ATE three-temperature test socket

Abstract

The utility model provides a kind of ATE three temperature test seat, including test seat main body, chip limiting guide frame, temperature control piece and test seat bottom plate, the center of test seat main body is provided with needle plate, probe is inserted in needle plate, the top surface of needle plate is formed with installation groove around, chip limiting guide frame is set in installation groove, and the chip to be tested is installed in needle plate top by chip limiting guide frame and keeps good contact with probe;The bottom surface of needle plate is formed with containing groove around, temperature control piece is annular, temperature control piece is set in containing groove, test seat bottom plate is set in the bottom of test seat main body and prevents temperature control piece from separating containing groove, temperature control piece uses semiconductor material, the top surface of temperature control piece is cold end or hot end by adjusting the voltage polarity of control line into temperature control piece, realize the refrigeration or heating of chip test seat main body and chip.The utility model is set in test seat by temperature control piece, realizes the accurate and fast adjustment of chip temperature.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to an ATE three-temperature test socket. Background Technology

[0002] ATE (Automatic Test Equipment) three-temperature testing refers to an integrated testing technology that uses automated test equipment to perform functional verification, parameter measurement, and reliability assessment of chips under high temperature, room temperature, and low temperature conditions. This technology is used throughout the chip mass production testing phase and is an important component of wafer testing (CP) and final product testing (FT).

[0003] Existing three-temperature testing equipment typically uses a built-in or external airflow-type temperature compensation system, i.e., an airflow nozzle. Airflow is directed through pre-drilled holes around the test mount to heat or cool the chip, according to testing requirements. However, due to the thickness of the test mount, the airflow nozzle holes are very small, making it difficult to control the chip's required temperature in a timely manner. Furthermore, the time required for airflow heating and cooling is longer, leading to a decrease in chip testing efficiency. Additionally, because the airflow channel size is small, the airflow is limited to a single hole only a few millimeters in size, and the airflow intensity is weak, restricting the size and power consumption of the chip being tested.

[0004] Therefore, there is a need to provide an ATE three-temperature test socket to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide an ATE three-temperature test socket, which enables accurate and rapid adjustment of chip temperature by setting a temperature control chip in the test socket.

[0006] This utility model provides an ATE three-temperature test socket, including a test socket body, a chip limiting guide frame, a temperature control plate, and a test socket base plate. A needle plate is disposed at the center of the test socket body, and a probe is inserted into the needle plate. Mounting grooves are formed around the top surface of the needle plate, and the chip limiting guide frame is disposed in the mounting grooves. The chip to be tested is mounted on the top of the needle plate via the chip limiting guide frame and maintains good contact with the probe. A receiving groove is formed around the bottom surface of the needle plate. The temperature control plate is annular and disposed in the receiving groove. The test socket base plate is disposed at the bottom of the test socket body to prevent the temperature control plate from detaching from the receiving groove. The temperature control plate is made of semiconductor material. By adjusting the polarity of the voltage on the control line supplied to the temperature control plate, the top surface of the temperature control plate can be adjusted to be either a cold end or a hot end, thereby achieving cooling or heating of the chip test socket body and the chip.

[0007] Preferably, the control lines of the temperature control plate include a first control line and a second control line. When the first control line and the second control line are respectively connected to the positive and negative electrodes, the top surface of the temperature control plate is the cold end and the bottom surface is the hot end. When the first control line and the second control line are switched to be connected to the negative and positive electrodes respectively, the top surface of the temperature control plate is the hot end and the bottom surface is the cold end.

[0008] Preferably, the temperature control chip adjusts the temperature difference between its cold and hot ends by adjusting the applied voltage.

[0009] Preferably, the top surface of the temperature control plate is provided with a high thermal conductivity medium layer.

[0010] Preferably, the bottom surface of the temperature control plate is provided with a low thermal conductivity medium layer.

[0011] Preferably, the test base plate is rectangular in shape, and its size is slightly larger than the outer contour of the temperature control plate. The four corners of the test base plate extend outward to form fixing ears. The bottom of the test base body is provided with a mounting boss that matches the test base plate, and the mounting boss is provided with a cable outlet groove that allows the control line to pass through.

[0012] Preferably, the test base plate has a pinhole group at its center, and the pinholes of the pinhole group are arranged one-to-one with the probes in the needle plate, allowing the probes to extend out of the pinholes.

[0013] Preferably, the test base plate and the test base body are positioned by a first pin and fixedly connected by a first screw.

[0014] Preferably, the chip limiting guide frame is positioned to the test base body by a second pin and fixedly connected by a second screw.

[0015] Compared with the prior art, the technical solution of this utility model embodiment has at least the following beneficial effects:

[0016] The ATE three-temperature test socket provided by this utility model includes a test socket body, a chip limiting guide frame, a temperature control plate, and a test socket base plate. A needle plate is located at the center of the test socket body, and a probe is inserted into the needle plate. Mounting grooves are formed around the top surface of the needle plate, and the chip limiting guide frame is placed in the mounting grooves. The chip to be tested is mounted on the top of the needle plate via the chip limiting guide frame and maintains good contact with the probe. A receiving groove is formed around the bottom surface of the needle plate, and the temperature control plate is annular and placed in the receiving groove. The test socket base plate is located at the bottom of the test socket body to prevent the temperature control plate from detaching from the receiving groove. The temperature control plate is made of semiconductor material. By adjusting the polarity of the voltage on the control line supplied to the temperature control plate, the top surface of the temperature control plate can be adjusted to be either the cold end or the hot end, thereby achieving cooling or heating of the chip test socket body and the chip. By adjusting the magnitude of the voltage supplied to the temperature control plate, the temperature difference between the cold and hot ends of the temperature control plate can be adjusted, thus accurately and quickly controlling the temperature of the temperature control plate and the chip. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the ATE three-temperature test socket in an embodiment of this utility model;

[0018] Figure 2 This is a schematic diagram of the ATE three-temperature test socket from another angle in an embodiment of this utility model;

[0019] Figure 3 This is a cross-sectional view of the ATE three-temperature test stand in an embodiment of this utility model;

[0020] Figure 4 This is an exploded view of the ATE three-temperature test socket in an embodiment of this utility model;

[0021] Figure 5 This is an exploded view of the ATE three-temperature test socket from another angle in an embodiment of this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Test socket body; 11. Needle plate; 12. Mounting slot; 13. Receiving slot; 14. Mounting boss; 15. Cable outlet slot;

[0024] 2. Chip limiting guide frame;

[0025] 3. Temperature control plate; 31. Control line;

[0026] 4. Test base plate; 41. Fixing lug; 42. Pinhole assembly;

[0027] 5. Probe;

[0028] 6. Chips;

[0029] 7. First pin; 8. First screw; 9. Second pin; 10. Second screw. Detailed Implementation

[0030] To make the objectives, features, and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining this utility model and are not intended to limit it. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0031] The purpose of this invention is to provide an ATE three-temperature test socket, which enables accurate and rapid adjustment of chip temperature by setting a temperature control chip in the test socket.

[0032] Figure 1 This is a schematic diagram of the structure of the ATE three-temperature test socket in an embodiment of this utility model; Figure 2 This is a schematic diagram of the ATE three-temperature test socket from another angle in an embodiment of this utility model; Figure 3 This is a cross-sectional view of the ATE three-temperature test stand in an embodiment of this utility model; Figure 4 This is an exploded view of the ATE three-temperature test socket in an embodiment of this utility model; Figure 5 This is an exploded view of the ATE three-temperature test socket from another angle in an embodiment of this utility model.

[0033] Now see Figures 1 to 5 This utility model provides an ATE three-temperature test socket, including a test socket body 1, a chip limiting guide frame 2, a temperature control plate 3, and a test socket base plate 4. A needle plate 11 is provided at the center of the test socket body 1, and a probe 5 is inserted into the needle plate 11. A mounting groove 12 is formed around the top surface of the needle plate 11. The chip limiting guide frame 2 is disposed in the mounting groove 12. The chip to be tested 6 is mounted on the top of the needle plate 11 via the chip limiting guide frame 2 and maintains good contact with the probe 5. A receiving groove 13 is formed around the bottom surface of the needle plate 11. The temperature control plate 3 is annular and is disposed in the receiving groove 13. The test socket base plate 4 is disposed at the bottom of the test socket body 1 to prevent the temperature control plate 3 from detaching from the receiving groove 13. The temperature control plate 3 is made of semiconductor material. By adjusting the polarity of the voltage of the control line 31 supplied to the temperature control plate 3, the top surface of the temperature control plate 3 can be adjusted to be either a cold end or a hot end, thereby achieving cooling or heating of the chip test socket body 1 and the chip 6.

[0034] In some embodiments, the control line 31 of the temperature control plate 3 includes a first control line and a second control line. When the first control line and the second control line are respectively connected to the positive and negative electrodes, the top surface of the temperature control plate 3 is the cold end and the bottom surface is the hot end. When the first control line and the second control line are switched to be connected to the negative and positive electrodes respectively, the top surface of the temperature control plate 3 is the hot end and the bottom surface is the cold end.

[0035] In some embodiments, the temperature control chip 3 adjusts the temperature difference between its cold and hot ends by adjusting the magnitude of the applied voltage.

[0036] Specifically, with the bottom surface temperature remaining stable, the temperature of the top surface can be accurately adjusted by controlling the voltage polarity and magnitude of the control line 31 connected to the temperature control chip 3, thereby controlling the temperature of the chip 6 at the set test temperature.

[0037] Specifically, the temperature control chip 3 utilizes the Peltier effect. Through paired P and N-type semiconductor units in the circuit, when energized, electron-hole pairs are generated at one end, resulting in a decrease in internal energy and a drop in temperature, forming a cold junction for cooling. At the other end, electron-hole recombination increases internal energy and raises temperature, forming a hot junction. A single PN semiconductor unit constitutes one chip, and multiple units together form a semiconductor temperature control chip, the shape of which can be customized. It operates without mechanical movement, has a long lifespan, high reliability, stable temperature control, and a fast response speed.

[0038] In some embodiments, a high thermal conductivity medium layer is provided on the top surface of the temperature control chip 3 to accelerate heat transfer and make the temperature of the top surface of the temperature control chip 3 keep consistent with the temperature of the chip 6 as soon as possible.

[0039] In some embodiments, a low thermal conductivity medium layer is provided on the bottom surface of the temperature control plate 3 to isolate heat transfer and keep the temperature of the bottom surface of the temperature control plate 3 stable.

[0040] In some embodiments, the test base plate 4 is rectangular in shape, and the size of the test base plate 4 is slightly larger than the outer contour of the temperature control plate 3. The four corners of the test base plate 4 extend outward to form fixing ears 41. The bottom of the test base body 1 is provided with a mounting boss 14 that matches the test base plate 4. The mounting boss 14 is provided with a wire outlet groove 15 that allows the control line 31 to pass through.

[0041] In some embodiments, a pinhole group 42 is provided at the center of the test base plate 4, and the pinholes of the pinhole group 42 are arranged one-to-one with the probes 5 in the needle plate 11, allowing the probes 5 to extend out from the pinholes.

[0042] In some embodiments, the test base plate 4 and the test body 1 are positioned by the first pin 7 and fixedly connected by the first screw 8.

[0043] Specifically, both the test base plate 4 and the test base body 1 are provided with a first positioning hole that matches the first pin 7. The first pin 7 is inserted into the first positioning hole to achieve positioning.

[0044] In some embodiments, the chip limiting guide frame 2 and the test base body 1 are positioned by the second pin 9 and fixedly connected by the second screw 10.

[0045] Specifically, both the chip limiting guide frame 2 and the test base body 1 are provided with a second positioning hole that matches the second pin 9. The second pin 9 is inserted into the second positioning hole to achieve positioning.

[0046] In summary, the ATE three-temperature test socket provided by this utility model includes a test socket body 1, a chip limiting guide frame 2, a temperature control plate 3, and a test socket base plate 4. A needle plate 11 is disposed at the center of the test socket body 1, and a probe 5 is inserted into the needle plate 11. Mounting grooves 12 are formed around the top surface of the needle plate 11, and the chip limiting guide frame 2 is disposed in the mounting grooves 12. The chip to be tested 6 is mounted on the top of the needle plate 11 via the chip limiting guide frame 2 and maintains good contact with the probe 5. A receiving groove 13 is formed around the bottom surface of the needle plate 11. The temperature control plate 3 is annular and... The chip is placed in the receiving groove 13. The test base plate 4 is set at the bottom of the test base body 1 to prevent the temperature control chip 3 from detaching from the receiving groove 13. The temperature control chip 3 is made of semiconductor material. By adjusting the polarity of the voltage on the control line 31 connected to the temperature control chip 3, the top surface of the temperature control chip 3 can be adjusted to be either the cold end or the hot end, thereby achieving cooling or heating of the chip test base body 1 and the chip 6. By adjusting the magnitude of the voltage connected to the temperature control chip 3, the temperature difference between the cold end and the hot end of the temperature control chip 3 can be adjusted, thereby accurately and quickly controlling the temperature of the temperature control chip 3 and the chip 6.

[0047] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of this utility model disclosure, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this utility model disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

[0048] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An ATE three-temperature test socket, characterized in that, The device includes a test socket body, a chip positioning guide frame, a temperature control plate, and a test socket base plate. A needle plate is centrally located on the test socket body, into which a probe is inserted. Mounting grooves are formed around the top surface of the needle plate, and the chip positioning guide frame is positioned within these grooves. The chip to be tested is mounted on the top of the needle plate via the chip positioning guide frame, maintaining good contact with the probe. A receiving groove is formed around the bottom surface of the needle plate. The temperature control plate is annular and positioned within the receiving groove. The test socket base plate is located at the bottom of the test socket body to prevent the temperature control plate from detaching from the receiving groove. The temperature control plate is made of semiconductor material. By adjusting the polarity of the voltage on the control line supplied to the temperature control plate, the top surface of the temperature control plate can be adjusted to be either a cold or hot end, thereby achieving cooling or heating of the chip test socket body and the chip.

2. The ATE three-temperature test socket according to claim 1, characterized in that, The temperature control plate includes a first control line and a second control line. When the first control line and the second control line are connected to the positive and negative electrodes respectively, the top surface of the temperature control plate is the cold end and the bottom surface is the hot end. When the first control line and the second control line are switched to be connected to the negative and positive electrodes respectively, the top surface of the temperature control plate is the hot end and the bottom surface is the cold end.

3. The ATE three-temperature test socket according to claim 2, characterized in that, The temperature control chip adjusts the temperature difference between its cold and hot ends by adjusting the applied voltage.

4. The ATE three-temperature test socket according to claim 1, characterized in that, The top surface of the temperature control plate is provided with a high thermal conductivity medium layer.

5. The ATE three-temperature test socket according to claim 1, characterized in that, The bottom surface of the temperature control plate is provided with a low thermal conductivity medium layer.

6. The ATE three-temperature test socket according to claim 1, characterized in that, The test base plate is rectangular in shape, and its size is slightly larger than the outer contour of the temperature control plate. The four corners of the test base plate extend outward to form fixing ears. The bottom of the test base body is provided with a mounting boss that matches the test base plate, and the mounting boss is provided with a cable outlet groove that allows the control line to pass through.

7. The ATE three-temperature test socket according to claim 1, characterized in that, The test base plate has a pinhole group at its center. The pinholes in the pinhole group are arranged one-to-one with the probes in the needle plate, allowing the probes to extend out of the pinholes.

8. The ATE three-temperature test socket according to claim 1, characterized in that, The test base plate and the test base body are positioned by a first pin and fixedly connected by a first screw.

9. The ATE three-temperature test socket according to claim 1, characterized in that, The chip limiting guide frame is positioned to the test base body by a second pin and is fixedly connected by a second screw.

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