A semiconductor DC probe testing device with a replaceable probe cartridge

CN224732017UActive Publication Date: 2026-09-08CHENGDU INSIJIA SEMICON TECH CO LTD
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Patent Information

Application Number
CN202621200510.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2026-08-05
Publication Date
2026-09-08
Estimated Expiration
2036-08-05

AI Technical Summary

Technical Problem

这种方案虽然初始物料成本较低,但在实际应用中却暴露出一系列难以克服的根本性问题:首先,尺寸微小的探针在手工操作下极难精准地穿入预设的细小孔道,对准过程费时费力;其次,由于缺乏精密的限位结构,操作者无法精确且一致地控制每一根独立探针从夹持件中伸出的实际长度,导致接触力不均;再次,此类简易夹持件通常难以在不扰动已定位探针位置的前提下,为其提供足够可靠、防松动的机械固定;最后,也是最为关键的一点,这类方案无法在探针的尾端(即后端)与外部高精度测试设备的线缆之间,建立起一种可重复实现、长期稳定且接触电阻极低的标准化电气连接通道

Benefits of technology

(1)本实用新型的主印刷电路板与探针匣采用可拆卸紧固连接的分体式结构设计,使探针匣成为独立可更换的适配模块;当需要测试不同型号的待测器件时,仅需更换与该待测器件焊盘分布匹配的探针匣,无需更换整个主印刷电路板及与之连接的外部连接器和导电电路板走线;该设计将一次性投入的主印刷电路板与按需配置的探针匣分离,避免了传统方案中为每种待测器件单独制作整块专用测试转接板的高成本问题,显著降低了多品种器件测试的综合成本,提高了测试系统的通用性和复用率;

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Abstract

This utility model relates to the technical field of semiconductor device testing equipment, and discloses a semiconductor DC probe testing device with a replaceable probe holder, solving the problems of high cost of probe tooling changeover and difficulty in probe assembly and disassembly in existing probe fixtures. It includes a main printed circuit board and a detachably connected probe holder. The main printed circuit board has a standard external connector and a long strip-shaped contact pad group. Each pin of the connector is electrically connected to the corresponding pad through independent traces. The probe holder includes a detachably connected upper and lower housing. The lower housing has probe slots that match the pad distribution of the device under test (DUT). The probes are clamped and fixed in the probe slots, with both ends extending out of the probe holder. After the probe holder is installed, one end of the probe makes electrical contact with the long strip-shaped contact pad, and the other end makes electrical contact with the pad of the DUT. This utility model integrates the probe arrangement into the probe holder, allowing the main printed circuit board to be reused. Changeover only requires replacing the probe holder, reducing R&D testing costs and making it suitable for rapid testing of DC parameters of various integrated circuits.
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Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor device testing equipment, specifically to a semiconductor DC probe testing device with a replaceable probe cartridge. Background Technology

[0002] When performing electrical characterization and DC testing on integrated circuits, precise positioning and alignment are required to ensure that the precision probe tips form a stable and reliable physical contact and electrical connection with the selected tiny pads on the device under test. Integrated circuits of different models, packages, or at different design stages typically exhibit significant differences in the number of external pads, their absolute coordinates, precise spacing, and overall peripheral layout. Therefore, traditional probe cards and probe tip assemblies usually need to be custom-designed and optimized for the unique pad layout of a specific device.

[0003] When the pad layout of the device under test changes, even with only a minor coordinate adjustment, traditional solutions often become unsuitable. Engineers typically need to redesign and manufacture guide structures, dedicated probes, complex wiring substrates, and even replace the core components of the entire probe card to adapt to the new layout. Outsourcing this customization task to external suppliers is often lengthy and expensive, requiring multiple design reviews and communications, high-precision machining, time-consuming assembly and debugging, and a significant delivery wait time. In the early stages of integrated circuit R&D and verification, pad layouts may be frequently adjusted and modified to optimize performance and packaging. Therefore, this traditional approach, relying on external customization and with its lengthy cycles, is clearly detrimental to rapid iteration, agile verification, and rapid exploration of technical solutions in R&D projects.

[0004] In response, some simplified solutions have attempted to reduce costs, such as using simple 3D-printed clamps with closed channels to secure the probes. While this approach has lower initial material costs, it has revealed a series of fundamental problems in practical applications: First, the tiny probes are extremely difficult to insert precisely into the pre-set narrow channels manually, making the alignment process time-consuming and laborious; second, due to the lack of precise limiting structures, operators cannot accurately and consistently control the actual length of each individual probe extending from the clamp, resulting in uneven contact force; third, such simple clamps often fail to provide sufficiently reliable and secure mechanical fixation without disturbing the already positioned probes; and finally, and most importantly, this approach cannot establish a repeatable, long-term stable, and low-resistance standardized electrical connection channel between the probe's tail end (i.e., the rear end) and the cables of external high-precision testing equipment.

[0005] Another compromise is to customize a dedicated printed circuit board (PCB) for each probe layout to achieve the fan-out and switching of electrical signals. While this approach can technically achieve reliable electrical connections, it essentially deviates from the core advantage of quick changeover. This is because custom PCBs require additional design, prototyping, and soldering time, which undoubtedly weakens the significant advantages of the probe cartridge solution in terms of shortening preparation time and saving costs, thus greatly diminishing its value. Utility Model Content

[0006] To address the shortcomings of existing technologies, the purpose of this invention is to provide a semiconductor DC probe testing device with a replaceable probe cartridge that can quickly reconfigure devices with different pad layouts while retaining a reusable main printed circuit board, achieving controlled positioning and reliable fixation of probes, reusable installation of probe cartridges, and reliable electrical contact between probes and the reusable main printed circuit board.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor DC probe testing device with a replaceable probe cartridge, comprising a main printed circuit board and a probe cartridge that can be detachably and securely connected to it. The main printed circuit board is provided with an external connector and a group of elongated contact pads. The external connector has multiple pins, and the group of elongated contact pads consists of multiple mutually insulated elongated contact pads. Each pin of the external connector is electrically connected to the corresponding elongated contact pad through an independent conductive circuit board trace. The probe holder includes a detachably fastened upper housing and a lower housing. The lower housing is provided with multiple probe slots designed for the pad distribution of the device under test. Probes are clamped and fixed in the probe slots by the upper and lower housings. Both ends of the probes extend out of the probe holder. When the probe holder is detachably installed on the main printed circuit board, one end of the probe makes electrical contact with the corresponding elongated contact pad, and the other end makes electrical contact with the corresponding pad of the device under test.

[0008] The working principle of this technical solution is as follows: A universal main printed circuit board (PCB) and a replaceable probe cartridge form the core architecture, separating the electrical transmission base from the device-specific probe positioning structure. The main PCB establishes a fixed electrical channel between the external connector and the elongated contact pad assembly via conductive circuit board traces. The replaceable probe cartridge holds the probes using separate upper and lower housings, utilizing the exposed structures at both ends of the probes to build a conductive path from the device under test (DUT) pads to the elongated contact pads. The replaceable probe cartridge can be fabricated using 3D printing, allowing for customized manufacturing based on the DUT's pad layout. This ensures that after the probe slots within the cartridge fix the probes, the electrical contact array formed by the probes matches the DUT's pads, thus enabling a single main PCB to adapt to multiple DUTs with different pad layouts.

[0009] To better realize this utility model, it further includes a clamping assembly, which includes an upper rigid clamping strip and a lower elastic silicone clamping strip. The rigid clamping strip is detachably and fixedly connected to the main printed circuit board. The lower part of the elastic silicone clamping strip clamps the end of all probes that are in electrical contact with the corresponding elongated contact pads, so that the ends of all probes are in close contact with the corresponding elongated contact pads.

[0010] To better realize this utility model, the edge of the rigid clamping strip is integrally formed with several ear-shaped connecting keys, and the main printed circuit board is provided with a threaded insert that matches the position of the ear-shaped connecting keys. The threaded insert is internally threaded with a clamping screw that passes through the ear-shaped keys of the rigid clamping strip. Tightening the clamping screw can lock and fix the rigid clamping strip to the main printed circuit board, and simultaneously press down the elastic silicone clamping strip so that the elastic silicone clamping strip presses the end of each probe that contacts the long strip-shaped contact pad.

[0011] To better realize this utility model, the upper casing is further provided with a pressing protrusion corresponding to each probe groove. After the upper casing and the lower casing are fitted and locked together, the pressing protrusion presses and limits the probe in the probe groove.

[0012] To better realize this utility model, each of the probe slots is further provided with at least two spaced support positions. The support positions of the probe slots cooperate with the pressing protrusions of the upper casing to form a circumferential multi-point pressing and limiting clamping of the probe placed in the probe slot.

[0013] To better realize this utility model, the probe is further defined as a straight probe, comprising a needle rod placed in a probe slot, a needle tip extending from the probe box to make electrical contact with the pad of the device under test, and a needle tail extending from the probe box to make electrical contact with the elongated contact pad; the needle tips of all probes form an electrical contact array matching the pad of the device under test according to the arrangement of the probe slots in the probe box, and the needle tails of all probes respectively make electrical contact with their respective elongated contact pads.

[0014] To better realize this utility model, the probe slots inside the probe box are arranged at an angle, so that the tips of all probes converge towards the device under test and the tails are distributed towards the long strip-shaped contact pad group.

[0015] To better realize this utility model, the probe box is further designed as a fan-shaped structure, with the tips of all probes converging at the fan-shaped head of the probe box to form an electrical contact array that adapts to the pads of the device under test; the tails of all probes are distributed along the side of the fan shape and make electrical contact with the corresponding elongated contact pads in the elongated contact pad group located at the edge of the fan shape of the probe box.

[0016] To better realize this utility model, the main printed circuit board is further provided with a positioning and anti-foolproof structure that matches the probe box. The positioning and anti-foolproof structure limits the installation direction and position of the probe box, so as to realize the precise and detachable assembly of the probe box and the main printed circuit board.

[0017] To better realize this utility model, it further includes a needle tip positioning fixture, which includes a base plate for fixing the lower housing, a positioning reference plate vertically arranged on one side of the base plate, and one end of the probe placed in the probe slot that is in electrical contact with the corresponding pad of the device under test abuts against the positioning reference plate for calibration.

[0018] The upper casing and the lower casing are detachably connected by casing fastening screws. The casing fastening screws pass through the upper casing fastening screw holes and cooperate with the lower casing fastening screw holes, so that a single probe can be installed, removed or replaced.

[0019] The probe cartridge is detachably mounted on a reusable main printed circuit board via probe cartridge mounting screws, which pass through probe cartridge mounting screw holes and engage with probe cartridge threaded mounting points.

[0020] The reusable main printed circuit board also includes a grounding terminal and external mounting holes, and the external connector is a multi-channel connector for connecting external semiconductor testing equipment.

[0021] The upper and lower housings are made of an electrically insulating photosensitive polymer resin manufactured by additive manufacturing.

[0022] Compared with the prior art, this utility model has the following advantages and beneficial effects: (1) The main printed circuit board and the probe box of this utility model adopt a split structure design that can be detachably and fastened, making the probe box an independent and replaceable adapter module. When different models of devices under test need to be tested, only the probe box that matches the pad distribution of the device under test needs to be replaced. There is no need to replace the entire main printed circuit board and the external connectors and conductive circuit board traces connected to it. This design separates the main printed circuit board that is invested at one time from the probe box that can be configured as needed, avoiding the high cost problem of making a whole dedicated test adapter board for each device under test in the traditional solution. It significantly reduces the overall cost of testing multiple types of devices and improves the versatility and reusability of the test system. (2) The elongated contact pad group on the main printed circuit board of this utility model is composed of multiple mutually insulated elongated contact pads, which provide a large tolerance range for the contact position of the probe tail along its extension length direction; compared with traditional circular or square dot pads, the elongated contact pads allow the probe tail to maintain reliable electrical contact even with a certain positional deviation in the length direction, reducing the strict requirements on the installation position accuracy of the probe box and the manufacturing accuracy of the probe; this tolerance design effectively alleviates the impact of manufacturing tolerance accumulation and assembly deviation on the reliability of electrical contact, and improves the system's assembly fault tolerance and long-term use stability; (3) The clamping assembly of this utility model adopts a clamping structure composed of a rigid clamping strip and an elastic silicone clamping strip; the rigid clamping strip provides a stable and uniform overall downward pressure source, and the elastic silicone clamping strip deforms elastically after being pressed, transmitting the pressure elastically to one end of all probes that make electrical contact with the long strip contact pad; the elastic deformation characteristics of the elastic silicone clamping strip can adaptively compensate for the height difference of each probe end caused by manufacturing tolerance or assembly error, ensuring that each probe end forms a tight conductive contact with the corresponding long strip contact pad; this structure eliminates the problems of uneven contact force, partial probe virtual contact or overpressure damage caused by inconsistent probe height in the traditional rigid clamping scheme, and significantly improves the signal transmission quality and contact reliability of multi-channel parallel testing; (4) In this utility model, the clamping screw passes through the rigid clamping strip ear-shaped connecting key and is screwed into the threaded insert embedded in the main printed circuit board to realize the detachable mechanical locking of the clamping component and the main printed circuit board; the threaded insert is embedded in the main printed circuit board, which provides a stronger internal thread structure compared with directly tapping the thread on the PCB substrate. It can withstand the tightening torque caused by repeated disassembly and assembly without stripping and damage, and greatly extends the service life of the main printed circuit board; at the same time, by controlling the tightening torque of the clamping screw, the clamping force can be precisely adjusted and quantified. While ensuring that the ends of each probe are in close conductive contact with the long strip contact pad, it avoids overpressure that may cause probe deformation or pad damage, and realizes the controllable and adjustable clamping force, providing flexible process parameter adjustment space for different test scenarios; (5) In this utility model, the pressing protrusions on the upper box body correspond one-to-one with each probe slot. After the upper box body and the lower box body are fitted and locked together, the pressing protrusions press and limit the probes in the probe slots. This structure makes the fixation of the probes in the probe box completely achieved by the clamping structure of the upper and lower boxes themselves, without relying on external pressing force or adhesive and other auxiliary means. As an independent module, the probe box can keep the internal probes firmly fixed when not installed on the main printed circuit board, which facilitates the independent transportation, storage and pre-assembly of the probe box, reduces the operation steps and error risks of on-site assembly, and improves the efficiency of test preparation. (6) In this utility model, at least two spaced support positions in each probe slot cooperate with the pressing protrusion of the upper casing to form a circumferential multi-point pressing and limiting clamping of the probe; the multi-point support constrains all translational and rotational degrees of freedom of the probe in the cross section, avoiding possible deflection or shaking of the probe when clamped at a single point or two points collinearly, so that the probe rod is stably locked in a precise position; this structure effectively resists probe displacement caused by vibration and impact during the test, ensures the consistency and accuracy of the contact position between the probe tip and the pad of the device under test, and improves the repeatability and reliability of the test results; (7) In this utility model, the probe is composed of three sections: the probe shaft, the probe tip, and the probe tail, which realizes the separation of mechanical fixation and electrical contact functions. The probe shaft is dedicated to positioning and support and can be optimized into a high-strength and wear-resistant structure. The probe tip is dedicated to electrical contact with the pads of the device under test and can be optimized into a sharp end suitable for penetrating the oxide layer. The probe tail is dedicated to electrical contact with the elongated contact pads and can be optimized into an end face geometry suitable for planar conductive contact. Each functional section is independently optimized without restraint, so that the overall performance of the probe is optimal. At the same time, the probe tips of all probes form an electrical contact array matching the pads of the device under test according to the probe slot arrangement, while all probe tails make electrical contact with their respective corresponding elongated contact pads, realizing the precise one-to-one mapping and transfer of signals between the non-standard, high-density pad array of the device under test and the standardized, low-density elongated contact pad group of the main printed circuit board. (8) In this utility model, the probe slots inside the probe box are arranged at an angle, so that the probe tips converge towards the device under test and the probe tails are dispersed towards the long strip contact pad group. The probe box as a whole is further optimized into a fan-shaped structure, with the probe tips converging at the head of the fan and the probe tails being dispersed along the side of the fan. This angled / fan-shaped arrangement uses the angled geometry of the probes to realize the conversion mapping of the pad spacing: the dense small-pitch pads of the device under test are precisely connected through the converged array of probe tips, while the dispersed probe tails are matched one-to-one with the long strip contact pad group with a larger spacing. The fan-shaped radial structure allows the angle of each probe to transition naturally along the arc surface, avoiding cross interference between probes. The arrangement is neat and orderly, and the force is uniform. This design effectively solves the problem that high-density pad devices cannot be directly connected to standardized large-pitch contact pads, and greatly expands the range of compatible device types of the test system. (9) The positioning and error prevention structure set on the main printed circuit board in this utility model limits the unique correct installation direction and position of the probe box through asymmetrical geometric positioning features. When the probe box is installed in the correct direction, the positioning and error prevention structure matches and cooperates with the corresponding features on the probe box to guide the probe box into precise position and ensure that the probe tail and the long strip contact pad are accurately aligned and make electrical contact. When the direction or position is wrong, the interference features of the positioning and error prevention structure prevent the probe box from being inserted from a physical level, thus eliminating serious consequences such as incorrect contact between the probe and the pad, signal short circuit or device damage caused by reverse installation or misalignment. This error prevention design changes the guarantee of assembly correctness from relying on the operator's experience to relying on the constraints of the structure itself, fundamentally eliminating the risk of human error and improving the operational safety and assembly efficiency in multi-variety and multi-batch testing scenarios. (10) In this utility model, the base plate of the needle tip positioning fixture is fixed to the lower box body, and the positioning reference plate is vertically set on one side of the base plate as a calibration reference surface. During the probe assembly process, the tip of each probe is pushed to abut against the positioning reference plate, and the extension length and end position of all needle tips are uniformly calibrated with the same high-precision reference surface. This process eliminates the influence of probe slot processing error, probe length manufacturing tolerance and manual assembly deviation on the needle tip position, ensuring that all needle tips form a highly consistent and precisely positioned electrical contact array after being installed in the probe box. The uniform needle tip position accuracy ensures that the contact force and contact position of each channel are uniform when the probe contacts the pad of the device under test, avoiding problems such as contact force difference, signal amplitude inconsistency or virtual contact caused by needle tip position deviation, and significantly improving the accuracy and consistency of multi-channel parallel testing. Attached Figure Description

[0023] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is an exploded view of the present invention; Figure 3 This is a top view of the present invention; Figure 4 This is a schematic diagram of the planar structure of the main printed circuit board in this utility model; Figure 5 This is a schematic diagram of the connection structure between the main printed circuit board and the clamping assembly in this utility model; Figure 6 This is a schematic diagram showing the disassembled structure of the main printed circuit board and the clamping assembly in this utility model; Figure 7 This is a schematic diagram of the disassembled structure of the probe box in this utility model; Figure 8 This is a left view of the probe box in this utility model; Figure 9 This is a three-dimensional structural diagram of the positioning fixture used to position the probes inside the probe box in this utility model. Figure 10 This is a schematic diagram of the planar structure of the positioning fixture in this utility model for positioning the probes in the probe box.

[0024] Wherein: 1—Main printed circuit board, 11—External connector, 12—Long strip contact pad group, 13—Conductive circuit board trace, 14—Threaded insert, 15—Positioning and foolproof structure, 2—Probe box, 21—Upper box body, 211—Clamping protrusion, 22—Lower box body, 23—Probe groove, 3—Probe, 31—Pin bar, 32—Pin tip, 33—Pin tail, 4—Clamping assembly, 41—Rigid clamping strip, 42—Elastic silicone clamping strip, 5—DUT, 51—Pad, 6—Positioning fixture, 61—Base plate, 62—Positioning reference plate, 7—Clamping screw. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] Example 1:

[0029] The main structure of this embodiment is as follows: Figures 1-8As shown, it includes a main printed circuit board 1 and a probe box 2 that can be detachably and securely connected to it. The main printed circuit board 1 is provided with an external connector 11 and a strip-shaped contact pad group 12. The external connector 11 has multiple pins, and the strip-shaped contact pad group 12 is composed of multiple mutually insulated strip-shaped contact pads. Each pin of the external connector 11 is electrically connected to the corresponding strip-shaped contact pad through an independent conductive circuit board trace 13. The probe holder 2 includes an upper holder 21 and a lower holder 22 that are detachably and securely connected. The lower holder 22 is provided with a plurality of probe slots 23 designed for the distribution of pads 51 of the device under test 5. Probes 3 are clamped and fixed in the probe slots 23 by the upper holder 21 and the lower holder 22. Both ends of the probes 3 extend out of the probe holder 2. When the probe holder 2 is detachably installed on the main printed circuit board 1, one end of the probe 3 makes electrical contact with the corresponding elongated contact pad, and the other end makes electrical contact with the corresponding pad 51 of the device under test 5.

[0030] In a specific implementation, an external connector 11 is arranged on the main printed circuit board 1, and a group of elongated contact pads 12, consisting of multiple mutually insulated elongated contact pads, is set on the board surface. Through the board manufacturing process, independent conductive circuit board traces 13 are arranged inside and on the surface of the main printed circuit board 1, so that each pin of the external connector 11 is electrically connected to its corresponding elongated contact pad through an independent conductive circuit board trace 13, forming a complete signal transfer path.

[0031] The arrangement and number of probe slots 23 on the lower housing 22 are designed according to the distribution of the pads 51 of the device under test 5. The probe housing 2 is printed using 3D printing. Probes 3 are placed one by one into the probe slots 23 of the lower housing 22. The upper housing 21 is then closed, and the probes 3 are clamped and fixed between the upper housing 21 and the lower housing 22 using fasteners or snap-fit ​​structures, ensuring that both ends of the probes 3 extend out of the probe housing 2 and are in a stable position.

[0032] The assembled probe holder 2 is detachably mounted on the main printed circuit board 1, aligning one end of the probe 3 with the corresponding elongated contact pad and making electrical contact. The device under test (DUT) 5 is placed in the test position, making the other end of the probe 3 make electrical contact with the corresponding pad 51 of the DUT 5. An external test device is connected via the external connector 11 to perform electrical performance testing on the DUT 5. After testing, the probe holder 2 can be detached from the main printed circuit board 1, and a probe holder 2 adapted to other DUTs 5 can be replaced.

[0033] Example 2:

[0034] This embodiment, based on the above embodiment, further adds a clamping component 4, such as... Figure 1 , Figure 2 , Figure 5 , Figure 6As shown, the system also includes a clamping assembly 4, which comprises an upper rigid clamping strip 41 and a lower elastic silicone clamping strip 42. The rigid clamping strip 41 is detachably and fixedly connected to the main printed circuit board 1. The lower part of the elastic silicone clamping strip 42 clamps the end of all probes 3 that makes electrical contact with the corresponding elongated contact pads, ensuring tight conductive contact between the ends of all probes 3 and the corresponding elongated contact pads. The rigid-elastic composite clamping structure ensures reliable electrical contact between the probes 3 and the elongated contact pads. The clamping assembly 4 includes an upper rigid clamping strip 41 and a lower elastic silicone clamping strip 42. The rigid clamping strip 41 is detachably and fixedly connected to the main printed circuit board 1, providing an overall rigid downward pressure source; the elastic silicone clamping strip 42 is located between the rigid clamping strip 41 and the end of the probe 3. After being pressed down by the rigid clamping strip 41, it undergoes elastic deformation, uniformly transmitting pressure to the end of all probes 3 that makes electrical contact with the elongated contact pads.

[0035] The elastic deformation characteristics of the elastic silicone clamping strip 42 can compensate for the height differences at the ends of each probe 3 caused by manufacturing tolerances or assembly errors, ensuring that the end of each probe 3 forms a tight conductive contact with the corresponding elongated contact pad, eliminating problems such as unstable test signals and excessive contact resistance caused by poor contact or uneven contact force, and significantly improving test reliability and signal transmission quality.

[0036] The specific implementation process involves preparing a rigid clamping strip 41 and an elastic silicone clamping strip 42. The rigid clamping strip 41 is made of rigid materials such as metal or hard engineering plastics, while the elastic silicone clamping strip 42 is made of non-conductive silicone material. Its length covers the arrangement range of all probes 3 and the contact ends of the long strip-shaped contact pads, thus fixing all probes 3 while preventing electrical short circuits between probe channels.

[0037] After the probe holder 2 is installed on the main printed circuit board 1, the elastic silicone clamping strip 42 is placed above the end of all probes 3 that are in electrical contact with the long strip contact pad, and then the rigid clamping strip 41 is stacked on top of the elastic silicone clamping strip 42.

[0038] The rigid clamping strip 41 can be detachably and fixedly connected to the main printed circuit board 1 using screws, clips, or other methods. The rigid clamping strip 41 presses down on the elastic silicone clamping strip 42. The elastic silicone clamping strip 42 deforms elastically under pressure, conforming to the end surfaces of each probe 3, evenly pressing all probe 3 ends onto the corresponding elongated contact pads to achieve tight conductive contact. To disassemble, loosening the connection between the rigid clamping strip 41 and the main printed circuit board 1 releases the clamping force. Other parts of this embodiment are the same as those in the above embodiments and will not be described again.

[0039] Example 3:

[0040] This embodiment, based on the above embodiment, further specifies the connection method between the clamping component 4 and the main printed circuit board 1, such as... Figure 5 , Figure 6 As shown, the rigid clamping strip 41 has several ear-shaped connecting keys integrally formed on its edge. The main printed circuit board 1 has threaded inserts 14 that match the positions of the ear-shaped connecting keys. A clamping screw 7, threaded through the ear-shaped keys of the rigid clamping strip 41, is internally connected to the threaded insert 14. Tightening the clamping screw 7 locks the rigid clamping strip 41 to the main printed circuit board 1, simultaneously pressing down the elastic silicone clamping strip 42, causing it to press against the ends of each probe 3 that contact the elongated contact pad. A screw-threaded insert mechanical locking structure is adopted. Several ear-shaped connecting keys are integrally formed on the edge of the rigid clamping strip 41, and threaded inserts 14 are pre-embedded at corresponding positions on the main printed circuit board 1. The clamping screw 7 passes through the ear-shaped connecting keys of the rigid clamping strip 41 and is threadedly connected to the threaded insert 14.

[0041] The threaded insert 14 is pre-embedded in the main printed circuit board 1. Compared to tapping threads directly on the PCB substrate, the threaded insert 14 provides a stronger internal thread structure, which can withstand the tightening torque caused by repeated disassembly and assembly without stripping or damaging the threads, thus extending the service life of the main printed circuit board 1. When the clamping screw 7 is tightened, the rigid clamping strip 41 is pulled downward and locked to the main printed circuit board 1, and the elastic silicone clamping strip 42 is pressed down simultaneously. The elastic deformation of the elastic silicone clamping strip 42 presses the ends of each probe 3 against the elongated contact pad. By controlling the tightening torque of the clamping screw 7, the clamping force can be precisely adjusted to ensure contact reliability while avoiding overpressure damage to the probe 3 or the pad.

[0042] The specific implementation process is as follows: when the main printed circuit board 1 is manufactured, a mounting hole is reserved at the position of the ear-shaped connecting key corresponding to the rigid clamping strip 41, and the threaded insert 14 is pressed into or pre-embedded in the main printed circuit board 1 by hot melting, so that the internal thread hole of the threaded insert 14 faces upward and is aligned with the through hole of the ear-shaped connecting key of the rigid clamping strip 41.

[0043] After the probe box 2 is installed on the main printed circuit board 1, the elastic silicone clamping strip 42 and the rigid clamping strip 41 are placed in sequence, so that the ear-shaped connecting key hole on the edge of the rigid clamping strip 41 corresponds one by one with the threaded insert 14 on the main printed circuit board 1.

[0044] Pass the clamping screw 7 through the through hole of the ear-shaped connecting key on the rigid clamping strip 41 and screw it into the corresponding threaded insert 14. Use a tool to gradually and symmetrically tighten each clamping screw 7, causing the rigid clamping strip 41 to move downwards evenly. This causes the elastic silicone clamping strip 42 to deform elastically, pressing the ends of each probe 3 against the elongated contact pad. Stop tightening after reaching the predetermined torque, completing the locking and fixing of the rigid clamping strip 41 and the clamping of the probe 3 ends. To disassemble, simply loosen the clamping screw 7 by rotating it in the opposite direction. Other parts of this embodiment are the same as those in the above embodiment and will not be described again.

[0045] Example 4:

[0046] This embodiment further defines the structure of the probe cartridge 2 based on the above embodiments, such as... Figure 1 , Figure 2 , Figure 7 , Figure 8 As shown, the upper casing 21 is also provided with a pressing protrusion 211 corresponding to each probe slot 23. After the upper casing 21 and the lower casing 22 are fitted and locked together, the pressing protrusion 211 presses and limits the probe 3 within the probe slot 23. When the upper casing 21 and the lower casing 22 are fitted and locked together, the pressing protrusion 211 extends from above into the space above the corresponding probe slot 23, pressing and limiting the probe 3 within the probe slot 23.

[0047] The clamping protrusion 211 and the bottom wall of the probe slot 23 form an upper and lower clamping constraint on the probe 3 rod 31, restricting the loosening of the probe 3 in the vertical direction. This structure ensures that the probe 3 is fixed in the probe holder 2 without relying on external clamping force, and the probe 3 will not fall off even when the probe holder 2 is not installed on the main printed circuit board 1, facilitating the independent transportation and storage of the probe holder 2. At the same time, the precise alignment of the clamping protrusion 211 ensures the consistency of the position of each probe 3 in the probe slot 23, providing structural protection for the accuracy of the electrical contact array of the probe tip 32.

[0048] The specific implementation process is as follows: multiple probe slots 23 are machined on the lower housing 22, and the number and position of the probe slots 23 are designed according to the distribution of the pads 51 of the device under test 5. A clamping protrusion 211 is integrally formed or precision machined at the corresponding position on the upper housing 21, ensuring that each clamping protrusion 211 precisely corresponds to the position of one probe slot 23, and that the size of the clamping protrusion 211 is adapted to the space above the probe slot 23.

[0049] The probes 3 are placed one by one into the probe slots 23 of the lower casing 22, so that the probe rods 31 of the probes 3 fall to the bottom of the probe slots 23, and the two ends of the probes 3 extend out of the two ends of the lower casing 22 respectively.

[0050] The upper housing 21 is aligned and fitted onto the lower housing 22, with each pressing protrusion 211 extending above the corresponding probe groove 23, abutting against the probe 3 rod 31 from above. Fasteners are used to lock the upper housing 21 and lower housing 22 tightly together, and the pressing protrusions 211 firmly press and limit the probe 3 within the probe groove 23, thus completing the stable fixation of the probe 3 within the probe housing 2. Other parts of this embodiment are the same as those in the above embodiment and will not be described again.

[0051] Example 5:

[0052] This embodiment further defines the structure of the probe cartridge 2 based on the above embodiments, such as... Figure 1 , Figure 2 , Figure 7 , Figure 8 As shown, each probe slot 23 has at least two spaced support positions. The support positions of the probe slot 23 cooperate with the clamping protrusion 211 of the upper housing 21 to form a circumferential multi-point clamping and limiting clamping of the probe 3 placed in the probe slot 23. Single-point or two-point collinear clamping can only restrict the probe 3's degree of freedom in one direction, and the probe 3 may still deflect or wobble in other directions; while circumferential multi-point clamping with at least three non-collinear contact points can constrain all translational and rotational degrees of freedom of the probe 3 in the cross-section, so that the probe 3's needle rod 31 is stably locked. The support positions of the probe slot 23 provide support from below and the sides, and the clamping protrusion 211 provides clamping force from above. The two cooperate to form a circumferential enveloping clamping of the probe 3, which greatly improves the positioning accuracy and vibration resistance of the probe 3, and ensures the accuracy and consistency of the contact position between the needle tip 32 and the pad 51 of the device under test 5.

[0053] The specific implementation process is as follows: the support positions of the probe groove 23 are processed. At least two spaced support positions are processed on the inner wall of each probe groove 23 of the lower housing 22. The support positions can be designed as bosses, groove shoulders or arc supports, etc., and are distributed along the circumference of the probe 3 so that when the probe 3 is placed in the probe groove 23, the needle rod 31 is supported by multiple support positions from different directions.

[0054] Insert the probe shaft 31 into the probe slot 23, ensuring it rests on the support positions. The support positions provide initial positioning of the probe 3 from below and the side. Adjust the position of the probe 3 to ensure the correct extension direction of the needle tip 32 and needle tail 33.

[0055] The upper casing 21 is closed and clamped at multiple points. With the upper casing 21 closed, the pressing protrusion 211 presses down on the probe 3 rod 31 from above. The pressing force of the pressing protrusion 211 and the supporting force of each support position within the probe groove 23 work together to form a circumferential multi-point pressing and limiting clamping of the probe 3. The upper casing 21 and lower casing 22 are locked, and the probe 3 is securely clamped at multiple points within the probe groove 23, with precise positioning and no rotation. Other parts of this embodiment are the same as those in the above embodiment and will not be described again.

[0056] Example 6:

[0057] This embodiment further defines the structure of probe 3 based on the above embodiments, such as... Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, the probe 3 is a straight probe, including a probe shaft 31 placed in the probe slot 23, a probe tip 32 extending from the probe holder 2 to make electrical contact with the pad 51 of the device under test 5, and a probe tail 33 extending from the probe holder 2 to make electrical contact with the elongated contact pad. The probe tips 32 of all probes 3 form a dedicated electrical contact array matching the pad 51 of the device under test 5 according to the arrangement of the probe slots 23 in the probe holder 2. The probe tails 33 of all probes 3 respectively make electrical contact with their respective corresponding elongated contact pads. The probe shaft 31 is responsible for mechanical fixation and does not participate in electrical contact, only for electrical conduction, and can be optimized into a high-strength structure. The probe tip 32 and the probe tail 33 are responsible for electrical contact at both ends, and the geometry and material properties of the contact ends can be independently optimized. Utilizing the straight probe structure of the probe 3, the spacing and arrangement of the probe tips 32 are determined by the arrangement of the probe slots 23, converting the distribution pattern of the pad 51 of the device under test 5 into a larger spacing of the probe tail contact arrangement, eliminating the need for a dedicated printed circuit board for the probe holder 2.

[0058] The tips 32 of all probes 3 form a dedicated electrical contact array that matches the pads 51 of the device under test 5, while the tails 33 make electrical contact with their respective elongated contact pads, thus realizing a one-to-one signal mapping and transfer between the non-standard pad array of the device under test 5 and the standardized elongated contact pad group 12 on the main printed circuit board 1.

[0059] The specific implementation process is as follows: based on the distribution and spacing of the pads 51 of the device under test 5, determine the required number of probes 3 and the spatial coordinates of the tip 32 of each probe 3, so that all the tips 32 form a dedicated electrical contact array that matches the pads 51 of the device under test 5. At the same time, determine the position of the elongated contact pad corresponding to the tail 33 of each probe 3.

[0060] The probe 3 is manufactured to have a straight three-section structure: the size of the middle probe bar 31 is adapted to the clamping space of the probe groove 23 and the clamping protrusion 211; the geometry of the tip 32 at one end is optimized to be a sharp or arc-shaped end suitable for piercing the oxide layer on the surface of the pad 51 of the device under test 5; the end face of the tail 33 at the other end is adapted to the planar contact requirements of the long strip contact pad.

[0061] Each probe 3 is inserted into the probe slot 23 of the probe holder 2 and secured by multiple clamping points using the clamping protrusion 211 and the support position. At this time, the tips 32 of all probes 3 form a dedicated electrical contact array at one end of the probe holder 2, and all the probe tails 33 are arranged at the other end according to the positions of the corresponding elongated contact pads. The probe holder 2 is then mounted on the main printed circuit board 1, with the probe tails 33 making electrical contact with the corresponding elongated contact pads and the probe tips 32 making electrical contact with the pads 51 of the device under test 5, thus completing the construction of the signal mapping path. The other parts of this embodiment are the same as those in the above embodiment and will not be described again.

[0062] Example 7:

[0063] This embodiment, based on the above embodiment, further defines the distribution of probe 3 within probe cartridge 2, such as... Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, the probe slots 23 within the probe holder 2 are arranged at an angle, causing the tips 32 of all probes 3 to converge towards the device under test (DUT) 5, while the tails 33 are dispersed towards the elongated contact pad group 12. The angled geometry of the probes 3 is used to achieve a mapping transformation of the pad spacing. The pads 51 of the DUT 5 are typically small in spacing and densely packed, while the elongated contact pad group 12 on the main printed circuit board 1 has a relatively large spacing due to limitations in PCB manufacturing processes and insulation requirements. By arranging the probes at an angle, the tips 32 converge to reduce the spacing to match the dense pads 51 of the DUT 5, while the tails 33 disperse to increase the spacing to match the large spacing of the elongated contact pad group 12. This achieves a geometric transformation from a small-pitch pad array to a large-pitch contact pad array, effectively solving the testing contact problem for high-density pad devices.

[0064] The specific implementation process is as follows: measure the small spacing of the pad 51 of the device under test 5 and the large spacing of each long strip contact pad in the long strip contact pad group 12. Based on the ratio of the spacing at both ends and the longitudinal dimension of the probe box 2, calculate and determine the tilt angle and convergence-dispersion geometry of the probe 3.

[0065] Based on the calculation results, probe grooves 23 are machined on the lower housing 22 at an angle, so that the probe grooves 23 are arranged in a convergent and dispersed manner within the probe housing 2: the spacing between the probe grooves 23 is small at one end and large at the other end. Correspondingly, pressing protrusions 211 with the same angle are provided on the upper housing 21.

[0066] The probe 3 is inserted into the inclined probe slot 23 and clamped in place. The tips 32 of the probe 3 converge and are arranged at one end of the probe holder 2, while the tails 33 are arranged dispersed at the other end. After the probe holder 2 is installed on the main printed circuit board 1, the converged tips 32 make precise contact with the densely packed pads 51 of the device under test 5, and the dispersed tails 33 make electrical contact with the elongated contact pads with larger spacing, completing the signal transfer from small pitch to large pitch. The other parts of this embodiment are the same as those in the above embodiment and will not be described again.

[0067] Example 8:

[0068] This embodiment further defines the structure of the probe cartridge 2 based on the above embodiments, such as... Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, the probe holder 2 has an overall fan-shaped structure. The tips 32 of all probes 3 converge at the fan-shaped head of the probe holder 2, forming an electrical contact array that adapts to the pads 51 of the device under test 5. The tails 33 of all probes 3 are distributed along the side of the fan and make electrical contact with the corresponding long strip contact pads in the long strip contact pad group 12 located at the edge of the fan of the probe holder 2. The technical advantages of the fan-shaped structure are: First, the radial geometry of the fan shape allows the tilt angle of each probe 3 to transition naturally along the arc surface, and there is no cross-interference between the probes 3, resulting in a more regular arrangement; Second, the fan-shaped head concentrates the contact array of the tips 32, making the structure compact and easy to align with the area of ​​the pads 51 of the device under test 5; Third, the tails 33 are distributed along the side of the fan and naturally correspond to the long strip contact pad group 12 arranged along the edge of the fan of the probe holder 2, resulting in a short and direct contact path and reducing signal crosstalk; Fourth, the overall rigidity of the fan-shaped structure is better than that of an irregular tilted arrangement, resulting in more uniform stress.

[0069] The specific implementation process is as follows: the position and size of the fan-shaped head are determined according to the position of the pad 51 of the device under test 5, and the curvature and expansion range of the fan-shaped side are determined according to the distribution of the elongated contact pad group 12. The probe box 2 is designed to be fan-shaped overall, with the fan-shaped head corresponding to the area of ​​the pad 51 of the device under test 5, and the fan-shaped side corresponding to the arrangement area of ​​the elongated contact pad group 12.

[0070] Inside the lower casing 22 with a fan-shaped structure, probe grooves 23 are machined along the radial direction, with the convergence point of the fan-shaped head as the reference, so that the probe grooves 23 are evenly distributed radially from the fan-shaped head to the fan-shaped side. Correspondingly, the upper casing 21 is provided with radially arranged pressing protrusions 211.

[0071] The probe 3 is inserted into the radial probe slot 23 and fixed by multiple clamping points of the clamping protrusion 211 and the support position. The tips 32 of all probes 3 converge at the fan-shaped head to form an electrical contact array that adapts to the pad 51 of the device under test 5; all the tails 33 are distributed along the side of the fan.

[0072] A set of elongated contact pads 12 is arranged along the fan-shaped edge of the probe holder 2 on the main printed circuit board 1. The fan-shaped probe holder 2 is mounted on the main printed circuit board 1, with the probe tip 32 making electrical contact with the pad 51 of the device under test 5, and the probe tail 33 making electrical contact with the corresponding elongated contact pad along the fan-shaped side. The probes are then pressed and fixed by the clamping assembly 4. The other parts of this embodiment are the same as those in the above embodiment and will not be described again.

[0073] Example 9:

[0074] This embodiment, based on the above embodiments, further defines the fixing structure between the probe holder 2 and the main printed circuit board 1, such as... Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, the main printed circuit board 1 is equipped with a positioning and anti-misalignment structure 15 that matches the probe cartridge 2. The positioning and anti-misalignment structure 15 limits the installation direction and position of the probe cartridge 2, enabling precise and detachable assembly of the probe cartridge 2 and the main printed circuit board 1. A unique correct assembly position is achieved through asymmetrical geometric positioning features. The anti-misalignment structure can be designed as asymmetrically distributed positioning pins and positioning holes, asymmetrical edge baffles, or keyway-type orientation structures, etc. When the probe cartridge 2 is installed in the correct direction, the positioning features of the positioning and anti-misalignment structure 15 match the corresponding features on the probe cartridge 2, allowing the probe cartridge 2 to be smoothly inserted and precisely positioned, ensuring that the probe tail 33 is precisely aligned with the elongated contact pad. When the direction or position is incorrect, the interference features of the positioning and anti-misalignment structure 15 prevent the probe cartridge 2 from being inserted, physically preventing faults such as incorrect contact between the probe 3 and the pad, and signal short circuits caused by reverse installation or misalignment. This achieves precise and detachable assembly of the probe cartridge 2 and the main printed circuit board 1, reducing the risk of operator error.

[0075] The specific implementation process involves designing an asymmetrical positioning and anti-foolproof structure 15 on the mounting area of ​​the probe holder 2 on the main printed circuit board 1. For example, at least two positioning pins with different diameters or asymmetrical positions are provided, or asymmetrical positioning stops are provided at the edge of the mounting area. Matching positioning holes or positioning notches are machined at corresponding positions on the probe holder 2.

[0076] The operator aligns the probe cartridge 2 with the mounting area of ​​the main printed circuit board 1, relying on the asymmetrical features of the positioning and error-proofing structure 15 to determine the correct mounting orientation. If the orientation is incorrect, the positioning features of the probe cartridge 2 do not match the positioning and error-proofing structure 15 of the main printed circuit board 1, and the probe cartridge 2 cannot be inserted, prompting the operator to adjust the orientation.

[0077] When the orientation is correct, the positioning features of the probe cartridge 2 match and engage with the positioning and anti-misalignment structure 15. The probe cartridge 2 is smoothly inserted along the positioning and anti-misalignment structure 15, which precisely defines the installation direction and position of the probe cartridge 2. The probe tail 33 makes precise electrical contact with the elongated contact pad, completing the precise and detachable assembly of the probe cartridge 2 and the main printed circuit board 1. It is then pressed and fixed by the clamping assembly 4. The other parts of this embodiment are the same as those in the above embodiment and will not be described again.

[0078] Example 10: This embodiment, based on the above embodiment, further adds a needle tip positioning fixture, such as... Figure 9 , Figure 10 As shown, the device also includes a tip positioning fixture 6, which includes a base plate 61 for fixing the lower housing 22. A positioning reference plate 62 is vertically arranged on one side of the base plate 61. One end of the probe 3 placed in the probe slot 23, which is in electrical contact with the corresponding pad 51 of the device under test 5, abuts against the positioning reference plate 62 for calibration. The tip positioning fixture 6 includes a base plate 61 and a positioning reference plate 62 vertically arranged on one side of the base plate 61. The base plate 61 is used to fix the lower housing 22 and provide a stable assembly reference platform; the positioning reference plate 62 serves as a calibration reference surface, and its surface accuracy and positional accuracy directly determine the calibration accuracy of the tip 32. When assembling the probe 3, one end of the tip 32 of the probe 3 is pushed to abut against the surface of the positioning reference plate 62, and the extension length and end position of all tips 32 are calibrated using the positioning reference plate 62 as a unified reference surface. Since all probe tips 32 are calibrated with the same positioning reference plate 62 as the reference, the influence of the processing error of each probe slot 23 and the length tolerance of the probe 3 on the position of the probe tip 32 is eliminated. This ensures that after being loaded into the probe box 2, all probe tips 32 form an electrical contact array with consistent height and precise position, thereby ensuring that the contact force and contact position of each probe tip 32 are uniform when the probe 3 contacts the pad 51 of the device under test 5.

[0079] The specific implementation process is as follows: the lower housing 22 is placed on the base plate 61 of the needle tip positioning fixture 6 and fixed, so that the opening of the needle tip 32 end of the probe groove 23 on the lower housing 22 faces the positioning reference plate 62, and the distance between the probe groove 23 and the positioning reference plate 62 meets the calibration requirements of the needle tip 32 extension length.

[0080] Insert the probe shaft 31 of probe 3 into the probe slot 23 of the lower housing 22, and push probe 3 along the probe slot 23 towards the positioning reference plate 62 until the tip 32 of probe 3 abuts against the surface of the positioning reference plate 62. Using the positioning reference plate 62 as the reference surface, calibrate the extension length and end position of the tip 32 of probe 3. Repeat this operation one by one, inserting all probes 3 into the corresponding probe slots 23 and calibrating them.

[0081] After all probes 3 are installed and their tips 32 are aligned with the positioning reference plate 62, the upper casing 21 is closed, and all probes 3 are fixed in place by clamping the pressing protrusions 211 and the support positions at multiple points. At this time, the positions of all probe tips 32 have been uniformly calibrated by the positioning reference plate 62, forming an electrical contact array with consistent accuracy.

[0082] After locking the upper housing 21 and the lower housing 22, remove the assembled probe housing 2 from the base plate 61 of the needle tip positioning fixture 6. Precisely install the probe housing 2 onto the main printed circuit board 1 using the positioning and anti-foolproof structure 15, and then press it firmly with the clamping assembly 4. This allows for precise electrical contact testing of the device under test 5. Other parts of this embodiment are the same as those in the above embodiments and will not be described again.

[0083] Example 11: This embodiment, based on the above embodiments, further specifies the specific structural details and materials, such as... Figures 1-10 As shown, the upper housing 21 and the lower housing 22 are detachably connected by housing fastening screws. The housing fastening screws pass through the fastening screw holes of the upper housing 21 and engage with the fastening screw holes of the lower housing 22, so that a single probe 3 can be installed, removed, or replaced. The probe housing 2 is detachably mounted on the reusable main printed circuit board 1 by probe housing mounting screws. The probe housing mounting screws pass through the probe housing mounting screw holes and engage with the probe housing threaded mounting points. The reusable main printed circuit board 1 also includes a grounding terminal and external mounting holes, and the external connector is a multi-channel connector for connecting external semiconductor testing equipment. The upper housing 21 and the lower housing 22 are made of electrically insulating photosensitive polymer resin formed by additive manufacturing.

[0084] The upper casing 21 and lower casing 22 can be quickly disassembled and assembled by using casing fastening screws and matching screw holes of upper and lower casings. After opening the casing, a single probe 3 can be taken out and replaced separately, solving the problem that the integrated clamping structure cannot replace the probes individually and the maintenance is cumbersome. Probe cartridge mounting screw locking structure: The probe cartridge mounting screws cooperate with the probe cartridge thread mounting points on the main printed circuit board 1 to achieve quick assembly and disassembly of the replaceable probe cartridge 2 as a whole, and together with the positioning and foolproof structure 15, ensure accurate alignment for each assembly. Grounding terminal and external mounting holes on the circuit board: The grounding terminal provides a shielded grounding channel for the main printed circuit board 1 to reduce DC test noise; the external mounting holes on the circuit board can fix the entire device on the probe station and displacement platform, adapting to automated / manual test stations; the multi-channel external connector 11 can simultaneously acquire multiple DC signals. Insulating photosensitive resin additive molding housing: The upper housing 21 and the lower housing 22 are both 3D printed. The material is insulating and does not interfere with electrical signals. Different arrangements of probe slots 23 can be quickly customized. The modification cycle during the research and development stage is short and the processing cost is low.

[0085] The specific implementation process includes: 1. Internal assembly of the probe cartridge and replacement of individual probes Take the upper casing 21 and lower casing 22, which are manufactured by additive manufacturing of electrically insulating photosensitive polymer resin, and put the probe 3 into the probe groove 23 of the lower casing 22; align the fastening screw holes of the upper casing and the lower casing, and screw the casing fastening screw through the upper casing fastening screw hole into the lower casing fastening screw hole. After tightening, the probe 3 is clamped and fixed by the clamping protrusion 211 and the support position of the probe groove 23. If a single probe 3 is worn or bent, simply loosen all the housing fastening screws, separate the upper housing 21 and the lower housing 22, remove the damaged probe and replace it with a new probe, and then tighten the housing fastening screws again. There is no need to replace the entire probe housing 2.

[0086] 2. The probe box is disassembled and fixed to the main printed circuit board 1. The assembled replaceable probe cartridge 2 is aligned with the positioning and anti-foolproof structure 15 along the main printed circuit board 1, so that the probe cartridge mounting screw holes correspond one-to-one with the probe cartridge thread mounting points on the main printed circuit board 1; the probe cartridge mounting screws are passed through the probe cartridge mounting screw holes, screwed into the probe cartridge thread mounting points and locked, so that the probe cartridge 2 can be detached and fixed; when replacing the device, simply loosen the probe cartridge mounting screws, remove the old probe cartridge, and replace it with a probe cartridge that matches the pad layout of the new device.

[0087] 3. Expanding the functionality of the main printed circuit board 1 The main printed circuit board 1 has a reserved grounding terminal, which can be connected to the shielded ground wire of the test equipment during assembly to eliminate DC test interference noise; the external mounting holes of the circuit board are used for bolts to fix the entire test device on the manual probe station and automatic displacement mechanism; the external connector 11 is a multi-channel connector, which can synchronously transmit multiple DC voltage and current signals of the device under test 5 to the external semiconductor test equipment.

[0088] 4. Instructions for the machining and forming of the casing Both the upper housing 21 and the lower housing 22 are made of electrically insulating photosensitive polymer resin and are integrally printed using additive manufacturing processes such as stereolithography and DLP. This allows for rapid modification of the model and printing of probe housings with different probe slot arrangements 23 according to the layout of the pads 51 of the device under test (DUT), eliminating the need for metal molds and adapting to scenarios with frequent model changes during chip development. Other parts of this embodiment are the same as those in the above embodiments and will not be repeated.

[0089] It is understood that the working principle and process of the semiconductor DC probe testing device structure according to one embodiment of the present invention, such as the external connector 11 and the conductive circuit board trace 13, are existing technologies and are well known to those skilled in the art, and will not be described in detail here.

[0090] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A semiconductor DC probe testing device with a replaceable probe holder, characterized in that, Includes a main printed circuit board (1) and a probe box (2) that can be detachably and securely connected to it. The main printed circuit board (1) is provided with an external connector (11) and a strip-shaped contact pad group (12). The external connector (11) has multiple pins. The strip-shaped contact pad group (12) is composed of multiple mutually insulated strip-shaped contact pads. Each pin of the external connector (11) is electrically connected to the corresponding strip-shaped contact pad through an independent conductive circuit board trace (13). The probe box (2) includes an upper box body (21) and a lower box body (22) that are detachably and fastened together. The lower box body (22) is provided with a plurality of probe slots (23) designed for the distribution of pads (51) of the device under test (5). A probe (3) is clamped and fixed in the probe slot (23) by the upper box body (21) and the lower box body (22). Both ends of the probe (3) extend out of the probe box (2). When the probe box (2) is detachably installed on the main printed circuit board (1), one end of the probe (3) makes electrical contact with the corresponding elongated contact pad, and the other end makes electrical contact with the corresponding pad (51) of the device under test (5).

2. A semiconductor DC probe testing device with a replaceable probe holder according to claim 1, characterized in that, It also includes a clamping assembly (4), which includes an upper rigid clamping strip (41) and a lower elastic silicone clamping strip (42). The rigid clamping strip (41) is detachably fixed to the main printed circuit board (1). The lower part of the elastic silicone clamping strip (42) clamps one end of all probes (3) that is in electrical contact with the corresponding elongated contact pad, so that the ends of all probes (3) are in close conductive contact with the corresponding elongated contact pad.

3. A semiconductor DC probe testing device with a replaceable probe holder according to claim 2, characterized in that, The edge of the rigid clamping strip (41) is integrally formed with several ear-shaped connecting keys. The main printed circuit board (1) is provided with a threaded insert (14) that matches the position of the ear-shaped connecting keys. The threaded insert (14) is internally threaded with a clamping screw (7) that passes through the ear-shaped key of the rigid clamping strip (41). Tightening the clamping screw (7) can lock the rigid clamping strip (41) to the main printed circuit board (1). Simultaneously, the elastic silicone clamping strip (42) is pressed down, so that the elastic silicone clamping strip (42) presses the end of each probe (3) that contacts the long strip contact pad.

4. A semiconductor DC probe testing apparatus with a replaceable probe cartridge according to any one of claims 1 to 3, characterized in that, The upper casing (21) is also provided with a pressing protrusion (211) corresponding to each probe groove (23). After the upper casing (21) and the lower casing (22) are fitted and locked together, the pressing protrusion (211) presses and limits the probe (3) in the probe groove (23).

5. A semiconductor DC probe testing device with a replaceable probe holder according to claim 4, characterized in that, Each of the probe slots (23) is provided with at least two spaced support positions. The support positions of the probe slots (23) cooperate with the pressing protrusions (211) of the upper casing (21) to form a circumferential multi-point pressing and limiting clamping of the probe (3) placed in the probe slots (23).

6. A semiconductor DC probe testing apparatus with a replaceable probe cartridge according to any one of claims 1 to 3, characterized in that, The probe (3) is a straight probe, including a needle bar (31) placed in the probe slot (23), a needle tip (32) extending from the probe box (2) to make electrical contact with the pad (51) of the device under test (5), and a needle tail (33) extending from the probe box (2) to make electrical contact with the elongated contact pad; the needle tips (32) of all probes (3) form an electrical contact array matching the pad (51) of the device under test (5) according to the arrangement of the probe slots (23) in the probe box (2), and the needle tails (33) of all probes (3) respectively make electrical contact with the corresponding elongated contact pad.

7. A semiconductor DC probe testing device with a replaceable probe cartridge according to claim 6, characterized in that, The probe slots (23) inside the probe box (2) are arranged at an angle so that the tips (32) of all probes (3) converge toward the device under test (5) and the tails (33) are distributed toward the long strip contact pad group (12).

8. A semiconductor DC probe testing device with a replaceable probe cartridge according to claim 7, characterized in that, The probe box (2) is in the shape of a fan. The tips (32) of all probes (3) converge at the fan-shaped head of the probe box (2) to form an electrical contact array that adapts to the pad (51) of the device under test (5). The tails (33) of all probes (3) are distributed along the side of the fan and make electrical contact with the corresponding long strip contact pad in the long strip contact pad group (12) located at the edge of the fan of the probe box (2).

9. A semiconductor DC probe testing apparatus with a replaceable probe cartridge according to any one of claims 1 to 3, characterized in that, The main printed circuit board (1) is provided with a positioning and anti-foolproof structure (15) that matches the probe box (2). The positioning and anti-foolproof structure (15) limits the installation direction and position of the probe box (2) to achieve precise and detachable assembly of the probe box (2) and the main printed circuit board (1).

10. A semiconductor DC probe testing apparatus with a replaceable probe cartridge according to any one of claims 1 to 3, characterized in that, It also includes a needle tip positioning fixture (6), which includes a base plate (61) for fixing the lower housing (22). A positioning reference plate (62) is vertically arranged on one side of the base plate (61). One end of the probe (3) placed in the probe slot (23) and the corresponding pad (51) of the device under test (5) are in electrical contact with the positioning reference plate (62) for calibration.