An automatic testing device applied to a mobile phone interface board

Abstract

This utility model provides an automatic testing device for mobile phone interface boards, including a base with an electronic control module inside. The device also includes a front substrate and a rear substrate. The front substrate is fixedly mounted on the base, and the rear substrate connects to the front substrate and covers the base. A lifting pressure plate assembly is also provided on the front substrate. The lifting pressure plate assembly has a pressure plate module and controls the lifting and lowering of the pressure plate module. A testing module is also provided on the front substrate, located below the pressure plate module. The tester places the product on the carrier board and, after confirming the correct placement orientation, the lifting pressure plate assembly drives the pressure plate module to press down, causing the upper probe plate to contact the product. Subsequently, the side insertion module operates, inserting the Type-C adapter and the SIM card adapter into their respective interfaces, and the test begins. After the test is completed, the marker module automatically marks the product, the side insertion module retracts, the pressure plate module rises, the tester removes the product, and the cycle begins again.

Description

Technical Field

[0001] This utility model relates to the field of electronic product testing equipment technology, and in particular to an automatic testing device for mobile phone interface boards. Background Technology

[0002] With the increasing demand for 5G communication, high-speed charging, and multi-functional expansion, the number and integration of connectors (USB-C, Lightning, BTB, FPC, etc. interface boards) on mobile phone motherboards are constantly improving. For mobile phone interface boards, integrating both a Type-C female connector and a SIM card tray has become the mainstream design for mid-to-high-end models. To ensure the overall yield rate, the interface boards must undergo functional testing after manufacturing.

[0003] Traditional testing methods are mostly manual, with testers repeatedly inserting and removing Micro-USB / USB-C male connectors or ribbon cables by hand. The average testing time for a single item exceeds 15 seconds, and secondary damage such as misaligned insertion, bent pins, etc., is prone to occur. This manual insertion and removal method is not only time-consuming and inefficient, but also requires a high level of skill from the testers.

[0004] Existing automated testing equipment typically uses motors or cylinders to directly drive the insertion module, resulting in numerous components, complex structures, large space requirements, and high equipment costs. Furthermore, this type of equipment often lacks versatility, with significant differences in interface positions and depths between different models. Traditional fixtures are often "one machine, one mold," requiring the entire fixture to be scrapped or redesigned during model changes, leading to excessively long new product introduction cycles. Its main drawbacks include: 1. The equipment is large in size, occupies a lot of design space, and has high production costs; 2. Poor versatility; different models require the replacement of the entire set of fixtures, resulting in low reuse rate; 3. The testing is highly limited; the Type-C interface and SIM card slot cannot be tested independently. 4. The structure is complex, making maintenance and upgrades inconvenient.

[0005] Therefore, there is an urgent need for an automatic testing device for mobile phone interface boards that is compact, highly versatile, and easy to replace and maintain. Utility Model Content

[0006] The purpose of this utility model is to provide an automatic testing device for mobile phone interface boards, so as to solve the problems of existing equipment being large in size, poor in versatility, strong functional limitations, and complex in structure.

[0007] To achieve the above objectives, the technical solution of this utility model is as follows: An automatic testing device for mobile phone interface boards includes a base, within which an electronic control module is installed. The device also includes a front substrate and a rear substrate, with the front substrate fixedly mounted on the base and the rear substrate connecting to and covering the front substrate. A lifting pressure plate assembly is provided on the front substrate, and a pressure plate module is provided on the lifting pressure plate assembly, which controls the lifting and lowering of the pressure plate module. A testing module is also provided on the front substrate, located below the pressure plate module.

[0008] Preferably, the lifting pressure plate assembly includes a pressing cylinder, a gantry frame, a setting platform, and an electrically controlled horn; the gantry frame is fixedly mounted on the front base plate, and its left and right supports are provided with slide rails on their inner sides; the setting platform is slidably connected between the gantry frame supports by a slider; the upper crossbeam of the gantry frame is provided with a pressing cylinder with its output shaft pointing downwards, and the output shaft is connected to the setting platform to drive the setting platform to move up and down.

[0009] Preferably, the pressure plate module includes a connecting plate, a pressure iron lifting module, a marker lifting module, an upper pressure plate, and an upper needle plate; the connecting plate is bolted to the setting platform; the upper pressure plate is bolted to the connecting plate, and the upper pressure plate is provided with an interface plate placement groove and a probe through hole, the upper needle plate is located on the upper pressure plate, and the probe contacts the mobile phone interface plate through the through hole.

[0010] Preferably, the test module includes a carrier board module, a side insertion module, and a test board; the carrier board module includes a lower needle plate and a carrier board component, which are sequentially arranged on the test board; the carrier board component is provided with an interface board under placement groove and a probe through hole, and the probe of the lower needle plate contacts the interface board through the through hole; the side insertion module is located on the side of the carrier board module.

[0011] Preferably, the side insertion module includes a Type-C adapter plate, a SIM card adapter plate, and a drive slider; there are two sets of drive sliders, which are slidably connected to the test board via guide rails and are equipped with corresponding adapter plates; the drive sliders are driven by drive cylinders and can complete the insertion force action individually or simultaneously; the drive sliders may also be equipped with side detection micro-needles for detecting the side function of the interface board.

[0012] Preferably, the probe is a spring-loaded probe to ensure contact stability during testing and reduce impact damage.

[0013] Preferably, the platform is also equipped with an electrically controlled horn to issue a warning sound during the pressing or operation process to prevent worker injury.

[0014] Preferably, the connecting plate is further provided with a pressure iron lifting module and a marker lifting module; The pressure iron lifting module and the marker lifting module both include a set of lifting cylinders, which drive the corresponding pressure iron and marker to lift and lower; and the upper pressure plate is also provided with corresponding pressure iron through holes and marker through holes.

[0015] The marker lifting module drives the marker to descend and mark the interface plate after inspection. The pressure plate lifting module is driven by a lifting cylinder, which briefly presses down during demolding to prevent the interface plate from rising with the upper pressure plate. Beneficial effects

[0016] Compared with the prior art, the present invention has the following advantages: 1. Small size and high integration: The overall structure is compact, occupies little space, and reduces production costs; 2. High versatility: Adopting a common platform design, different models can be reused simply by replacing the relevant test modules, improving fixture utilization; 3. Flexible functionality: The side-mounted module adopts a dual-slide rail, dual-cylinder structure design, allowing the Type-C interface and SIM card slot to be tested simultaneously or separately; 4. Convenient maintenance and upgrades: The quick-release structure design allows for the replacement of the pressure plate module or test module by loosening only a few screws, shortening the maintenance cycle; 5. High testing accuracy: The carrier plate limiting structure is customized according to the product shape to prevent incorrect placement; the cylinder has a buffer design to effectively reduce the impact of downward pressure. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the device in this embodiment; Figure 2 This is a schematic diagram of the lifting pressure plate assembly structure in this embodiment; Figure 3 This is a schematic diagram of the pressure plate module structure in this embodiment; Figure 4 This is a schematic diagram of the bottom structure of the pressure plate module in this embodiment. Figure 5 This is a schematic diagram of the test module structure in this embodiment; Figure 6 This is a schematic diagram of the side-insertion module structure in this embodiment. Detailed Implementation

[0018] The present invention will now be described in detail with reference to the accompanying drawings. Example

[0019] like Figure 1-6 As shown, an automatic testing device for mobile phone interface boards includes a base 1, and an electrical control module is provided inside the base 1. The device is characterized in that it further includes a front substrate 2 and a rear substrate 3. The front substrate 2 is fixedly mounted on the base 1, and the rear substrate 3 is connected to the front substrate 2 and covers the base 1. The front base plate 2 is also provided with a lifting pressure plate assembly 4; The lifting pressure plate assembly 4 is equipped with a pressure plate module 5 and controls the lifting and lowering of the pressure plate module 5. The front substrate 2 is also provided with a test module 7, which is located below the pressure plate module 5.

[0020] Preferably, the lifting pressure plate assembly 4 includes a pressing cylinder 401, a gantry frame 402, a setting platform 403, and an electrically controlled horn; The gantry frame 402 is fixedly mounted on the front base plate 2. The inner sides of the left and right supports of the gantry frame 402 are equipped with slide rails. The mounting platform 403 is slidably connected between the inner sides of the left and right supports of the gantry frame 402 by a slider. The upper crossbeam of the gantry 402 is equipped with a downward-sloping cylinder 401 with its output shaft oriented downwards. The output shaft of the downward-sloping cylinder 401 is connected to a mounting platform 403, which slides up and down under the drive of the downward-sloping cylinder 401. In this embodiment, the downward-sloping cylinder 401 is a buffered type, providing downward pressure buffer protection.

[0021] Preferably, the mounting platform 403 is also equipped with an electronically controlled speaker.

[0022] Preferably, the pressure plate module 5 includes a connecting plate 501, a pressure iron lifting module 502, a marker lifting module 503, an upper pressure plate 504, and an upper needle plate 505. The connecting plate 501 is bolted to the mounting platform 403; An upper pressure plate 504 is bolted to the connecting plate 501. The upper pressure plate 504 has an interface plate placement groove 506 and an upper needle plate 505. The upper pressure plate 504 also has a probe through hole. The probe of the upper needle plate 505 contacts the mobile phone interface plate through the probe through hole.

[0023] Preferably, the connecting plate 501 is also provided with a pressure iron lifting module 502 and a marker pen lifting module 503; Both the pressure iron lifting module 502 and the marker pen lifting module 503 include a set of lifting cylinders 6, which drive the corresponding pressure iron 502a and marker pen 503a to lift and lower; and the upper pressure plate 504 is also provided with corresponding through holes for pressure iron 502a and marker pen 503a.

[0024] Preferably, the test module 7 includes a carrier board module 701, a side-insertion module 702, and a test board 703; The upper pressure plate 504 and the test plate 703 are also provided with mutually cooperating positioning pins and positioning holes.

[0025] Both the carrier module 701 and the side insertion module 702 are mounted on the test board 703; The side-insertion module 702 is located on the side of the carrier module 701; The carrier plate module 701 includes a lower needle plate 701a and a carrier plate component 701b corresponding to the upper pressure plate 504; The lower needle plate 701a and the carrier plate 701b are sequentially arranged on the test plate 703. The carrier plate 701b has an interface board placement groove 701c and a probe through hole. The probe of the lower needle plate 701a contacts the mobile phone interface plate through the probe through hole.

[0026] Preferably, the side-insertion module 702 includes a Type-C adapter 702a, a SIM card adapter 702b, and a drive slider 702c; Two sets of drive sliders 702c are provided, which are slidably connected to the test board 703 via guide rails; The drive slider 702c is equipped with a Type-C converter plate 702a and a SIM card converter plate 702b respectively.

[0027] Preferably, the side insertion module 702 also includes a drive cylinder 702d, and the drive slider 702c slides relative to the test plate 703 through a set of drive cylinders 702d.

[0028] Preferably, the side insertion module 702 also includes a side detection microneedle 702e; The side-detecting microneedle 702e is mounted on one or two sets of drive sliders 702c.

[0029] Preferably, all probes are spring-buffered probes. Spring-buffered probes are a use of existing technology, and their fine structure will not be explained here.

[0030] The carrier module 701 consists of a lower pin plate 701a and a carrier plate component 701b. The carrier plate component 701b has an interface board placement slot and a probe through hole. The probe of the lower pin plate 701a contacts the bottom of the interface board. The side insertion module 702 adopts a dual slide rail and dual cylinder structure. The Type-C adapter and SIM card adapter are installed on the drive slider 702c, which can be inserted into the interface separately or simultaneously for functional testing. The drive slider 702c also has a side probe micro-needle 702e for extended testing.

[0031] During the testing process, the tester places the product on the carrier board 701b. After confirming that the placement direction is correct, the lifting pressure plate assembly 4 drives the pressure plate module 5 to press down, so that the upper needle plate 505 probe contacts the product. Then, the side insertion module 702 is activated, and the Type-C adapter and SIM card adapter are inserted into the corresponding interfaces, and the test begins. After the test is completed, the marker pen 503a module automatically marks the product, the pressure plate module 5 rises, the side insertion module 702 retracts, the tester removes the product, and the cycle begins again.

[0032] In this embodiment, each drive component is connected and electrically controlled by an electronic control module located in the base 1. The connection method of the rear base plate 3 facilitates subsequent opening for reconnection, inspection and maintenance of the internal electronic control.

[0033] This embodiment has a reasonable structure, which ensures that the testing process is efficient and reliable, and facilitates product replacement and maintenance upgrades.

[0034] The above is a detailed description of the present invention in conjunction with specific embodiments, and it should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, any equivalent substitutions or obvious modifications made without departing from the concept of the present invention, and which have the same performance or use, should be considered as falling within the patent protection scope defined by the submitted claims.

Claims

1. An automatic testing device applied to a mobile phone interface board, comprising a base, an electric control module is arranged in the base, characterized in that: The device also comprises a front base plate and a rear base plate; The front base plate is fixedly arranged on the base, and the rear base plate is connected with the front base plate and covers the base; The front base plate is also provided with a lifting pressure plate assembly; The lifting pressure plate assembly is provided with a pressure plate module and controls the lifting of the pressure plate module; The front base plate is also provided with a test module, which is located below the pressure plate module.

2. The automatic testing device applied to the interface board of the mobile phone according to claim 1, characterized in that: The lifting pressure plate assembly comprises a downward pressure cylinder, a gantry and a setting table; The gantry is fixedly arranged on the front base plate, and the inner sides of the left and right supports of the gantry are provided with sliding rails, and the setting table is slidingly connected between the inner sides of the left and right supports of the gantry through sliding blocks; The upper beam of the gantry is provided with a downward pressure cylinder, and the output shaft of the downward pressure cylinder is connected with the setting table, and the setting table slides up and down under the driving of the downward pressure cylinder.

3. The automatic testing device applied to the interface board of the mobile phone according to claim 2, characterized in that: The setting table is also provided with an electrically controlled horn.

4. The automatic testing device applied to the interface board of the mobile phone according to claim 3, characterized in that: The pressure plate module comprises a connecting plate, an upper pressure plate and an upper needle plate; The connecting plate is bolted with the setting table; The connecting plate is bolted with the upper pressure plate, and the upper pressure plate is provided with an interface plate placing groove, and the upper pressure plate is provided with an upper needle plate, and the upper pressure plate is also provided with a probe passing hole, and the probe of the upper needle plate contacts the interface plate of the mobile phone through the probe passing hole.

5. The automatic testing device applied to the interface board of the mobile phone according to claim 4, characterized in that: The connecting plate is also provided with a pressure iron lifting module and a marker pen lifting module; The pressure iron lifting module and the marker pen lifting module each comprise a group of lifting cylinders, and each lifting cylinder drives the corresponding pressure iron and marker pen to lift; and the upper pressure plate is also provided with corresponding pressure iron passing holes and marker pen passing holes.

6. The automatic testing device applied to the interface board of the mobile phone according to claim 5, characterized in that: The test module comprises a carrier plate module, a side insertion module and a test plate; The carrier plate module and the side insertion module are arranged on the test plate; The side insertion module is located at the side of the carrier plate module; The carrier plate module comprises a lower needle plate and a carrier plate corresponding to the upper pressure plate; The lower needle plate and the carrier plate are arranged on the test plate in sequence, the carrier plate is provided with an interface plate lower placing groove, and the carrier plate is also provided with a probe passing hole, and the probe of the lower needle plate contacts the interface plate of the mobile phone through the probe passing hole.

7. The automatic testing device applied to the interface board of the mobile phone according to claim 6, characterized in that: The side insertion module comprises a Type-C conversion plate, a SIM card conversion plate and a driving sliding block; The driving sliding block is provided with two groups, which are slidingly connected on the test plate through guide rails respectively; The driving sliding block is provided with a Type-C conversion plate and a SIM card conversion plate respectively.

8. The automatic testing device applied to the interface board of the mobile phone according to claim 7, characterized in that: The side insertion module further comprises a driving cylinder, and the driving sliding block slides relative to the test plate through a group of driving cylinders.

9. The automatic testing device applied to the interface board of the mobile phone according to claim 8, characterized in that: The side insertion module further comprises a side detection microneedle; The side detection microneedle is arranged on one or two groups of driving sliding blocks.

10. The automatic testing device applied to the interface board of the mobile phone according to claim 9, characterized in that: The probe is a spring buffer probe.

Images