Intracranial electrode resistance testing device

Abstract

The application discloses an intracranial brain electrode resistance test device, which comprises a first test device used for fixedly connecting at least one electrode contact on a front-end electrode piece, a second test device used for fixedly connecting a plurality of connecting terminals in a connecting port through a docking module, and a resistance test mainboard, wherein the first test device and the second test device are connected to the resistance test mainboard through a wire, and an access device interface corresponding to the first test device and an access device interface corresponding to the second test device are respectively connected to an external resistance tester and form a passage, so that the resistance tester displays the multi-channel resistance value of the intracranial brain electrode to be detected. The intracranial brain electrode resistance test device can conveniently, quickly, accurately and efficiently perform multi-channel resistance test on the intracranial brain electrode, improves the stability of the multi-channel resistance test on the electrode, saves a complicated test operation process, and improves the resistance test efficiency.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and more specifically, to an intracranial brain electrode resistance testing device. Background Technology

[0002] Intracranial EEG electrodes are primarily used to monitor and locate abnormal epileptic discharges in specific deep brain regions. Preoperative stereotactic localization is required to define the electrode implantation path to the predetermined location, avoiding cerebral blood vessels. Stereotactic localization employs visualization methods such as X-rays, angiography, and MRI. After surgical implantation, an EEG cable and EEG machine are connected to observe brain electrical activity (EEG) changes. Abnormal EEG patterns are recorded to analyze lesion location. Intracranial EEG electrodes consist of electrode contacts, catheters, and connecting terminals. It is essential to ensure that all connecting terminals maintain proper connection to the electrode contacts.

[0003] However, since multi-channel intracranial brain electrodes are non-standard components, there is no specialized equipment on the market to test their multi-channel resistance values. Currently, it is still necessary to manually test the resistance values ​​of each channel using a multimeter to ensure they meet the requirements. If the resistance values ​​of each channel of a mass-produced multi-channel intracranial brain electrode were to be tested one by one, it would be very time-consuming and labor-intensive, with high labor costs and a complicated testing process. There are also problems such as inaccurate resistance values ​​due to incomplete contact. Utility Model Content

[0004] One objective of this application is to provide an intracranial brain electrode resistance testing device, which can at least solve the technical problems in the prior art, such as the cumbersome and time-consuming nature of using a multimeter to test the multi-channel resistance values ​​of intracranial brain electrodes.

[0005] To achieve the above objectives, this application provides the following technical solutions.

[0006] According to an embodiment of the first aspect of this application, an intracranial brain electrode resistance testing device is used to test the multi-channel resistance value of an intracranial brain electrode. The intracranial brain electrode to be tested includes a front-end electrode component and a connection port, comprising: a first testing device for fixing and connecting at least one electrode contact on the front-end electrode component; a second testing device including a docking module for fixing and connecting multiple connection terminals in the connection port through the docking module; and a resistance testing motherboard, wherein the first testing device and the second testing device are respectively connected to a resistance testing motherboard via a first ribbon cable. The resistance testing motherboard includes an access device interface, and the access device interface corresponding to the first testing device and the access device interface corresponding to the second testing device are respectively connected to an external resistance tester and form a path, so that the resistance tester displays the multi-channel resistance value of the intracranial brain electrode to be tested.

[0007] Optionally, the first testing device includes a mounting base plate, a mounting top plate, and a mounting base plate vertically disposed on the mounting base plate. A pressing upper plate and a pressing lower plate are disposed between the mounting top plate and the mounting base plate, and the pressing lower plate is fixedly connected to the mounting base plate.

[0008] Optionally, the top plate, bottom plate, and upper plate are provided with corresponding mounting holes on both sides. The first test device also includes two guide rods and two linear bearings. The guide rods pass through the mounting holes on one side of the upper plate and a single linear bearing fixedly located below the upper plate. The two ends of the guide rods are fixedly connected to the mounting holes on the corresponding sides of the top plate and bottom plate, respectively.

[0009] Optionally, the mounting base is fixedly provided with a mounting component, a fixing seat, a lifting handle connected to the mounting component, a crank connected to the lifting handle, and a linkage push rod connected to the crank. The fixing seat includes a bent component and a sleeve. The sleeve passes through a through hole on the upper surface of the mounting top plate. The linkage push rod extends into the sleeve and is connected to a mounting piece fixed on the side of the pressing plate facing the mounting top plate, so that the pressing plate slides up and down along the guide rod under the drive of the lifting handle.

[0010] Optionally, the lower pressing plate has a boss on the side facing the upper pressing plate, an electrode insertion hole on the side of the boss facing the guide rod, and a receiving space on the side of the boss away from the mounting substrate. The receiving space contains a plurality of metal detection elements, which contact each electrode contact that extends into the electrode insertion hole; and / or the upper pressing plate has a plurality of spring pins on the side facing the mounting base plate. When the upper pressing plate and the lower pressing plate are pressed together, the spring pins contact each electrode contact that extends into the electrode insertion hole, and the arrangement gap between each metal detection element or spring pin is consistent with the arrangement gap between each electrode contact.

[0011] Optionally, the upper pressing plate has an internal accommodating space and an electrical signal acquisition main board, which is electrically connected to the spring pin. The side of the upper pressing plate facing the mounting top plate has a first socket, which is electrically connected to the electrical signal acquisition main board. The bottom surface of the mounting base plate has a second socket, which is electrically connected to the metal detection component. The first socket and the second socket are connected by a second ribbon cable.

[0012] Optionally, the spring needle and metal detection element are gold-plated copper parts.

[0013] Optionally, the second testing device also includes a base plate, on which the docking module is mounted. The docking module includes a docking port, a docking socket that matches the connection port, and a quick-release component. The docking port is located at one end of the docking module, and the docking socket and quick-release component are located at the other end.

[0014] Optionally, both sides of the docking socket are provided with a groove and a first extension. The quick ejection assembly includes a push rod and a scooping assembly connected to the push rod. A spring is provided between the push rod and the first extension. The scooping assembly can slide within the groove.

[0015] Optionally, the front end of the shovel of the shovel component is sloped.

[0016] The intracranial brain electrode resistance testing device 1000 of this application enables convenient and effective multi-channel resistance testing of intracranial brain electrodes. Only one connection at both ends is required to quickly measure the resistance values ​​corresponding to each channel within the intracranial brain electrode, making it extremely convenient, fast, accurate, and efficient. By simply adjusting the arrangement parameters of the metal detection components and spring components, it can be adapted to different models of intracranial brain electrodes and their multi-channel resistance values ​​can be tested. The upper and lower pressing plates are each equipped with detection components, doubly ensuring complete contact of the intracranial brain electrode contacts, greatly improving the stability of multi-channel resistance testing. It significantly reduces labor costs, eliminates tedious testing procedures, and eliminates the need for manual connection and testing of each channel within the intracranial brain electrode, greatly improving inspection efficiency and solving the problem of inaccurate electrode channel resistance values ​​measured when using a multimeter without complete contact with the electrode contacts during manual testing of multi-channel resistance values.

[0017] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0019] Figure 1 This is a schematic diagram of the structure of an intracranial brain electrode resistance testing device according to an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of an intracranial brain electrode resistance testing device according to an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of the first testing device of an intracranial brain electrode resistance testing device according to another embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the first testing device of an intracranial brain electrode resistance testing device according to another embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the first testing device of an intracranial electroencephalogram (EEG) resistance testing device according to another embodiment of this application.

[0024] Figure 6 This is a schematic diagram of the first testing device of an intracranial electroencephalogram (EEG) resistance testing device according to another embodiment of this application.

[0025] Figure 7 This is a schematic diagram of a second testing device of an intracranial electroencephalogram (EEG) device according to another embodiment of the present application;

[0026] Figure 8 This is a schematic diagram of a second testing device of an intracranial electroencephalogram (EEG) device according to another embodiment of the present application;

[0027] Figure 9 This is a schematic diagram of a second testing device of an intracranial electroencephalogram (EEG) device according to another embodiment of the present application;

[0028] Figure 10 This is a schematic diagram of a second testing device of an intracranial electroencephalogram (EEG) device according to another embodiment of the present application;

[0029] Figure 11 For yet another embodiment of this application Figure 10 Enlarged view of point A of the second test device in the image;

[0030] Figure 12 A schematic diagram of the structure of the first test device according to another embodiment of this application after the boss is hidden;

[0031] Figure 13 This is a schematic diagram of the structure of an intracranial brain electrode according to an embodiment of this application;

[0032] Figure 14 This is a schematic diagram of the structure of the first testing device of the intracranial brain electrode resistance testing device according to another embodiment of this application.

[0033] Icon labels:

[0034] Front electrode 10; Electrode contact 11; Connection port 12;

[0035] Intracranial brain electrode resistance testing equipment 1000;

[0036] First testing device 100; First ribbon cable 101; Mounting base plate 102; Mounting top plate 103; Mounting base plate 104; Mounting component 105; Fixing seat 106; Bending component 107; Sleeve 108; Lifting handle 109; Crank 110; Linkage push rod 111; Pressing upper plate 112; Pressing lower plate 113; Mounting hole 114; Guide rod 115; Linear bearing 116; Boss 117; Electrode insertion hole 118; Metal detection component 119; Spring pin 120; Electrical signal acquisition main board 121; First socket 122; Second socket 123; Second ribbon cable 124; Wiring cover 125; Mounting piece 126; Main board output port 127; Toothed component 128.

[0037] Second testing device 200; docking port 201; base plate 202; docking module 203; docking socket 204; groove 205; first extension 206; quick ejection assembly 207; push rod 208; shovel assembly 209; spring component 210; front shovel head 211; limit post 212; connecting post 213;

[0038] Resistance test motherboard 300; access device interface 301. Detailed Implementation

[0039] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0040] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0041] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0042] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0044] The intracranial brain electrode resistance testing device 1000 according to an embodiment of this application is described in detail below with reference to the accompanying drawings.

[0045] In one embodiment of this application, the intracranial brain electrode resistance testing device 1000 is used to test, for example... Figure 13 The multi-channel resistance values ​​of the intracranial brain electrodes shown are illustrated. The intracranial brain electrodes to be tested include a front electrode component 10 and a connection port 12. The intracranial brain electrode resistance testing device 1000 in this embodiment includes: a first testing device 100 for fixedly connecting at least one electrode contact 11 on the front electrode component 10; a second testing device 200, which includes a docking module 203 for fixedly connecting multiple connection terminals (not shown in the figures) within the connection port 12 via the docking module 203; and a resistance testing main board 300, where the first testing device 100 and the second testing device 200 are respectively connected to a resistance testing main board 300 via a first ribbon cable 101. The resistance testing main board 300 includes an access device interface 301. The access device interface 301 corresponding to the first testing device 100 and the access device interface 301 corresponding to the second testing device 200 are respectively connected to an external resistance tester and form a path, so that the resistance tester displays the multi-channel resistance values ​​of the intracranial brain electrodes to be tested.

[0046] Specifically, such as Figure 1 As shown, the intracranial brain electrode resistance testing device 1000 provided in this application is used to perform multi-channel resistance value testing on intracranial brain electrodes. Based on the resistance values ​​corresponding to the multiple channels of the intracranial brain electrode, it is determined whether the resistance value is within the normal resistance range. If the resistance value corresponding to each channel of the intracranial brain electrode is within the normal resistance range, then the multi-channel resistance value of the intracranial brain electrode is deemed qualified. Figure 13 As shown, a conventional intracranial EEG electrode includes a front electrode component 10 and a connection port 12. The front surface of the front electrode component 10 is embedded with multiple spaced-apart electrode contacts 11. These contacts 11 are used to contact target points in the patient's brain tissue to acquire EEG signals at those target points. Different contacts 11 can contact different target points. Each contact corresponds to one channel, allowing for the acquisition of multi-channel EEG signals. The front electrode component 10 contains guide wires connected to each contact 11, converging the EEG signals acquired by each contact 11 through their respective guide wires and connecting them to the connection port 12 at the rear end of the intracranial EEG electrode. The connection port 12 connects to a transmission cable, transmitting the multi-channel acquired EEG signals to an external electroencephalogram (EEG) machine for display. This is content known to those skilled in the art and will not be elaborated further.

[0047] It should be noted that the above description describes the signal transmission principle of intracranial brain electrodes when collecting multi-channel EEG signals from target points on a patient. Based on this, the intracranial brain electrode resistance testing device 1000 proposed in this application aims to test the resistance values ​​of multiple channels of intracranial brain electrodes. It only requires one end of the testing device to be fixedly connected to multiple electrode contacts 11 of the front electrode component 10, and the other end to be fixedly connected to multiple connection terminals within the connection port 12. This forms a circuit at the beginning and end of the multi-channel intracranial brain electrodes, allowing for the testing of the resistance values ​​of the multiple channels and the determination of whether the resistance values ​​of each channel are within the normal threshold range. The following will describe in detail the technical content of the intracranial brain electrode resistance testing device 1000 provided in this application. The dotted or dashed lines in the accompanying drawings are outlines.

[0048] For intracranial brain electrode multichannel resistance testing, such as Figure 2 As shown, the intracranial brain electrode resistance testing device 1000 provided in this application includes a first testing device 100 and a second testing device 200. The first testing device 100 is used to fix the front electrode component 10 of the intracranial brain electrode and make fixed contact connections with one or more electrode contacts 11 thereon. That is, the first testing device 100 can form a pathway with each electrode contact 11 on the front electrode component 10 of the intracranial brain electrode.

[0049] The second testing device 200 is used to fixably connect to all the connection terminals in the connection port 12 at the rear of the intracranial brain electrodes using its docking module 203. For the intracranial brain electrodes, the multiple connection terminals can respectively correspond to the EEG signals transmitted from each channel of the electrode contacts 11 on the front electrode 10. In other words, one connection terminal corresponds to receiving the EEG signal collected by one electrode contact 11. Based on this, the docking module 203 of the second testing device 200 can also correspond one-to-one with the multiple connection terminals in the connection port 12 at the rear of the intracranial brain electrodes. That is to say, the second testing device 200 can form a path with the multiple connection terminals in the connection port 12 of the intracranial brain electrodes, which will be described in detail below and will not be repeated here.

[0050] In this embodiment, the resistance test motherboard 300 is used to organize the channel sequence and then connect the channels corresponding to each contact electrode to the test channels of the external resistance tester in the same order to form a circuit. Specifically, the first test device 100 and the second test device 200 are respectively connected to a resistance test motherboard 300 through two first ribbon cables 101. Each resistance test motherboard 300 includes an access device interface 301. The access device interface 301 is used to connect to an external resistance tester. In addition, the resistance test motherboard 300 also includes an internal circuit channel, which can adjust the channel sequence corresponding to each electrode contact 11 in the circuit to be consistent with the test channel sequence of the external resistance tester. This is something that those skilled in the art can understand and is not the focus of this application, so it will not be elaborated here. Based on this, the access device interface 301 corresponding to the first test device 100 and the access device interface 301 corresponding to the second test device 200 are respectively connected to the external resistance tester to form a circuit. Figure 1 The circuit shown is configured such that the order of the test channels of the external resistance tester matches the order of the channels corresponding to each electrode contact 11, so that the external resistance tester displays the resistance values ​​corresponding to each channel of the intracranial brain electrode under test according to the arrangement of the electrode contacts 11. Based on the above, those skilled in the art can accurately determine which specific electrode contact 11 on the tested intracranial brain electrode has an abnormal resistance value by observing the resistance values ​​of each channel of the intracranial brain electrode displayed by the external resistance tester. This is something that those skilled in the art will understand, and will not be elaborated further here.

[0051] In this embodiment, when the first testing device 100 is connected to each electrode contact 11 on the front electrode 10 to form a circuit, and the second testing device 200 is connected to multiple connection terminals of the intracranial brain electrode to form a circuit, the first testing device 100 can be connected to a resistance testing motherboard 300 via a first ribbon cable 101 through a connector, and the second testing device 200 can be connected to another resistance testing motherboard 300 via another first ribbon cable 101 through a connector. Each resistance testing motherboard 300 is provided with an access device interface 301. Specifically, the access device interface 301 of the resistance testing motherboard 300 to which the first testing device 100 is connected, and the access device interface 301 of the other resistance testing motherboard 300 to which the second testing device 200 is connected, are respectively electrically connected to an external resistance tester and form a circuit.

[0052] like Figure 1As shown, one end of the external resistance tester is indirectly connected to each electrode contact 11 at one end of the intracranial brain electrode to be tested, and the other end is indirectly connected to multiple connection terminals in the connection port 12 at the other end of the intracranial brain electrode, thus forming a complete connection path. Therefore, the external resistance tester can display the resistance value corresponding to each channel within the multi-channel test of the intracranial brain electrode. It should be noted that the external resistance tester in this application is a conventional instrument used by those skilled in the art. The resistance tester requires an external power supply during testing; its working principle and usage will not be elaborated upon here.

[0053] In another embodiment of this application, the first testing device 100 includes a mounting base plate 102, a mounting top plate 103, and a mounting base plate 104 vertically disposed on the mounting base plate 102. A pressing upper plate 112 and a pressing lower plate 113 are provided between the mounting top plate 103 and the mounting base plate 102, and the pressing lower plate 113 is fixedly connected to the mounting base plate 102.

[0054] Simply put, such as Figure 6 As shown, the first testing device 100 includes a mounting base plate 102, a mounting top plate 103, and a mounting base plate 104 vertically mounted on the mounting base plate 102. The mounting base plate 102 or the mounting top plate 103 can be made of plastic or metal, without limitation. The vertically mounted mounting base plate 104 can be made of aluminum alloy or stainless steel. The bottom of the mounting base plate 104 can be fixedly connected to the mounting base plate 102 by screws, or the mounting base plate 102 and the mounting base plate 104 can be integrated into one component. A pressing upper plate 112 and a pressing lower plate 113 are also provided between the mounting top plate 103 and the mounting base plate 102 from top to bottom. The pressing lower plate 113 is fixedly connected to the mounting base plate 102. The bottom surface of the pressing lower plate 113 can be bonded and fixed to the mounting base plate 102, or the pressing lower plate 113 can be integrated into the mounting base plate 102.

[0055] In other embodiments of this application, the mounting top plate 103, the mounting bottom plate 102, and the pressing upper plate 112 are provided with corresponding mounting holes 114 on both sides. The first testing device 100 also includes two guide rods 115 and two linear bearings 116. The guide rods 115 pass through the mounting holes 114 on one side of the pressing upper plate 112 and a single linear bearing 116 fixedly disposed below the pressing upper plate 112. The two ends of the guide rods 115 are respectively fixedly connected to the mounting holes 114 on the corresponding sides of the mounting top plate 103 and the mounting bottom plate 102.

[0056] Specifically, in this embodiment, as Figures 4 to 6As shown, mounting top plate 103, mounting bottom plate 102, and pressing upper plate 112 all have corresponding mounting holes 114 on both sides in the horizontal direction for mounting guide rods 115. The inner diameter of these mounting holes 114 is adapted to the outer diameter of the guide rods 115, and the inner diameter of the hole in the linear bearing 116 is also adapted to the outer diameter of the guide rods 115. Thus, the guide rods 115 on both sides can pass through the middle holes of the linear bearings 116 on both sides and the pressing upper plate 112, and the two ends of the guide rods 115 on both sides extend into the corresponding mounting holes 114 of the mounting bottom plate 102 and the mounting top plate 103 and are fixedly installed. The linear bearings 116 and the pressing upper plate 112 are fixedly connected, and the two can slide up and down along the guide rods 115. In this embodiment, the linear bearings 116 play a light, high-speed, precise, and smooth linear guiding function during the up and down sliding of the pressing upper plate 112 along the guide rods 115. The top surface of the linear bearing 116 can be glued to the bottom surface of the pressing plate 112 or fixed in other ways, which is not limited here.

[0057] In another embodiment of this application, a mounting component 105, a fixing seat 106, a lifting handle 109 connected to the mounting component 105, a crank 110 connected to the lifting handle 109, and a linkage push rod 111 connected to the crank 110 are fixedly provided on the mounting base 104. The fixing seat 106 includes a bending component 107 and a sleeve 108. The sleeve 108 passes through a through hole on the upper surface of the mounting top plate 103. The linkage push rod 111 extends into the sleeve 108 and is connected to the mounting piece 126 fixedly provided on the side of the pressing upper plate 112 facing the mounting top plate 103, so that the pressing upper plate 112 slides up and down along the guide rod 115 under the drive of the lifting handle 109.

[0058] Specifically, such as Figures 2 to 6 As shown, a mounting component 105 is fixedly mounted on the upper end of the mounting base 104. The mounting component 105 can be welded onto the mounting base 104. One end of the lifting handle 109 is movably connected to the mounting component 105 via a pin. The mounting component 105 serves as a fixed support, providing a center of rotation for the lifting handle 109, allowing it to rotate around its axis. The other end of the lifting handle 109 is connected to the upper end of the linkage push rod 111 via a crank 110. The lifting handle 109, crank 110, and linkage push rod 111 are all sequentially movably connected via pins, which will not be elaborated further here.

[0059] In addition, such as Figures 2 to 6As shown, a fixing seat 106 is fixedly mounted on the mounting base 104 with screws. The fixing seat 106 is mounted below the mounting member 105. The fixing seat 106 consists of two parts: a bent part 107 and a sleeve 108. A through hole is provided in the center of the upper surface of the mounting top plate 103, and the inner diameter of the through hole is larger than the outer diameter of the sleeve 108. Therefore, the sleeve 108 can extend into the through hole of the mounting top plate 103. The sleeve 108 extends into the through hole and can be fixedly connected to the mounting top plate 103 by means of adhesive or other methods. In some embodiments, the horizontal plane of the front end of the sleeve 108 extending into the through hole can be flush with the lower surface of the mounting top plate 103 to avoid the part of the sleeve 108 protruding from the lower surface of the mounting top plate 103 from obstructing the up and down sliding of the pressing upper plate 112.

[0060] In this embodiment, the sleeve 108 has an inner tube with an inner diameter that matches the outer diameter of the linkage push rod 111, allowing the linkage push rod 111 to extend into the sleeve 108. After passing through the sleeve 108, it can be welded to the mounting piece 126 on the side of the pressing plate 112 facing the mounting top plate 103. In this embodiment, the mounting piece 126 can be screwed to the pressing plate 112. Based on the above structure, the pressing plate 112 slides up and down along the guide rod 115 under the drive of the lifting handle 109.

[0061] Furthermore, when the tester manually presses down on the lifting handle 109, the handle 109 drives the crank 110, which in turn drives the linkage push rod 111 downwards. The mounting plate 126 at the other end of the linkage push rod 111 also moves downwards, causing the upper pressing plate 112 to move vertically downwards along the guide rod 115 until it presses against the lower pressing plate 113. Conversely, when the tester manually lifts the lifting handle 109, the handle 109 drives the crank 110, which in turn drives the linkage push rod 111 upwards. The mounting plate 126 at the other end of the linkage push rod 111 also moves upwards, causing the upper pressing plate 112 to move vertically upwards along the guide rod 115, thus disengaging from the lower pressing plate 113. The pressing down or lifting up of the lifting handle 109 can be done manually or automatically; the specific control method is not limited here.

[0062] In another embodiment of this application, the lower pressing plate 113 is provided with a boss 117 on the side facing the upper pressing plate 112. The boss 117 is provided with an electrode insertion hole 118 on the side facing the guide rod 115. The side of the boss 117 away from the mounting substrate 104 is provided with a receiving space. A plurality of metal detection elements 119 are provided in the receiving space. The metal detection elements 119 contact each electrode contact 11 extending into the electrode insertion hole 118. And / or the upper pressing plate 112 is provided with a row of a plurality of spring pins 120 on the side facing the mounting base plate 102. When the upper pressing plate 112 and the lower pressing plate 113 are pressed together, the spring pins 120 contact each electrode contact 11 extending into the electrode insertion hole 118. The arrangement gap between each metal detection element 119 or spring pin 120 is consistent with the arrangement gap between each electrode contact 11.

[0063] Specifically, such as Figure 6 As shown, the lower pressing plate 113 has a boss 117 on the side facing the upper pressing plate 112. An electrode insertion hole 118 can be provided on the side of the boss 117 facing either guide rod 115. The electrode insertion hole 118 is a through hole, while the side of the boss 117 facing the other guide rod 115 does not have an electrode insertion hole 118. The front electrode 10 of the intracranial brain electrode to be tested can enter the boss 117 through this electrode insertion hole 118. When the tester inserts the front electrode 10 into the boss 117, if the front electrode 10 cannot advance further against the inner wall of the boss 117 on the side without the electrode insertion hole 118, it indicates that the front electrode 10 has been fully inserted into the boss 117 and the placement is complete.

[0064] Furthermore, in this embodiment, as Figure 6 and Figure 14As shown, a row of spaced-apart protrusions 128 are also provided on the side of the boss 117 facing the second row of lines 124. In this embodiment, the protrusions 128 and the boss 117 can be integrated. The spacing between each protrusion 128 forms multiple independent receiving spaces. A metal detection element 119 can be embedded in the bottom of each receiving space. The upper surface of the metal detection element 119 can be on the same horizontal plane as the upper surface of the pressing lower plate 113 or slightly protrude from the horizontal plane of the upper surface of the pressing lower plate 113, so that the metal detection element 119 can better contact each electrode contact 11 on the front electrode 10 of the intracranial brain electrode that penetrates into one end of the boss 117. A through hole (not shown in the figure) can be opened in the side wall of each protrusion 128 at a corresponding position, so that the front electrode 10 can pass straight through the side wall of each protrusion 128 and reach the other end of the boss 117. In simple terms, the front electrode 10 of the intracranial brain electrode to be tested passes through the electrode insertion hole 118 on the side of the boss 117, and then sequentially passes through the through holes on the side wall of each protruding tooth 128 until the front end of the front electrode 10 abuts against the inner wall of the side of the boss 117 without the electrode insertion hole 118, thus completing the placement. With the front electrode 10 in place, each electrode contact 11 on the intracranial brain electrode can be located within its respective receiving space and can contact the metal detection element 119 at the bottom of each receiving space.

[0065] In this embodiment, the metal detection element 119 can specifically be a conductive copper pillar. It should be noted that in this embodiment, the upper surface of each metal detection element 119 can contact each electrode contact 11 of the electrode insertion hole 118. It should also be noted that the arrangement gap between the multiple metal detection elements 119 in a row in this embodiment can be set to be consistent with the arrangement gap between each electrode contact 11 of the electrode insertion hole 118, thereby ensuring that each electrode contact 11 of the electrode insertion hole 118 can contact each metal detection element 119 disposed within the boss 117. It should be noted that parameters such as the arrangement gap between the metal detection elements 119 in a row can be adjusted by those skilled in the art according to the arrangement gap and number of contacts on different types of intracranial brain electrodes to be tested, and are not limited here.

[0066] Furthermore, in this embodiment, such as Figure 4 As shown, a row of multiple spring pins 120 can also be fixedly provided on one side of the upper pressing plate 112 facing the mounting base plate 102. When the test user presses the lifting handle 109 to press the upper pressing plate 112 and the lower pressing plate 113 together, each spring pin 120 can contact the electrode contact 11 at the corresponding position on the intracranial brain electrode.

[0067] It is important to note that the spacing between the spring pins 120 in a row can be consistent with the spacing between the electrode contacts 11 in the electrode insertion holes 118, allowing the electrode contacts 11 in the electrode insertion holes 118 to contact the spring pins 120 in a row on the pressing plate 112. It should be noted that parameters such as the spacing between the spring pins 120 in a row on the pressing plate 112 can be adjusted by those skilled in the art to suit different models of intracranial electrodes under test, based on the spacing and number of electrode contacts 11. No restrictions are imposed here.

[0068] Another point to note is that, as described above, the spacing between the metal detectors 119 and spring pins 120 in this embodiment is consistent with the spacing between the electrode contacts 11 on the intracranial brain electrodes that extend into the electrode insertion holes 118. In fact, if multiple metal detectors 119 are only placed on the side of the lower pressing plate 113 facing the upper pressing plate 112 to contact the electrode contacts 11, or if multiple spring pins 120 are only placed on the side of the upper pressing plate 112 facing the mounting base plate 102 to contact the electrode contacts 11, contact between the detectors and the electrode contacts 11 can also be achieved. However, this could result in missed contact or a situation where contact appears to be made but is not actually complete, causing the external resistance meter to fail to display the resistance values ​​corresponding to some channels in the multi-channel intracranial brain electrode system.

[0069] Therefore, in order to avoid this situation, such as Figure 12 As shown, the embodiments of this application employ a technical solution in which contact elements are provided on both the upper pressing plate 112 and the lower pressing plate 113. When the upper pressing plate 112 and the lower pressing plate 113 are pressed together, the upper and lower contact elements can simultaneously contact each electrode contact 11 that extends into the electrode insertion hole 118. The advantage of this is that even if the multiple metal detection elements 119 on the lower pressing plate 113 do not fully contact some electrode contacts 11, the multiple spring pins 120 on the upper pressing plate 112 can ensure contact with these electrode contacts 11, thereby further increasing contact stability and greatly reducing the error rate of actual problems such as missed contact or apparent contact but actual incomplete contact.

[0070] In another embodiment of this application, the upper pressing plate 112 has an accommodating space and an electrical signal acquisition main board 121. The electrical signal acquisition main board 121 is electrically connected to the spring pin 120. The side of the upper pressing plate 112 facing the mounting top plate 103 has a first socket 122, which is electrically connected to the electrical signal acquisition main board 121. The bottom surface of the mounting base plate 102 has a second socket 123, which is electrically connected to the metal detection component 119. The first socket 122 and the second socket 123 are connected by a second ribbon cable 124.

[0071] Specifically, in this embodiment, the upper pressing plate 112 has an internal accommodating space. An electrical signal acquisition main board 121 (not shown in the attached figure) can be installed within this space. In this embodiment, the electrical signal acquisition main board 121 is electrically connected to the spring pins 120 at the lower end of the upper pressing plate 112. Specifically, each spring pin 120 is sequentially connected to the electrical signal acquisition main board 121 located inside the upper pressing plate 112 via a wire. Therefore, when each spring pin 120 contacts each electrode contact 11, the multiple electrical signals received by the electrical signal acquisition main board 121 are consistent according to the arrangement order of the electrode contacts 11. This ensures that the resistance values ​​corresponding to each channel of the intracranial brain electrode obtained subsequently will not be disordered. In other words, since the arrangement order of the multiple channels in the complete path from the electrode contacts to the external resistance meter is always consistent, the external resistance meter can accurately display the resistance value corresponding to each channel, and thus accurately measure which specific channel of the intracranial brain electrode has an abnormal resistance value. This is something that those skilled in the art will understand, and will not be elaborated further here.

[0072] Furthermore, in this embodiment, such as Figure 6As shown, the upper pressing plate 112 has a first socket 122 on the side facing the mounting top plate 103. The first socket 122 is electrically connected to the electrical signal acquisition main board 121 inside the upper pressing plate 112. The bottom surface of the mounting base plate 102 is fixedly provided with a second socket 123. The second socket 123 is also electrically connected to the multiple metal detection elements 119 on the boss 117 in sequence through their respective connecting wires. Furthermore, in this embodiment, the first socket 122 and the second socket 123 are connected by a second ribbon cable 124. The advantage of doing so is that, by using the second ribbon cable 124 to connect the first socket 122 and the second socket 123 in front of the first testing device 100, the second ribbon cable 124 in this embodiment can connect the multiple metal detection elements 119 on the lower pressing plate 113 and the multiple electrode contacts 11 that are respectively contacted by the multiple spring pins 120 on the upper pressing plate 112 in series. In simple terms, for example, even if the multiple metal detectors 119 on the lower pressing plate 113 are not in complete contact with some electrode contacts 11, as long as the multiple spring pins 120 on the upper pressing plate 112 are in contact with these electrode contacts 11, it will not affect the measurement of the resistance value of the corresponding channel of these electrode contacts. In this way, it can be ensured that each electrode contact 11 is in contact with at least one of the corresponding metal detectors 119 or spring pins 120, and this will not affect the measurement of the resistance value of the corresponding channel of any electrode contact. The advantage of this is that it can greatly increase the success rate of measuring the multi-channel resistance value of all electrode contacts 11 on the intracranial brain electrode. In some other embodiments of this application, the tester can adjust the arrangement parameters of the multiple metal detectors and multiple spring pins in this testing device according to the arrangement parameters, spacing distance, contact width, and other parameters of the multiple electrode contacts of the intracranial brain electrode to be tested, so as to adapt to intracranial brain electrodes of different models and different numbers of channels and test their multi-channel resistance values. This is something that those skilled in the art will understand, and will not be elaborated further here.

[0073] In this embodiment, multiple metal detectors 119 can be electrically connected to a second socket 123 via their respective wires. The second socket 123 is connected to a first socket 122 via a second ribbon cable 124. The first socket 122 is also electrically connected to an electrical signal acquisition mainboard 121 located within the pressing plate 112. Therefore, the multiple metal detectors 119 are indirectly connected to the electrical signal acquisition mainboard 121. Based on this, since multiple spring pins 120 are also connected to the electrical signal acquisition mainboard 121, the electrode contacts 11 connected to the multiple spring pins 120 and the electrode contacts 11 connected to the multiple metal detectors 119 are actually both connected to the electrical signal acquisition mainboard 121. In other words, in this embodiment, the electrical signal acquisition mainboard 121 can form a path through multiple spring pins 120 and multiple electrode contacts 11, or it can form a path through multiple metal detectors 119 and multiple electrode contacts 11. For example, if during the detection process, a spring pin 120 does not make complete contact with the corresponding electrode contact 11, then because the metal detection element 119 at the corresponding position makes complete contact with the electrode contact 11, the electrical signal acquisition motherboard 121 can still connect with the electrode contact 11 and measure the resistance value of its corresponding path. This is something that those skilled in the art will understand, and will not be elaborated further here.

[0074] In this embodiment, as Figures 2 to 6 As shown, a wiring cover 125 is also screwed and fixed to the mounting base plate 102. The wiring cover 125 is mounted on one side of the electrical signal acquisition main board 121 on the mounting base plate 104 and located behind the pressing upper plate 112. The wiring cover 125 has an opening on one side facing the pressing upper plate 112. The pressing upper plate 112 has a main board output port 127 on the side facing the wiring cover 125. The main board output port 127 is electrically connected to the electrical signal acquisition main board 121. The main board output port 127 is connected to multiple wires. The multiple wires sequentially form a path with each channel of the electrode contacts. The multiple wires enter from the opening of the wiring cover 125 and converge inside the wiring cover 125 before connecting to the first row of wires 101 located on the back of the wiring cover. The other end of the first row of wires 101 is then electrically connected to the resistance testing main board 300. The wiring process here is understandable to those skilled in the art and will not be described in detail here.

[0075] In addition, in some other embodiments of this application, the spring pin 120 and the metal detection element 119 in this application can be set as gold-plated copper parts. Gold-plated copper parts have advantages such as good conductivity, greater stability, corrosion resistance, and accurate resistance measurement.

[0076] In another embodiment of this application, the second testing device further includes a base plate 202, and a docking module 203 is disposed on the base plate 202. The docking module 203 includes a docking socket 201, a docking receptacle 204 that matches the connection port 12, and a quick-release component 207. The docking socket 201 is disposed at one end of the docking module 203, and the docking receptacle 204 and the quick-release component 207 are disposed at the other end.

[0077] Specifically, such as Figures 8 to 9 As shown, the second testing device 200 includes a base plate 202 and a docking module 203 disposed on the base plate 202. Figure 9 As shown, the docking port 201 can be located at one end of the docking module 203. The docking port 201 on the docking module 203 can be connected to a resistance testing motherboard 300 via a first ribbon cable 101. The other end of the docking module 203 can be provided with a docking socket 204 that matches the connection port 12 and a quick-release component 207. When the intracranial brain electrode is testing resistance, the front electrode 10 at one end of the intracranial brain electrode is connected to the first testing device 100, and the connection port 12 at the other end can be docked with the docking socket 204 on the second testing device 200 to form a circuit. A quick-release component 207 is also provided on the side of the docking socket 204 away from the docking port 201. The quick-release component 207 can quickly and effectively detach the connection port 12 and the docking socket 204 of the intracranial brain electrode after the intracranial brain electrode test is completed, eliminating the tedious and laborious process of manually detaching or using a pry tool.

[0078] In some other embodiments of this application, the docking socket 204 has a groove 205 and a first extension 206 on both sides. The quick ejection assembly 207 includes a push rod 208 and a scooping assembly 209 connected to the push rod 208. A spring 210 is provided between the push rod 208 and the first extension 206. The scooping assembly 209 can slide within the groove 205. The front scoop head 211 of the scooping assembly 209 is sloped.

[0079] Specifically, such as Figure 9As shown, slots 205 can be provided on both sides of the docking socket 204. First extensions 206 can be provided on the outer sides of the slots 205 on both sides. The quick-release assembly 207 includes a push rod 208 and two scraper assemblies 209 connected to the push rod 208 and distributed on both sides. The scraper assemblies 209 can be located on the side of the push rod 208 facing the docking socket 204. A spring member 210 can be provided between the push rod 208 and the two first extensions 206. The spring member 210 includes a connecting post 213 and a spring sleeved on the connecting post 213. Through holes are provided at both ends of the push rod 208. One end of the connecting post 213 on both sides is fixedly connected to the first extension 206, and the other end of the connecting post 213 passes through the through holes at both ends of the push rod 208. Two limiting posts 212 are provided on the side of the push rod 208 away from the spring. The limiting posts 212 are fixedly mounted on the base plate 202 and located behind both ends of the push rod 208. The limiting post 212 is used to prevent the push rod 208 from disengaging from the spring 210.

[0080] like Figures 9 to 11 As shown, the front shovel heads 211 of the two shovel components 209 can be positioned within the groove 205 when the push rod 208 is not pushed (the spring 210 is in a fully relaxed state). At this time, the limiting post 212 can hold the two ends of the push rod 208, preventing the push rod 208 from disengaging from the spring 210. In this application, the connection port 12 and the docking socket 204 of the intracranial brain electrode are... Figure 2 In the docking state shown, the connection port 12 covers the area of ​​the docking socket 204 and the two end grooves 205. In reality, there is a gap at the bottom of the connection port 12; that is, the plane containing the bottom of the connection port 12 does not contact the bottom surface of the groove 205. Therefore, after the intracranial brain electrode test is completed, if the tester intends to detach the connection port 12 and the docking socket 204, the tester can push the push rod 208 horizontally towards the docking socket 204. The push rod 208 moves inward along the connecting post 213, the spring 210 is compressed, and the scooping assembly 209 can slide within the groove 205 towards the docking socket 204. In this embodiment, the front scoop head 211 of the scooping assembly 209 can be configured as follows: Figure 11 The slope shape shown facilitates the insertion into the gap between the connection port 12 and the bottom surface of the groove 205 to detach the connection port 12 of the intracranial brain electrode, which is in the docking state, thereby quickly separating the connection port 12 of the intracranial brain electrode from the docking socket 204.

[0081] In summary, the intracranial brain electrode resistance testing device 1000 provided in this application embodiment has at least the following beneficial effects: it enables convenient and effective multi-channel resistance testing of intracranial brain electrodes, requiring only one connection at both ends to quickly measure the resistance values ​​corresponding to each channel within the intracranial brain electrode, offering advantages such as convenience, speed, accuracy, and efficiency; the arrangement parameters of the metal detection components and spring components can be adjusted to adapt to different models of intracranial brain electrodes and test their multi-channel resistance values; detection components are respectively set on the upper and lower pressing plates, doubly ensuring complete contact of all electrode contacts of the intracranial brain electrode, greatly improving the stability of multi-channel resistance testing and avoiding the problem of inaccurate resistance values ​​measured due to incomplete contact with the electrodes when manually testing contacts with a multimeter; finally, it greatly reduces labor costs, eliminates cumbersome testing procedures, and eliminates the need for manual connection and testing of each channel within the intracranial brain electrode, significantly improving testing efficiency.

[0082] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. An intracranial brain electrode resistance testing device, used to test the multi-channel resistance value of intracranial brain electrodes, wherein the intracranial brain electrode to be tested includes a front electrode component and a connection port, characterized in that, include: A first testing device is used to fix and connect at least one electrode contact on the front-end electrode component; The second testing device includes a docking module for fixing multiple connection terminals within the connection port through the docking module. A resistance testing motherboard is provided, wherein the first testing device and the second testing device are respectively connected to the resistance testing motherboard via a first ribbon cable. The resistance testing motherboard includes an access device interface, wherein the access device interface corresponding to the first testing device and the access device interface corresponding to the second testing device are respectively connected to an external resistance tester and form a path, so that the resistance tester displays the multi-channel resistance value of the intracranial brain electrode to be tested.

2. The intracranial brain electrode resistance testing device according to claim 1, characterized in that, The first testing device includes a mounting base plate, a mounting top plate, and a mounting base plate vertically disposed on the mounting base plate. A pressing upper plate and a pressing lower plate are disposed between the mounting top plate and the mounting base plate, and the pressing lower plate is fixedly connected to the mounting base plate.

3. The intracranial brain electrode resistance testing device according to claim 2, characterized in that, The mounting top plate, mounting bottom plate, and pressing upper plate are all provided with corresponding mounting holes on both sides. The first testing device also includes two guide rods and two linear bearings. The guide rods pass through the mounting holes on one side of the pressing upper plate and a single linear bearing fixedly located below the pressing upper plate. The two ends of the guide rods are fixedly connected to the mounting holes on the corresponding sides of the mounting top plate and the mounting bottom plate, respectively.

4. The intracranial brain electrode resistance testing device according to claim 3, characterized in that, The mounting base is fixedly provided with a mounting component, a fixing seat, a lifting handle connected to the mounting component, a crank connected to the lifting handle, and a linkage push rod connected to the crank. The fixing seat includes a bent component and a sleeve. The sleeve passes through a through hole on the upper surface of the mounting top plate. The linkage push rod extends into the sleeve and is connected to a mounting piece fixed on the side of the pressing upper plate facing the mounting top plate, so that the pressing upper plate slides up and down along the guide rod under the drive of the lifting handle.

5. The intracranial brain electrode resistance testing device according to claim 4, characterized in that, The lower pressing plate has a boss on the side facing the upper pressing plate. The boss has an electrode insertion hole on the side facing the guide rod. The side of the boss away from the mounting base plate has a receiving space. The receiving space contains a plurality of metal detection elements. The metal detection elements contact each electrode contact that extends into the electrode insertion hole. And / or the upper pressing plate has a plurality of spring pins on the side facing the mounting base plate. When the upper pressing plate and the lower pressing plate are pressed together, the spring pins contact each electrode contact that extends into the electrode insertion hole. The arrangement gap between each metal detection element or spring pin is consistent with the arrangement gap between each electrode contact.

6. The intracranial brain electrode resistance testing device according to claim 5, characterized in that, The upper pressing plate has an internal accommodating space and an electrical signal acquisition main board. The electrical signal acquisition main board is electrically connected to the spring pin. The side of the upper pressing plate facing the mounting top plate has a first socket, which is electrically connected to the electrical signal acquisition main board. The bottom surface of the mounting base plate has a second socket, which is electrically connected to the metal detection component. The first socket and the second socket are connected by a second ribbon cable.

7. The intracranial brain electrode resistance testing device according to claim 6, characterized in that, The spring needle and the metal detection component are gold-plated copper parts.

8. The intracranial brain electrode resistance testing device according to claim 7, characterized in that, The second testing device also includes a base plate, and the docking module is disposed on the base plate. The docking module includes a docking port, a docking socket that matches the connection port, and a quick-release component. The docking port is disposed at one end of the docking module, and the docking socket and the quick-release component are disposed at the other end of the docking module.

9. The intracranial brain electrode resistance testing device according to claim 8, characterized in that, Both sides of the docking socket are provided with grooves and first extensions. The quick ejection assembly includes a push rod and a scooping assembly connected to the push rod. A spring is provided between the push rod and the first extension. The scooping assembly can slide within the groove.

10. The intracranial brain electrode resistance testing device according to claim 9, characterized in that, The front end of the shovel assembly is sloped.

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