A substrate sheet taking, measuring, and loading device

Abstract

The utility model relates to the field of semiconductor, disclose a kind of substrate piece takes piece and measures thick device, including carrying mechanism, detection mechanism and handling mechanism;Carrying mechanism includes carrying tray, and carrying tray is provided with multiple carrying jig;Detection mechanism includes detection table, first rotating motor, detection assembly and displacement assembly, and detection table is used to carry the substrate piece to be detected;Displacement assembly is used to drive detection assembly to be close to or away from detection table, and first rotating motor is used to drive detection table to rotate around its axis to adjust the orientation of substrate piece side edge wall;Handling mechanism includes linear motion assembly and vacuum component, and linear motion assembly is used to drive vacuum component to move between detection table and multiple carrying jig, and vacuum component is used to suck and fix the substrate piece in jig and at detection table;The utility model can realize the adjustment of substrate piece orientation by first rotating motor, to measure the thickness of different positions of substrate piece, to improve the accuracy of substrate piece thickness measurement.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a substrate wafer picking, thickness measuring, and loading device. Background Technology

[0002] A substrate is the material used as a base layer in semiconductor manufacturing. It is typically a wafer made of single-crystal semiconductor material, serving as the foundation for chips and electronic devices. The substrate can be considered the "foundation" of semiconductor devices. Its structure varies depending on the specific application and requirements, and it is usually circular or square in shape. Substrates can be directly used in wafer fabrication to produce semiconductor devices, or they can be processed using epitaxial growth techniques to produce epitaxial wafers. The thickness of the substrate significantly affects the high-frequency performance of the device, making substrate thickness measurement a crucial step in substrate manufacturing.

[0003] However, existing substrate thickness measurement devices lack alignment capabilities, often resulting in significant errors in thickness measurement, particularly between different directions. Furthermore, current substrate thickness measurement devices frequently rely on manual intervention for substrate handling, severely impacting measurement efficiency and potentially damaging the substrate. Utility Model Content

[0004] The technical problem to be solved by this utility model is: how to improve the efficiency and accuracy of substrate thickness measurement. In order to solve the above technical problem, this utility model provides a substrate loading and unloading device for measuring thickness, including a loading mechanism, a detection mechanism and a transport mechanism. The loading mechanism includes a loading tray, which is provided with multiple loading fixtures for accommodating the substrate to be tested; the testing mechanism includes a testing stage, a first rotary motor, a testing component, and a displacement component. The testing stage is used to support the substrate to be tested; the displacement component is used to drive the testing component to move closer to or away from the testing stage; and the first rotary motor is used to drive the testing stage to rotate around its axis to adjust the orientation of the sidewalls of the substrate. The conveying mechanism includes a linear motion component and a vacuum component. The linear motion component is used to drive the vacuum component to move between the testing stage and the plurality of the carrier fixtures. The vacuum component is used to pick up and fix the substrate sheet inside the carrier fixture and at the testing stage.

[0005] Preferably, the cargo tray has a circular structure, and a plurality of cargo fixtures are evenly distributed on the upper surface of the cargo tray along its axis. A second rotary motor is provided below the cargo tray. The second rotary motor is used to drive the cargo tray to rotate around its axis to drive and adjust different cargo fixtures to be directly below the vacuum assembly.

[0006] Preferably, the linear motion assembly includes a first linear motion module, a second linear motion module, and a frame. The first linear motion module is drivenly connected to the frame, the second linear motion module is disposed on the frame, and the vacuum assembly is drivenly connected to the second linear motion module. The first linear motion module is perpendicular to the second linear motion module. The second linear motion module is used to drive the vacuum component to move closer to or away from the cargo tray. The first linear motion module is used to drive the second linear motion module and the vacuum component to move closer to or away from the detection stage.

[0007] Preferably, the linear motion component further includes a third linear motion module, wherein the second linear motion module is perpendicular to the first linear motion module and the second linear motion module; The third linear motion module is fixedly mounted on the frame, and the third linear motion module is connected to the second linear motion module. The third linear motion module is used to drive and adjust the position of the projection of the second linear motion module and the vacuum component on the cargo tray.

[0008] Preferably, the linear motion component further includes a cylinder, the main body of which is fixedly connected to the output end of the second linear motion module, and the output end of which is connected to the vacuum component. The cylinder is used to drive the vacuum component to move closer to or away from the cargo tray.

[0009] Preferably, the conveying mechanism further includes a camera assembly, which is fixedly connected to the main body of the cylinder, and the camera assembly is used to capture the position of the substrate sheet on the carrier tray.

[0010] Preferably, the vacuum assembly includes a vacuum chuck connected to a vacuum device, the vacuum chuck being used to suction and fix the substrate sheet under negative pressure.

[0011] Preferably, the detection component includes a detection bracket and a sensor, the detection bracket is tractively connected to the displacement component, and the sensor is disposed at the end of the detection bracket corresponding to the detection stage.

[0012] Preferably, the displacement component includes a fourth linear motion module, the output end of which is connected to the detection bracket, and the fourth linear motion module is used to drive the detection bracket and the sensor to move inward or close to the detection platform.

[0013] Preferably, the detection stage is hollow, and a hollow detection fixture is provided on the side of the detection stage facing the sensor. The detection fixture is provided with a convex ring, which is used to support the substrate.

[0014] Compared with the prior art, the substrate wafer picking, thickness measuring, and mounting device provided in this embodiment of the present invention has the following advantages: In this invention, the carrying mechanism can simultaneously support multiple substrates to be tested, facilitating the orderly conduct of subsequent testing and improving the efficiency of substrate thickness measurement. The inclusion of a testing stage and a first rotary motor allows for adjustment of the orientation of the substrates on the testing stage, enabling the testing components to measure the thickness at different positions along the edge of the substrates, thereby improving the accuracy of substrate thickness measurement. Furthermore, the linear motion component and vacuum component in the transport mechanism significantly improve the transfer efficiency of the substrates during the testing process, thereby increasing the efficiency of substrate thickness measurement and avoiding potential damage to the substrates caused by manual transfer. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a side view of the present invention; Figure 3 This is a bottom view of the structure of this utility model; Figure 4 This is a three-dimensional view of the present invention.

[0016] In the diagram: 1. Loading mechanism; 11. Loading tray; 12. Loading fixture; 13. Second rotary motor; 2. Testing mechanism; 21. Testing table; 211. Testing fixture; 22. First rotary motor; 23. Testing assembly; 231. Testing bracket; 232. Sensor; 24. Displacement assembly; 241. Fourth linear motion module; 3. Handling mechanism; 31. Linear motion assembly; 311. First linear motion module; 312. Second linear motion module; 313. Third linear motion module; 314. Frame; 315. Cylinder; 32. Vacuum assembly; 33. Camera assembly; 4. Substrate. Detailed Implementation

[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0018] like Figures 1 to 4As shown, a preferred embodiment of the present invention provides a substrate wafer loading and thickness measurement device, which includes a loading mechanism 1, a detection mechanism 2 and a transport mechanism 3; The carrier mechanism 1 includes a carrier tray 11, which is provided with a plurality of carrier fixtures 12 for accommodating the substrate 4 to be tested; The testing mechanism 2 includes a testing stage 21, a first rotary motor 22, a testing component 23, and a displacement component 24. The testing stage 21 is used to support the substrate 4 to be tested; the displacement component 24 is used to drive the testing component 23 to move closer to or away from the testing stage 21; and the first rotary motor 22 is used to drive the testing stage 21 to rotate around its axis to adjust the orientation of the sidewalls of the substrate 4. The conveying mechanism 3 includes a linear motion component 31 and a vacuum component 32. The linear motion component 31 is used to drive the vacuum component 32 to move between the detection stage 21 and multiple carrier fixtures 12. The vacuum component 32 is used to pick up the substrate 4 inside the fixed carrier fixture 12 and at the detection stage 21.

[0019] Specifically, in this embodiment, the tray 11 is provided with multiple mounting fixtures 12, each of which contains a substrate sheet 4 to be tested. When the thickness of the substrate sheet 4 needs to be tested, the linear motion component 31 drives the vacuum component 32 to move above the tray 11 and moves the vacuum component 32 above one of the mounting fixtures 12. Then, the linear motion component 31 drives the vacuum component 32 to move downward, the vacuum component 32 contacts the substrate sheet 4 to be tested, and vacuum-suctions the substrate sheet 4. Then, the linear motion component 31 drives the vacuum component 32 upward away from the mounting fixture 12, and transfers the vacuum component 32 and the substrate sheet 4 it has sucked up to the testing stage 21. The vacuum component 32 then releases the vacuum and lowers the substrate sheet 4. After the substrate sheet 4 is stably placed on the testing stage 21, the displacement component 24 drives the testing component 23 to move to... At the testing station 21, the testing component 23 begins the first thickness measurement of the substrate 4 on the testing station 21. After the first thickness measurement is completed, the first rotary motor 22 drives the testing station 21 to rotate, which in turn drives the substrate 4 on the testing station 21 to rotate. The testing component 23 can then measure the thickness of other edge parts of the substrate 4, making the thickness measurement of the substrate 4 more accurate and reliable with smaller errors. After the thickness measurement of the substrate 4 is completed, the linear motion module drives the vacuum component 32 to move to the testing station 21 again. The vacuum component 32 picks up the substrate 4 that has been measured and transfers it to the original carrier fixture 12 or another substrate 4 storage location. Then, the linear motion component 31 drives the vacuum component 32 to move to another carrier fixture 12 and picks up a new substrate 4 to be measured again for the next round of thickness measurement. In this embodiment, the entire transport and transfer process of the substrate 4 relies on the linear motion component 31 and the vacuum component 32, which greatly improves the transport and transfer efficiency of the substrate 4, thereby improving the efficiency of substrate 4 thickness measurement and avoiding potential damage to the substrate 4 caused by manual handling. The inclusion of the first rotary motor 22 allows the detection component 23 to conveniently and quickly detect the thickness of the substrate 4 at different locations, improving both the accuracy of substrate 4 thickness detection and the speed of substrate 4 orientation adjustment, thus enhancing measurement efficiency.

[0020] In some embodiments, the carrying tray 11 has a circular structure, and a plurality of carrying fixtures 12 are evenly distributed on the upper surface of the carrying tray 11 along its axis. A second rotary motor 13 is provided below the cargo tray 11. The second rotary motor 13 is used to drive the cargo tray 11 to rotate around its axis to drive and adjust different cargo fixtures 12 to be directly below the vacuum assembly 32.

[0021] Specifically, in this embodiment, the carrying tray 11 is circular, and the multiple carrying fixtures 12 on it are also evenly distributed circumferentially. In one specific embodiment, there are six carrying fixtures 12 evenly distributed circumferentially on the carrying tray 11. The circular carrying tray 11, in conjunction with the second rotary motor 13, can effectively adjust the position of each carrying fixture 12 evenly distributed circumferentially on the carrying tray 11, thereby facilitating and quickly adjusting the position of the substrate 4. In actual operation, when it is necessary to transfer a new substrate 4 to below the vacuum assembly 32, the carrying tray 11 can be rotated by the second rotary motor 13, thereby moving the new carrying fixture 12 and the substrate 4 on it to below the vacuum assembly 32, thus facilitating the vacuum assembly 32 to pick up the substrate 4 for thickness measurement.

[0022] In a secondary embodiment, the pallet 11 may also be rectangular in shape, such as a conveyor belt structure, so as to better connect with the preceding and following processes.

[0023] In some embodiments, the linear motion assembly 31 includes a first linear motion module 311, a second linear motion module 312, and a frame 314. The first linear motion module 311 is connected to the frame 314 in a transmission manner, the second linear motion module 312 is disposed on the frame 314, and the second linear motion module 312 is connected to a vacuum assembly 32 in a transmission manner. The first linear motion module 311 is perpendicular to the second linear motion module 312. The second linear motion module 312 is used to drive the vacuum component 32 to approach or move away from the loading tray 11. The first linear motion module 311 is used to drive the second linear motion module 312 and the vacuum component 32 to approach or move away from the detection stage 21.

[0024] Specifically, in this embodiment, two first linear motion modules 311 are arranged in parallel, and the two ends of the frame 314 are respectively connected to the sliding blocks of the two first linear motion modules 311, while a second linear motion module 312 is also provided on the frame 314. In actual operation, the first linear motion module 311 first moves the second linear motion module 312 above a carrier fixture 12 via the frame 314. Then, the second linear motion module 312 drives the vacuum component 32 to move downward, so that the vacuum component 32 can contact and pick up the substrate 4 to be tested. After vacuum picking up the substrate 4, the second linear motion module 312 drives the vacuum component 32 to move upward, so as to remove the substrate 4 from the carrier fixture 12. Then, the first linear motion module 311 drives the second linear motion module 312, the vacuum component 32 and the substrate 4 to move above the detection stage 21. The second linear motion module 312 then drives the vacuum component 32 to move downward. After moving into position, the vacuum component 32 releases the vacuum and places the substrate 4 on the detection stage 21. The second linear motion module 312 then cooperates with the first linear motion module 311 to drive the vacuum component 32 away from the detection stage 21, thereby making room for the detection component 23 to perform the detection. In this embodiment, both the first linear motion module 311 and the second linear motion module 312 adopt a structure of motor and screw. In other alternative embodiments, a hydraulic structure, a pneumatic structure, or a linear motor structure may also be adopted.

[0025] In some embodiments, the linear motion component 31 further includes a third linear motion module 313, and a second linear motion module 312 is perpendicular to the first linear motion module 311 and the second linear motion module 312. The third linear motion module 313 is fixedly mounted on the frame 314. The third linear motion module 313 is connected to the second linear motion module 312. The third linear motion module 313 is used to drive and adjust the position of the projection of the second linear motion module 312 and the vacuum component 32 on the cargo tray 11.

[0026] Specifically, the arrangement of the third linear motion module 313 means that the position of the second linear motion module 312 on the frame 314 is no longer fixed, and the vacuum assembly 32 no longer needs to wait for the second rotary motor 13 to drive the tray 11 to rotate and move the jig 12 below the vacuum assembly 32. In one embodiment, in addition to the second rotary motor 13 driving the tray 11 to rotate and move the jig 12 below the vacuum assembly 32, the third linear motion module 313 can also work with the first linear motion module 311 to adjust the position of the vacuum assembly 32, so that the vacuum assembly 32 can be completely aligned with the substrate 4 in the jig 12, thereby better picking up the substrate 4, improving the efficiency of substrate 4 handling and transfer, and thus improving the efficiency of substrate 4 thickness measurement.

[0027] In some embodiments, the linear motion component 31 further includes a cylinder 315, the main body of which is fixedly connected to the output end of the second linear motion module 312, and the output end of the cylinder 315 is connected to a vacuum component 32. The cylinder 315 is used to drive the vacuum component 32 to approach or move away from the loading tray 11.

[0028] Specifically, in this embodiment, a cylinder 315 is also provided between the second linear motion module 312 and the vacuum component 32. The main body of the cylinder 315 is fixed to the output end of the second linear motion module 312, which is the moving part of the second linear motion module 312. The push rod of the output end of the cylinder 315 is connected to the vacuum component 32. Compared with the solution where the second linear motion module 31 directly drives the vacuum component 32 to move and contact the substrate 4, the cylinder 315 drives with less force and is more precise and reliable. This can prevent the second linear motion module 312 from applying too much force to the vacuum component 32, which could damage the substrate 4.

[0029] In some embodiments, the conveying mechanism 3 further includes a camera assembly 33, which is fixedly connected to the main body of the cylinder 315. The camera assembly 33 is used to capture images to obtain the position of the substrate sheet 4 on the carrying tray 11.

[0030] Specifically, the camera assembly 33 is fixedly connected to the main body of the cylinder 315 via a mounting plate. The camera assembly 33 is driven by the second linear motion module 312 along with the cylinder 315. The camera in the camera assembly 33 can capture and identify the position of the loading fixture 12 and the substrate 4 on the loading tray 11, and send the position information to the PLC. Then, the PLC controller can control the first linear motion module 311 and the third linear motion module 313 to drive the second linear motion module 312 and the vacuum assembly 32 to move, so that the vacuum assembly 32 can move more accurately to the top of the substrate 4, thereby facilitating the vacuum assembly 32 to pick up the substrate 4, improving the handling efficiency of the substrate 4 and the stability of the substrate 4 picking up state.

[0031] In some embodiments, the vacuum assembly 32 includes a vacuum chuck connected to a vacuum device. The vacuum chuck is used to suction and fix the substrate 4 under negative pressure. An interface is provided on the side of the vacuum chuck away from the carrier tray 11, which is connected to a vacuum negative pressure device. This interface can draw air to create a negative pressure environment, thereby stably suctioning the substrate 4 within the carrier fixture 12. In other embodiments, multiple vacuum chucks in the vacuum assembly 32 may be evenly distributed circumferentially.

[0032] In some embodiments, the detection component 23 includes a detection bracket 231 and a sensor 232. The detection bracket 231 is connected to the displacement component 24 in a transmission manner, and the sensor 232 is provided at the end of the detection bracket 231 corresponding to the detection stage 21.

[0033] Furthermore, the displacement component 24 includes a fourth linear motion module 241, the output end of which is connected to a detection bracket 231. The fourth linear motion module 241 is used to drive the detection bracket 231 and the sensor 232 to move in the direction of or close to the detection stage 21.

[0034] Furthermore, the testing stage 21 is hollow, and a hollow testing fixture 211 is provided on the side of the testing stage 21 facing the sensor 232. The testing fixture 211 is provided with a convex ring, which is used to support the substrate 4.

[0035] Specifically, both the testing stage 21 and the testing fixture 211 are hollow, and the sensor 232 in the testing assembly 23 is divided into upper and lower parts. In actual operation, after the substrate 4 to be tested is placed stably on the testing fixture 211, the fourth linear motion module 241 drives the support and the sensor 232 on it to move to the testing stage 21. The sensor 232 is then aligned with the edge of the substrate 4 to be tested, so as to complete the first detection of the thickness of the substrate 4. Subsequently, the first rotary motor 22 drives the testing stage 21 and the substrate 4 to rotate, and the sensor 232 detects the thickness of the other side of the substrate 4 again, thereby improving the accuracy of the substrate 4 detection and reducing the detection error.

[0036] In summary, this utility model embodiment provides a substrate 4 loading and thickness measurement device. When the thickness of the substrate 4 needs to be measured, the first rotary motor 22 drives the tray 11, the loading fixture 12, and the substrate 4 to rotate. The camera component 33 captures the position of the substrate 4 and feeds it back to the PLC controller. The PLC controller then controls the second rotary motor 13 to rotate, moving the substrate 4 to be measured directly below the vacuum chuck. Subsequently, the cylinder 315 moves downward, driving the vacuum chuck downward and picking up the substrate 4. The cylinder 315 then moves upward, moving the vacuum chuck and the substrate 4 upward. The first linear motion module 311 then drives the second linear motion module 312, the third linear motion module 313, the vacuum chuck, and the substrate 4 to move above the detection stage 21. After the cylinder 315 moves downward to its final position, the vacuum chuck breaks the vacuum and releases the substrate 4. The cylinder 315 then moves upward, while the first linear motion module 311 drives the second linear motion module 312. The third linear motion module 313 and the vacuum suction cup move away from the detection stage 21; the fourth linear motion module 31 drives the sensor 232 to move above the detection stage 21, and the sensor 232 begins to measure the thickness of the substrate 4. After the sensor 232 completes the first measurement, the first rotary motor 22 drives the detection stage 21 to rotate 180 degrees, and the sensor 232 measures the thickness of the substrate 4 for the second time. After the two measurements of the substrate 4 are completed, the fourth linear motion module 241 drives the sensor 232 away from the detection stage 21, and the cylinder 315 drives the vacuum suction cup to move downward and pick up the substrate 4. Subsequently, the cylinder 315 moves upward and, together with the first linear motion module 311, the second linear motion module 312 and the third linear motion module 313, moves the substrate 4 to directly above the loading fixture 12 of the loading tray 11. Finally, the cylinder 315 moves downward again, and the vacuum suction cup breaks the vacuum and places the tested substrate 4 into the corresponding loading fixture 12.

[0037] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of this utility model, and these improvements and substitutions should also be considered within the protection scope of this utility model.

Claims

1. A substrate wafer picking, thickness measuring, and mounting device, characterized in that, include: A loading mechanism, the loading mechanism including a loading tray, the loading tray being provided with a plurality of loading fixtures for accommodating a substrate to be tested; The testing mechanism includes a testing stage, a first rotary motor, a testing component, and a displacement component. The testing stage is used to carry the substrate to be tested. The displacement component is used to drive the testing component to move closer to or away from the testing stage. The first rotary motor is used to drive the testing stage to rotate around its axis to adjust the orientation of the sidewalls of the substrate. The conveying mechanism includes a linear motion component and a vacuum component. The linear motion component drives the vacuum component to move between the testing stage and the plurality of the carrier fixtures. The vacuum component is used to pick up and fix the substrate sheet inside the carrier fixture and at the testing stage.

2. The substrate wafer picking, thickness measuring, and mounting device according to claim 1, characterized in that, The loading tray has a circular structure, and multiple loading fixtures are evenly distributed on the upper surface of the loading tray along its axis. A second rotary motor is provided below the cargo tray. The second rotary motor is used to drive the cargo tray to rotate around its axis to drive and adjust different cargo fixtures to be directly below the vacuum assembly.

3. The substrate wafer picking, thickness measuring, and mounting device according to claim 1, characterized in that, The linear motion assembly includes a first linear motion module, a second linear motion module, and a frame. The first linear motion module is drivenly connected to the frame, the second linear motion module is disposed on the frame, and the vacuum assembly is drivenly connected to the second linear motion module. The first linear motion module is perpendicular to the second linear motion module. The second linear motion module is used to drive the vacuum component to move closer to or away from the cargo tray. The first linear motion module is used to drive the second linear motion module and the vacuum component to move closer to or away from the detection stage.

4. The substrate wafer picking, thickness measuring, and mounting device according to claim 3, characterized in that, The linear motion component further includes a third linear motion module, and the second linear motion module is perpendicular to the first linear motion module and the second linear motion module; The third linear motion module is fixedly mounted on the frame, and the third linear motion module is connected to the second linear motion module. The third linear motion module is used to drive and adjust the position of the projection of the second linear motion module and the vacuum component on the cargo tray.

5. The substrate wafer picking, thickness measuring, and mounting device according to claim 4, characterized in that, The linear motion component also includes a cylinder, the main body of which is fixedly connected to the output end of the second linear motion module. The output end of the cylinder is connected to the vacuum component, and the cylinder is used to drive the vacuum component to move closer to or away from the cargo tray.

6. The substrate wafer picking, thickness measuring, and mounting device according to claim 5, characterized in that, The transport mechanism also includes a camera assembly, which is fixedly connected to the main body of the cylinder. The camera assembly is used to capture images to obtain the position of the substrate sheet on the carrier tray.

7. The substrate wafer picking, thickness measuring, and mounting device according to claim 1, characterized in that, The vacuum assembly includes a vacuum chuck connected to a vacuum device, which is used to suction and fix the substrate under negative pressure.

8. The substrate wafer picking, thickness measuring, and mounting device according to claim 1, characterized in that, The detection component includes a detection bracket and a sensor. The detection bracket is connected to the displacement component via a transmission connection, and the sensor is disposed at the end of the detection bracket corresponding to the detection stage.

9. The substrate wafer picking, thickness measuring, and mounting apparatus according to claim 8, characterized in that, The displacement component includes a fourth linear motion module, the output end of which is connected to the detection bracket. The fourth linear motion module is used to drive the detection bracket and the sensor to move closer to or from the detection platform.

10. The substrate wafer picking, thickness measuring, and mounting apparatus according to claim 8, characterized in that, The detection stage is hollow, and a hollow detection fixture is provided on the side of the detection stage facing the sensor. The detection fixture is provided with a convex ring, which is used to support the substrate.

Images