An electric quantity acquisition device

Abstract

The utility model relates to electric quantity collection technical field, and disclose a kind of electric quantity collection device, including equipment shell, the front side of equipment shell is provided with control screen, pilot lamp, interface and fixed plate, the top surface of equipment shell is equipped with first heat dissipation hole, the outside of equipment shell is equipped with convection hole, the rear side of equipment shell is equipped with second heat dissipation hole, the inside of equipment shell is fixedly installed with heat dissipation fan, baffle and water pump, the inside of baffle is fixedly installed with heat conduction base, the rear side of heat conduction base is fixedly installed with sealing joint, the outside of sealing joint is fixedly connected with first cooling pipe, the left side of water pump is fixedly installed with second cooling pipe.The utility model can firmly fix equipment in predetermined position by fixed plate and mounting hole, prevent it from happening to shake or displacement in operating process, and by using bolt, nut etc. connecting piece can make installation process more convenient, reduce maintenance cost.

Description

Technical Field

[0001] This utility model relates to the field of power acquisition technology, specifically to a power acquisition device. Background Technology

[0002] Electricity data acquisition devices are used to collect and process electricity data in power systems. They are primarily used for real-time monitoring and collection of electricity information from various nodes in the power network, providing real-time electricity data for power system dispatching and control. They can also be used for electricity metering, power quality analysis, and equipment fault diagnosis. Electricity data acquisition devices can not only accurately statistically analyze energy consumption data and monitor the energy consumption of power stations, thereby enabling targeted energy-saving measures and improving energy efficiency, but also provide a basis for power dispatching, rationally allocating power resources, and assisting in energy decision-making.

[0003] According to a search, Chinese patent document CN221101477U discloses a lithium battery-powered power acquisition device. A transparent protective plate is fixed to the mounting slot using screws. This protective plate effectively protects the display screen of the acquisition module, preventing damage from impacts that could affect the device's operation. The display screen allows real-time monitoring of the lithium battery's power level. A protective cover is installed at one end of the control chamber to protect the control buttons inside. However, this device lacks an effective heat dissipation structure. Prolonged use can lead to heat buildup inside the device, damaging internal components and affecting overall performance and lifespan. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a power acquisition device that features convenient installation, multiple heat dissipation methods, improved heat dissipation efficiency, and extended service life, thus solving the aforementioned technical problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a power acquisition device, comprising a device housing, a control panel, indicator lights, an interface, and a fixing plate provided on the front side of the device housing, a first heat dissipation hole provided on the top surface of the device housing, a convection hole provided on the outer side of the device housing, a second heat dissipation hole provided on the rear side of the device housing, a cooling fan, a baffle, and a water pump fixedly installed inside the device housing, a heat-conducting base fixedly installed inside the baffle, a sealing joint fixedly installed on the rear side of the heat-conducting base, a first cooling pipe fixedly connected to the outer side of the sealing joint, a second cooling pipe fixedly installed on the left side of the water pump, a radiator fixedly connected to the left end of the second cooling pipe, and a third cooling pipe fixedly installed on the left side of the radiator.

[0006] Preferably, there are two fixing plates, and each of the two fixing plates has a mounting hole on its front side.

[0007] The above technical solution allows the equipment to be firmly fixed in a predetermined position using a fixing plate and mounting holes, preventing it from shaking or shifting during operation. Furthermore, the use of bolts, nuts, and other connecting parts makes the installation process more convenient and reduces maintenance costs.

[0008] Preferably, the number of the first heat dissipation hole, the convection hole and the second heat dissipation hole are all multiple, and the multiple convection holes are evenly distributed on both sides of the device housing.

[0009] With the above technical solution, when the cooling fan is started, the convection holes on both sides of the equipment can promote the flow of air inside. Then the cooling fan can actively expel the heat inside the device from the first heat dissipation hole, thereby reducing the temperature inside the device. In addition, multiple second heat dissipation holes can also effectively dissipate the heat generated by the radiator, improving the overall heat dissipation efficiency.

[0010] Preferably, there are multiple thermal conductive bases, and the front sides of each of the multiple thermal conductive bases are connected to the chip.

[0011] The above technical solution can be used to increase the conductivity between the thermal pad and the chip by using materials such as silicone grease. Then, multiple thermal pads can effectively conduct away the heat generated by the chip, reduce chip failures caused by overheating, and thus improve the stability and reliability of the entire system.

[0012] Preferably, there are multiple sealing joints and multiple first cooling pipes, and one of the first cooling pipes is connected to the right side of the water pump at the end away from the sealing joint, and the third cooling pipe is connected to the outer side of one of the sealing joints at the end away from the radiator.

[0013] With the above technical solution, when the water pump is started, the water pump can deliver the coolant in the second cooling pipe to the inside of the sealed joint through the first cooling pipe. After the coolant comes into contact with the heat-conducting base and other parts, it can effectively remove the heat inside them. Then, after passing through multiple first cooling pipes and the inside of the sealed joint, the coolant can flow into the inside of the radiator. The coolant can then dissipate heat and cool down inside the radiator. After cooling down, the coolant can flow back to the water pump, thus completing the cycle. Therefore, it can effectively dissipate heat from components such as chips and improve the energy utilization rate of the equipment. The radiator and other parts are all existing technologies, so their working principles will not be described in detail.

[0014] Preferably, the rear sides of the plurality of heat-conducting bases are provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fin arrays are distributed inside the sealed joint.

[0015] Through the above technical solution, when the coolant flows into the interior of the sealed joint, the multiple heat dissipation fins can greatly increase the surface area of ​​the heat-conducting base for heat dissipation, thereby effectively improving the overall heat dissipation efficiency of the device, thus improving the stability of the system and extending the equipment life.

[0016] Compared with the prior art, the present invention provides a power acquisition device, which has the following beneficial effects: 1. This utility model promotes the airflow inside the device by starting the cooling fan and using the convection holes on both sides of the device. Then, the cooling fan can actively expel the heat inside the device from the first heat dissipation hole, thereby reducing the temperature inside the device. In addition, multiple second heat dissipation holes can also effectively dissipate the heat generated by the radiator, improving the overall heat dissipation efficiency.

[0017] 2. This invention increases the conductivity between the heat-conducting base and the chip by using materials such as silicone grease. Then, a water pump is activated, delivering coolant from the second cooling pipe through the first cooling pipe to the inside of the sealed joint. After contacting the heat-conducting base, heat dissipation fins, and other components, the coolant effectively removes internal heat. Passing through multiple first cooling pipes and the sealed joint, the coolant flows into the heat sink, where it cools down. The cooled coolant then flows back to the water pump, completing the cycle. This effectively dissipates heat from components such as the chip. The multiple heat dissipation fins significantly increase the surface area of ​​the heat-conducting base, thereby improving the overall heat dissipation efficiency of the device, enhancing system stability, and extending equipment lifespan. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model; Figure 2This is a right-side cross-sectional view of the structural equipment housing and other parts of this utility model; Figure 3 This is a three-dimensional cross-sectional view of the structural baffle and other parts of this utility model; Figure 4 This is a three-dimensional cross-sectional schematic diagram of the structural sealing joint and other parts of this utility model.

[0019] The components include: 1. Equipment housing; 2. Control panel; 3. Indicator light; 4. Interface; 5. Fixing plate; 6. First heat dissipation hole; 7. Convection hole; 8. Second heat dissipation hole; 9. Cooling fan; 10. Baffle; 11. Water pump; 12. Thermal conductive base; 13. Sealing joint; 14. First cooling pipe; 15. Second cooling pipe; 16. Radiator; 17. Third cooling pipe; 18. Mounting hole; 19. Heat dissipation fins. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 A power acquisition device includes a housing 1. The front side of the housing 1 is provided with a control panel 2, an indicator light 3, an interface 4, and a fixing plate 5. The top surface of the housing 1 is provided with a first heat dissipation hole 6. The outer side of the housing 1 is provided with a convection hole 7. The rear side of the housing 1 is provided with a second heat dissipation hole 8. The housing 1 is internally fixedly installed with a cooling fan 9, a baffle 10, and a water pump 11. The baffle 10 is internally fixedly installed with a heat-conducting base 12. The rear side of the heat-conducting base 12 is fixedly installed with a sealing joint 13. The outer side of the sealing joint 13 is fixedly connected with a first cooling pipe 14. The left side of the water pump 11 is fixedly installed with a second cooling pipe 15. The left end of the second cooling pipe 15 is fixedly connected with a radiator 16. The left side of the radiator 16 is fixedly installed with a third cooling pipe 17.

[0022] Specifically, there are two fixing plates 5, and each fixing plate 5 has a mounting hole 18 on its front side. The advantage is that the fixing plates 5 and the mounting holes 18 can firmly fix the equipment in the predetermined position, preventing it from shaking or shifting during operation. Furthermore, the use of bolts, nuts, and other connecting parts makes the installation process more convenient and reduces maintenance costs.

[0023] Specifically, multiple first heat dissipation holes 6, convection holes 7, and second heat dissipation holes 8 are provided, with the multiple convection holes 7 evenly distributed on both sides of the equipment housing 1. The advantage is that when the cooling fan 9 is started, the convection holes 7 on both sides of the equipment promote airflow inside, allowing the cooling fan 9 to actively expel heat from the device through the first heat dissipation holes 6, thereby reducing the internal temperature of the device. Additionally, the multiple second heat dissipation holes 8 effectively dissipate the heat generated by the radiator 16, improving the overall heat dissipation efficiency.

[0024] Specifically, multiple thermal pads 12 are provided, and the front sides of each thermal pad 12 are connected to the chip. The advantage is that this structure allows the use of materials such as silicone grease to increase the conductivity between the thermal pads 12 and the chip. Subsequently, the multiple thermal pads 12 can effectively conduct the heat generated by the chip away, reducing chip failures due to overheating and thus improving the stability and reliability of the entire system.

[0025] Specifically, multiple sealing joints 13 and first cooling pipes 14 are provided, with one end of the first cooling pipe 14 away from the sealing joint 13 connected to the right side of the water pump 11, and the end of the third cooling pipe 17 away from the radiator 16 connected to the outer side of one of the sealing joints 13. The advantage is that, with this structure, when the water pump 11 is started, it can transport the coolant in the second cooling pipe 15 through the first cooling pipe 14 to the inside of the sealing joint 13. After the coolant comes into contact with components such as the heat-conducting base 12, it can effectively remove the heat from their interior. Then, after passing through multiple first cooling pipes 14 and the inside of the sealing joint 13, the coolant can flow into the inside of the radiator 16, where it can further dissipate heat and cool down. After cooling, the coolant can flow back to the water pump 11, thus completing the cycle. Therefore, it can effectively dissipate heat from components such as chips and improve the energy utilization rate of the equipment. The radiator 16 and other components are existing technologies, so their working principles will not be elaborated upon.

[0026] Specifically, multiple heat dissipation fins 19 are provided on the rear side of each of the multiple heat-conducting bases 12, and the multiple heat dissipation fins 19 are arrayed inside the sealing joint 13. The advantage is that, through this structure, when the coolant flows into the interior of the sealing joint 13, the multiple heat dissipation fins 19 can greatly increase the surface area for heat dissipation of the heat-conducting base 12, thereby effectively improving the overall heat dissipation efficiency of the device, thus improving the stability of the system and extending the equipment life.

[0027] During use, by activating the cooling fan 9, the airflow inside the device is promoted through the convection holes 7 on both sides. The cooling fan 9 then actively dissipates heat from the device through the first heat dissipation hole 6, thereby reducing the internal temperature. Additionally, multiple second heat dissipation holes 8 effectively dissipate heat generated by the heat sink 16, improving overall heat dissipation efficiency. Using materials such as silicone grease increases the conductivity between the thermal base 12 and the chip. Then, activating the water pump 11 delivers coolant from the second cooling pipe 15 through the first cooling pipe 14 to the inside of the sealing joint 13. The coolant then interacts with the thermal base 12. 2. After the heat dissipation fins 19 and other components come into contact, the heat inside them can be effectively carried away. Then, after passing through the interiors of multiple first cooling pipes 14 and sealing joints 13, the coolant can flow into the interior of the radiator 16. The coolant can then be cooled down inside the radiator 16. After cooling down, the coolant can flow back to the water pump 11 to complete the circulation. Therefore, it can effectively dissipate heat from components such as chips. The multiple heat dissipation fins 19 can greatly increase the surface area of ​​the heat conduction base 12, thereby effectively improving the overall heat dissipation efficiency of the device, thus improving the stability of the system and extending the life of the equipment.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electricity harvesting device comprising a device housing (1), characterized in that: The front side of the equipment housing (1) is provided with a control panel (2), indicator lights (3), interface (4) and fixing plate (5). The top surface of the equipment housing (1) is provided with a first heat dissipation hole (6). The outer side of the equipment housing (1) is provided with a convection hole (7). The rear side of the equipment housing (1) is provided with a second heat dissipation hole (8). The inside of the equipment housing (1) is fixedly installed with a cooling fan (9), a baffle (10) and a water pump (11). The inside of the baffle (10) is fixedly installed with a heat-conducting base (12). The rear side of the heat-conducting base (12) is fixedly installed with a sealing joint (13). The outer side of the sealing joint (13) is fixedly connected with a first cooling pipe (14). The left side of the water pump (11) is fixedly installed with a second cooling pipe (15). (15) is fixedly connected to a heat sink (16) at its left end. A third cooling pipe (17) is fixedly installed on the left side of the heat sink (16). There are multiple heat-conducting bases (12), and the front sides of the multiple heat-conducting bases (12) are connected to the chip. Multiple heat dissipation fins (19) are provided on the rear sides of the multiple heat-conducting bases (12), and the multiple heat dissipation fins (19) are arrayed inside the sealing joint (13). There are multiple sealing joints (13) and multiple first cooling pipes (14), and one end of the first cooling pipe (14) away from the sealing joint (13) is connected to the right side of the water pump (11). The end of the third cooling pipe (17) away from the heat sink (16) is connected to the outer side of one of the sealing joints (13).

2. The electric power harvesting device of claim 1, wherein: There are two fixing plates (5), and each fixing plate (5) has a mounting hole (18) on its front side.

3. The electric power harvesting device of claim 1, wherein: The first heat dissipation hole (6), the convection hole (7) and the second heat dissipation hole (8) are all provided in multiple quantities, and the multiple convection holes (7) are evenly distributed on both sides of the equipment housing (1).

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