Test fixture and test system

Abstract

The present disclosure relates to a test tool and a test system, the test tool is used for pressure maintaining test of a heat dissipation piece, comprising: a body and a pressure maintaining piece, the pressure maintaining piece is arranged on a first side of the body, the first side is a side facing the heat dissipation piece, and the pressure maintaining piece supports a heat dissipation area of the heat dissipation piece after the body is connected with the heat dissipation piece. In this way, when the heat dissipation piece is installed in the test tool for pressure maintaining test, the heat dissipation area of the heat dissipation piece can be supported by the pressure maintaining piece, the deformation of the heat dissipation area of the heat dissipation piece during the pressure maintaining test can be reduced, and the heat dissipation piece after the pressure maintaining test can meet the assembly requirements of a chip.

Description

Technical Field

[0001] This disclosure relates to the field of cold plate testing technology, and more specifically, to a testing fixture and testing system. Background Technology

[0002] In related technologies, as chip power consumption increases, the heat dissipation requirements of the chip also increase. For example, in graphics card modules, as the power consumption and power density of GPU (Graphics Processing Unit) increase, higher requirements are placed on the heat dissipation capacity of the GPU heat sink. During stress testing, the heat dissipation area where the heat sink contacts the GPU is prone to deformation, which does not meet the assembly requirements of the heat sink and the chip after stress testing. Utility Model Content

[0003] The purpose of this disclosure is to provide a test fixture and test system that reduces the deformation of the heat dissipation area of ​​the heat sink during the test and can meet the requirements of assembling the heat sink with the chip after pressure testing, thereby at least partially solving the related technical problems.

[0004] To achieve the above objectives, according to a first aspect of this disclosure, a test fixture is provided for pressure holding testing of a heat sink, comprising: a body; and a pressure holding member disposed on a first side of the body for supporting the heat dissipation area of ​​the heat sink after the body is connected to the heat sink.

[0005] Optionally, the area of ​​the pressure-holding component is greater than or equal to the area of ​​the heat dissipation area.

[0006] Optionally, the body and the pressure-holding component are integrally formed.

[0007] Optionally, the body has a first mounting hole corresponding to the second mounting hole of the heat sink, for fasteners to pass through the first mounting hole and the second mounting hole to fix the body and the heat sink together.

[0008] Optionally, the first mounting hole includes a screw hole for engaging with a spring screw on the heat sink.

[0009] Optionally, there may be multiple first mounting holes, which surround the outer periphery of the pressure-holding member.

[0010] Optionally, the body may further have an abutting portion for contacting the heat sink.

[0011] Optionally, the pressure-holding member is located between at least two of the abutting portions.

[0012] Optionally, the test fixture is made of metal.

[0013] According to a second aspect of this disclosure, a pressure supply mechanism and the aforementioned test fixture are provided.

[0014] The above-described technical solution, namely the test fixture disclosed herein, is used for pressure holding tests of heat sinks. The test fixture includes a body and a pressure holding component. The pressure holding component is disposed on the first side of the body and supports the heat dissipation area of ​​the heat sink after the body is connected to the heat sink. Therefore, during the pressure holding test, the pressure holding component supports the heat dissipation area of ​​the heat sink, reducing deformation of the heat dissipation area during the test, and ensuring that the heat sink meets the assembly requirements with the chip after the pressure holding test.

[0015] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the accompanying drawings...

[0017] Figure 1 This is a schematic diagram of the assembly of test fixtures and heat sinks provided in some embodiments of this disclosure.

[0018] Figure 2 This is a side view of the assembly of the test fixture and heat sink provided in some embodiments of this disclosure.

[0019] Figure 3 This is a schematic diagram of a test fixture provided in some embodiments of this disclosure.

[0020] Figure 4 This is a schematic diagram of a heat sink provided in some embodiments of this disclosure.

[0021] Explanation of reference numerals in the attached figures 1-Body; 11-First side; 12-First mounting hole; 13-Abutting part; 2-Pressure holding component; 3-Heat dissipation component; 31-Heat dissipation area; 32-Second mounting hole; 33-Spring screw; 4-Fastener. Detailed Implementation

[0022] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0023] In this disclosure, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower parts of the corresponding figures; "inner" and "outer" refer to the outline of the corresponding components themselves. The terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not have sequential or importance. When the following description refers to the figures, unless otherwise indicated, the same numbers in different figures represent the same or similar elements.

[0024] In related technologies, as the power consumption and power density of GPUs (Graphics Processing Units) in graphics card modules increase, higher requirements are placed on the heat dissipation capacity of GPU heat sinks. During stress testing, the heat dissipation area of ​​the heat sink in contact with the GPU is prone to deformation, resulting in the heat sink failing to meet the assembly requirements with the chip after stress testing.

[0025] To achieve the above objectives, such as Figures 1 to 3 As shown, according to a first aspect of this disclosure, a test fixture is provided for a pressure holding test of a heat sink 3, comprising: a body 1 and a pressure holding member 2, the pressure holding member 2 being disposed on a first side 11 of the body 1, the first side 11 being a side facing the heat sink 3, and the pressure holding member 2 being supported on the heat dissipation area 31 of the heat sink 3 after the body 1 is connected to the heat sink 3.

[0026] The above-described technical solution, namely the test fixture disclosed herein, is used for pressure holding testing of the heat sink 3. The test fixture includes a body 1 and a pressure holding component 2. During testing, the heat sink 3 is fixed on the test fixture. After the body 1 is connected to the heat sink 3, the pressure holding component 2 supports the heat dissipation area 31 of the heat sink 3. Therefore, during the pressure holding test of the heat sink 3, the pressure holding component 2 can support the heat dissipation area 31 of the heat sink 3, reducing deformation of the heat dissipation area 31 during the pressure holding test, so that the heat sink 3 after the pressure holding test meets the assembly requirements with the chip.

[0027] It is understood that the chip described above can be a GPU chip, the heat sink 3 can be a cold plate, and the heat dissipation area 31 is in contact with the GPU chip. Coolant is circulated into the cold plate, and when the coolant flows to the heat dissipation area 31, it dissipates heat from the GPU chip. The above description of the chip as a GPU chip is illustrative. In other embodiments, the chip can be a SOC (System on Chip) chip or a CPU (Central Processing Unit).

[0028] When the power density of the GPU is from 50-60W / CM 2 (Average) rapidly increases by 80-100 W / cm 2 The ultimate power density even reaches 300W / CM 2Therefore, the heatsink 3 corresponding to the GPU chip also needs to have its heat dissipation capacity improved accordingly. To improve the heat dissipation capacity of the heatsink 3, skived fins are provided in the heat dissipation area 31 of the heatsink 3. The skived fins increase the heat dissipation area and quickly dissipate the heat from the GPU chip. However, the skived fins also increase the overall thickness of the heat dissipation area 31 in the heatsink 3 by about 1.5mm. The increased thickness of the heat dissipation area 31 in the heatsink 3 will increase the thermal resistance and correspondingly reduce the heat dissipation performance. Therefore, it is necessary to control the thinning of the heat dissipation area 31 in the heatsink 3. However, the thinned heatsink 3 is prone to deformation during the pressure holding test. The pressure holding component 2 in the test fixture of this application provides support for the heat dissipation area 31 of the heatsink 3, thereby accommodating the deformation of the heat dissipation area 31 of the thinner heatsink 3 during the pressure holding test, so that the heatsink 3 after the pressure holding test meets the assembly requirements with the chip. The test fixture provided in this application can be used to perform a pressure holding test of 0.6-0.8 MPa on the heat sink 3. The heat sink 3 with shovel-tooth fins and a thin heat dissipation area 31 can be adapted to reduce the thickness of the heat dissipation area 31 of the heat sink 3 from 1.5 mm to about 0.8 mm.

[0029] In some feasible methods, in order to ensure that the pressure-holding component 2 provides sufficient support for the heat dissipation area 31 of the heat sink 3 during testing, the area of ​​the pressure-holding component 2 is greater than or equal to the area of ​​the heat dissipation area 31. For example... Figure 3 As shown, the pressure-holding component 2 can be constructed as a rectangular protrusion away from the first side 11, and the heat dissipation area 31 in the heat sink 3 can also be a rectangular protrusion facing away from the heat sink 3. The area of ​​the pressure-holding component 2 can be slightly larger than the area of ​​the heat dissipation area 31 in the heat sink 3, so that the pressure-holding component 2 completely covers the heat dissipation area 31, providing sufficient support for the heat dissipation area 31 during the test and preventing deformation of the heat dissipation area 31 during the pressure holding test. Alternatively, the area of ​​the pressure-holding component 2 can be equal to the area of ​​the heat dissipation area 31. During the pressure test of the heat sink 3, the pressure-holding component 2 can also provide sufficient support for the heat dissipation area 31, preventing deformation of the heat dissipation area during the pressure holding test.

[0030] In some feasible approaches, to improve the structural strength and reliability of the test fixture, the main body 1 and the pressure-holding component 2 can be integrally molded. This integral molding avoids stress concentration problems caused by traditional assembly processes (such as welding and threaded connections), resulting in higher overall structural uniformity of the fixture. Furthermore, the integral molding of the main body 1 and the pressure-holding component 2 simplifies the manufacturing process and improves processing efficiency.

[0031] In some feasible embodiments, the test fixture can be made of metal. Metal has good thermal conductivity and is easy to process and shape. Both the body 1 and the pressure holding component 2 in the test fixture are made of metal. The metal material can include any one or more combinations of copper, copper alloy, aluminum, aluminum alloy, copper-based composite material, aluminum-based aluminum composite material, or copper-aluminum composite material. In this embodiment, the test fixture can be made of aluminum alloy, which has advantages such as good heat dissipation, easy processing, light weight, and low cost.

[0032] When both the main body 1 and the pressure holding component 2 in the test fixture are made of aluminum alloy, the main body 1 and the pressure holding component 2 can be integrally formed by processes such as die casting, machining or 3D printing.

[0033] Of course, the above-described integral molding of the body 1 and the pressure-holding component 2 is illustrative. In other embodiments, the body 1 and the pressure-holding component 2 can also be detachably connected. For example, the body 1 can be detachably connected to the pressure-holding component 2 via fasteners 4. In this way, when testing heat sinks corresponding to chips of different sizes, the tooling change process can be simplified by simply replacing the corresponding pressure-holding component 2.

[0034] To securely connect the heat sink 3 to the test fixture, in some feasible embodiments, the body 1 has a first mounting hole 12 corresponding to the second mounting hole 32 on the heat sink 3. Fasteners 4 can pass through the first mounting hole 12 and the second mounting hole 32 to securely connect the body 1 and the heat sink 3. The heat sink 3 can have multiple second mounting holes 32, and the body 1 has multiple first mounting holes 12 corresponding one-to-one with the second mounting holes 32. When it is necessary to securely install the heat sink 3 to the test fixture, the heat sink 3 is installed on the test fixture by passing fasteners 4 through the first mounting holes 12 and the corresponding second mounting holes 32. Of course, to facilitate securing the heat sink 3 to the test fixture, the fasteners 4 can be bolts or screws.

[0035] like Figure 4As shown, when the heat sink 3 is constructed as a cold plate and applied to a graphics card module, the cold plate is provided with multiple second mounting holes 32 for fixed installation with the graphics card module housing, and spring screws 33 set in the second mounting holes 32. In some feasible embodiments, the fastener 4 can be the corresponding spring screw 33 on the cold plate. The first mounting hole 12 can include screw holes for connecting with the spring screw 33. The number of first mounting holes 12 corresponds one-to-one with the number of spring screws 33. In this way, the cold plate and the test fixture can be easily installed by sharing the second mounting holes 32 and spring screws 33 on the cold plate. That is, the cold plate and the test fixture can be fixedly connected without changing the structure of the cold plate as much as possible. Of course, the structure of sharing the second mounting holes and spring screws 33 on the cold plate can also reduce the number of parts used and reduce costs. In addition, when the cold plate is subjected to pressure testing, the spring on the spring screw 33 can also provide elasticity so that the corresponding heat dissipation area 31 on the cold plate can abut against the pressure holding member 2 more stably. Through the adaptive adjustment of the spring, it can also avoid the failure of contact with the test fixture due to the deformation of the cold plate under pressure during the pressure test.

[0036] In some feasible embodiments, there can be multiple first mounting holes 12, which surround the outer periphery of the pressure-holding component 2. For example, when there are four spring screws 33 surrounding the heat dissipation area 31 of the cold plate, the first mounting holes 12 correspond one-to-one with the spring screws 33, that is, there can be four first mounting holes 12, and the four first mounting holes 12 surround the outer periphery of the pressure-holding component 2, thereby enabling the heat dissipation component 3 to be subjected to more uniform force when assembled with the test fixture.

[0037] In other feasible implementations, the fastener 4 can also be a separate component. When the heat sink 3 is constructed as a cold plate and applied to a graphics card module, the cold plate also has through holes for mating with other components. In this case, the fastener 4 can be a screw, and the body 1 has first mounting holes 12 that correspond one-to-one with the through holes. The screw passes through the through holes and the first mounting holes 12 to fix the cold plate to the test fixture. In this case, the number of first mounting holes 12 can be selected according to the specific number of through holes.

[0038] Furthermore, when the heat sink 3 is constructed as a cold plate and applied to a graphics card module, the heat dissipation area 31 provided on the cold plate is used to dissipate heat from the GPU chip. The cold plate is also provided with heat dissipation parts for other electronic components in the graphics card module or with limiting parts that cooperate with the module housing. In this case, in order to enable the heat sink 3 to be tightly connected with the test fixture, in some feasible embodiments, the body 1 is also formed with an abutment part 13 for cooperating with the heat sink 3. The abutment part 13 can abut with the heat dissipation part or the limiting part on the cold plate. Thus, by setting the abutment part 13, the heat dissipation area 31 on the heat sink 3 can be tightly connected with the pressure holding part 2 when the heat sink 3 is assembled with the test fixture, reducing the deformation of the heat dissipation area 31 of the heat sink 3 during the pressure holding test, so that the heat sink 3 after the pressure holding test meets the assembly requirements with the chip.

[0039] In some feasible embodiments, the pressure holding member 2 can be located between at least two abutment portions 13. That is, the pressure holding member 2 can be located in the middle of the body 1, and two abutment portions 13 are provided on the body 1 and on opposite sides of the pressure holding member 2. In this way, the two abutment portions 13 can abut against the heat dissipation portion or limiting portion on the cold plate, so that when the heat dissipation member 3 is assembled with the test fixture, the heat dissipation area 31 on the heat dissipation member 3 is tightly connected to the pressure holding member 2, reducing the deformation of the heat dissipation area 31 of the heat dissipation member 3 during the pressure holding test, so that the heat dissipation member 3 after the pressure holding test meets the assembly requirements with the chip.

[0040] It is understood that the aforementioned pressure-holding member 2 may be a schematic structure located between two abutting portions 13. In other embodiments, the number of abutting portions 13 may be three or four.

[0041] According to a second aspect of this disclosure, a testing system is provided, including a pressure supply mechanism and the aforementioned testing fixture. For example, the pressure supply mechanism may include a coolant tank, a pressure pump, an inlet pipe, a return pipe, a cooling assembly, and a pressure control valve. The coolant tank is used to store coolant, such as water, ethylene glycol-based liquid, or fluorinated liquid. The inlet of the inlet pipe and the outlet of the return pipe are respectively connected to the coolant tank. The outlet of the inlet pipe is connected to the coolant inlet of the heat sink, and the inlet of the return pipe is connected to the coolant outlet of the heat sink. The pressure pump, cooling assembly, and pressure control valve are sequentially connected in the direction away from the coolant tank on the inlet pipe. The pressure pump is used to provide power so that the coolant can flow from the inlet pipe into the cold plate. The cooling assembly is used to cool the coolant in the inlet pipe. The pressure control valve is used to control the pressure of the cooled coolant entering the cold plate. Thus, when the heat sink is installed on the testing fixture, the aforementioned pressure supply mechanism can introduce coolant into the heat sink according to a preset temperature and pressure based on different operating conditions, thereby completing the pressure test of the heat sink. Of course, it is understandable that the above-mentioned testing system includes all the beneficial effects of the testing fixtures, which will not be elaborated here.

[0042] Of course, it is understood that the structure of the pressure supply mechanism described above, including the coolant tank, pressure pump, inlet pipe, return pipe, cooling components, and pressure control valve, is illustrative. In other embodiments, the pressure supply mechanism may also have other structures. This disclosure does not specifically limit the specific structure of the pressure supply mechanism.

[0043] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0044] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0045] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A testing fixture for pressure holding tests of heat sinks, characterized in that, include: ontology; and A pressure-holding component is provided on the first side of the body and is used to support the heat dissipation area of ​​the heat dissipation component after the body is connected to the heat dissipation component.

2. The testing fixture according to claim 1, characterized in that, include: The area of ​​the pressure-holding component is greater than or equal to the area of ​​the heat dissipation area.

3. The testing fixture according to claim 1, characterized in that, The main body and the pressure-holding component are integrally formed.

4. The test fixture according to claim 1, characterized in that, The body has a first mounting hole corresponding to the second mounting hole of the heat sink, for fasteners to pass through the first mounting hole and the second mounting hole to fix the body and the heat sink together.

5. The testing fixture according to claim 4, characterized in that, The first mounting hole includes a screw hole for engaging with a spring screw on the heat sink.

6. The testing fixture according to claim 4, characterized in that, There are multiple first mounting holes, which surround the outer periphery of the pressure-holding member.

7. The test fixture according to claim 1, characterized in that, The body also has an abutting portion for contacting the heat sink.

8. The test fixture according to claim 7, characterized in that, The pressure-holding member is located between at least two of the abutting portions.

9. The test fixture according to claim 1, characterized in that, The test fixture is made of metal.

10. A testing system, characterized in that, It includes a pressure supply mechanism and the test fixture as described in any one of claims 1-9.

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