A spatially optimized thermal imaging detector module

Abstract

This utility model discloses a space-optimized thermal imaging detector module, relating to the field of thermal imaging detector technology. It includes a lens assembly, a chip assembly, and a support assembly arranged sequentially. The detector module achieves a compact layout through the sequential arrangement of these components. The lens assembly integrates the lens and shutter components using a lens mounting tube and a shutter mount, efficiently collecting and controlling infrared radiation. The chip assembly is fixed below the shutter mount using a UFPA board bracket. The internal HK detector module and UFPA board module are directly plugged into each other via the upper and lower end faces of the UFPA board bracket, reducing space occupation and lowering the overall module size. The support assembly provides stable support and circuit connection through a CPU bracket and a tail plate, effectively avoiding the encroachment of the circuit board bracket on the detector body's space, making the structure more compact and significantly reducing the dimensions in the length and width directions, meeting the small-size installation requirements of infrared thermal imaging cores.

Description

Technical Field

[0001] This utility model relates to the field of thermal imaging detector technology, specifically a space-optimized thermal imaging detector module. Background Technology

[0002] As described in the published patent CN222279939U, "Infrared Thermal Imaging Module and Infrared Thermal Imager," an infrared thermal imager is a device that utilizes infrared thermal imaging technology to detect the infrared radiation of a target object and, through signal processing and photoelectric conversion, converts the temperature distribution of the target object into a visual image. The infrared thermal imager accurately quantifies the actual detected heat and images the entire target object in real time in a planar format, thus accurately identifying suspected faulty areas that are overheating. Operators can initially judge the overheating situation and fault location by using the image color and hotspot tracking display function on the screen, and then conduct rigorous analysis, demonstrating high efficiency and high accuracy in confirming problems.

[0003] Existing infrared thermal imagers mostly use a stacked structure for their infrared thermal imaging cores. The detector body and circuit board bracket are usually locked together by screws or other connectors. The circuit board bracket is located on the side of the detector body where the detector chip is located. When the circuit board bracket is installed, it occupies part of the area of ​​the detector body, resulting in a large length and width dimension of the detector body. This cannot meet the installation requirements of ultra-small infrared thermal imaging cores, thus limiting its application range.

[0004] In summary, in the related technologies of thermal imaging detectors (thermal imagers), some circuit board brackets occupy the space of the detector body because they need to make way for the chipset, resulting in an overly bulky overall structure of the detector body. Utility Model Content

[0005] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution for a space-optimized thermal imaging detector module that can solve the aforementioned problems.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A space-optimized thermal imaging detector module includes a lens assembly, a chip assembly, and a support assembly arranged sequentially. The lens assembly includes a lens bracket, which includes an integrally formed lens mounting cylinder and a shutter mounting base. The lens mounting cylinder contains a lens component, and the shutter mounting base contains a shutter component. The chip assembly includes a UFPA board bracket fixedly mounted below the shutter mounting base. The UFPA board bracket houses an HK detector module and a UFPA board module, which are respectively inserted into each other from the upper and lower end faces of the UFPA board bracket. The bracket assembly includes a CPU bracket fixedly mounted below the UFPA board bracket, and a tail plate is fixedly mounted below the CPU bracket.

[0007] As a further embodiment of this utility model: the UFPA plate bracket includes a first frame fixedly installed below the shutter mounting base. The front end and rear end of the first frame are respectively provided with a front insertion slot and a rear insertion slot. The lower end surface of the shutter mounting base is formed with a front insertion block and a rear insertion block. The front insertion block is inserted and engaged in the front insertion slot, and the rear insertion block is inserted and engaged in the rear insertion slot.

[0008] As a further embodiment of this utility model: a first mounting plate is fixedly installed inside the first frame, and countersunk mounting holes are respectively opened on the front end plug block and the rear end plug block. Screw locking holes that align and cooperate with the countersunk mounting holes are respectively opened on the front end face and the rear end face of the first mounting plate.

[0009] As a further embodiment of this utility model: the first mounting plate is provided with a through slot, the HK detector module is mounted on the top of the first mounting plate, the UFPA board module is mounted on the bottom of the first mounting plate, and the PIN pin group of the HK detector module passes downward from the through slot and is aligned and plugged into the PIN pin socket on the UFPA board module.

[0010] As a further embodiment of this utility model: the lower end of the rear plug block is formed with a foolproof plug block, the first mounting plate is provided with a first foolproof slot, the UFPA board module includes a UFPA board, the UFPA board is provided with a second foolproof slot that is aligned with the first foolproof slot, and the foolproof plug block is inserted and engaged in the first foolproof slot and the second foolproof slot.

[0011] As a further embodiment of this utility model: a limiting plug is formed at the corner of the diagonal line on the lower end face of the first frame, and a limiting slot is provided on the UFPA plate to engage with the limiting plug.

[0012] As a further embodiment of this utility model: a bolt insertion hole is provided on the lower end face of the first frame, a first mounting through hole is provided at the four corners of the UFPA board, the CPU bracket includes a second frame, a second mounting through hole is provided at the four corners of the second frame, and a third mounting through hole is provided at the four corners of the tail plate, wherein the first, second and third mounting through holes are aligned and fitted with the bolt insertion hole.

[0013] As a further embodiment of this utility model, a foam component is fixedly installed below the tail plate.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model's detector module achieves a compact layout through the sequential arrangement of a lens assembly, a chip assembly, and a bracket assembly. The lens assembly integrates the lens and shutter components using a lens mounting tube and a shutter mounting base, efficiently collecting and controlling infrared radiation. The chip assembly is fixed below the shutter mounting base using a UFPA board bracket. The internal HK detector module and UFPA board module are directly plugged into each other through the upper and lower end faces of the UFPA board bracket, reducing space occupation and lowering the overall module size. The bracket assembly provides stable support and circuit connection through a CPU bracket and a tail plate, effectively avoiding the encroachment of the circuit board bracket on the detector body's space, making the structure more compact and significantly reducing the dimensions in the length and width directions, meeting the small-size installation requirements of infrared thermal imaging cores. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural view of the present invention; Figure 2 This is another three-dimensional view of the structure of this utility model; Figure 3 This is an exploded view of the structure of this utility model; Figure 4 This is another exploded view of the structure of this utility model; Figure 5 This is a top view of the present invention; Figure 6 yes Figure 5 A cross-sectional view along the AA direction; Figure 7 This is a three-dimensional structural view of the lens bracket in this utility model; Figure 8 This is a three-dimensional structural view of the UFPA plate support in this utility model; Figure 9 This is another three-dimensional view of the UFPA plate bracket in this utility model; Figure 10 This is another exploded view of the structure of this utility model; The reference numerals and names in the figure are as follows: Lens assembly - 101, Chip assembly - 102, Bracket assembly - 103, Lens bracket - 104, Lens mounting tube - 105, Shutter mount - 106, Lens component - 107, Shutter component - 108, UFPA board bracket - 109, HK detector module - 110, UFPA board module - 111, CPU bracket - 112, Tail plate - 113, First frame - 114, Front connector slot - 115, Rear connector slot - 116, Front connector block - 117, Rear connector block - 118, First Mounting plate-119, countersunk mounting hole-120, screw locking hole-121, through slot-122, PIN pin assembly-123, PIN pin socket-124, foolproof insert-125, first foolproof slot-126, UFPA board-127, second foolproof slot-128, limit insert-129, limit slot-130, bolt insertion hole-131, first mounting through hole-132, second frame-133, second mounting through hole-134, third mounting through hole-135, foam part-136. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-10 A space-optimized thermal imaging detector module includes a lens assembly 101, a chip assembly 102 and a support assembly 103 arranged sequentially. The lens assembly 101 includes a lens bracket 104, which includes an integrally formed lens mounting cylinder 105 and a shutter mounting base 106. The lens mounting cylinder 105 is equipped with a lens component 107, and the shutter mounting base 106 is equipped with a shutter component 108. The chip assembly 102 includes a UFPA board bracket 109 fixedly mounted below the shutter mounting base 106. The UFPA board bracket 109 houses an HK detector module 110 and a UFPA board module 111, which are respectively inserted into each other from the upper and lower end faces of the UFPA board bracket 109. The bracket assembly 103 includes a CPU bracket 112 fixedly installed below the UFPA board bracket 109, and a tail plate 113 fixedly installed below the CPU bracket 112. like Figure 1 , 2As shown in Figure 3, the chip assembly 102 in the detector module of this utility model adopts a matching method in which the HK detector module 110 and the UFPA board module 111 are directly plugged into each other from the upper and lower end faces of the UFPA board bracket 109. This eliminates the bulky circuit board bracket located on the side of the detector and secured by screws in related technologies, and eliminates the structural space occupied by the circuit board bracket in the length and width directions of the detector body. This compresses the projected area of ​​the module in the XY plane, which can meet the installation requirements of small size and ultra-thin volume of infrared thermal imaging core in application scenarios such as UAVs, handheld devices, and security helmets. The top and bottom plug-in connection, along with the sequential fixed connection of the lens bracket 104, UFPA board bracket 109, and CPU bracket 112, forms a rigid and stable overall frame. This not only reduces the cumulative tolerance caused by splicing multiple discrete components and improves the accuracy of the optical path and circuit connection, but also enhances the module's mechanical properties against vibration and impact, ensuring clear and stable imaging in harsh environments. This modular, axially stacked design simplifies the assembly process. Each functional module can be produced in parallel and quickly plugged in for assembly, reducing process complexity and assembly time. At the same time, if a component (such as UFPA board module 111) fails, it can be disassembled and replaced accordingly, making maintenance convenient. The detector module of this utility model achieves a compact layout through the sequential arrangement of lens assembly 101, chip assembly 102, and bracket assembly 103. Lens assembly 101 integrates lens component 107 and shutter component 108 using lens mounting tube 105 and shutter mounting base 106, efficiently collecting and controlling infrared radiation. Chip assembly 102 is fixed below shutter mounting base 106 using UFPA board bracket 109. The internal HK detector module 110 and UFPA board module 111 are directly plugged into each other via the upper and lower end faces of UFPA board bracket 109, reducing space occupation and lowering the overall module size. Bracket assembly 103 provides stable support and circuit connection through CPU bracket 112 and tail plate 113, effectively avoiding the encroachment of circuit board bracket on the detector body's space, making the structure more compact, and significantly reducing the dimensions in the length and width directions, meeting the small-size installation requirements of infrared thermal imaging cores.

[0018] In this embodiment of the utility model, the UFPA plate bracket 109 includes a first frame 114 fixedly installed below the shutter mounting base 106. The front end and rear end of the first frame 114 are respectively provided with a front insertion groove 115 and a rear insertion groove 116. The lower end surface of the shutter mounting base 106 is formed with a front insertion block 117 and a rear insertion block 118. The front insertion block 117 is inserted into the front insertion groove 115, and the rear insertion block 118 is inserted into the rear insertion groove 116. like Figure 4and 8 As shown, this plug-in mechanism avoids the installation operation space reserved in related technologies (if a circuit board bracket is used, installation operation space needs to be reserved for the circuit board bracket), and realizes direct docking between the shutter mount 106 and the UFPA board bracket 109, reducing the waste of space in the radial direction (i.e., length and width direction), which is the key to realizing the overall miniaturization and lightweighting of the module. The plug-in structure set at both the front and rear ends forms a stable rectangular support frame with "multi-point" contact. Compared with single-point or a few screw fixation, this design can evenly distribute stress and effectively resist torsion and bending deformation. It not only improves the connection rigidity between components and the overall structural stability, but also significantly enhances the durability and reliability of the module under harsh working conditions such as vibration and impact, thereby ensuring the long-term alignment accuracy of internal precision optical components and detector chips. The plug-in structure is essentially a self-positioning and alignment design. Assembly workers can quickly and intuitively slide the plug-in blocks into the plug-in slots without the tedious individual tightening and torque control required when using screws. This simplifies the assembly process, reduces the difficulty of operation and reliance on skilled workers, and helps improve production cycle and product consistency. At the same time, it reduces the assembly defect rate caused by loose screws, stripped threads, or over-tightening. When it is necessary to repair or replace the upper lens assembly 101, non-destructive disassembly and reassembly can be easily performed.

[0019] In this embodiment of the utility model, a first mounting plate 119 is fixedly installed inside the first frame 114, and countersunk mounting holes 120 are respectively opened on the front end plug block 117 and the rear end plug block 118. The front end face and the rear end face of the first mounting plate 119 are respectively opened with screw locking holes 121 that are aligned and cooperate with the countersunk mounting holes 120. like Figure 4 , 7 As shown in Figure 8, by setting a first mounting plate 119 in the first frame 114 and opening a countersunk mounting hole 120 on the plug block, the countersunk mounting hole 120 is aligned with the screw locking hole 121 on the first mounting plate 119, thereby introducing a screw connection method that is vertically locked from the side on the basis of mechanical positioning of plug-in engagement. While retaining the advantages of the plug-in structure, such as rapid self-positioning, high-precision alignment and saving radial space, the tensile strength of the connection point and the rigidity of the overall structure are enhanced by screws in the vertical direction on the side, which effectively prevents the components from loosening under vibration or impact. The use of countersunk holes ensures that the screw heads do not protrude, maintaining the flatness of the structural surface and further guaranteeing the compactness of the module. This collaborative operation mode of "plug-in positioning first, screw reinforcement later" simplifies the assembly process, reduces the difficulty of adjustment, and achieves a balance between connection reliability and space utilization efficiency.

[0020] In this embodiment of the present invention, the first mounting plate 119 is provided with a through slot 122, the HK detector module 110 is mounted above the first mounting plate 119, the UFPA board module 111 is mounted below the first mounting plate 119, and the PIN pin group 123 of the HK detector module 110 passes downward from the through slot 122 and is aligned and plugged into the PIN pin socket 124 on the UFPA board module 111. like Figure 4 and 6 As shown, by opening a through slot 122 on the first mounting plate 119 of the UFPA board bracket 109, a vertical spatial channel is constructed for the electrical interconnection between the HK detector module 110 and the UFPA board module 111. During assembly, the HK detector module 110 located above the first mounting plate 119 passes its PIN pin group 123 through the through slot 122 and vertically aligns it with the corresponding PIN pin socket 124 on the UFPA board module 111 located below, thereby realizing a direct electrical connection between the detector and the processing circuit in three-dimensional space. This design eliminates the need for flexible circuit boards or lateral cable connections found in related technologies, saving space on the sides of the detector body and enabling a small and compact module layout. Secondly, the vertical direct connection shortens the signal transmission path, which helps reduce signal attenuation and electromagnetic interference, improving the reliability of electrical connections and signal integrity. Furthermore, this structure allows for rapid and accurate positioning during assembly, simplifying the production process. In one embodiment, the HK detector module 110 is a variety of detector products (such as HK-DTS100) launched by manufacturers such as Hikvision. Its core is a chip that can convert the received infrared radiation (heat) into electrical signals. The module typically includes a detector chip, a readout circuit, and a packaging structure that realizes vacuum sealing and cooling. In one embodiment, the UFPA board module 111 is a drive and signal processing board directly connected to the detector. Therefore, the UFPA board module 111 can be understood as an electronic circuit module specifically used to drive, bias, read the aforementioned infrared detector, and perform initial signal amplification, conditioning, and digitization and other front-end processing on it. It should be noted that names such as "HK detector module 110" and "UFPA board module 111" are terms defined by the applicant to generally refer to the set of components that perform specific functions in their solution. They do not directly correspond to a specific publicly disclosed model or unique structure on the market. Their core functions (photoelectric conversion by the detector and signal reading and processing by the circuit board) are clear. The specific technical details of their implementation (such as pixel scale, pixel size, packaging form, chip model, etc.) are common technologies in the field and will vary depending on different manufacturers and product series. The focus of protection of this utility model is on the spatial layout and connection relationship between these modules and between them and the supporting structure. The structural design of this utility model can adapt to a variety of HK detector modules 110 and UFPA board modules 111 that meet the interface and size specifications.

[0021] In this embodiment of the present invention, the lower end of the rear plug-in block 118 is formed with a foolproof plug 125, the first mounting plate 119 is provided with a first foolproof slot 126, the UFPA board module 111 includes a UFPA board 127, the UFPA board 127 is provided with a second foolproof slot 128 that is aligned with the first foolproof slot 126, and the foolproof plug 125 is inserted and engaged in the first foolproof slot 126 and the second foolproof slot 128. like Figure 4 , 7 As shown in Figure 8, by forming a unique anti-mistake plug 125 at the lower end of the rear plug block 118, and by having the anti-mistake plug 125 pass sequentially through the first anti-mistake slot 126 on the first mounting plate 119 and the second anti-mistake slot 128 on the UFPA plate 127 during assembly, a positioning mechanism that penetrates the multi-layer structure is formed; a mandatory physical error prevention function is provided, ensuring that the UFPA plate module 111 and the entire lens bracket 104 assembly 103 can only be assembled in a unique direction and position, avoiding reverse or misaligned installation due to human error, thereby protecting the precision PIN pin group 123 from bending or damage; This through-type plug-in connection establishes an additional, stable mechanical anchor point between the UFPA board module 111 and the upper lens bracket 104. This not only further enhances the structural rigidity and integrity of the entire chip assembly 102 in three-dimensional space and effectively suppresses the relative displacement of each component under vibration, but also assists in the pre-alignment of the PIN pin plug-in between the UFPA board 127 and the HK detector module 110, improving the smoothness of assembly.

[0022] In this embodiment of the utility model, a limiting plug 129 is formed at the corner of the diagonal line of the lower end face of the first frame 114, and a limiting slot 130 is provided on the UFPA plate 127 to be inserted and cooperated with the limiting plug 129. like Figure 4 and 8 As shown, by inserting the limiting plug 129 arranged diagonally on the lower end face of the first frame 114 into the corresponding limiting slot 130 on the UFPA board 127, the constraints provided by the diagonal layout are used to effectively limit the translational and rotational degrees of freedom of the UFPA board module 111 in the horizontal plane. By applying constraints at key positions, a stable relative position between the UFPA board module 111 and the upper structure is ensured.

[0023] In this embodiment of the utility model, the lower end face of the first frame 114 is provided with a bolt insertion hole 131, the corners of the UFPA board 127 are provided with a first mounting through hole 132, the CPU bracket 112 includes a second frame 133, the corners of the second frame 133 are provided with a second mounting through hole 134, and the corners of the tail plate 113 are provided with a third mounting through hole 135. The first, second and third mounting through holes 135 are aligned and cooperate with the bolt insertion hole 131. like Figure 4 and 9 As shown, by opening bolt insertion holes 131 on the lower end face of the first frame 114, and aligning the first, second, and third mounting through holes 135 at the corners of the UFPA plate 127, the second frame 133, and the tail plate 113 with the bolt insertion holes 131, the bolts are finally vertically inserted through all components from top to bottom and locked, thus constructing an axial fastening system that runs through the entire module. The axial locking mechanism simplifies the assembly process. At the same time, this vertical bolt layout distributed at the corners tightly presses the components of each level into a whole, effectively suppressing the relative displacement and deformation of each component under complex working conditions.

[0024] In this embodiment of the utility model, a foam component 136 is fixedly installed below the tail plate 113; By fixing an elastic and compressible foam component 136 under the tail plate 113, it serves as an interface material between the module and the external installation environment, playing a good role in filling and isolating. This not only prevents wear or scratches caused by hard contact between the tail plate 113 and the installation surface, but also blocks dust and impurities from entering the bottom of the module to a certain extent, thus improving the product's environmental adaptability and durability.

[0025] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A space-optimized thermal imaging detector module, characterized in that, It includes a lens assembly (101), a chip assembly (102), and a bracket assembly (103) arranged in sequence. The lens assembly (101) includes a lens bracket (104), which includes an integrally formed lens mounting tube (105) and a shutter mounting base (106). The lens mounting tube (105) contains a lens component (107), and the shutter mounting base (106) contains a shutter component (108). The chip assembly (102) includes a UFPA board bracket (109) fixedly mounted below the shutter mounting base (106). The UFPA board bracket (109) houses an HK detector module (110) and a UFPA board module (111). The HK detector module (110) and the UFPA board module (111) are respectively inserted into each other from the upper and lower end faces of the UFPA board bracket (109). The bracket assembly (103) includes a CPU bracket (112) fixedly mounted below the UFPA board bracket (109), and a tail plate (113) is fixedly mounted below the CPU bracket (112).

2. The space-optimized thermal imaging detector module according to claim 1, characterized in that, The UFPA board bracket (109) includes a first frame (114) fixedly installed below the shutter mount (106). The front end and rear end of the first frame (114) are respectively provided with a front insertion slot (115) and a rear insertion slot (116). The lower end surface of the shutter mount (106) is formed with a front insertion block (117) and a rear insertion block (118). The front insertion block (117) is inserted into the front insertion slot (115), and the rear insertion block (118) is inserted into the rear insertion slot (116).

3. The space-optimized thermal imaging detector module according to claim 2, characterized in that, The first frame (114) is fixedly installed with a first mounting plate (119). The front end plug block (117) and the rear end plug block (118) are respectively provided with countersunk mounting holes (120). The front end face and the rear end face of the first mounting plate (119) are respectively provided with screw locking holes (121) that are aligned and cooperate with the countersunk mounting holes (120).

4. The space-optimized thermal imaging detector module according to claim 3, characterized in that, The first mounting plate (119) has a through slot (122). The HK detector module (110) is mounted above the first mounting plate (119). The UFPA board module (111) is mounted below the first mounting plate (119). The PIN pin group (123) of the HK detector module (110) extends downward from the through slot (122) and is aligned and plugged into the PIN pin socket (124) on the UFPA board module (111).

5. A space-optimized thermal imaging detector module according to claim 3, characterized in that, The lower end of the rear plug block (118) is formed with a foolproof plug block (125). The first mounting plate (119) is provided with a first foolproof slot (126). The UFPA board module (111) includes a UFPA board (127). The UFPA board (127) is provided with a second foolproof slot (128) that is aligned with the first foolproof slot (126). The foolproof plug block (125) is inserted and engaged in the first foolproof slot (126) and the second foolproof slot (128).

6. A space-optimized thermal imaging detector module according to claim 5, characterized in that, Limiting blocks (129) are formed at the corners of the diagonal lines on the lower end face of the first frame (114), and a limiting slot (130) is provided on the UFPA plate (127) to engage with the limiting blocks (129).

7. A space-optimized thermal imaging detector module according to claim 5, characterized in that, The lower end face of the first frame (114) is provided with a bolt insertion hole (131), the corners of the UFPA board (127) are provided with a first mounting through hole (132), the CPU bracket (112) includes a second frame (133), the corners of the second frame (133) are provided with a second mounting through hole (134), the corners of the tail plate (113) are provided with a third mounting through hole (135), and the first, second and third mounting through holes (135) are aligned and fitted with the bolt insertion hole (131).

8. A space-optimized thermal imaging detector module according to any one of claims 1-7, characterized in that, A foam component (136) is fixedly installed below the tail plate (113).

Images