Single-layer mechanical sodimm module

Abstract

The utility model relates to PCBA board SODIMM card slot card test technical field, concretely is a single -layer mechanical type SODIMM module, including module body, the module body includes the carrier plate, upper needle plate and PCBA board, the upper needle plate is provided with in the top of carrier plate, the surface of PCBA board is placed at the top position of carrier plate, the module body still includes module mounting plate, fixed pressure block, spring, movable peg, guide slot, torsional spring and SODIMM card, the surface of fixed pressure block bottom position department is provided with SODIMM card. The utility model makes the module use time can solve the low efficiency and artificial cost increase and so on when manually inserting SODIMM card test, makes the test efficiency higher when the module uses.

Description

Technical Field

[0001] This utility model relates to the field of SODIMM card slot insertion and testing technology on PCBA boards, specifically a single-layer mechanical SODIMM module. Background Technology

[0002] SODIMM slot testing on PCBs is a critical step in ensuring their performance and reliability, detecting physical defects, verifying electrical performance, and ensuring compatibility. However, current SODIMM slot testing on PCBAs is done manually, which is inefficient. To meet market needs, a single-layer mechanical SODIMM module is required.

[0003] The existing SODIMM modules are not efficient enough during testing, which affects the overall testing efficiency. This means that the modules cannot solve the problems of low efficiency and increased labor costs when manually inserting SODIMM cards for testing, thus reducing the overall testing efficiency of the modules during use. Utility Model Content

[0004] The purpose of this invention is to provide a single-layer mechanical SODIMM module to solve the problem of insufficient testing efficiency when using SODIMM modules as mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a single-layer mechanical SODIMM module, comprising a module body, the module body including a carrier plate, an upper pin plate and a PCBA board, the upper pin plate being disposed above the carrier plate, the PCBA board being placed on the surface of the top position of the carrier plate, the module body further including a module mounting plate, a fixing block, a spring, a movable pin, a guide groove, a torsion spring and an SODIMM adapter, the SODIMM adapter being disposed on the surface of the bottom position of the fixing block.

[0006] Preferably, a module mounting plate is installed on the surface at the bottom of the upper needle plate, a fixing block is provided on the surface of the module mounting plate, a connecting frame is provided on the surface of the fixing block, a connecting plate is provided on the surface of the fixing block, and two sets of movable pins are installed on the surface of the fixing block.

[0007] Preferably, the surface of the connecting plate is provided with a guide groove for cooperating with the movable pin, the guide groove and the surface of the movable pin are slidably engaged, and a torsion spring is installed on the surface of the fixing block, one end of the torsion spring being fixed to the inner wall of the connecting frame.

[0008] Preferably, the surface array of the fixed pressure block is equipped with multiple sets of springs, one end of each spring is fixed to the inner wall of the connecting frame, and the surface of the PCBA board is provided with an SODIMM connector, which is located below the SODIMM adapter card.

[0009] Preferably, an SODIMM test card is mounted on the surface of the fixed pressure block, and a chamfered groove is formed on the surface of the SODIMM test card at the center of one side.

[0010] Preferably, the SODIMM connector has rounded corner blocks mounted on its surface, and the rounded corner blocks engage with the surface of the chamfered C-groove.

[0011] Compared with the prior art, the beneficial effects of this utility model are: the single-layer mechanical SODIMM module can solve the defects of low efficiency and increased labor costs when manually inserting SODIMM cards for testing, making the module more efficient in testing.

[0012] With the carrier board, fixing blocks, and SODIMM adapter cards in place, the bottom of the PCBA board moves into the positioning slot. Initially, the module mounting plate is fixed on the upper pin plate, and the right-side fixing blocks simultaneously contact the SODIMM connector on the PCBA board surface. When the carrier board moves vertically upward, it drives the SODIMM connector to move. The chamfered C-shaped groove on the surface of the SODIMM adapter card contacts and guides the rounded corner block on the surface of the SODIMM connector. After the rounded corner block and the chamfered C-shaped groove are aligned, the carrier board continues to rise, and the SODIMM adapter card is fully inserted into the SODIMM connector, beginning the process of installing the SODIMM connector. During the IMM connector test, the movable pin moves horizontally inside the guide groove. After the test, the bottom TAU drives the carrier plate downward, separating the SODIMM connector and SODIMM adapter. At this time, the rounded corner block moves away from the inside of the chamfered C-corner groove. The test ends, and the fixing block, SODIMM adapter, and SODIMM test card are reset by torsion springs and springs. This achieves the function of high-efficiency module testing, thereby solving the defects of low efficiency and increased labor costs when manually inserting SODIMM cards for testing, making the module more efficient in use. Attached Figure Description

[0013] Figure 1 This is a three-dimensional exploded structural diagram of the present invention;

[0014] Figure 2 This is a schematic diagram of the initial state structure of the product of this utility model;

[0015] Figure 3 This is a schematic diagram of the product's working state structure according to this utility model;

[0016] Figure 4 This is a three-dimensional exploded structural diagram of the present invention;

[0017] Figure 5 This is an enlarged structural schematic diagram of the SODIMM adapter card and SODIMM connector of this utility model under test conditions.

[0018] In the diagram: 1. Module body; 10. Carrier plate; 101. Fixing block; 102. Connecting frame; 11. Upper pin plate; 12. PCBA board; 13. Spring; 14. SODIMM adapter; 15. Movable pin; 16. Guide groove; 17. Module mounting plate; 18. Connecting plate; 19. SODIMM connector; 110. SODIMM test card; 111. Chamfered corner groove; 112. Rounded corner block; 113. Torsion spring. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. In addition, the terms "first", "second", "third", "upper", "lower", "left", "right", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance. At the same time, in the description of the present utility model, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0020] This utility model provides a structure for a single-layer mechanical SODIMM module, as follows: Figures 1 to 5As shown, the module includes a module body 1, which comprises a carrier plate 10, an upper pin plate 11, and a PCBA board 12. The upper pin plate 11 is positioned above the carrier plate 10, and the PCBA board 12 is placed on the top surface of the carrier plate 10. The module body 1 also includes a module mounting plate 17, a fixing block 101, a spring 13, movable pins 15, a guide groove 16, a torsion spring 113, and a SODIMM adapter 14. The module mounting plate 17 is mounted on the bottom surface of the upper pin plate 11, and the fixing block 101 is mounted on the surface of the module mounting plate 17. A connecting frame 102 is mounted on the surface of the fixing block 101, and the connecting frame 102 cooperates with the fixing block 101. A connecting plate 18 is mounted on the surface of the fixing block 101, and two sets of movable pins 15 are mounted on the surface of the fixing block 101. A guide groove 16 is provided on the surface of the connecting plate 18 for cooperating with the movable pins 15. The guide groove 16 and the movable pin 15 slide against each other. A torsion spring 113 is installed on the surface of the fixed pressure block 101. One end of the torsion spring 113 is fixed to the inner wall of the connecting frame 102. An SODIMM adapter 14 is provided on the surface of the bottom of the fixed pressure block 101. Multiple sets of springs 13 are arrayed on the surface of the fixed pressure block 101. One end of the spring 13 is fixed to the inner wall of the connecting frame 102. An SODIMM connector 19 is provided on the surface of the PCBA board 12. The SODIMM connector 19 is located below the SODIMM adapter 14. An SODIMM test card 110 is installed on the surface of the fixed pressure block 101. A chamfered C-corner groove 111 is opened on the surface of the center position of one side of the SODIMM adapter 14. A rounded corner block 112 is installed on the surface of the SODIMM connector 19. The rounded corner block 112 and the surface of the chamfered C-corner groove 111 engage with each other.

[0021] During implementation, the PCBA board 12 to be tested is placed at a designated position on the surface of the carrier board 10. The module body 1 mainly consists of a mechanical linkage structure, utilizing a combination of spring 13, movable pin 15, guide groove 16, connecting plate 18, and torsion spring 113 to achieve the transformation of the structure from vertical to horizontal movement. In the initial state, the module mounting plate 17 is fixed on the upper pin plate 11, and is tilted by the action of spring 13. The right-side fixing pressure block 101 simultaneously contacts the SODIMM connector 19 on the surface of the PCBA board 12. When the carrier board 10 moves vertically upward, it drives the SODIMM connector 19 to move. The chamfered C-corner groove 111 on the surface of the SODIMM adapter 14 and the rounded corner block 11 on the surface of the SODIMM connector 19... After the rounded corner block 112 and the chamfered C-groove 111 are aligned, the carrier plate 10 continues to rise, and the SODIMM adapter 14 is fully inserted into the SODIMM connector 19 to begin testing. At this time, the movable pin 15 moves horizontally inside the guide groove 16. After the test, the bottom TAU drives the carrier plate 10 to move downward, causing the SODIMM connector 19 and the SODIMM adapter 14 to separate. At this time, the rounded corner block 112 moves away from the inside of the chamfered C-groove 111, and the test ends. The fixed pressure block 101, the SODIMM adapter 14 and the SODIMM test card 110 are reset by the torsion spring 113 and the spring 13 to achieve the function of high-efficiency module testing.

[0022] Working principle: In use, first place the module body 1 in the designated position, and place the PCBA board 12 to be tested in the designated position on the surface of the carrier board 10. The module body 1 is mainly a mechanical linkage structure. It uses the combination of spring 13, movable pin 15, guide groove 16, connecting plate 18 and torsion spring 113 to realize the transformation of the structure from vertical movement to horizontal movement. In the initial state, the module mounting plate 17 is fixed on the upper pin plate 11. Under the action of spring 13, it is tilted to a position of about 13.5° with the horizontal. The right side fixing pressure block 101 simultaneously contacts the SODIMM connector 19 on the surface of the PCBA board 12. When the carrier board 10 moves vertically upward, it drives the SODIMM connector 19 to move. The chamfered C-corner groove 111 on the surface of the SODIMM adapter 14 contacts and guides the rounded corner block 112 on the surface of the SODIMM connector 19. After alignment 11, the carrier plate 10 continues to rise, and the SODIMM adapter 14 is fully inserted into the SODIMM connector 19, starting the testing of the SODIMM connector 19. At this time, the movable pin 15 moves horizontally inside the guide groove 16. After the test, the bottom TAU drives the carrier plate 10 to move downward, causing the SODIMM connector 19 and the SODIMM adapter 14 to separate. At this time, the rounded corner block 112 moves away from the inside of the chamfered corner groove 111. The test ends, and the fixed pressure block 101, SODIMM adapter 14 and SODIMM test card 110 are reset by the torsion spring 113 and the spring 13 to realize the function of high-efficiency module testing. This solves the defects of low efficiency and increased labor costs when manually inserting SODIMM cards for testing, making the module more efficient in use and finally completing the use of the SODIMM module.

[0023] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A single-layer mechanical SODIMM module, comprising a module body (1), characterized in that: The module body (1) includes a carrier plate (10), an upper pin plate (11) and a PCBA board (12). The upper pin plate (11) is provided on the top of the carrier plate (10). The PCBA board (12) is placed on the surface of the top position of the carrier plate (10). The module body (1) also includes a module mounting plate (17), a fixing block (101), a spring (13), a movable pin (15), a guide groove (16), a torsion spring (113) and a SODIMM adapter (14). The SODIMM adapter (14) is provided on the surface of the bottom position of the fixing block (101).

2. A single-layer mechanical SODIMM module according to claim 1, characterized in that: A module mounting plate (17) is installed on the surface of the bottom of the upper needle plate (11). A fixing block (101) is provided on the surface of the module mounting plate (17). A connecting frame (102) is provided on the surface of the fixing block (101). A connecting plate (18) is provided on the surface of the fixing block (101). Two sets of movable pins (15) are installed on the surface of the fixing block (101).

3. A single-layer mechanical SODIMM module according to claim 2, characterized in that: The surface of the connecting plate (18) is provided with a guide groove (16) for cooperating with the movable pin (15). The guide groove (16) and the surface of the movable pin (15) slide against each other. The surface of the fixed pressure block (101) is equipped with a torsion spring (113). One end of the torsion spring (113) is fixed to the inner wall of the connecting frame (102).

4. A single-layer mechanical SODIMM module according to claim 1, characterized in that: Multiple sets of springs (13) are mounted on the surface array of the fixed pressure block (101). One end of the spring (13) is fixed to the inner wall of the connecting frame (102). The surface of the PCBA board (12) is provided with an SODIMM connector (19), which is located below the SODIMM adapter card (14).

5. A single-layer mechanical SODIMM module according to claim 1, characterized in that: The surface of the fixed pressure block (101) is equipped with an SODIMM test card (110), and a chamfered groove (111) is formed on the surface of the SODIMM adapter (14) at the center of one side.

6. A single-layer mechanical SODIMM module according to claim 4, characterized in that: The SODIMM connector (19) has a rounded corner block (112) mounted on its surface, and the rounded corner block (112) and the surface of the chamfered C-groove (111) engage with each other.

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