A chip support structure for chip experiments

Abstract

The utility model discloses a chip support structure for chip test belongs to chip test device technical field, include: bearing station is used to bear to test chip, base the top of base is with the bottom of bearing station is connected, heat dissipation subassembly is with the bottom of base is connected, through the first heat dissipation mechanism of setting can produce the heat of chip test process in time conduction to the air, and the second heat dissipation mechanism of setting can cool down to first heat dissipation mechanism to form the cooling effect of high efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip testing equipment technology, specifically a chip support structure for chip testing. Background Technology

[0002] During chip research and development and manufacturing, various electrical performance tests and environmental reliability tests are required. The chip test support structure, as a key component of the testing system, directly affects the testing accuracy and efficiency.

[0003] High-power chip testing generates a lot of heat. Existing flip-type test sockets, due to their enclosed space design, have narrow heat dissipation channels and low heat convection efficiency, making them prone to heat accumulation. Excessive temperature can cause the properties of semiconductor materials inside the chip to drift, seriously affecting the reliability of test results. Utility Model Content

[0004] To address the problems of existing technologies, this utility model provides a chip support structure for chip testing, comprising: A support platform is used to support the test chip; The base, the top of which is connected to the bottom of the support platform. A heat dissipation component is connected to the bottom of the base; The heat dissipation assembly includes: a first heat dissipation mechanism and a second heat dissipation mechanism; The first heat dissipation mechanism is connected to the base, and its upper end is in contact with the bottom of the support platform; The second heat dissipation mechanism is connected to the base and is located below the first heat dissipation mechanism; The first heat dissipation mechanism is used to conduct heat generated by the test chip into the air, and the second heat dissipation mechanism is used to cool down the first heat dissipation mechanism.

[0005] Furthermore, the support platform is made of a copper and ceramic composite substrate with multiple through holes on its surface; An adsorption component is provided on one side of the support platform, and the output end of the adsorption component is connected to the through hole through a pipe.

[0006] Furthermore, the bottom of the support platform has an arc-shaped structure, and a thermally conductive silicone pad is provided on the bottom surface of the support platform; the upper end of the first heat dissipation mechanism is in contact with the thermally conductive silicone pad.

[0007] Furthermore, the base is a hollow, open cavity, and the top profile of the base is adapted to the bottom profile of the support platform; The upper end of the first heat dissipation mechanism passes through the bottom of the base, and the lower end of the first heat dissipation mechanism is located outside the base; The base has heat dissipation holes on its side.

[0008] Furthermore, the first heat dissipation mechanism includes: a heat pipe and a graphene coating; The heat pipe array is configured; The upper end of the heat pipe passes through the base and contacts the thermally conductive silicone pad, while the lower end of the heat pipe is located outside the base and is connected to the second heat dissipation mechanism. The base is provided with an installation plate, and the heat pipe passes through the installation plate. The graphene coating is applied to the surface of the heat pipe, and each heat pipe has multiple through holes.

[0009] Furthermore, the heat pipe is made of aluminum-magnesium alloy.

[0010] Furthermore, the second heat dissipation mechanism includes: a housing, an axial fan, a concentrator shroud, and a guide tube; The shell has an open, hollow internal structure; The top of the housing is connected to the bottom of the base; The outer side of the wind-gathering shroud is sealed to the inner wall of the housing, and a gap is left between it and the bottom of the housing; The guide tube array is inserted into the wind-gathering shroud and its position is adapted to the heat-conducting tube; Multiple axial fans are provided, and all of them are connected to the bottom of the housing to introduce outside air into the housing. The lower end of the heat pipe is inserted into the guide tube.

[0011] The beneficial effects of this utility model are: The first heat dissipation mechanism uses a combination of heat pipe array and graphene coating. Its upper end is in close contact with the thermally conductive silicone pad at the bottom of the support platform, which can quickly conduct the heat transferred from the test chip through the support platform to the heat pipe. The graphene coating is in direct contact with the air and has ultra-high thermal conductivity, thus quickly transferring the heat to the air. At the same time, the through holes on the heat pipe increase the contact area with the air, further improving the heat dissipation effect.

[0012] The second heat dissipation mechanism consists of an axial fan, a concentrator, and guide tubes, forming an active air cooling system. The axial fan actively introduces cold air from the outside, and the concentrator directs the airflow into the guide tubes that correspond one-to-one with the heat pipes. The cold air acts directly on the lower end of the heat pipes inserted into the guide tubes, actively cooling the first heat dissipation mechanism. This forms a dual heat dissipation system of heat conduction and active air cooling, effectively reducing the high temperature problem during chip testing. Attached Figure Description

[0013] Figure 1This is a schematic diagram of the internal exploded structure of the support structure provided by this utility model; Figure 2 A schematic diagram of the side structure of the support mechanism provided by this utility model; Figure 3 A schematic diagram of the support mechanism provided by this utility model from a bottom-view perspective; Figure 4 A top-view structural diagram of the support mechanism provided by this utility model.

[0014] Figure label: In the diagram: 1 is the support platform, 2 is the base, 3 is the adsorption component, 4 is the thermally conductive silicone pad, 5 is the heat-conducting pipe, 6 is the mounting plate, 7 is the small hole, 8 is the shell, 9 is the axial fan, 10 is the air shroud, and 11 is the guide tube. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figure 1-4 This utility model provides a chip support structure for chip testing, comprising: Platform 1 is used to support the test chip; Base 2, the top of which is connected to the bottom of the support platform 1. A heat dissipation component is connected to the bottom of the base 2; The heat dissipation assembly includes: a first heat dissipation mechanism and a second heat dissipation mechanism; The first heat dissipation mechanism is connected to the base 2, and its upper end is in contact with the bottom of the support platform 1; The second heat dissipation mechanism is connected to the base 2 and is located below the first heat dissipation mechanism; The first heat dissipation mechanism is used to conduct heat generated by the test chip into the air, and the second heat dissipation mechanism is used to cool down the first heat dissipation mechanism.

[0017] The top of the support platform is used to place the chip, and the bottom is detachably connected to the top of the base by bolts, which facilitates subsequent maintenance and replacement.

[0018] The base is a rigid support structure. Its top is connected to the bottom of the support platform by bolts, and its bottom is fixed to the heat dissipation components by welding or bolts.

[0019] The heat dissipation components form a two-level heat dissipation system with upper-level conduction and lower-level cooling. The first heat dissipation mechanism is responsible for heat absorption and conduction, while the second heat dissipation mechanism is responsible for active cooling. The two work together to solve the heat dissipation problem of high-power chips.

[0020] The upper end of the first heat dissipation mechanism is in close contact with the bottom of the support platform, and the lower end is connected through the bottom of the base. It transfers the heat from the chip received by the support platform to the air through heat conduction, thus achieving preliminary passive heat dissipation. The second heat dissipation mechanism is located entirely outside the base and is directly connected to the lower end of the first heat dissipation mechanism. It cools the first heat dissipation mechanism through active air cooling, accelerates heat dissipation, and prevents the first heat dissipation mechanism from reducing its thermal conductivity due to saturation.

[0021] In some embodiments, the support platform 1 is a substrate formed of copper and ceramic composite, and the surface is provided with a plurality of through holes; An adsorption component 3 is fixedly installed on one side of the support platform 1, and the output end of the adsorption component 3 is connected to the through hole through a pipe.

[0022] The support platform provides a negative pressure channel for the adsorption components and also assists in heat dissipation. It is made of an alloy of copper and ceramic, which has high thermal conductivity, thus preventing heat from accumulating on the support platform.

[0023] The adsorption components include a miniature vacuum pump, an electromagnetic control valve, and a silicone nozzle (connected to the end of the pipe to avoid scratching the chip surface). The negative pressure output end of the adsorption component is connected to the through hole of the support platform through a polytetrafluoroethylene pipe. The pipe and the through hole are sealed to ensure that there is no leakage of negative pressure. During testing, the vacuum pump is activated to generate negative pressure, which adsorbs and fixes the chip onto the surface of the support platform through the through-hole; after the test, the solenoid valve releases the pressure, and the chip can be easily removed.

[0024] In some embodiments, the bottom of the support platform 1 has an arc-shaped structure, and a thermally conductive silicone pad 4 is provided on the bottom surface of the support platform 1; the upper end of the first heat dissipation mechanism is in contact with the thermally conductive silicone pad 4.

[0025] The bottom of the support platform is convex arc-shaped, which increases the contact area with the first heat dissipation mechanism, reduces thermal resistance, and improves heat transfer efficiency.

[0026] The thermally conductive silicone pad is fixed to the bottom arc-shaped surface of the support platform with adhesive backing, and is completely attached to the upper end of the first heat dissipation mechanism, further reducing the contact thermal resistance.

[0027] The upper surface of the first heat dissipation mechanism is machined into an arc surface that matches the arc shape of the bottom of the support platform to ensure contact with the thermally conductive silicone pad surface.

[0028] In some embodiments, the base 2 is a hollow, open cavity, and the top profile of the base 2 is adapted to the bottom profile of the support platform 1; The upper end of the first heat dissipation mechanism passes through the bottom of the base 2, and the lower end of the first heat dissipation mechanism is located outside the base 2; The base 2 has heat dissipation holes on its side.

[0029] The base is made of aluminum alloy and has a rectangular or cylindrical open structure. The shape and size of the opening at the top of the base are completely consistent with the bottom of the support platform. A silicone sealing ring is installed on the connection surface between the top of the base and the bottom of the support platform to prevent dust and moisture from entering the base and affecting the performance of the heat dissipation components.

[0030] An array of mounting holes is provided at the bottom of the base. The diameter of the mounting holes is larger than the outer diameter of the heat pipe of the first heat dissipation mechanism. The upper end of the heat pipe enters the interior of the base through the mounting hole, and the lower end extends to the outside of the base.

[0031] In some embodiments, the first heat dissipation mechanism includes: a heat pipe 5 and a graphene coating; The heat pipes 5 are arranged in an array and have a hollow structure; the heat pipes 5 are made of aluminum-magnesium alloy. The upper end of the heat pipe 5 passes through the base 2 and contacts the thermally conductive silicone pad 4, and the lower end of the heat pipe 5 is located outside the base 2 and is connected to the second heat dissipation mechanism. The base 2 is provided with an installation plate 6, and the heat pipe 5 passes through the installation plate 6. The graphene coating is applied to the surface of the heat pipe 5, and each heat pipe 5 has multiple through holes 7.

[0032] The heat pipe is designed according to the size of the support platform. Its upper end passes through the mounting hole at the bottom of the base and makes close contact with the thermally conductive silicone pad. Its lower end extends to the outside of the base and is inserted into the guide tube of the second heat dissipation mechanism.

[0033] The graphene coating thickness is 5μm-10μm.

[0034] The small holes are mainly used to increase the contact area between the heat pipe and the air, accelerate the dissipation of heat from the pipe into the air, and assist in passive heat dissipation.

[0035] The mounting plate is fixed to the lower middle part of the base with bolts, and has positioning holes adapted to the heat pipe (the hole diameter is larger than the outer diameter of the heat pipe). It is mainly used to limit and fix the heat pipe to prevent it from shifting due to vibration during the test and to ensure that it is aligned with the position of the thermal silicone pad and guide tube.

[0036] In some embodiments, the second heat dissipation mechanism includes: a housing 8, an axial fan 9, a concentrator shroud 10, and a guide tube 11; The housing 8 has an open, hollow internal structure; The top of the housing 8 is connected to the bottom of the base 2; The outer side of the wind-gathering cover 10 is sealed to the inner wall of the housing 8, and a gap is left between it and the bottom of the housing 8. The array of guide tubes 11 is inserted through the wind-gathering shroud 10 and its position is adapted to the heat-conducting tube 5; Multiple axial fans 9 are provided, and all of them are connected to the bottom of the housing 8 to introduce outside air into the housing 8; The lower end of the heat pipe 5 is inserted into the guide pipe 11.

[0037] The top of the housing is detachably connected to the bottom of the base by bolts, and a silicone sealing ring is provided on the connection surface to ensure a seal between the housing and the base and prevent air leakage.

[0038] The air shroud has an inverted conical hollow structure. Its outer surface is tightly fitted to the inner wall of the housing through a silicone sealing ring, and then fixed from the outside of the housing with bolts. It is used to concentrate and guide the cold air introduced by the axial fan into the guide tube, avoid airflow dispersion, and improve air cooling efficiency.

[0039] The guide tube and the air-concentrating cover are integrally formed, arranged in an array and positioned perfectly aligned with the heat pipe. This guides cold air to flow precisely to the lower end of the heat pipe, ensuring full contact between the cold air and the heat pipe and accelerating its cooling process.

[0040] The axial fan is equipped with 3 to 5 heat pipes, which are fixed to the bottom of the housing by screws through the bracket. After the fan is started, it draws in cold air from the outside from the bottom of the housing. The cold air is concentrated by the air shroud and blown to the lower end of the heat pipes through the guide tube. After entering the heat pipes, it absorbs heat and is then discharged from the heat dissipation holes, forming an air-cooled cycle.

[0041] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip support structure for chip testing, characterized in that, include: A support platform is used to support the test chip; The base, the top of which is connected to the bottom of the support platform. A heat dissipation component is connected to the bottom of the base; The heat dissipation assembly includes: a first heat dissipation mechanism and a second heat dissipation mechanism; The first heat dissipation mechanism is connected to the base, and its upper end is in contact with the bottom of the support platform; The second heat dissipation mechanism is connected to the base and is located below the first heat dissipation mechanism; The first heat dissipation mechanism is used to conduct heat generated by the test chip into the air, and the second heat dissipation mechanism is used to cool down the first heat dissipation mechanism.

2. The chip support structure for chip testing according to claim 1, characterized in that, The support platform is made of a substrate formed by copper and ceramic composite, and the surface is provided with multiple through holes; An adsorption component is provided on one side of the support platform, and the output end of the adsorption component is connected to the through hole through a pipe.

3. The chip support structure for chip testing according to claim 1, characterized in that, The bottom of the support platform has an arc-shaped structure, and a thermally conductive silicone pad is provided on the bottom surface of the support platform; the upper end of the first heat dissipation mechanism is in contact with the thermally conductive silicone pad.

4. The chip support structure for chip testing according to claim 1, characterized in that, The base is a hollow, open cavity, and the top contour of the base is adapted to the bottom contour of the support platform; The upper end of the first heat dissipation mechanism passes through the bottom of the base, and the lower end of the first heat dissipation mechanism is located outside the base; The base has heat dissipation holes on its side.

5. The chip support structure for chip testing according to claim 3, characterized in that, The first heat dissipation mechanism includes: a heat pipe and a graphene coating; The heat pipe array is configured; The upper end of the heat pipe passes through the base and contacts the thermally conductive silicone pad, while the lower end of the heat pipe is located outside the base and is connected to the second heat dissipation mechanism. The base is provided with an installation plate, and the heat pipe passes through the installation plate. The graphene coating is applied to the surface of the heat pipe, and each heat pipe has multiple through holes.

6. The chip support structure for chip testing according to claim 5, characterized in that, The heat pipe is made of aluminum-magnesium alloy.

7. The chip support structure for chip testing according to claim 5, characterized in that, The second heat dissipation mechanism includes: a housing, an axial fan, a concentrator shroud, and a guide tube; The shell has an open, hollow internal structure; The top of the housing is connected to the bottom of the base; The outer side of the wind-gathering shroud is sealed to the inner wall of the housing, and a gap is left between it and the bottom of the housing; The guide tube array is inserted into the wind-gathering shroud and its position is adapted to the heat-conducting tube; Multiple axial fans are provided, and all of them are connected to the bottom of the housing to introduce outside air into the housing. The lower end of the heat pipe is inserted into the guide tube.

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