A device for testing low-temperature bending performance of an electric wire

Abstract

The utility model discloses a kind of electric wire low-temperature bending performance testing device, belong to electric wire testing technical field, its technical scheme main points include low-temperature box, the inside of low-temperature box bottom is equipped with cooling mechanism, the left side of low-temperature box inside top is rotatably connected with bending mechanism, cooling mechanism is directly generated cold source in cooling cavity by semiconductor refrigeration plate, directional cool air conveying structure is formed with air supply pipe, cold quantity is concentrated and acts on electric wire sample area, significantly improve cooling rate, substantially shorten the pretreatment time of single test, cooling mechanism and low-temperature box integrated design, realize the regulation and control of semiconductor refrigeration plate power, electric blower fan wind speed by PLC controller, in combination with the real-time feedback of temperature sensor, different test standard temperature requirement can be flexibly adapted, it is convenient to operate and degree of automation is high, ventilation opening design gives consideration to heat dissipation and box internal air pressure balance, avoid refrigeration system failure due to overheating, prolong equipment service life.

Description

Technical Field

[0001] This utility model relates to the field of wire testing technology, and in particular to a device for testing the low-temperature bending performance of wires. Background Technology

[0002] The low-temperature bending performance testing device for electrical wires is a device specifically designed to test the ability of electrical wires and cables to withstand repeated bending in low-temperature environments. Its core purpose is to verify whether electrical wires will experience failure problems such as insulation layer cracking or conductor breakage under cold conditions.

[0003] Existing patents offer solutions to the above problems, but existing wire low-temperature bending performance testing devices lack a structure for rapid cooling of the wires, resulting in lengthy testing cycles and severely limiting mass production testing efficiency, thereby reducing batch quality inspection efficiency.

[0004] To address this, a device for testing the low-temperature bending performance of electrical wires is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a low-temperature bending performance testing device for electrical wires, which can solve the problem that existing electrical wire testing lacks a structure for rapid cooling of the wires, resulting in a long testing cycle, severely limiting the efficiency of mass production testing, and thus reducing the efficiency of batch quality inspection.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a low-temperature bending performance testing device for electrical wires, comprising a low-temperature chamber, a cooling mechanism provided on the inner side of the bottom of the low-temperature chamber, and a bending mechanism rotatably connected to the left side of the top inner side of the low-temperature chamber. The cooling mechanism includes a cooling cavity, a mounting plate, several semiconductor cooling plates, several vents, a partition, five mounting holes, an air supply pipe, an electric blower, and a PLC controller. The cooling cavity is located on the inner side of the bottom of the low-temperature chamber, the mounting plate is welded to the bottom of the low-temperature chamber, the semiconductor cooling plates are mounted on the top of the mounting plate, the vents are located on the bottom of both sides of the low-temperature chamber, the partition is welded to the inner side of the low-temperature chamber, the mounting holes are located on the inner side of the partition, the air supply pipe is welded to the inner side of the mounting hole, the electric blower is mounted on the top of the inner side of the air supply pipe, the PLC controller is mounted on the front side of the low-temperature chamber, and a cover is rotatably connected to the top of the low-temperature chamber.

[0007] Preferably, the bending mechanism includes a support beam, a locking half-hole, a lead screw, a limiting rod, a moving beam, four fixed half-rings, a buffer spring, a contact half-ring, and a servo motor. The support beam is welded to the top of the inner side of the cryogenic chamber.

[0008] Preferably, the snap-fit ​​half-holes are respectively opened on the inner side of the top of the support beam, the top of both sides of the low temperature chamber, and the bottom of the chamber cover. The lead screws are respectively rotatably connected to the left side of the top of the inner side of the low temperature chamber and the right side of the top of the inner side of the low temperature chamber. The rear side of the left lead screw and the front side of the right lead screw are connected to the connecting shaft by a flat key. The limiting rods are respectively welded to the left side of the top of the inner side of the low temperature chamber and the right side of the top of the inner side of the low temperature chamber. Threaded blocks and sliders are respectively welded to both sides of the bottom of the moving beam. The threaded blocks are threadedly connected to the surface of the lead screws, and the sliders are slidably connected to the surface of the limiting rods.

[0009] Preferably, the movable beam is slidably connected to the left side of the top inner side of the low-temperature chamber and the right side of the top inner side of the low-temperature chamber, respectively. The fixed half-ring is welded to the surface of the movable beam. The buffer spring is installed on the inner wall of the fixed half-ring. The contact half-ring is welded to the inner side of the buffer spring. The servo motor is installed on the left side of the rear side of the low-temperature chamber and the right side of the front side of the low-temperature chamber, respectively. The output end of the servo motor passes through the low-temperature chamber and is fixedly connected to the side of the connecting shaft away from the lead screw.

[0010] Preferably, a sealing strip is installed on the top of the low-temperature chamber, and a sealing groove is provided at the bottom of the chamber cover, with the sealing strip engaging with the sealing groove.

[0011] Preferably, a filter ring is movably connected to the top of the inner side of the air supply duct, and the surface of the filter ring is coated with an anti-corrosion coating.

[0012] Preferably, a temperature sensor is installed on the top of the lid, and the detection end of the temperature sensor extends through and into the inside of the lid.

[0013] Preferably, the inner wall of the contact semi-ring is fitted with a buffer pad, and the surface of the buffer pad is engraved with anti-slip texture.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. The cooling mechanism of this application generates a cold source directly in the cooling chamber through a semiconductor cooling plate. Combined with an electric fan and air supply pipe, it forms a directional cold air delivery structure, concentrating the cooling energy on the wire sample area, significantly improving the cooling rate and greatly shortening the pre-processing time of a single test. The cooling mechanism is integrated with the low-temperature chamber. The power of the semiconductor cooling plate and the speed of the electric fan are controlled by a PLC controller. Combined with real-time feedback from the temperature sensor, it can flexibly adapt to the temperature requirements of different test standards. It is easy to operate and highly automated. The ventilation port design takes into account both heat dissipation and air pressure balance inside the chamber, avoiding the failure of the cooling system due to overheating and extending the service life of the equipment.

[0016] 2. The bending mechanism of this application uses a servo motor to drive the lead screw to rotate, which in turn moves the moving beam along the limit rod. Combined with the fixing effect of the support beam and the locking half hole, it can realize the bending of the wire sample. The bending speed and frequency can be adjusted by the PLC controller, which can simulate the bending stress under different usage scenarios. The test conditions are more in line with actual applications. The design of the fixed half ring and the contact half ring with buffer springs and buffer pads can reduce the hard damage to the wire insulation layer during bending. The symmetrical design of the lead screw and servo motor on both sides ensures the synchronization and stability of the moving beam movement, avoids the sample being displaced by force during bending, and meets the requirements of long-term high-frequency testing. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of the wire low-temperature bending performance testing device of this utility model;

[0018] Figure 2 This is a schematic diagram of the mounting plate of this utility model;

[0019] Figure 3 This is a schematic diagram of the mounting hole structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the support beam of this utility model;

[0021] Figure 5 This utility model Figure 4 Enlarged diagram of point A in the middle.

[0022] In the diagram, 1. Low-temperature chamber; 2. Cooling mechanism; 21. Cooling chamber; 22. Mounting plate; 23. Semiconductor cooling plate; 24. Vent; 25. Partition; 26. Mounting hole; 27. Air duct; 28. Electric fan; 29. ​​PLC controller; 3. Bending mechanism; 31. Support beam; 32. Snap-fit ​​half hole; 33. Lead screw; 34. Limiting rod; 35. Moving beam; 36. Fixed half ring; 37. Buffer spring; 38. Contact half ring; 39. Servo motor; 4. Chamber cover; 5. Sealing strip; 6. Sealing groove; 7. Filter ring; 8. Temperature sensor; 9. Buffer pad. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5 The present invention provides the following technical solution:

[0025] A low-temperature bending performance testing device for electrical wires includes a low-temperature chamber 1. A cooling mechanism 2 is provided on the inner side of the bottom of the low-temperature chamber 1. A bending mechanism 3 is rotatably connected to the left side of the top inner side of the low-temperature chamber 1. The cooling mechanism 2 includes a cooling chamber 21, a mounting plate 22, several semiconductor cooling plates 23, several vents 24, a partition 25, five mounting holes 26, an air supply pipe 27, an electric fan 28, and a PLC controller 29. The cooling chamber 21 is located on the inner side of the bottom of the low-temperature chamber 1. The mounting plate 22 is welded to the bottom of the low-temperature chamber 1. The semiconductor cooling plates 23 are mounted on the top of the mounting plate 22. The vents 24 are located on the bottom of both sides of the low-temperature chamber 1. The partition 25 is welded to the inner side of the low-temperature chamber 1. The mounting holes 26 are located on the inner side of the partition 25. The air supply pipe 27 is welded to the inner side of the mounting holes 26. The electric fan 28 is mounted on the top of the inner side of the air supply pipe 27. The PLC controller 29 is mounted on the front side of the low-temperature chamber 1. A chamber cover 4 is rotatably connected to the top of the low-temperature chamber 1.

[0026] In this embodiment: The low-temperature chamber 1 provides a closed testing space for the low-temperature bending test of the wire, effectively isolating it from external environmental interference. Combined with the cooling mechanism 2, it maintains a stable internal low-temperature environment and provides a mounting base for the bending mechanism 3, cooling components, etc. The chamber cover 4 is rotatably connected to the top of the low-temperature chamber 1. When closed, it seals the testing space, reducing cold loss and maintaining a stable low-temperature environment. When open, it facilitates sample loading and unloading, making operation convenient. The cooling chamber 21 provides mounting space for the semiconductor cooling plate 23, forming an independent cold source generation area, reducing cold diffusion to the outside of the low-temperature chamber 1, improving cooling efficiency, and facilitating centralized collection and transportation of cold energy. The mounting plate 22 is welded to the bottom of the low-temperature chamber 1, ensuring the cooling plate is securely installed and preventing displacement or damage due to equipment vibration. The semiconductor cooling plate 23 can quickly provide stable cooling, meeting the requirements of low-temperature testing for cooling rate and temperature stability. Ventilation is also provided. The opening 24 balances the air pressure between the cooling chamber 21 and the outside, preventing excessive air pressure inside the chamber from affecting the cooling efficiency. At the same time, it can dissipate the heat generated by the semiconductor cooling plate 23 during operation, preventing the cooling plate from failing due to overheating and extending the service life of the equipment. The partition 25 separates the cooling chamber 21 from the upper test area, which not only prevents the sample from directly contacting the cold source and causing local overcooling, but also guides the cold energy to be directionally delivered through the air supply pipe 27. The mounting hole 26 provides an installation position for the air supply pipe 27. The air supply pipe 27 can directionally guide the cold energy generated by the cooling chamber 21 to the wire sample, enhance the heat exchange efficiency between the cold energy and the sample, and accelerate the sample cooling speed. The electric fan 28 blows the cold energy of the cooling chamber 21 to the sample area quickly through forced convection, accelerates the cold air flow rate, improves the heat exchange efficiency, and further shortens the sample cooling time. The PLC controller 29 can integrate and control the cooling power of the semiconductor cooling plate 23, the wind speed of the electric fan 28, and the action parameters of the bending mechanism 3.

[0027] Specifically, such as Figure 4 , Figure 5 As shown, the bending mechanism 3 includes a support beam 31, a snap-fit ​​half-hole 32, a lead screw 33, a limit rod 34, a moving beam 35, four fixed half-rings 36, a buffer spring 37, a contact half-ring 38, and a servo motor 39. The support beam 31 is welded to the top of the inner side of the cryogenic chamber 1.

[0028] Specifically, such as Figure 4 , Figure 5 As shown, the snap-fit ​​half-holes 32 are respectively opened on the inner side of the top of the support beam 31, the top of both sides of the low temperature chamber 1, and the bottom of the chamber cover 4. The lead screws 33 are respectively rotatably connected to the left side of the top of the inner side of the low temperature chamber 1 and the right side of the top of the inner side of the low temperature chamber 1. The rear side of the left lead screw 33 and the front side of the right lead screw 33 are connected to the connecting shaft by a flat key. The limiting rods 34 are respectively welded to the left side of the top of the inner side of the low temperature chamber 1 and the right side of the top of the inner side of the low temperature chamber 1. The bottom sides of the moving beam 35 are respectively welded with threaded blocks and sliders. The threaded blocks are threadedly connected to the surface of the lead screw 33, and the sliders are slidably connected to the surface of the limiting rods 34.

[0029] Specifically, such as Figure 4 , Figure 5 As shown, the moving beam 35 is slidably connected to the left side of the top inner side of the cryogenic chamber 1 and the right side of the top inner side of the cryogenic chamber 1, respectively. The fixed half ring 36 is welded to the surface of the moving beam 35. The buffer spring 37 is installed on the inner wall of the fixed half ring 36. The contact half ring 38 is welded to the inner side of the buffer spring 37. The servo motor 39 is installed on the left side of the rear side of the cryogenic chamber 1 and the right side of the front side of the cryogenic chamber 1, respectively. The output end of the servo motor 39 passes through the cryogenic chamber 1 and is fixedly connected to the side of the connecting shaft away from the lead screw 33.

[0030] In this embodiment: A support beam 31 is used as a fixed support component for the wire sample, providing an installation base for the snap-fit ​​half-hole 32. Combined with the snap-fit ​​structure of the cover 4 and the side wall of the low-temperature chamber 1, stable fixation of both ends of the sample is achieved, preventing sample displacement during bending. The snap-fit ​​half-hole 32 enables rapid sample positioning, ensuring stable force on the sample during bending. The lead screw 33 rotates, driving the threaded block to translate, which in turn drives the moving beam 35 to move, realizing the bending action of the wire sample. The limiting rod 34 cooperates with the slider of the moving beam 35 to limit the movement direction of the moving beam 35, preventing the moving beam 35 from shifting or rotating during translation, ensuring stable and reliable bending action. The moving beam 35... The lead screw 33 drives translation, which in turn moves the fixed half-ring 36, thereby applying a bending force to the wire sample. The fixed half-ring 36 provides structural support for sample clamping and drives the bending of the sample through synchronous movement with the moving beam 35. The buffer spring 37 is installed between the fixed half-ring 36 and the contact half-ring 38 to ensure that the clamping force of the contact half-ring 38 on the sample is moderate, avoiding damage to the sample due to excessive clamping or slippage due to excessive loose clamping. The contact half-ring 38 is in direct contact with the wire sample, and the elasticity of the buffer spring 37 achieves flexible clamping of the sample, which can ensure that the sample does not fall off during bending and reduce hard damage to the clamping part. The servo motor 39 provides power for the rotation of the lead screw 33.

[0031] Specifically, such as Figure 4 As shown, a sealing strip 5 is installed on the top of the low-temperature chamber 1, and a sealing groove 6 is opened at the bottom of the chamber cover 4. The sealing strip 5 and the sealing groove 6 are engaged and snapped together.

[0032] Specifically, such as Figure 3 As shown, a filter ring 7 is movably connected to the top of the inner side of the air supply duct 27, and the surface of the filter ring 7 is coated with an anti-corrosion coating.

[0033] In this embodiment: by setting a sealing strip 5, which cooperates with the sealing groove 6 of the cover 4, the sealing performance between the low-temperature chamber 1 and the cover 4 is enhanced, and cold leakage is reduced. By setting a sealing groove 6, which cooperates with the sealing strip 5, the sealing effect is further improved, ensuring that the low-temperature chamber 1 forms a closed space during the test. By setting a filter ring 7, impurities or dust in the cold air can be filtered to prevent impurities from adhering to the surface of the wire sample and affecting the test results, or from entering the refrigeration components and causing equipment failure. By setting an anti-corrosion coating, its service life is extended and it is suitable for low-temperature and humid environments.

[0034] Specifically, such as Figure 1 As shown, a temperature sensor 8 is installed on the top of the box cover 4, and the detection end of the temperature sensor 8 extends through and into the inside of the box cover 4.

[0035] Specifically, such as Figure 5As shown, a buffer pad 9 is fitted on the inner wall of the contact semi-ring 38, and the surface of the buffer pad 9 is engraved with anti-slip texture.

[0036] In this embodiment: by setting a temperature sensor 8, the temperature inside the low-temperature chamber 1 can be monitored in real time and the data can be fed back to the PLC controller 29. By setting a buffer pad 9, the clamping force can be further buffered by its own elasticity to avoid damage to the sample insulation layer and protect the integrity of the sample. By setting an anti-slip texture, the friction with the wire sample is increased to prevent the sample from sliding during bending.

[0037] Working Principle: First, the operator places the wire sample into the locking half-holes 32 on both sides of the support beam 31 and the top of the low-temperature chamber 1. After closing the chamber cover 4, the locking half-holes 32 at the bottom of the cover 4 cooperate with the locking structure below to form a complete fixing hole. Next, the operator starts the semiconductor cooling plate 23 through the PLC controller 29. The semiconductor cooling plate 23 quickly generates cold air in the cooling chamber 21. At the same time, the electric fan 28 starts, blowing the cold air in the cooling chamber 21 upward through the air duct 27 to the sample area. The temperature sensor 8 monitors the temperature inside the low-temperature chamber 1 in real time and feeds the data back to the PLC controller 29. The PLC controller 29 adjusts the power of the semiconductor cooling plate 23 and the wind speed of the electric fan 28 to stabilize the temperature inside the low-temperature chamber 1 at the set test value. The sealing strip 5 cooperates with the sealing groove 6 to ensure the airtightness of the chamber and reduce the loss of cold air. Then, the operator controls the PLC controller 29 to control the temperature. Servo motor 39 starts, and drives lead screw 33 to rotate through connecting shaft. The threaded block on lead screw 33 drives moving beam 35 to move smoothly along limit rod 34. Moving beam 35 drives fixed half ring 36, buffer spring 37 and contact half ring 38 to move synchronously, bending the clamped wire sample. Buffer spring 37 and buffer pad 9 continuously buffer the clamping force during bending to avoid damaging the sample. Afterwards, PLC controller 29 continuously receives feedback data from temperature sensor 8 to ensure that the temperature in low temperature chamber 1 always meets the test requirements. At the same time, it records the number of times bending mechanism 3 operates. When the set number of bending times is reached, servo motor 39 automatically stops running, completing the test cycle. Finally, the operator closes cooling mechanism 2 and bending mechanism 3, opens chamber cover 4, takes out wire sample, and checks whether the insulation layer of the sample has cracks and whether the conductor is conductive, in order to determine whether the low temperature bending performance of the wire meets the standard.

[0038] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for testing the low-temperature bending performance of electrical wires, comprising a low-temperature chamber (1), characterized in that: A cooling mechanism (2) is provided on the inner side of the bottom of the low-temperature chamber (1). A bending mechanism (3) is rotatably connected to the left side of the top of the inner side of the low-temperature chamber (1). The cooling mechanism (2) includes a cooling chamber (21), a mounting plate (22), several semiconductor cooling plates (23), several vents (24), a partition (25), five mounting holes (26), an air supply pipe (27), an electric fan (28), and a PLC controller (29). The cooling chamber (21) is located on the inner side of the bottom of the low-temperature chamber (1), and the mounting plate (22) is welded to the bottom of the low-temperature chamber (1). The semiconductor cooling plate (23) is mounted on the top of the mounting plate (22), the vent (24) is opened at the bottom of both sides of the low temperature chamber (1), the partition (25) is welded to the inside of the low temperature chamber (1), the mounting hole (26) is opened on the inside of the partition (25), the air supply pipe (27) is welded to the inside of the mounting hole (26), the electric blower (28) is installed on the top of the inside of the air supply pipe (27), the PLC controller (29) is installed on the front of the low temperature chamber (1), and the top of the low temperature chamber (1) is rotatably connected to the top of the chamber (1).

2. The electrical wire low-temperature bending performance testing device according to claim 1, characterized in that: The bending mechanism (3) includes a support beam (31), a snap-fit ​​half hole (32), a lead screw (33), a limit rod (34), a moving beam (35), four fixed half rings (36), a buffer spring (37), a contact half ring (38), and a servo motor (39). The support beam (31) is welded to the top of the inner side of the low temperature chamber (1).

3. The electrical wire low-temperature bending performance testing device according to claim 2, characterized in that: The snap-fit ​​half-holes (32) are respectively opened on the inner side of the top of the support beam (31), the top of both sides of the low temperature chamber (1), and the bottom of the chamber cover (4). The lead screws (33) are respectively rotatably connected to the left side of the top of the inner side of the low temperature chamber (1) and the right side of the top of the inner side of the low temperature chamber (1). The rear side of the left lead screw (33) and the front side of the right lead screw (33) are connected to the connecting shaft by a flat key. The limiting rods (34) are respectively welded to the left side of the top of the inner side of the low temperature chamber (1) and the right side of the top of the inner side of the low temperature chamber (1). The bottom sides of the moving beam (35) are respectively welded with threaded blocks and sliders. The threaded blocks are threadedly connected to the surface of the lead screw (33), and the sliders are slidably connected to the surface of the limiting rods (34).

4. The electrical wire low-temperature bending performance testing device according to claim 2, characterized in that: The movable beam (35) is slidably connected to the left side of the top inside the low temperature chamber (1) and the right side of the top inside the low temperature chamber (1). The fixed half ring (36) is welded to the surface of the movable beam (35). The buffer spring (37) is installed on the inner wall of the fixed half ring (36). The contact half ring (38) is welded to the inner side of the buffer spring (37). The servo motor (39) is installed on the left side of the rear side of the low temperature chamber (1) and the right side of the front side of the low temperature chamber (1). The output end of the servo motor (39) passes through the low temperature chamber (1) and is fixedly connected to the side of the connecting shaft away from the lead screw (33).

5. The electrical wire low-temperature bending performance testing device according to claim 1, characterized in that: The top of the low-temperature chamber (1) is equipped with a sealing strip (5), and the bottom of the chamber cover (4) is provided with a sealing groove (6). The sealing strip (5) and the sealing groove (6) are engaged and snapped together.

6. The electrical wire low-temperature bending performance testing device according to claim 1, characterized in that: A filter ring (7) is movably connected to the top of the inner side of the air supply pipe (27), and the surface of the filter ring (7) is coated with an anti-corrosion coating.

7. The electrical wire low-temperature bending performance testing device according to claim 1, characterized in that: A temperature sensor (8) is installed on the top of the box cover (4), and the detection end of the temperature sensor (8) extends through and into the inside of the box cover (4).

8. The electrical wire low-temperature bending performance testing device according to claim 2, characterized in that: The inner wall of the contact semi-ring (38) is fitted with a buffer pad (9), and the surface of the buffer pad (9) is engraved with anti-slip texture.

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