An infrared thermal imaging module with a folded-on-board circuit

Abstract

The utility model provides a whole circuit board folding installation infrared thermal imaging machine core, the machine core presents multilayer circuit board superposition structure, is linked through flexible circuit board between each circuit board, and flexible circuit board (2) covers all circuit board and the connecting range between circuit board, and is provided with structural member between the adjacent layer circuit board, the circuit board includes the mainboard, signal processing circuit board and interface processing circuit board who are connected in the two sides of mainboard through flexible circuit board, to make interface processing circuit board folding installation between signal processing circuit board and mainboard, the mainboard folding installation is located the outermost side of machine core, the mainboard side side is equipped with main chip, when the mainboard folding installation, the main chip is located the outside of mainboard, the utility model need not to set up board board connector between the circuit board, make the mainboard of big heat output can be located the outside of whole structure, guarantee the problem of heat dissipation and circuit connection.

Description

Technical Field

[0001] This utility model relates to the field of infrared thermal imaging cores, and in particular to an infrared thermal imaging core with an integrated circuit board folding installation. Background Technology

[0002] Infrared thermal imaging modules need to be integrated into other optoelectronic systems during assembly, thus their size is strictly limited. The circuit board system of a thermal imaging module typically consists of multiple independent functional modules, such as detector driver circuit boards, signal processing circuit boards, power supply and interface processing circuit boards, etc. To control system dimensions, these circuit boards need to be stacked and assembled. Traditionally, this is achieved through board-to-board connectors to transmit signals between the multiple circuit boards.

[0003] Board-to-board connectors occupy space, and their contact conduction method is prone to slight movement when the core is subjected to vibration / impact loads, thus affecting signal transmission performance. With the increase in detector resolution and the demand for output digital signals, the signal bandwidth requirements have greatly increased, and existing core chips cannot guarantee the high signal bandwidth requirements through board-to-board connectors.

[0004] Meanwhile, as a heat-sensitive detection device, the self-heating of the circuit board in the thermal imaging module can interfere with the sensitivity of the infrared thermal imaging detector to the radiation response of the target. Utility Model Content

[0005] The purpose of this utility model is to provide an infrared thermal imaging core that is installed by folding so that the motherboard with high heat generation is located on the outside of the overall structure, and the circuit boards are connected by a support frame with heat insulation plate to achieve overall stability.

[0006] To solve the above-mentioned technical problems, this utility model provides an infrared thermal imaging core with an integrated circuit board folding installation. The core has a multi-layer circuit board stacked structure, and the circuit boards are connected by flexible circuit boards. The flexible circuit boards cover all circuit boards and the connection range between the circuit boards. Structural components are provided between adjacent circuit board layers. The circuit board includes a main board, a signal processing circuit board and an interface processing circuit board respectively connected to both sides of the main board by the flexible circuit boards, so that the interface processing circuit board is folded and installed between the signal processing circuit board and the main board. After folding and installation, the main board is located on the outermost side of the core. The main chip is arranged on the side of the main board. When the main board is folded and installed, the main chip is located on the outer side of the main board.

[0007] Furthermore, the structural component includes a main support and a secondary support spliced ​​to the side of the main support, with an installation area formed between the main support and the secondary support, and a heat insulation plate installed in the installation area.

[0008] Furthermore, the heat insulation plate is provided with a first semi-circular hole groove and a second semi-circular hole groove on both sides. The edge surface of the first semi-circular hole groove is lower than the edge of the heat insulation plate, and the edge surface of the second semi-circular hole groove is flush with the edge of the heat insulation plate. At least two first connecting posts are provided on one side of the main support. The top of the first connecting post is provided with a buckle cap. The middle of the first connecting post is a limiting plate. The first semi-circular hole groove is fastened between the buckle cap and the limiting plate. The inner wall of the first semi-circular hole groove is engaged with the cylindrical surface of the first connecting post.

[0009] Furthermore, at least two second connecting piles are provided on the other side of the main support, and at least two mounting columns are provided on the secondary support. The mounting columns have mounting grooves in the middle, and the mounting columns match the grooves of the second semi-circular holes. The mounting grooves match the second connecting piles.

[0010] Furthermore, the heat insulation plate has several wire-passing grooves on its outer periphery so that the flexible circuit board can pass through the wire-passing grooves.

[0011] Furthermore, the interface processing circuit board has an interface bonding board and a first sensor connected to both sides via flexible circuit boards, so that after the motherboard is folded and installed, the interface bonding board is folded and installed on the outer side of the motherboard.

[0012] Furthermore, the signal processing circuit board is mounted on the structural mounting base, and the second sensor is connected to the side of the first sensor via a flexible circuit board. After the main board is folded and installed, the first sensor and the second sensor are folded and installed on the outside of the structural mounting base.

[0013] Furthermore, the motherboard, interface processing circuit board, signal processing circuit board, interface bonding board, first sensor, and second sensor are all provided with first positioning holes on their sides, the first connecting post is provided with a second positioning hole, and the mounting post is provided with a third positioning hole, so that the locking bolt can be sequentially passed through the first positioning hole, the second positioning hole, and the third positioning hole for positioning.

[0014] Furthermore, a heat sink is provided on the outer side of the motherboard, and the heat sink is in close contact with the main chip.

[0015] Furthermore, the outer periphery of the motherboard and the interface processing circuit board are provided with several first grooves so that the flexible circuit board can be folded through the first groove positions; and the sides of the motherboard, the signal processing circuit board, the interface processing circuit board and the interface bonding board are provided with second grooves for connecting the flexible circuit board.

[0016] The beneficial effects of this utility model are as follows: When assembling the multi-layer circuit board of the infrared thermal imaging core, the signal processing circuit board and the interface processing circuit board are respectively connected to both sides of the motherboard to ensure stable transmission between the motherboard and the two. Due to the connection setting of the flexible circuit board, the interface processing circuit board can be folded and installed between the motherboard and the signal processing circuit board, forming a combination of the transmission connection of the motherboard in the central position and the interface processing circuit board in the central position of the folded structure. This can effectively make the motherboard located on the outside of the overall structure, thereby ensuring the heat dissipation effect of the main chip, so as to achieve stable transmission and good heat dissipation between the motherboard and the signal processing circuit board.

[0017] Meanwhile, the structural components allow for structural support between adjacent circuit boards, thus replacing the supporting function of board-to-board connectors, without affecting the transmission of signals between boards or the connection of circuits between boards. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the circuit board of this utility model.

[0020] Figure 3 This is a schematic diagram of the motherboard mounting heat insulation plate in this utility model.

[0021] Figure 4 This is a schematic diagram of the interface processing circuit board folded to the motherboard in this utility model.

[0022] Figure 5 This is a schematic diagram of the main bracket installed between the interface processing circuit board and the motherboard of this utility model.

[0023] Figure 6 This is a schematic diagram of the sub-bracket installed between the interface processing circuit board and the motherboard of this utility model.

[0024] Figure 7 This is a schematic diagram of the heat insulation plate mounted on the signal processing circuit board in this utility model.

[0025] Figure 8 This is a schematic diagram of the main bracket installed between the signal processing circuit board and the interface processing circuit board of this utility model.

[0026] Figure 9 This is a schematic diagram of the signal processing circuit board folded to the interface processing circuit board in this utility model.

[0027] Figure 10 This is a schematic diagram of the mounting bracket between the signal processing circuit board and the interface processing circuit board of this utility model.

[0028] Figure 11 This is a schematic diagram of the heat sink and interface soldering board of this utility model.

[0029] Figure 12 This is a schematic diagram showing the connection between the main support, the secondary support, and the heat insulation plate in this utility model.

[0030] Figure 13 This is an exploded view of the main support, secondary support, and heat insulation plate in this utility model.

[0031] Figure 14 This is a schematic diagram of the unfolded circuit boards of this utility model.

[0032] Reference numerals: 1. Main board; 2. Flexible circuit board; 3. Signal processing circuit board; 4. Interface processing circuit board; 5. Main chip; 6. Interface bonding board; 7. First sensor; 8. Structural fixing base; 9. Second sensor; 10. Main bracket; 11. Sub-bracket; 12. First positioning hole; 13. Locking bolt; 14. Heat sink; 15. First groove; 16. Second groove; 17. Heat insulation plate; 18. First semi-circular hole groove; 19. First connecting post; 191. Reverse buckle cap; 192. Limiting plate; 20. Mounting post; 21. Mounting slot; 22. Wire guide groove; 23. Second positioning hole; 24. Third positioning hole; 25. Hole-shaped groove; 26. Second semi-circular hole groove. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model are within the protection scope of the present utility model.

[0034] Those skilled in the art should understand that in the disclosure of this utility model, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as a limitation of this utility model.

[0035] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0036] like Figures 1-14 The present invention provides an infrared thermal imaging core with an integrated circuit board folding installation. The core has a multi-layer circuit board stacked structure. The circuit boards are connected by a flexible circuit board 2. The flexible circuit board (2) covers all circuit boards and the connection range between the circuit boards. Structural components are provided between the adjacent circuit boards. The circuit board includes a main board 1, a signal processing circuit board 3 connected to both sides of the main board 1 by the flexible circuit board 2, and an interface processing circuit board 4, so that the interface processing circuit board 4 is folded and installed between the signal processing circuit board 3 and the main board 1. After the main board 1 is folded and installed, it is located on the outermost side of the core. A main chip 5 is arranged on the side of the main board 1. When the main board 1 is folded and installed, the main chip 5 is located on the outer side of the main board 1.

[0037] When assembling the multi-layer circuit boards of the infrared thermal imaging core, the signal processing circuit board and the interface processing circuit board are connected to both sides of the motherboard to ensure stable transmission between the motherboard and the two boards. Due to the flexible circuit board connection, the interface processing circuit board can be folded and installed between the motherboard and the signal processing circuit board, forming a transmission connection with the motherboard in the center and the interface processing circuit board in the center of the folded structure. This combination effectively places the motherboard on the outside of the overall structure, thereby ensuring the heat dissipation of the main chip and achieving stable transmission and good heat dissipation between the motherboards. Since no connectors are needed between the circuit boards, the core structure of this solution can be simpler and more compact under the same conditions.

[0038] Meanwhile, the structural components allow for structural support between adjacent circuit boards, thus replacing the supporting function of board-to-board connectors, without affecting the transmission of signals between boards or the connection of circuits between boards.

[0039] The structure of the flexible circuit board is the same as that of the existing flexible circuit board, and will not be described in detail here. Each circuit board is formed into an integral structure with the flexible circuit board 2 through a pressing process. The flexible circuit board 2 is arranged with wire channels to directly connect the communication chip.

[0040] In one embodiment of this solution, a heat sink 14 is provided on the outer side of the motherboard 1. The heat sink 14 is in close contact with the main chip 5 so that the heat sink can stably dissipate heat from the main chip on the outer side of the motherboard. Since the motherboard is located on the outer side of the overall structure, the heat sink in this solution can provide better heat dissipation than the heat sinks in the prior art (in order to ensure the stable connection with each layer of circuit board, the existing motherboard can only be set in the middle of the overall structure, so the heat sink connected to the motherboard can only be set in the middle of the overall structure).

[0041] Preferably, the structural component includes a main support 10 and a secondary support 11 spliced ​​to the side of the main support 10, with an installation area formed between the main support 10 and the secondary support 11, and a heat insulation plate 17 installed in the installation area.

[0042] Specifically, the main support and the secondary support are spliced ​​together to form an installation area, in which the heat insulation board can be placed. The main support and the secondary support can position the heat insulation board, ensuring the accurate relative position between the heat insulation board and the structural components, thereby ensuring the stability of the heat insulation effect.

[0043] Meanwhile, structural components are used to support and space the gaps between the multi-layer circuit boards, ensuring the stability of the folded installation of each layer of circuit boards. At the same time, heat insulation boards are used to insulate the multi-layer circuit boards to prevent heat from the motherboard, signal processing circuit board and other heat-generating circuit boards from being conducted to other circuit boards, thereby improving the heat stability between each layer of circuit boards. This, combined with the external heat dissipation effect of the motherboard and signal processing circuit board, increases the overall heat dissipation effect of the equipment.

[0044] In one embodiment of this solution, the heat insulation plate 17 is made of non-metallic material and has a certain degree of elasticity.

[0045] Preferably, the main support 10 has an opening structure on its side, and the secondary support 11 matches the opening structure.

[0046] Specifically, the opening structure allows the main bracket to be snapped onto the side of the insulation board when it is installed between adjacent circuit boards. This ensures a tight connection between the main bracket and the insulation board and avoids interference between the main bracket and the side of the circuit board, which could prevent installation. The secondary bracket is then matched and snapped onto the opening structure, forming a closed installation structure between the main bracket and the secondary bracket. This ensures the installation position of the insulation board and allows the main bracket and the secondary bracket to work together to surround the adjacent circuit boards.

[0047] In one embodiment of this solution, the main support has a U-shaped structure and the secondary support has an I-shaped structure, so that the main support and the secondary support are spliced ​​together to form a complete rectangular frame, and the heat insulation board is located in the rectangular frame.

[0048] Preferably, the heat insulation plate 17 has a first semi-circular hole groove 18 and a second semi-circular hole groove 26 on both sides. The edge surface of the first semi-circular hole groove 18 is lower than the edge of the heat insulation plate 17, and the edge surface of the second semi-circular hole groove 26 is flush with the edge of the heat insulation plate 17. The main support 10 has at least two first connecting posts 19 on one side. The top of the first connecting post 19 is provided with a buckle cap 191. The middle of the first connecting post 19 is a limiting plate 192. The first semi-circular hole groove 18 is fastened between the buckle cap 191 and the limiting plate 192. The inner wall of the first semi-circular hole groove 18 is engaged with the cylindrical surface of the first connecting post 19.

[0049] The main support 10 has at least two second connecting piles 25 on the other side, and the auxiliary support 11 has at least two mounting columns 20. The mounting column has a mounting groove 21 in the middle. The mounting column 20 matches the second semi-circular hole groove 26, and the mounting groove 21 matches the second connecting pile 25.

[0050] Specifically, when the main bracket is snapped onto the outer periphery of the heat insulation board, the first connecting post is fastened into the first semi-circular hole groove, so that the first connecting post and the first semi-circular hole groove are initially positioned. Then, when the secondary bracket is connected to the main bracket, the fitting post is fastened into the first semi-circular hole groove. Due to the setting of the fitting groove, the fitting groove is simultaneously snapped onto the outside of the first connecting post, so that the fitting post can simultaneously connect the first semi-circular hole groove and the first connecting post, thereby achieving the effect of synchronous positioning of the main bracket, secondary bracket and heat insulation board, which greatly improves the connection stability between the three.

[0051] In one embodiment of this solution, the first semi-circular hole groove has a semi-circular groove structure, the end of the first connecting pile of the main support located at the corner has a mushroom head structure, and the mounting column buckles are set on the upper and lower sides of the first connecting pile at both ends of the opening structure.

[0052] Preferably, the heat insulation plate 17 has a plurality of wire-passing grooves 22 on its outer periphery so that the flexible circuit board 2 passes through the wire-passing grooves 22.

[0053] Specifically, by setting the wire-passing groove, the flexible circuit boards connected between adjacent circuit boards or interlayer circuit boards can pass through the wire-passing groove without being blocked by the heat insulation plate. After the main bracket and the sub-bracket are fastened to the outer periphery of the heat insulation plate, the wire-passing groove can form a closed through-slot structure for the flexible circuit board to ensure the connection stability and limiting effect of the flexible circuit board.

[0054] It is worth mentioning that, since the flexible circuit boards between adjacent or interlayer circuit boards are relatively long and need to extend through the sides of the entire heat insulation board or multiple heat insulation boards, there is a possibility that the flexible circuit boards may arch outward. This solution covers the outside of the flexible circuit board with the main bracket, so that the structural components can not only support the position between the circuit boards of each layer, but also limit the position of the flexible circuit board, thereby improving the overall connection stability of the equipment.

[0055] Preferably, the interface processing circuit board 4 has an interface bonding board 6 and a first sensor 7 connected to both sides of the interface through a flexible circuit board 2, so that after the motherboard 1 is folded and installed, the interface bonding board 6 is folded and installed on the outer side of the motherboard 1.

[0056] Specifically, the interface bonding board is directly connected to the side of the interface processing circuit board via a flexible circuit board to ensure a stable connection between the two. Furthermore, due to the foldable nature of the flexible circuit board, the interface bonding board can be folded and installed directly at the bottom of the chassis to ensure a stable physical connection between the interface bonding board and the interface processing circuit board, and to avoid interference between the interface bonding board and the motherboard or interface processing circuit board.

[0057] Preferably, the signal processing circuit board 3 is mounted on the structural fixing base 8, and the side of the first sensor 7 is connected to the second sensor 9 through the flexible circuit board 2. After the main board 1 is folded and installed, the first sensor 7 and the second sensor 9 are folded and installed on the outside of the structural fixing base 8.

[0058] Specifically, the first sensor and the second sensor are connected to the interface processing circuit board in sequence via a flexible circuit board. Then, after the main board is folded, the first sensor and the second sensor are folded and installed on the outside of the structural fixing base, so that the sensors can perform sensing work stably.

[0059] Preferably, the motherboard 1, interface processing circuit board 4, signal processing circuit board 3, interface bonding board 6, first sensor 7 and second sensor 9 are each provided with a first positioning hole 12 on their sides, the first connecting post 19 is provided with a second positioning hole 23, and the mounting post 20 is provided with a third positioning hole 24, so that the locking bolt 13 can be positioned by passing through the first positioning hole 12, the second positioning hole 23 and the third positioning hole 24 in sequence.

[0060] Specifically, after the heat insulation plates between each layer of circuit boards and adjacent circuit boards are installed, and the heat insulation plates are surrounded by the main bracket and the secondary bracket, the first positioning holes, the second positioning holes, and the third positioning holes are aligned. Then, the locking bolts are sequentially inserted into the positioning holes. The locking bolts can then be used to position each layer of circuit boards, the heat insulation plates, the main bracket, and the secondary bracket. Since the locking bolts in the existing circuit boards need to fix each circuit board into a whole, and then lock the position of the board-to-board connectors by fixing the circuit boards, and the board-to-board connectors themselves do not have a locking function, the reliability is low under harsh working conditions. However, the locking bolts in this solution are only used to fix each layer of circuit boards, allowing for a certain degree of misalignment and deformation between the layers of circuit boards, thus resulting in higher reliability under harsh working conditions.

[0061] Preferably, the outer periphery of the motherboard 1 and the interface processing circuit board 4 are provided with a plurality of first grooves 15 so that the flexible circuit board 2 can be folded through the first grooves 15; and the sides of the motherboard 1, the signal processing circuit board 3, the interface processing circuit board 4 and the interface bonding board 6 are provided with second grooves 16 for connecting the flexible circuit board 2.

[0062] Specifically, since some flexible circuit boards need to be connected across boards, the first groove effectively provides a path for the flexible circuit board to be connected across boards, preventing the flexible circuit board from arching outwards when connected across boards and providing stability for the connection. At the same time, since the connection between the edge of the circuit board and the flexible circuit board is prone to arching due to bending when the circuit board is folded and installed, this solution provides a second groove so that the connection at the end of the flexible circuit board is located in the second groove. Even if the connection of the flexible circuit board is bent and arched, it can be accommodated in the second groove, thereby ensuring the bending stability of the flexible circuit board.

[0063] The following procedure can be followed when folding and installing the circuit boards and insulation boards of each layer: ① Place the heat insulation plate 17 at the position of the motherboard 1 facing the interface processing circuit board 4, fold the interface processing circuit board 4 towards the motherboard 1, so that the heat insulation plate 17 is sandwiched between the motherboard 1 and the interface processing circuit board 4. At this time, the main bracket 10 and the secondary bracket 11 are sequentially fastened to the outer periphery of the heat insulation plate 17. ② Place the heat insulation plate 17 at the position of the signal processing circuit board 3 facing the interface processing circuit board 4. First, snap the main bracket 10 into the outer periphery of the heat insulation plate 17, then fold the interface processing circuit board 4 toward the signal processing circuit board 3, and finally snap the secondary bracket 11 into the outer periphery of the heat insulation plate 17. ③ A heat sink 14 is arranged on the outside of the main chip 5, and an interface bonding board 6 is folded and installed on the outside side of the heat sink 14. ④ Fold the first sensor 7 and the second sensor 9 and install them on the outside of the structural fixing base 8 to complete the overall folding and installation steps of the infrared thermal imaging core.

[0064] This utility model is not limited to the above-described preferred embodiments. Anyone can derive other forms of products under the guidance of this utility model. However, regardless of any changes made in their shape or structure, any technical solution that is the same as or similar to this application falls within the protection scope of this utility model.

Claims

1. An integral circuit board folded mounting infrared thermal imaging engine core, characterized by: The mechanism is a multi-layer circuit board stacked structure. The circuit boards are connected by a flexible circuit board (2). The flexible circuit board (2) covers all circuit boards and the connection range between circuit boards. Structural components are provided between adjacent circuit boards. The circuit board includes a main board (1), a signal processing circuit board (3) connected to both sides of the main board (1) by the flexible circuit board (2), and an interface processing circuit board (4) so ​​that the interface processing circuit board (4) is folded and installed between the signal processing circuit board (3) and the main board (1). After the main board (1) is folded and installed, it is located on the outermost side of the mechanism. The main chip (5) is arranged on the side of the main board (1). When the main board (1) is folded and installed, the main chip (5) is located on the outside of the main board (1).

2. The integrated circuit board folding and mounting infrared thermal imaging core according to claim 1, characterized in that: The structural components include a main support (10) and a secondary support (11) spliced ​​to the side of the main support (10). An installation area is formed between the main support (10) and the secondary support (11), and a heat insulation plate (17) is installed in the installation area.

3. The integrated circuit board folding and mounting infrared thermal imaging core according to claim 2, characterized in that: The heat insulation plate (17) is provided with a first semi-circular hole groove (18) and a second semi-circular hole groove (26) on both sides. The edge surface of the first semi-circular hole groove (18) is lower than the frame of the heat insulation plate (17), and the edge surface of the second semi-circular hole groove (26) is flush with the frame of the heat insulation plate (17). At least two first connecting posts (19) are provided on one side of the main support (10). The top of the first connecting post (19) is provided with a reverse buckle cap (191). The middle of the first connecting post (19) is a limiting plate (192). The first semi-circular hole groove (18) is fastened between the reverse buckle cap (191) and the limiting plate (192). The inner wall of the first semi-circular hole groove (18) is engaged with the cylindrical surface of the first connecting post (19).

4. The monolithic circuit board folded-mount infrared thermal imaging engine core of claim 3, wherein: The main support (10) has at least two second connecting piles (25) on the other side, and the auxiliary support (11) has at least two mounting columns (20). The mounting columns have a mounting groove (21) in the middle. The mounting columns (20) match the second semi-circular hole groove (26), and the mounting groove (21) matches the second connecting piles (25).

5. The monolithic circuit board folded-mount infrared thermal imaging engine core of claim 2, wherein: The heat insulation plate (17) has several wire-passing grooves (22) on its outer periphery so that the flexible circuit board (2) passes through the wire-passing grooves (22).

6. The monolithic circuit board folded-mount infrared thermal imaging engine core of claim 4, wherein: The interface processing circuit board (4) is connected to the interface bonding board (6) and the first sensor (7) on both sides by the flexible circuit board (2) respectively, so that after the motherboard (1) is folded and installed, the interface bonding board (6) is folded and installed on the outer side of the motherboard (1).

7. The monolithic circuit board folded-mount infrared thermal imaging engine core of claim 6, wherein: The signal processing circuit board (3) is mounted on the structural fixing base (8), and the side of the first sensor (7) is connected to the second sensor (9) through the flexible circuit board (2). After the main board (1) is folded and installed, the first sensor (7) and the second sensor (9) are folded and installed on the outside of the structural fixing base (8).

8. The monolithic circuit board folded-mount infrared thermal imaging engine core of claim 7, wherein: The motherboard (1), interface processing circuit board (4), signal processing circuit board (3), interface bonding board (6), first sensor (7) and second sensor (9) are all provided with first positioning holes (12) on their sides, the first connecting post (19) is provided with second positioning holes (23), and the mounting post (20) is provided with third positioning holes (24), so that the locking bolt (13) can be positioned by passing through the first positioning hole (12), the second positioning hole (23) and the third positioning hole (24) in sequence.

9. The integrated circuit board folding and mounting infrared thermal imaging core according to claim 1, characterized in that: The motherboard (1) is provided with a heat sink (14) on the outside, and the heat sink (14) is in close contact with the main chip (5).

10. The monolithic circuit board folded-mount infrared thermal imaging engine core of claim 6, wherein: The outer periphery of the motherboard (1) and the interface processing circuit board (4) are provided with a plurality of first grooves (15) so that the flexible circuit board (2) can be folded through the first groove (15); and the sides of the motherboard (1), the signal processing circuit board (3), the interface processing circuit board (4) and the interface bonding board (6) are provided with second grooves (16) for connecting the flexible circuit board (2).

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