A probe device of a wafer point measurement machine

Abstract

This utility model discloses a detection device for a wafer spot testing machine, including a worktable with an air pump drive mechanism on one side of the top of the worktable. It also includes a first detection mechanism located on one side of the drive mechanism, with a first sliding mechanism at the top and a first detector at the bottom. A first detection head, cylindrical in shape, is located in the middle of the first detector. By setting up the first, second, and third detection mechanisms, the first detection mechanism can detect the top and bottom surfaces of the wafer, the second detection mechanism can detect the curved surface of the wafer, and the third detection mechanism can detect the junction between the top and curved surfaces. This allows for effective detection of different surfaces on the wafer, providing accurate detection data and strong practicality.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a detection device for a wafer spot testing machine. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. The raw material for wafers is silicon, while silicon dioxide is an inexhaustible resource on the Earth's crust. Silicon dioxide ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polycrystalline silicon. Spot testing machines are used to inspect this silicon during wafer production.

[0003] A search revealed that Chinese Patent Publication No. CN215986353U discloses a detection device for a wafer spot testing machine, relating to the field of spot testing technology. The device includes a main body and a probe mounting tube. The main body has an internal mounting disk with a mounting groove on its upper surface. A first internal retaining ring is fixedly connected to the inner wall of the mounting groove, and a probe mounting tube is movably connected to the inner wall of the mounting groove. A through-line pipe is formed on the upper surface of the probe mounting tube, and a rotary motor is housed inside the probe mounting tube. This utility model, by incorporating a mounting disk and a probe mounting tube, solves the problem of low installation and working efficiency in existing wafer spot testing machine detection devices, which can only install one probe at a time. Furthermore, it addresses the inconvenience of fixing the probes externally during installation by incorporating a rotating device and a telescopic rod.

[0004] A search revealed that Chinese Patent Publication No. CN208385355U discloses a detection device for a wafer probing machine, comprising a device frame and a probe. The probe is disposed inside the device frame. First grooves are provided on the outer surfaces of both sides of the device frame. A connecting block is provided at one end of the probe, and one side of the connecting block is slidably connected inside the first groove. Rotating devices are respectively provided at both ends of the device frame, and mounting seats are provided outside the rotating devices. The rotating devices and mounting seats are fixedly connected. By placing the probe inside the device frame for sliding connection, and by controlling servo motors on both sides of the device frame to drive the device frame to rotate, the probe can be rotated, achieving a rotatable and adjustable position function. This allows for arbitrary adjustment of the probe's position even after installation, improving ease of use.

[0005] However, existing technologies cannot effectively detect different surfaces on a wafer, resulting in inaccurate detection data and poor practicality.

[0006] To address this issue, we propose a detection device for a wafer spot testing machine. Utility Model Content

[0007] The purpose of this invention is to address the shortcomings of existing technologies by proposing a detection device for a wafer spot testing machine.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] A detection device for a wafer spot testing machine includes a worktable, a pneumatic pump drive mechanism on one side of the top of the worktable, and further includes:

[0010] The first detection mechanism is located on one side of the driving device. The top of the first detection mechanism is provided with a first sliding mechanism, the bottom of the first sliding mechanism is provided with a first detector, and the middle position inside the first detector is provided with a first detection head, which is cylindrical in shape.

[0011] The second detection mechanism is located on one side of the first detection mechanism. The top of the second detection mechanism is located on the second sliding mechanism. A second detection head is provided at one end of the second sliding mechanism. The second sliding mechanism is inclined, and the inclination angle of the second sliding mechanism is between 30° and 45°.

[0012] The third testing mechanism is located on the opposite side of the second testing mechanism. The third testing mechanism is equipped with a third sliding mechanism, and the top of the third sliding mechanism is equipped with a third testing head.

[0013] More preferably, a placement slot is provided below the first detector, the placement slot is located at the top of the workbench, and a limiting slot is provided in the placement slot, with the first detection head located directly above the limiting slot.

[0014] More preferably, the height of the third detection head is higher than the top surface of the placement slot, the height of the second detection head is higher than the third detection head, and the height of the first detection head is higher than the second detection head.

[0015] More preferably, a pressure gauge is provided at one end of the workbench, and a control box is provided at the top of the workbench on one side of the third detection mechanism, with control buttons provided on the control box.

[0016] More preferably, the workbench is provided with support legs at the four corners of its bottom end, and the bottom surface of the support legs is cylindrical.

[0017] More preferably, the third sliding mechanism is provided with limiting blocks at both ends, the limiting blocks are located below the third detection head, the top surface of the limiting blocks is fixedly connected to the bottom surface of the third detection head, and the limiting blocks and the third sliding mechanism are slidably connected.

[0018] More preferably, the first sliding mechanism, the second sliding mechanism, and the third sliding mechanism are all driven by an air pump drive mechanism, and the pressure gauge is used to detect the air pump drive mechanism.

[0019] More preferably, the first detection head, the second detection head, and the third detection head are all detachable, and the ends of the second detection head and the third detection head are conical.

[0020] More preferably, the worktable is hollow and has a cuboid shape.

[0021] More preferably, the bottom of the control box is provided with a support column for connecting to the workbench, and the support column and the workbench are rotatably connected.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] By setting up a first inspection mechanism, a second inspection mechanism, and a third inspection mechanism, the first inspection mechanism can inspect the top and bottom surfaces of the wafer, the second inspection mechanism can inspect the curved surface of the wafer, and the third inspection mechanism can inspect the connection between the top surface and the curved surface. This allows for effective inspection of different surfaces on the wafer, providing accurate inspection data and strong practicality. Attached Figure Description

[0024] Figure 1 This is a top view of the detection device of a wafer spot testing machine proposed in this utility model;

[0025] Figure 2 This is a bottom view of the detection device of a wafer spot testing machine proposed in this utility model;

[0026] Figure 3 for Figure 1 Enlarged structural diagram at point A in the middle;

[0027] Figure 4 for Figure 2 Enlarged schematic diagram of the structure at point B.

[0028] In the diagram: 1. Workbench; 2. Air pump drive mechanism; 3. First detection mechanism; 4. Second detection mechanism; 5. Third detection mechanism; 6. Pressure gauge; 7. Control box; 8. Placement slot; 9. Limiting slot; 10. Second sliding mechanism; 11. Second detection head; 12. First sliding mechanism; 13. First detector; 14. Support leg; 15. Third sliding mechanism; 16. Limiting block; 17. Third detection head; 18. First detection head. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0030] refer to Figure 1 A detection device for a wafer spot testing machine includes a worktable 1, which supports other components. The worktable 1 is made entirely of stainless steel, which has good strength and corrosion resistance, effectively improving the strength and service life of the worktable 1. An air pump drive mechanism 2 is provided on one side of the top of the worktable 1. The air pump drive mechanism 2 is a device that uses components such as a cam, a connecting shaft, and a pressing component to press the diaphragm mechanism of the air pump, thereby realizing the air pump's pumping or charging function.

[0031] refer to Figure 1 and Figure 2 The first detection mechanism 3 is used to detect the top and bottom surfaces of the wafer. The first detection mechanism 3 is located on one side of the driving device. The air pump driving mechanism 2 drives the first sliding mechanism 12 on the first detection mechanism 3. The first detection device has a first sliding mechanism 12 at the top. The first detector 13 can be raised and lowered by sliding through the first sliding mechanism 12, thereby realizing the detection of the wafer.

[0032] refer to Figure 1 , Figure 2 and Figure 4 The first sliding mechanism 12 has a first detector 13 at its bottom end. The first detector 13 is essentially a wafer spot tester. The wafer spot tester is existing technology and is also known as an automated semiconductor chip testing device. It is a special device used to inspect and test the quality of semiconductor chips. The first detector 13 has a first detection head 18 in the middle position inside. The first detection head 18 is cylindrical in shape, so that the first detection head 18 can cover the top and bottom surfaces of the wafer and can completely and effectively test the wafer.

[0033] refer to Figure 1The second detection mechanism 4 is used to detect the curved surface of the wafer. The second detection mechanism 4 is located on one side of the first detection mechanism 3. The top of the second detection mechanism 4 is located on the second sliding mechanism 10. The air pump drive mechanism 2 drives the second sliding mechanism 10 on the second detection mechanism 4. The second detector can slide downward through the first sliding mechanism 12. The second detection head 11 at one end of the second sliding mechanism 10 is used to accurately detect the curved surface of the wafer.

[0034] refer to Figure 1 The second sliding mechanism 10 is inclined so that the second detection head 11 and the first detection head 18 will not collide during use. The inclination angle of the second sliding mechanism 10 is between 30° and 45°, which makes it easier to detect the curved surface of the wafer and makes it easier for the second detection head 11 to contact the curved surface of the wafer.

[0035] refer to Figure 1 and Figure 3 The third inspection mechanism 5 can inspect the connection between the top surface and the arc surface. The third inspection mechanism 5 is located on the opposite side of the second inspection mechanism 4, so as to make reasonable use of the space at the top of the workbench 1 and improve the space utilization rate. The third inspection mechanism 5 is equipped with a third sliding mechanism 15, and the top of the third sliding mechanism 15 is equipped with a third inspection head 17. The air pump drive mechanism 2 drives the third sliding mechanism 15 on the third inspection mechanism 5. The third detector can be moved by sliding through the third sliding mechanism 15, and then the third inspection head 17 is used to inspect the wafer.

[0036] refer to Figure 1 Below the first detector 13 is a placement slot 8, which is used to place untested wafers. The placement slot 8 is located at the top of the worktable 1. A limiting slot 9 is provided in the placement slot 8. The wafer is placed in the limiting slot 9. The edge of the limiting slot 9 can be set to a concave shape to hold the wafer. The first detection head 18 is located directly above the limiting slot 9, which facilitates the first detection head 18 to perform detection. When the top surface of the wafer is detected, the wafer can be flipped over to detect the bottom surface.

[0037] refer to Figure 1 The height of the third detection head 17 is higher than the top surface of the placement slot 8, the height of the second detection head 11 is higher than the third detection head 17, and the height of the first detection head 18 is higher than the second detection head 11. This ensures that when the first detection head 18, the second detection head 11, and the third detection head 17 are performing detection at the same time, they are on different horizontal planes, so that the first detection head 18, the second detection head 11, and the third detection head 17 do not affect each other during use.

[0038] refer to Figure 1One end of the workbench 1 is equipped with a pressure gauge 6, which is used to monitor the air pump drive mechanism 2. When the air pump drive mechanism 2 malfunctions, the user can observe and detect it on the pressure gauge 6. The top of the workbench 1 is located on one side of the third detection mechanism 5 and is equipped with a control box 7. The control box 7 includes a power supply section, a control section, a protection section, a measurement section, an execution section, a main structure, an equipment mounting plate, a power inlet, and a control panel. The user can operate it through the control buttons on the control box 7.

[0039] refer to Figure 2 The workbench 1 is provided with four support legs 14 at the bottom corners. The support legs 14 are used to support the workbench 1, prevent the workbench 1 from directly contacting the ground, and prevent the workbench 1 from getting damp. The bottom surface of the support legs 14 is cylindrical, which can increase the contact area with the ground and improve the stability of the support legs 14 in supporting the workbench 1.

[0040] refer to Figure 3 The third sliding mechanism 15 has limit blocks 16 at both ends. The limit blocks 16 are located below the third detection head 17. The top surface of the limit block 16 is fixedly connected to the bottom surface of the third detection head 17. The limit block 16 and the third sliding mechanism 15 are slidably connected. The limit block 16 can limit the third detection head 17 and restrict the third detection head 17 from sliding in a fixed direction on the third sliding mechanism 15.

[0041] refer to Figure 1 The first sliding mechanism 12, the second sliding mechanism 10, and the third sliding mechanism 15 are all driven by the air pump drive mechanism 2. The pressure gauge 6 is used to detect the air pump drive mechanism 2. The air pump drive mechanism 2 is a device that uses components such as cams, connecting shafts, and extruders to extrude the diaphragm mechanism of the air pump, thereby realizing the air pump's pumping or inflation function. Thus, the first sliding mechanism 12, the second sliding mechanism 10, and the third sliding mechanism 15 can slide and rise and fall using the pneumatic principle.

[0042] refer to Figures 1-4 The first detection head 18, the second detection head 11, and the third detection head 17 are all detachable, allowing them to be disassembled for maintenance and cleaning. The ends of the second detection head 11 and the third detection head 17 are conical. Because the wafer is thin, the conical shape allows for more accurate detection of the wafer.

[0043] refer to Figure 1The workbench 1 is hollow, and other components can be placed inside the workbench 1, such as power supply components to provide power to other components, protection devices including fuses, thermal relays, leakage protection devices, etc., to ensure the safety of equipment and personnel, including PLC (programmable logic controller), terminal blocks, etc., to realize more control functions. The workbench 1 is rectangular, and the rectangular shape has better stability.

[0044] refer to Figure 1 and Figure 2 The bottom of the control box 7 is provided with a support column for connecting to the workbench 1. The support column can connect the control box 7 and the workbench 1. The support column and the workbench 1 are rotatably connected, so the position of the control box 7 can be adjusted by rotating the support column, which makes it convenient for the user to operate. The user does not need to go over other parts to operate, and can directly operate the control box 7 from the side of the workbench 1.

[0045] Furthermore, when the terms "first," "second," "third," etc., are used in this application specification to describe various features, these terms are only used to distinguish these features and should not be construed as indicating or implying the correlation or relative importance between features or implicitly indicating the number of features indicated.

[0046] In addition, this application specification describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or perspective views. Therefore, differences from the illustrated shapes are foreseeable due to factors such as manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but should include deviations in shape caused, for example, by manufacturing processes. Thus, the regions shown in the figures are substantially schematic, and their shapes are not intended to illustrate the actual shapes of the regions of the device, nor to limit the scope of the exemplary embodiments.

Claims

1. A detection device for a wafer spot testing machine, comprising a worktable (1), wherein a pneumatic pump drive mechanism (2) is provided on one side of the top of the worktable (1), characterized in that, Also includes: The first detection mechanism (3) is located on one side of the driving device. The top of the first detection device is provided with a first sliding mechanism (12). The bottom of the first sliding mechanism (12) is provided with a first detector (13). The middle position inside the first detector (13) is provided with a first detection head (18). The first detection head (18) is cylindrical. The second detection mechanism (4) is located on one side of the first detection mechanism (3). The top of the second detection mechanism (4) is located on the second sliding mechanism (10). The second sliding mechanism (10) has a second detection head (11) at one end. The second sliding mechanism (10) is inclined and the inclination angle of the second sliding mechanism (10) is between 30° and 45°. The third detection mechanism (5) is located on the opposite side of the second detection mechanism (4). The third detection mechanism (5) is provided with a third sliding mechanism (15), and the top of the third sliding mechanism (15) is provided with a third detection head (17).

2. The detection device of a wafer spot testing machine according to claim 1, characterized in that, The first detector (13) is provided with a placement slot (8) below it. The placement slot (8) is located at the top of the workbench (1). The placement slot (8) is provided with a limiting slot (9). The first detection head (18) is located directly above the limiting slot (9).

3. The detection device of a wafer spot testing machine according to claim 2, characterized in that, The height of the third detection head (17) is higher than the top surface of the placement groove (8), the height of the second detection head (11) is higher than the third detection head (17), and the height of the first detection head (18) is higher than the second detection head (11).

4. The detection device of a wafer spot testing machine according to claim 1, characterized in that, A pressure gauge (6) is provided at one end of the workbench (1), and a control box (7) is provided at the top of the workbench (1) on one side of the third detection mechanism (5). A control button is provided on the control box (7).

5. The detection device of a wafer spot testing machine according to claim 1, characterized in that, The workbench (1) has four support legs (14) at the bottom corners, and the bottom surface of the support legs (14) is cylindrical.

6. The detection device of a wafer spot testing machine according to claim 1, characterized in that, The third sliding mechanism (15) has limit blocks (16) at both ends. The limit blocks (16) are located below the third detection head (17). The top surface of the limit block (16) and the bottom surface of the third detection head (17) are fixedly connected. The limit blocks (16) and the third sliding mechanism (15) are slidably connected.

7. The detection device of a wafer spot testing machine according to claim 4, characterized in that, The first sliding mechanism (12), the second sliding mechanism (10) and the third sliding mechanism (15) are all driven by the air pump drive mechanism (2), and the pressure gauge (6) is used to detect the air pump drive mechanism (2).

8. The detection device of a wafer spot testing machine according to claim 1, characterized in that, The first detection head (18), the second detection head (11) and the third detection head (17) are all detachable, and the ends of the second detection head (11) and the third detection head (17) are conical.

9. The detection device of a wafer spot testing machine according to claim 1, characterized in that, The workbench (1) is hollow and has a cuboid shape.

10. The detection device of a wafer spot testing machine according to claim 4, characterized in that, The bottom of the control box (7) is provided with a support column for connecting with the workbench (1), and the support column and the workbench (1) are rotatably connected.

Images