in cooling liquid tank is guided into cooling jacket by circulation pipeline (including inlet pipe, outlet pipe and circulation pipe), to uniformly absorb the heat in sintering furnace body, simultaneously, cooling liquid with heat is guided into heat exchange pipe frame by circulation pipeline, cooling liquid is radiated by heat exchange pipe frame, the cold energy of cooling liquid is guaranteed, finally cooling liquid is guided back cooling liquid tank and is stored, realize the cooling of sintering furnace body, realize the circulation use of cooling liquid, to solve the problem of low cooling efficiency that traditional target material sintering furnace cooling device relies on air convection heat dissipation and cools target material.

Description

Technical Field

[0001] This utility model relates to the field of cooling device technology, and in particular to a cooling device for a target sintering furnace. Background Technology

[0002] With the development of electronic information technology, the application fields of sputtering targets are constantly expanding, such as in integrated circuits and liquid crystal displays. In the sputtering target production process, the cooling time after sintering is one of the important factors affecting the production cycle.

[0003] Traditional target sintering furnaces have relatively simple cooling devices that use natural cooling, relying on natural air convection to remove heat. This slow cooling rate can easily lead to significant thermal stress inside the target material, affecting its quality and performance. Utility Model Content

[0004] The purpose of this invention is to provide a cooling device for a target sintering furnace, which aims to solve the problem of low cooling efficiency caused by traditional target sintering furnace cooling devices relying on air convection for heat dissipation.

[0005] To achieve the above objectives, this utility model provides a cooling device for a target sintering furnace, including a sintering furnace body and a cooling assembly. The cooling assembly includes a support frame, a coolant tank, a heat exchange tube frame, a cooling jacket, and a circulation pipeline. The support frame is disposed on one side of the sintering furnace body. The coolant tank is fixedly connected to the support frame and located on one side of the support frame. The heat exchange tube frame is assembled on one side of the support frame. The cooling jacket is assembled on the outside of the sintering furnace body. The circulation pipeline connects the coolant tank, the heat exchange tube frame, and the cooling jacket, respectively.

[0006] The heat exchange tube rack includes a heat exchange tube coil, a heat dissipation fin, and a heat dissipation fan. The heat exchange tube coil is mounted on one side of the support frame, the heat dissipation fin is mounted on both sides of the heat exchange tube coil, and the heat dissipation fan is located on one side of the heat dissipation fin.

[0007] The heat exchange tube rack also includes a snap-fit ​​bracket and a dustproof mesh cover. The snap-fit ​​bracket is located on one side of the heat exchange tube coil, and the dustproof mesh cover is snapped into the snap-fit ​​bracket and located on both sides of the snap-fit ​​bracket.

[0008] The dustproof mesh cover has a groove located on one side of the dustproof mesh cover.

[0009] The heat dissipation fin includes a thermally conductive silicone pad and a heat dissipation fin body. The thermally conductive silicone pad is disposed on both sides of the heat exchange tube coil, and the heat dissipation fin body is disposed on the side of the thermally conductive silicone pad away from the heat exchange tube coil.

[0010] This utility model discloses a cooling device for a target sintering furnace. The support frame provides support and installation space for the heat exchange tube frame and the coolant tank. After the target material is sintered in the sintering furnace body (a commonly used technology in the market), the circulation pipeline (including an inlet pipe, an outlet pipe, and a circulation pipe) guides the coolant from the coolant tank into the cooling jacket. The cooling jacket evenly absorbs the heat inside the sintering furnace body. Simultaneously, the coolant carrying heat is then guided into the heat exchange tube frame through the outlet pipe of the circulation pipeline. The heat exchange tube frame dissipates heat from the coolant, ensuring the cooling energy of the coolant. Finally, the coolant is guided back to the coolant tank for storage through the circulation pipe of the circulation pipeline. This achieves both cooling of the sintering furnace body and recycling of the coolant, thereby solving the problem of low cooling efficiency caused by traditional target sintering furnace cooling devices that rely on air convection for heat dissipation. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0012] Figure 1 This is a schematic diagram of the cooling device for a target sintering furnace according to the present invention.

[0013] Figure 2 This is a top view of a cooling device for a target sintering furnace according to the present invention.

[0014] Figure 3 yes Figure 2 A cross-sectional view along plane AA.

[0015] In the diagram: 1-Sintering furnace body, 2-Cooling components, 21-Support frame, 22-Coolant tank, 23-Heat exchange tube frame, 24-Cooling jacket, 25-Circulation pipeline, 231-Heat exchange tube coil, 232-Heat dissipation fins, 233-Heat dissipation fan, 234-Snap-fit ​​bracket, 235-Dustproof mesh cover, 236-Groove, 2321-Thermal conductive silicone pad, 2322-Heat dissipation fin body. Detailed Implementation

[0016] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0017] Please see Figures 1 to 3This utility model provides a cooling device for a target sintering furnace, including a sintering furnace body 1 and a cooling assembly 2. The cooling assembly 2 includes a support frame 21, a coolant tank 22, a heat exchange tube frame 23, a cooling jacket 24, and a circulation pipeline 25. The support frame 21 is disposed on one side of the sintering furnace body 1. The coolant tank 22 is fixedly connected to the support frame 21 and located on one side of the support frame 21. The heat exchange tube frame 23 is assembled on one side of the support frame 21. The cooling jacket 24 is assembled on the outside of the sintering furnace body 1. The circulation pipeline 25 connects the coolant tank 22, the cooling jacket 24, the heat exchange tube frame 23, and the cooling jacket 24 respectively.

[0018] In this embodiment, the support frame 21 provides support and installation space for the heat exchange tube frame 23 and the coolant tank 22. After the sintering furnace body 1 sinters the target material, the circulation pipeline 25 (including the inlet pipe, outlet pipe, and circulation pipe) introduces the coolant in the coolant tank 22 into the cooling jacket 24. The cooling jacket 24 evenly absorbs the heat in the sintering furnace body 1. At the same time, the coolant carrying heat is introduced into the heat exchange tube frame 23 through the outlet pipe of the circulation pipeline 25. The heat exchange tube frame 23 dissipates heat from the coolant, ensuring the cooling energy of the coolant. Finally, the coolant is guided back to the coolant tank 22 for storage through the circulation pipe of the circulation pipeline 25. This achieves the cooling of the sintering furnace body 1 while realizing the recycling of the coolant, thereby solving the problem of low cooling efficiency caused by the traditional target material sintering furnace cooling device relying on air convection for heat dissipation.

[0019] Furthermore, the heat exchange tube frame 23 includes a heat exchange tube coil 231, a heat dissipation fin 232, and a heat dissipation fan 233. The heat exchange tube coil 231 is mounted on one side of the support frame 21, the heat dissipation fin 232 is mounted on both sides of the heat exchange tube coil 231, and the heat dissipation fan 233 is located on one side of the heat dissipation fin 232.

[0020] In this embodiment, the outlet pipe of the circulation pipe 25 introduces the coolant carrying heat into the heat exchange tube coil 231. Based on the heat conduction effect, the heat exchange tube coil 231 absorbs the heat of the coolant and dissipates it through the heat dissipation fins 232, thereby ensuring the cooling energy of the coolant. The cooling fan 233 is provided to accelerate the heat dissipation effect of the heat dissipation fins 232. The heat exchange tube coil 231 is an S-shaped bend made of a metal material with good thermal conductivity.

[0021] Furthermore, the heat exchange tube rack 23 also includes a snap-fit ​​bracket 234 and a dustproof mesh cover 235. The snap-fit ​​bracket 234 is disposed on one side of the heat exchange tube coil 231, and the dustproof mesh cover 235 is snapped into the snap-fit ​​bracket 234 and located on both sides of the snap-fit ​​bracket 234.

[0022] In this embodiment, the clip bracket 234 is used to clip and fix the dustproof mesh cover 235 to the outside of the heat dissipation fin 232, so as to prevent the heat dissipation fan 233 from blowing air to the heat dissipation fin 232 and sucking in external dust, which would cause dust to accumulate on the heat dissipation fin 232. Normally, it can also protect the heat dissipation fin 232 from dust.

[0023] Furthermore, the dustproof mesh cover 235 has a groove 236 located on one side of the dustproof mesh cover 235.

[0024] In this embodiment, the groove 236 is provided to facilitate the operation of workers pulling the dustproof mesh cover 235 to snap on or remove it.

[0025] Furthermore, the heat dissipation fin 232 includes a thermally conductive silicone pad 2321 and a heat dissipation fin body 2322. The thermally conductive silicone pad 2321 is disposed on both sides of the heat exchange tube coil 231, and the heat dissipation fin body 2322 is disposed on the side of the thermally conductive silicone pad 2321 away from the heat exchange tube coil 231.

[0026] In this embodiment, the thermal conductivity of the heat dissipation fin body 2322 is greater than that of the heat exchange tube coil 231, and it is used for heat dissipation by the heat exchange tube coil 231. The setting of the thermally conductive silicone pad 2321 increases the contact area between the heat dissipation fin body 2322 and the heat exchange tube coil 231, thereby improving the heat dissipation efficiency of the heat dissipation fin body 2322.

[0027] The above-disclosed embodiments are merely preferred embodiments of a cooling device for a target sintering furnace according to this application, and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments, and equivalent variations made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. A cooling device for a target sintering furnace, characterized in that... ； It includes a sintering furnace body and a cooling assembly, wherein the cooling assembly includes a support frame, a coolant tank, a heat exchange tube frame, a cooling jacket, and a circulation pipeline; The support frame is disposed on one side of the sintering furnace body. The coolant tank is fixedly connected to the support frame and located on one side of the support frame. The heat exchange tube frame is assembled on one side of the support frame. The cooling jacket is assembled on the outside of the sintering furnace body. The circulation pipeline is connected to the coolant tank, the heat exchange tube frame, and the cooling jacket respectively.

2. The cooling device for the target sintering furnace as described in claim 1, characterized in that; The heat exchange tube rack includes a heat exchange tube coil, heat dissipation fins, and a heat dissipation fan. The heat exchange tube coil is mounted on one side of the support frame, the heat dissipation fins are mounted on both sides of the heat exchange tube coil, and the heat dissipation fan is located on one side of the heat dissipation fins.

3. The cooling device for the target sintering furnace as described in claim 2, characterized in that; The heat exchange tube rack also includes a snap-fit ​​bracket and a dustproof mesh cover. The snap-fit ​​bracket is located on one side of the heat exchange tube coil, and the dustproof mesh cover is snapped into the snap-fit ​​bracket and located on both sides of the snap-fit ​​bracket.

4. The cooling device for the target sintering furnace as described in claim 3, characterized in that... ； The dustproof mesh cover has a groove located on one side of the dustproof mesh cover.

5. The cooling device for the target sintering furnace as described in claim 2, Its characteristics are: The heat dissipation fin includes a thermally conductive silicone pad and a heat dissipation fin body. The thermally conductive silicone pad is disposed on both sides of the heat exchange tube coil, and the heat dissipation fin body is disposed on the side of the thermally conductive silicone pad away from the heat exchange tube coil.

Images